KR100671456B1 - Electroconductive Coating Composition for Vacuum Forming and Packaging Materials - Google Patents

Abstract

The present invention is a conductive coating composition for vacuum molding for packaging materials having excellent antistatic ability, such as electronic parts and semiconductor parts, 0.5 to 5 parts by weight of conductive polymer, 10 to 50 parts by weight of polymer binder, 1 to 5 parts by weight of thickener, and 1 to 5 parts of dispersant. A coating composition having improved antistatic properties comprising 5 parts by weight, 0.01 to 0.1 parts by weight of surfactant as an adhesive and a lubricant, and 40 to 80 parts by weight of a solvent which is a diluent is disclosed. When the coating composition of the present invention according to the above composition is applied to the base polymer, the surface resistance can be adjusted in the range of 10 ⁴ to ^{10 10} Ω / □, and the coating film hardness and the solvent resistance of the coating film are excellent, and impurities can be prevented. In addition, the conductive polymer coating composition of the present invention is excellent in the visible light transmittance, it is possible to produce an antistatic packaging product having a transparency of more than 95% compared to the base polymer when applied to the coating.

Description

Electroconductive Coating Composition for Vacuum Forming and Packaging Materials

1 is a curing reaction of methoxymethyl polyamide.

The present invention relates to a conductive coating composition for vacuum molding for packaging materials having excellent antistatic performance, such as electronic components and semiconductor components, and packaging materials using the same. More specifically, 0.5 to 5 parts by weight of conductive polymer and 10 to 50 parts by weight of polymer binder. 1 to 5 parts by weight of a thickener, 1 to 5 parts by weight of a dispersant, 0.01 to 0.1 parts by weight of a surfactant as an adhesive and a lubricant, and 40 to 80 parts by weight of a solvent as a diluent, thereby improving a coating composition including all antistatic properties. It relates to a packaging material.

Due to the high integration of electronic components and semiconductors, problems with functional degradation and product damage caused by static electricity generation have emerged, and much efforts have been made to minimize damage to static electricity generated through various paths. Static electricity affecting parts in assembling or using electronic parts is not less than 35% of total parts damage rate of static electricity generated from worker or packing material during worker's body, work space, part itself, assembly and packing, and transport process. As it is known to occupy, materials carrying and transporting finished electronic components must be free of static electricity or effectively dissipate the generated static electricity. To this end, the work area including the workbench is treated with anti-static materials, and in order to prevent the static electricity generated in the human body from being transferred to the parts, workers must wear anti-static clothes, shoes, etc. It must be transported in an antistatic package during all shipping operations until it is a final product.

There are many kinds of conventional materials used as packaging materials for preventing static electricity of electronic components and semiconductor components. The most commonly known is carbon black, which is mixed with a polymer having a desired physical property or coated on a surface, thereby exhibiting conductivity of about 10 ⁴ Ω / □ and currently being used most widely.

However, carbon black has a problem of contaminating the product or the work space due to particle impurities during use. Therefore, high cleanliness must be maintained in the surrounding environment. Also, since the black color is black, it is impossible to check the product inside the container with the naked eye. It is pointed out.

The antistatic material using the surfactant is used by mixing the surfactant with the base polymer or coating the surface in order to give the chargeability of about 10 ⁹ to 10 ¹² Ω / □. However, since the material is an ion-conducting material that exhibits conductivity after a certain amount of water and hydrophilic groups of the surfactant are hydrogen-bonded on the surface, when the humidity drops to 20% or less, the antistatic ability is extinguished. It is pointed out that the product is corroded by ionic impurities that leak or are generated in the particles.

In addition to the above materials, indium tin oxide (ITO), antimony tin oxide (ATO), etc. are used by depositing or coating on the surface of the polymer, which has a limit of resistance control, is very expensive, and cannot be formed into a molded product, so it is not applicable to molded products. , Materials such as barium sulphate and titanium oxide, which are mixed with the base polymer, are also particles that are mixed with carbon black, so impurities are generated, and a large amount of content must be added to produce an antistatic performance. There is this.

In addition, conductive polymers may be cited as one of the conductive materials other than metal and carbon black. However, conductive polymers are also difficult to melt or dissolve after synthesis and are difficult to use in mixing with coatings or polymers, and because of the unlocalized polymer chain structure, most of them have a dark color, which makes it difficult to maintain coating transparency.

