KR100665194B1 - Fixing holder for electronic assembly - Google Patents

Fixing holder for electronic assembly Download PDF

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Publication number
KR100665194B1
KR100665194B1 KR1020050079887A KR20050079887A KR100665194B1 KR 100665194 B1 KR100665194 B1 KR 100665194B1 KR 1020050079887 A KR1020050079887 A KR 1020050079887A KR 20050079887 A KR20050079887 A KR 20050079887A KR 100665194 B1 KR100665194 B1 KR 100665194B1
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KR
South Korea
Prior art keywords
hole
substrate
holder
soldering
leg
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KR1020050079887A
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Korean (ko)
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이상훈
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주식회사 한림전자
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

A fixing holder for an electronic assembly is provided to considerably improve the reliability of an electronic product by accurately, firmly, and stably coupling a solder part. In a fixing holder for an electronic assembly, a head part(10) has a through-hole(11). The head part(10) has a leg part(20) connected to the head part(10) in one body. The leg part(20) has a curved projection to fix the leg in the through-hole(11). The curved projection is a ring-type pressure plate(21) curved to the outside of the leg part(20). The leg part(20) is penetrated through the through-hole(11) and the pressure plate(21) is extended to the outside to be firmly fixed.

Description

전자부품 솔더용 고정홀더{Fixing holder for electronic assembly}Fixing holder for electronic assembly

도 1은 본 발명의 사시도.1 is a perspective view of the present invention.

도 2는 도 1의 종단면도.2 is a longitudinal cross-sectional view of FIG.

도 3은 본 발명의 사용상태를 도시한 설명도.3 is an explanatory diagram showing a state of use of the present invention.

***도면의 주요부분의 부호설명****** Explanation of symbols in main part of drawing ***

10; 머리부 11; 통공 12; 날개 10; Head 11; Through 12; wing

20; 탄성다리 21; 가압편 201; 리드선20; Elastic legs 21; Pressing piece 201; Lead wire

본 발명은 전자기기에 사용되는 PCB기판에 전자부품을 고정시키기 위한 부품 솔더용 고정홀더에 관한 것으로, 전자기기의 PCB기판에 관통공을 뚫고 PCB기판용 부품 솔더용 고정홀더를 체결하여 무연 솔더링(Lead-Free)시 부품 리드의 안전한 고정과 무연 솔더부의 견고성을 향상하도록 하기 위한 전자부품 솔더용 고정홀더에 관한 것이다.The present invention relates to a fixing holder for component solder for fixing electronic components to a PCB substrate used in electronic devices, by drilling a through-hole in the PCB substrate of the electronic device and fastening the soldering holder for the PCB substrate component solder lead-free soldering ( The present invention relates to a fixing holder for soldering electronic components to secure the lead of parts and improve the rigidity of the lead-free solder.

전자기기의 구성은 케이스부와 회로부로 구성되고 이 회로부는 판재의 PCB기판과 이 기판에 다수의 소정위치에 전자부품이 체결되는 통공을 형성하게 된다.The electronic device is composed of a case part and a circuit part, and the circuit part forms a PCB substrate of a plate material and a through hole through which electronic components are fastened to a plurality of predetermined positions on the substrate.

그리고 상기 통공에 소정한 부품의 리드선을 관통하여 이면에서 납을 사용하여 솔더링하고 접속하는 결합을 이루고 있다. 그리고 이러한 기판은 공지된 바와 같이 제품의 특성에 따라 여러 가지 유형의 도전박판이 인쇄되어 있고, 적절한 위치에는 각종 전자부품의 조립이 이루어질 수 있도록 다수의 구멍이 천공되어 있다.And through the lead wire of the predetermined part to the said through hole, the back surface is soldered and connected using lead. The substrate is printed with various types of conductive thin plates according to the characteristics of the product as is known, and a plurality of holes are perforated so that various electronic components can be assembled at appropriate locations.

즉, 기판에 전자부품을 조립할 때는 PCB기판에 형성된 통공에 전자부품의 리드선을 끼운 후 전자부품의 리드선이 돌출되는 PCB기판 이면에서 납으로 솔더링하여 전자부품을 PCB기판에 고정과 함께 전속시키게 되는 것이다.In other words, when assembling electronic components on the board, the lead wires of the electronic components are inserted into the through-holes formed in the PCB, and then soldered with lead on the back side of the PCB substrate from which the lead wires of the electronic components protrude, thereby transferring the electronic components to the PCB board together with fixing. .