Examples of the conductive polymer currently on the market include W-GREEN solution of Omecon, Germany and Baytron PH of Bayer, Germany. W. Green is a product in which a binder is mixed. When the coating is applied to a polyester film, the adhesion is poor and the evaporation time of the solvent is very long. Although excellent in coating, the solution itself does not have adhesive strength, surface hardness, and chemical resistance.

In addition, the particle dispersion type polyaniline solution produced in Korea is pointed out the disadvantages of poor particle dispersion and low electrical conductivity in spite of high solid content.

In the case of using the commercially available conductive polymer solution as described above, the conductive polymer solution should be mixed with other solvents or binders to give physical properties, but when applied to the above products, the solids precipitate or the surface of the polymer is not used. The disadvantages of separating at the surface or dissolving in the solvent are pointed out.

The base polymer materials currently used as vacuum forming sheets include polystyrene, polyvinyl chloride, amorphous polyethylene terephthalate, hexadimethyl glycol copolymerized amorphous polyethylene terephthalate (PETG), and polycarbonate. Is required. In this case, additives and coating agents additionally used should have an elongation of a degree similar to or the same as that of the base polymer.

As an additive, carbon black is added up to 30% in powder form, and even if it is increased, there is no significant change in physical properties such as resistance change, and since it is a monomolecular surfactant, it does not occur to be isolated from the polymer even if it is increased to a certain length. However, when coating the base polymer surface to impart conductivity, a certain amount of binder should be used. At this time, if the elongation of the binder is too small, there is a problem that the coating film is destroyed because it is not similar to the degree of increase of the polymer when stretched. do.

In addition, when the base polymers are vulnerable to organic solvents and manufactured according to the conventional method, problems such as melting of the coating film by organic solvents, such as washing water, cannot be solved. .

The present inventors recognize the limitations of the prior art as described above, while having excellent electrical conductivity, high transparency, excellent coating properties, and stable coating treatment as well as researching a conductive coating composition having excellent solvent resistance. In the meantime, the present invention has been completed.

Accordingly, an object of the present invention is to provide a conductive polymer coating composition having excellent antistatic properties and general properties.

Conductive coating composition for vacuum molding of the present invention is 0.5 to 5 parts by weight of conductive polymer, 10 to 50 parts by weight of polymer binder, 1 to 5 parts by weight of thickener, 1 to 5 parts by weight of dispersant, 0.01 to 0.1 weight of surfactant as adhesive and lubricant. Parts, 40 to 80 parts by weight of a solvent which is a diluent.

The coating composition of the present invention provides a coating composition with excellent antistatic ability, in particular for application to packaging materials for electronic and semiconductor parts. The coating composition can be applied to vacuum molding plastic films and sheets, and in particular, the raw materials of the films and sheets include polystyrene, polyvinyl chloride, amorphous polyethylene terephthalate, hexadimethyl glycol copolymerized amorphous polyethylene terephthalate (PETG), polycarbonate and The polymer has a mixed polymer containing 10 to 30% of the rubber component.

The conductive polymer includes a water-soluble or solvent-type polymer, for example, polypyrrole, polyaniline, polythiophene, and modified polyelectrolyte thereof, and a polyti containing an alkyl group having 5 to 12 carbon atoms at the 3 position. Off-phene, polythiophene substituted with ethylenedioxy group at 3,4 position, alkoxy group containing 1 to 4 carbon atoms at position 2, 3, or polyaniline containing amino group, sulfone group, alkyl group having 5 to 12 carbon atoms It includes any one selected from polypyrrole containing.

The conductive polymer is preferably provided in the coating composition in the form of a water-soluble or solvent-type solution according to the physical properties of the polymer. Examples of the conductive polymer solution as described above include a water-soluble type of Bitelon Piech (trade name: Baytron PH, Bayer Germany, Germany), in which a polythiophene-based conductive polymer is dispersed within 1% in an aqueous solution. W1 One Green (brand name: W1-Green, Germany Omecon).

The amount of the conductive polymer added to the coating composition is preferably 0.5 to 5 parts by weight. If it is less than 0.5 parts by weight, it is difficult to secure the required sufficient conductivity, and if it exceeds 5 parts by weight, the antistatic performance is more than necessary. It is not preferable because the conductivity is high and the color becomes dark. However, the composition range is not intended to set the critical range of the absolute meaning, and the deviation in the appropriate range is of a degree that will be apparent to those skilled in the art without departing from the scope of the present invention.
In the case of applying the conductive polymer solution alone during the coating treatment, it is necessary to add a binder together with this, because it may cause a problem of being separated from the underlying polymer surface to be coated or dissolved in a solvent. The amount of the conductive polymer added to the coating composition is preferably 10 to 50 parts by weight. The binder may be separated from the base polymer surface to be coated or dissolved in a solvent. The change in the addition effect is insignificant.
In addition, the binders to be exemplified below are selected and added according to the properties of the solvent to be used. In this case, the amount of the conductive polymer added to the coating composition may vary depending on the required resistance. In the present invention, when the required surface resistance is in the range of 10 ⁴ to ^{10 10} Ω / □, it is preferable to maintain a weight ratio of 1: 100 to 1:10 of the conductive polymer and the binder solid when the binder is added.

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Binders usable in the present invention include water-soluble or solvent-type binders, for example, water-soluble or general-purpose organic solvents having a Tg of at least room temperature, acrylic, urethane, ester, ether, and epoxy-type melamine and epoxy curing agents. Possible polymer binders and polyamides containing a methoxymethyl group which can be cured with an organic weak acid.

Among the above-mentioned binders, in particular, polyamide including methoxymethyl group is more preferably applied to impart solvent resistance and stability of coating film during vacuum molding. The polyamide containing the methoxymethyl group is cured by methoxy group reacting with -NH- group in the polyamide by treatment of organic weak acid such as paratoluenesulfonic acid to remove one molecule of methanol and linking with amide group and methylene group in another chain. Coating properties are increased (see FIG. 1 Reaction Diagram).

In addition, since the polyamide resin has excellent ductility, there is no change in the coating film even when the conductive coating composition is prepared and coated on the polymer base resin and then vacuum formed. This property is particularly useful in the manufacture of antistatic vacuum molded parts for packaging electronic parts and semiconductor parts. In other words, in the environment where a high temperature condition of 250 ° C. or higher is required, such as vacuum forming, the uniformity of the coating film may be lost, and the resistance may be suddenly reduced or even becomes an insulator. There is no concern.

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In addition, the coating composition of the present invention may be added a suitable amount of the surfactant as an adhesive and a lubricant in order to promote surface spreadability and adhesion during coating. At this time, examples of the surfactant that can be added include FC series (3M company) containing fluorine, a zonyl additive (Dupont company) containing phosphorus and fluorine, a silicone type lubricant (Shin-Etsu company), and the like.

Thickeners for dispersing conductive materials include glycols and glycerols having a boiling point of 200 ° C. or higher selected from the group of ethylene glycol, diethylene glycol, ethylene glycol diethyl ether, diethylene glycol diethyl ether, glycerol, and glycerol diglycidyl ether. At least 1 type is preferable.

The dispersant of the conductive polymer is not particularly limited, but is preferably 1-methyl-2-pyrrolidinone, 1-methylpyrrolidone, 2-methylpyrrolidone, or 1-methyl-3-. Pyrrolidiols and the like.

In general, polymer materials constituting the vacuum forming sheet used for packaging electronic components and semiconductor components include polystyrene, polyvinyl chloride, amorphous polyethylene terephthalate, hexadimethylglycol copolymerized amorphous polyethylene terephthalate (PETG), and polycarbonate. Among them, amorphous polyethylene terephthalate is in the spotlight because of its excellent mechanical strength and transparency. However, the above materials have insufficient resistance to organic solvents including acetone and toluene, as described above.

The present invention includes a conductive polymer coating composition in which an appropriate amount of organosilicate is added to the coating composition for the purpose of improving the solvent resistance of the polymer material constituting the sheet as described above.

Examples of the material usable as the organosilicates include tetraethoxyol silicate having 1 to 4 carbon atoms, tetramethoxy silicate, tetraisopropoxy silicate, tetrabutoxysilicate, and the like, but are not limited thereto. It includes.

The organosilicate is preferably provided in the form of a silicate sol solution which is hydrolyzed by reacting a predetermined weak acid with water in the coating composition. In addition, in order to secure sufficient solvent resistance of the coating film, the silicate sol solution is preferably 5 to 95 parts by weight based on the solid content of the binder to be used, and in particular, vinyl, epoxy, methacryl, etc., to enhance adhesion to the polymer base resin. It is preferable to mix 5-20 weight part with respect to the sol solution solid content using the silicate containing the functional group of.

When the organosilicate is added to the coating composition as described above, partial reaction proceeds at the time of coating, and as in polyamide curing reaction, curing is completed during vacuum molding, and solvent resistance, especially water-soluble binder, greatly improves solvent resistance to alcohol. Also, it is very excellent in resistance to isopropyl alcohol and ethyl alcohol, which are widely used as cleaning agents in the industrial field.