이러한 종래의 구성은 PCB기판에 천공한 통공에 전자부품을 직접 끼워 넣는 조립을 하게 됨으로써 부품의 리드선이 상기 통공과 크기를 달리하여 리드선이 끼워진 상태에서 움직이게 되고 이러한 유동성에 의하여 고정이 안정적으로 이루어지지 못하여 헐겁게 조립되는 경우가 많다.This conventional configuration is assembled by inserting the electronic components directly into the through-hole perforated on the PCB substrate, the lead wire of the component is different from the through-hole to move in the state where the lead wire is fitted, the fixing is not made stable by this fluidity It is often loosely assembled.

일예로 접속과 고정을 위한 납땜에서 부품이 비틀림 된 상태에서 납땜되고 또는 리드선이 비스듬히 세워진 상태로 납땜됨으로 납량을 균일하게 도포시킬 수 없고 안정적으로 땜 작업을 이룰 수 없는 문제가 발생된다.For example, in soldering for connection and fixing, soldered in a twisted state or soldered in an inclined direction, leads to a problem in that the amount of lead cannot be uniformly applied and the soldering can not be stably performed.

이와 같이 부품이 비스듬히 세워지고 또는 납땜의 모양이 일률적이지 못함으로서 상품의 질을 손상하고 특히 납땜불량이 자주 발생하여 회로상의 도통이 원활하게 이루어지지 못하는 경우가 잦아 각종 전자부품 생산 시에 PCB기판으로 인한 불량률 발생을 대량으로 발생시키게 되는 요인이 되고 있다. 또한 환경문제로 인하여 납사용이 규제됨에 따라 무연 솔더시는 납이 함유되지 않은 솔더 합금을 사용하므로 솔더 불량이 대량으로 발생과 동시에 솔더부의 신뢰성에 크게 문제가 발생 될 소지가 많다.As such, the parts are erected at an angle or the shape of the solder is not uniform, which damages the quality of the product and in particular, the poor soldering occurs frequently, so that the conduction of the circuit is not performed smoothly. It is a factor that causes a large amount of defective rate caused. In addition, due to environmental problems, the use of lead is regulated due to environmental problems, so lead-free solders use solder alloys containing no lead, which causes a large amount of solder defects and a large problem in reliability of the solder part.

이러한 폐단을 개선하기 위하여 상기 기판에 뚫린 통공에 이 통공으로 삽입되는 리드선을 안정적으로 지지할 수 있는 홀더 구성이 일부 알려진바 있다.In order to improve such a closed end, a holder configuration capable of stably supporting a lead wire inserted into the through hole formed in the substrate has been known.

이러한 구성들은 기판에 뚫린 통공에 끼워져 관통되도록 한 소정길이의 다리부재와 이 다리부재와 일체로 머리부재를 구비하여 통공 주변에 걸림으로 이탈되지 못하도록 하는 머리부재 및 머리부재 내측으로 리드선이 관통되는 구멍부와 상기 다리부재는 기판을 관통하고 그 통공에 밀착되어 끼워진 후 다시 쉽게 이탈되지 못하도록 하기 위한 걸림부를 구성하고 있다.These components are provided with a leg member of a predetermined length to be inserted through the through hole drilled in the substrate, and a head member integrally with the leg member, and a head member through which the lead wire penetrates into the head member to prevent it from being separated by a hook around the through hole. The portion and the leg member constitute a catching portion for penetrating the substrate and tightly contacting the through hole so that it is not easily detached.

특히 대한민국 실용신안등록 제 20-0188634 호에서는 PCB기판에 천공된 부품의 리드선이 삽입되는 구멍에 걸림턱과 탄성편을 가지는 탄성지지편을 형성시켜 구멍에 끼워짐과 함께 이탈되지 않도록 한 돌기부를 구성하고 있다.In particular, the Republic of Korea Utility Model Registration No. 20-0188634 is formed in the hole in which the lead wire of the perforated part is inserted into the PCB substrate to form an elastic support piece having a latching jaw and an elastic piece so as to fit in the hole and prevent the separation Doing.