In addition, the addition of the organosilicate is very useful for improving surface lubrication. Electronic components and semiconductor packaging materials have a lot of problems with organic and inorganic impurities. Since traces of organic particles are regarded as impurities, additives that do not participate in the reaction or network formation cannot be used. There is a limitation that cannot be used. However, when the organic silicate is added, the surface is very smooth after the curing reaction, and there is no need to provide surface lubrication by using an additive separately.

The solvent used in the conductive polymer coating composition of the present invention is to select a suitable solvent according to the conductive polymer and binder used, and examples of the solvent that can be used include distilled water according to the coating liquid; Alcohols having 1 to 4 carbon atoms including methanol, ethanol, isopropanol and normal butanol; This includes at least one solvent selected from the group of toluene, xylene, acetone, methyl ethyl ketone, methoxybutanol, ethoxy butanol, ethyl acetate, 1-methyl-2-pyrrolidinone. Preferably, the solvent is selected from two or more of those having a high specific gravity and a low specific gravity and compatibility with the entire composition, and 20 to 80 parts by weight of the total coating composition is sufficient.

In another aspect, the present invention is a polystyrene, polyvinyl chloride, amorphous polyethylene terephthalate, hexadimethylglycol copolymorphic amorphous polyethylene terephthalate (PETG), polycarbonate and the rubber component in the polymer as a base polymer using the antistatic conductive coating composition It includes packaging materials for electronic components or semiconductor components manufactured by coating at least one surface selected from the group of mixed polymers containing 30%.

Hereinafter, the present invention will be described in detail with reference to examples, but the following examples are merely illustrative for describing the present invention and do not limit the scope of the present invention.

Comparative Example 1

25 g of ethyl alcohol and isopropyl alcohol by adding 4 g of 3,4-polyethylene dioxythiophene aqueous solution, 9.6 g of water-soluble acrylic binder (Tg = 10 ^o C), 0.01 g of zonyl additive (Dupont), and 0.2 g of ethylene glycol It was dissolved in the mixed solution, coated on an amorphous polyester sheet, and dried at 70 ^° C. for 5 minutes. The sheet resistance of the sheet prepared by the above method was 10 ⁵ Ω / □ and the adhesive force by the ASTM D3359 method was 4B. In addition, the transparency at 550 nm observed in the UV spectrum is 95% compared to that of the polymer sheet, and the resistance when washing with wipes immersed in isopropyl alcohol is more than 10 ¹² Ω / □, and the resistance during vacuum molding at 260 ^o C is 10 ¹² Ω. Increased by / □

Comparative Example 2

25 g of ethyl alcohol and isopropyl alcohol by adding 4 g of 3,4-polyethylenedioxythiophene aqueous solution, 8.9 g of water-soluble urethane binder (Tg = 35 ^o C), 0.01 g of zonyl additive (Dupont), and 0.2 g of ethylene glycol It was dissolved in the mixed solution, coated on an amorphous polyester sheet, and dried at 70 ^° C. for 5 minutes. The sheet resistance of the sheet prepared by the above method was 10 ⁵ Ω / □ and the adhesive force by the ASTM D3359 method was 5B. In addition, the transparency at 550 nm observed in the UV spectrum is 95% compared to that of the polymer sheet, and the resistance when cleaning with wipes immersed in isopropyl alcohol is 10 ¹² Ω / □ or more, and the resistance during vacuum molding at 260 ^o C is 10 ¹² Ω. Increased by / □

Comparative Example 3

25 g of 4 g of 3,4-polyethylenedioxythiophene water dispersion solution, 8.9 g of water-soluble urethane binder (Tg = 35 ^o C), 0.02 g of water-soluble melamine curing agent, 0.01 g of zonyl additive (Dupont) and 0.2 g of ethylene glycol were added. It was dissolved in ethyl alcohol and isopropyl alcohol mixed solution, coated on an amorphous polyester sheet, and dried at 70 ^° C. for 5 minutes. The sheet resistance of the sheet prepared by the above method was 10 ⁵ Ω / □ and the adhesive force by the ASTM D3359 method was 5B. In addition, the transparency at 550 nm observed in the UV spectrum was 95% compared to that of the polymer sheet, and the resistance when washing with wipes immersed in isopropyl alcohol was 10 ¹² Ω / □ or higher, and the resistance during vacuum molding at 260 ^o C was 10 ^12. Increased above Ω / □.

<Example 1>

4 g of 3,4-polyethylenedioxythiophene aqueous solution, 9 g of methoxymethyl polyamide (MW: 40,000), 0.01 g of zonyl additive (DuPont) and 0.2 g of ethylene glycol, 0.2 g of 1-methyl2-pyrrolidinone It was dissolved in 25 g of ethyl alcohol and isopropyl alcohol mixed solution, coated on an amorphous polyester sheet, and dried at 70 ^° C. for 5 minutes. The sheet resistance of the sheet prepared by the above method was 10 ⁵ Ω / □ and the adhesive force by the ASTM D3359 method was 5B. In addition, the transparency at 550 nm observed in the UV spectrum was 95% compared to that of the polymer sheet, and the resistance when washing with wipes immersed in isopropyl alcohol was 10 ¹⁰ Ω / □, and the resistance during vacuum molding at 260 ^o C was 10 ⁷ Ω /. □ was observed.

<Example 2>

4 g of 3,4-polyethylenedioxythiophene aqueous solution, 9 g of methoxymethyl polyamide (MW: 40,000), 0.01 g of zonyl additive (Dupont), 0.003 g of weak organic acid paratoluenesulphonic acid and 0.2 g of ethylene glycol, 0.2 g of 1-methyl2-pyrrolidinone was dissolved in 25 g of a mixture of ethyl alcohol and isopropyl alcohol, coated on an amorphous polyester sheet, and dried at 70 ^° C. for 5 minutes. The sheet resistance of the sheet prepared by the above method was 10 ⁵ Ω / □ and the adhesive force by the ASTM D3359 method was 5B. In addition, the transparency at 550 nm observed in the UV spectrum was 95% compared to that of the polymer sheet, and the resistance when washing with wipes immersed in isopropyl alcohol was 10 ⁶ Ω / □, and the resistance during vacuum molding at 260 ^o C was 10 ⁷ Ω /. □ was observed.

<Example 3>

4 g of 3,4-polyethylenedioxythiophene aqueous solution, 9 g of methoxymethyl polyamide (MW: 40,000), 0.01 g of zonyl additive (DuPont) and 0.2 g of ethylene glycol, 0.2 g of 1-methyl2-pyrrolidinone After preparing a mixture of 25g ethyl alcohol and isopropyl alcohol, the tetraethoxy silane was diluted with ethyl alcohol to a solid content of 5%, and 0.5g of a silicate sol solution reacted at room temperature for 4 hours was added and coated on an amorphous polyester sheet. After drying at 70 ^o C for 5 minutes. The sheet resistance of the sheet prepared by the above method was 10 ⁵ Ω / □ and the adhesive force by the ASTM D3359 method was 5B. In addition, the transparency at 550 nm observed in the UV spectrum was 95% compared to that of the polymer sheet, and the resistance when washing with wipes immersed in isopropyl alcohol was 10 ⁵ Ω / □, and the resistance during vacuum molding at 260 ^o C was 10 ⁷ Ω /. □ was observed.

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<Example 4>

3 g of polyaniline doped with camphorsulfonic acid, 5 g of solvent-type acrylic binder solution (Tg: 60 ^o C), 0.01 g of KP322 (Shin-Etsu Corp.), 10 g of toluene, and 10 g of normal butanol were coated on a hard polyvinyl chloride sheet at 70 ^o C. It was dried for 5 minutes. The sheet resistance of the sheet prepared by the above method was 10 ⁵ Ω / □ and the adhesive force by the ASTM D3359 method was 4B. In addition, the transparency at 550 nm observed in the UV spectrum was 75% compared to that of the polymer sheet, and the resistance when washing with wipes immersed in isopropyl alcohol was 10 ⁹ Ω / □, and the resistance during vacuum molding at 260 ^o C was 10 ¹⁰ Ω /. □ was observed.

Example 5

3 g of polypyrrole solution doped with iron chloride, 5 g of acryl polyol binder solution (Tg: 45 ^o C) in which urethane is produced after solvent type curing, 0.01 g of BYK 310 (BYK), 10 g of toluene, and 10 g of normal butanol After coating on the sheet and dried for 5 minutes at 70 ^° C. The sheet resistance of the sheet prepared by the above method was 10 ⁸ Ω / □ and the adhesive force by the ASTM D3359 method was 4B. In addition, the transparency at 550 nm observed in the UV spectrum is 80% compared to that of the polymer sheet, and the resistance when cleaning with wipes immersed in isopropyl alcohol is 10 ⁹ Ω / □, and the resistance during vacuum molding at 260 ^o C is 10 ⁹ Ω /. □ was observed.