이러한 선행기술은 탄성지지편이 외향으로 벌려지는 탄성으로 구멍에서 지지되고 있으나, 이때의 고정력이 극히 미약하여 납땜작업 중 탄성지지판이 이동되고 또는 이탈되는 폐단 발생과 함께 탄성지지편 내측으로 끼워진 리드선이 이동되면서 접속상태가 불량하게 되는 문제가 발생 될 소지가 있다.In the prior art, the elastic support piece is supported in the hole with elasticity outwardly, but the fixing force is very weak at this time, and the lead wire inserted into the elastic support piece is moved with the occurrence of the closed end of the elastic support plate being moved or detached during the soldering operation. There is a possibility that the problem that the connection state is bad.

또한 부품리드의 폭에 따라 탄성지지판이 외향으로 벌어지나 실제 솔더시와는 무관하게 단순히 벌어져 부품리드만 지지하는 구조로 되어 있다.In addition, the elastic support plate spreads outwards depending on the width of the component lead, but is simply structured to support only the component lead regardless of the actual soldering time.

본 발명은 상기한 종래의 제반문제점을 개선하기 위하여 안출된 것으로, 특히, 기판상에 위치되고 리드선이 끼워지는 통공을 구비한 머리부와 이 머리부에서 하향된 복수개의 탄성다리를 구성하되, 탄성다리의 끝단을 외향으로 “∪”자형 절곡시킨 가압편을 일체로 구성함을 목적으로 한다.The present invention has been made in order to improve the above-mentioned conventional problems, and in particular, it comprises a head having a through-hole which is located on the substrate and the lead wire is fitted and a plurality of elastic legs downward from the head, the elastic The purpose is to form a pressurized piece in which the end of the leg is bent outwardly.

이러한 본 발명은 기판에 천공된 통공을 관통한 탄성다리의 가압편이 통공외측 기판상에 위치되어 탄성으로 기판을 가압시켜 홀더가 기판에 견고히 체결됨으로써 작업 중 홀더가 이탈되는 문제점을 개선하며, 부품 리드 삽입시 솔더링이 효율적으로 되도록 리드 폭에 맞게 탄성다리와 가압편이 외향으로 벌어지며, 효율적인 솔더링이 될 수 있도록 하는 것이다.The present invention improves the problem that the holder is detached during the operation by being firmly fastened to the substrate by pressurizing the substrate elastically by pressing the substrate with the elastic leg penetrating the through-hole perforated on the substrate and elastically pressurizing the substrate. To ensure efficient soldering during insertion, the elastic legs and the pressure pieces are spread outwardly in accordance with the width of the lead, so that they can be efficiently soldered.

또한 “∪”자형 가압편은 관통공에 삽입시 가이드 역할도 하여 삽입시의 오삽 방지 역할도 하는 것이 특징이다.In addition, the "∪" shaped pressing piece is characterized by acting as a guide when inserted into the through-hole, and also prevents mis-insertion during insertion.

이러한 본 발명은 전자부품의 리드선이 관통하는 관통공과 기판에 천공된 통공외부로 걸림 되는 크기의 머리부와 이 머리부에서 하향된 복수개의 탄성다리를 구성하되, 탄성다리의 끝단을 외향으로 “∪”자형 절곡시킨 가압편을 일체로 구성시킨 홀더를 구성한다.The present invention comprises a head portion having a size of the through-hole through which the lead wire of the electronic component penetrates and a through-hole perforated in the substrate, and a plurality of elastic legs downwardly from the head, the ends of the elastic leg outwardly "∪" The holder is formed by integrally forming the “bent bending piece”.

이러한 홀더는 기판에 천공된 통공에 탄성다리를 관통시켜 끼워 넣으면 탄성다리가 통공에 위치되고 그 끝단의 가압편은 통공을 관통하여 탄성으로 벌어져 가압편이 통공 외측 기판상에 위치되고 탄성으로 기판을 가압시켜 홀더가 기판에 견고히 체결하게 된다.The holder is inserted into the through-hole perforated in the substrate and the elastic leg is positioned in the through-hole, and the pressurized piece at its end is elastically penetrated through the through-hole so that the press piece is positioned on the outer substrate of the through-hole and pressurizes the substrate with elasticity. The holder is firmly fastened to the substrate.