The content and physical property measurement results of the conductive polymer coating composition including Examples 1 to 5 and Comparative Examples are shown in Table 1 below.

<Table 1> Contents and results of measurement of conductive polymer coating composition

division Conductive material Binder type Surface Resistance (Ω / □) Adhesion (B) Resistance after cleaning (Ω / □) Resistance after molding (Ω / □) Comparative Example 1 PEDOT ^* acryl 10sup5 4 10sup12 10sup12 Comparative Example 2 PEDOT urethane 10sup5 5 10sup12 10sup12 Comparative Example 3 PEDOT urethane 10sup5 5 10sup12 10sup12 Example 1 PEDOT Amide 10sup5 5 10sup10 10sup7 Example 2 PEDOT Amide 10sup5 5 10sup6 10sup7 Example 3 PEDOT Amide 10sup5 5 10sup5 10sup7 Example 4 PANI ⁺ acryl 10sup5 4 10sup9 10sup10 Example 5 PPY ⁺⁺ acryl 10sup8 4 10sup9 10sup9

* 3,4-polyethylenedioxythiophene, +: polyaniline, ++: polypyrrole

According to the present invention, the surface resistance can be adjusted in the range of 10 ⁴ to ^{10 10} Ω / □, and the coating film hardness and the solvent resistance of the coating film are excellent and impurities can be prevented. In addition, the conductive coating composition for vacuum molding of the present invention is excellent in the visible light transmittance, it is possible to produce an antistatic packaging product having a transparency of 95% or more relative to the base polymer when applied to the coating.

Claims (13)

In the base polymer coating composition of the packaging material for packaging electronic components or semiconductor components, Polypyrrole, polyaniline, polythiophene and modified modified polymers thereof, including polythiophene containing an alkyl group having 5 to 12 carbon atoms at position 3, and polythiophene substituted with ethylenedioxy group at position 3 and 4 0.5 to 5 parts by weight of any one of a conductive polymer selected from polypyrrole containing an alkoxy group containing 1 to 4 carbon atoms in the 2,3 position, or polyaniline containing an amino group, a sulfone group, an alkyl group of 5 to 12 carbon atoms, 10 to 50 parts by weight of any one polymer binder selected from polyamides including water-soluble or general-purpose organic solvent-dispersed epoxy, acrylic, urethane, ester, ether, and methoxymethyl groups to impart solvent resistance and stability of the coating film, 1 to 5 parts by weight of any one thickener selected from ethylene glycol, diethylene glycol, ethylene glycol diethyl ether, diethylene glycol diethyl ether, glycerol, and glycerol diglycidyl ether as a glycol having a boiling point of 200 ° C. or higher, and 40 to 80 parts by weight of a solvent which is a diluent, A conductive coating composition for coating a plastic film or sheet for vacuum forming of a packaging material for packaging an electronic component or a semiconductor component. delete delete delete delete The method of claim 1, wherein the solvent is distilled water, depending on the coating liquid; Alcohols having 1 to 4 carbon atoms including methanol, ethanol, isopropanol and normal butanol; For vacuum molding, comprising at least one solvent selected from the group of toluene, xylene, acetone, methyl ethyl ketone, methoxy butanol, ethoxy butanol, ethyl acetate, and 1-methyl-2-pyrrolidinone Conductive coating composition for coating plastic films or sheets. The method of claim 1, wherein the composition component further comprises at least one member selected from the group consisting of tetraethoxyolsosilicates having 1 to 4 carbon atoms, tetramethoxysilicate, tetraisopropoxysilicate and tetrabutoxysilicate as organosilicates. A conductive coating composition for coating a plastic film or sheet for vacuum forming, characterized in that. The conductive coating composition for coating the plastic film or sheet for vacuum forming according to any one of claims 1, 6 and 7, as a base polymer, polystyrene, polyvinyl chloride, amorphous polyethylene terephthalate, hexadimethyl glycol copolymerization A packaging material for an electronic component or a semiconductor component coated on at least one surface selected from the group consisting of amorphous polyethylene terephthalate (PETG), polycarbonate. The conductive coating composition of claim 1, wherein the polymer binder is curable with an epoxy or melamine curing agent or with an organic weak acid. delete delete delete delete

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