이와 같이 홀더가 기판과 탄성으로 가압 고정됨으로써 안정된 솔더링이 될 수 있게 “∪"자형 가압편은 부품리드를 잡아주며 솔더링이 매우 균일하고 안정적 으로 이루어질 수 있고 자동화 작업시에 오삽 방지로 관통공 삽입시 가이드 역할을 하여 매우 효과적인 작업을 수행할 수 있고 솔더링부의 접속력이 향상되어 각종전자부품의 조립 생산성을 높일 수 있어 상품의 신뢰성을 극대화시킬 수 있는 것이다.In this way, the holder is pressurized and fixed elastically with the substrate to ensure stable soldering. The “∪” shaped pressing piece holds the lead of the part and the soldering can be made very uniform and stable. By acting as a guide, it is possible to perform highly effective work and improve the connection power of soldering parts to increase the assembly productivity of various electronic components, thereby maximizing the reliability of the product.

이러한 본 발명을 첨부도면에 의해 그 실시 예를 보다 상세히 설명하면 다음과 같다.When explaining the embodiment of the present invention in more detail by the accompanying drawings as follows.

도 1은 본 발명의 사시도이고 도 2는 도 1의 종단면도 및 도 3은 본 발명의 사용상태를 도시한 설명도이다.1 is a perspective view of the present invention, Figure 2 is a longitudinal cross-sectional view of Figure 1 and Figure 3 is an explanatory view showing a state of use of the present invention.

상기 도면에 도시된 바와 같이 통상의 전자기기의 PCB기판(100) 상에 위치되고 전자부품(200)의 리드선(201)이 끼워지는 통공(11)을 구비한 머리부(10)와 이 머리부(10)에서 하향된 복수개의 탄성다리(20)를 구성한다.As shown in the figure, the head portion 10 and the head portion having a through hole 11, which is positioned on the PCB substrate 100 of the conventional electronic device and into which the lead wire 201 of the electronic component 200 is fitted. A plurality of elastic legs 20 which are downward in the configuration (10).

상기 머리부(10)는 기판(100)에 형성된 관통공(101)으로 삽입되지 않도록 확장된 날개(12)를 형성하며 이 날개(12)는 판재를 절취시켜 탄성다리(20)를 구비하는 과정에서 탄성다리(20) 사이의 판재를 수평으로 절단시켜 구성하게 된다.The head portion 10 forms a wing 12 extended so as not to be inserted into the through hole 101 formed in the substrate 100, the wing 12 is a process of cutting the plate material to provide the elastic leg 20 In the plate between the elastic legs 20 is formed by cutting horizontally.

상기 복수개의 탄성다리(20)는 끝단을 외향으로 “∪”자형 절곡시킨 고리형의 가압편(21)을 일체로 구성하여 관통공(101)을 통과한 상태에서 가압편(21)이 관통공(101)외부로 확장되어 기판에 가압으로 고정되는 체결을 이루도록 구성된다.The plurality of elastic legs 20 are integrally formed with an annular pressing piece 21 having a “∪” -shaped bent end outward and integrally passing through the through hole 101 so that the pressing piece 21 passes through the through hole 101. 101 is configured to extend to the outside to achieve a fastening fixed to the substrate by pressure.

미설명부호 (300)은 납땜층을 표시한 것이다.Reference numeral 300 denotes a solder layer.

이상과 같이 구성되는 본 발명의 작용효과를 보다 상세히 설명한다.The effects of the present invention configured as described above will be described in more detail.

도 1은 본 발명의 사시도이고 도 2는 도 1의 종단면도 및 도 3은 본 발명의 사용상태를 도시한 설명도로 이에 도시된 바와 같이 본 발명의 홀더는 공지된 바와 같이 기다란 연속형의 홀더밴드에 일률적으로 구비되어 홀더 체결장치부에 공급되며 이 홀더체결장치에 별도로 공급된 PCB기판(100)과 이 PCB기판(100)에 뚫린 관통공(102)에 본 발명의 홀더를 체결하게 되는 것이다.Figure 1 is a perspective view of the present invention and Figure 2 is a longitudinal cross-sectional view of Figure 1 and Figure 3 is an explanatory view showing the use state of the present invention as shown in the holder of the present invention elongated continuous holder band as known It is uniformly provided in the holder fastening unit is to be fastened to the holder of the present invention to the PCB substrate 100 and the through hole 102 drilled in the PCB substrate 100 is supplied separately to the holder fastening device.

이때 기판(100) 상부에서 기판에 뚫린 관통공(101)으로 본 발명 홀더의 하강된 탄성다리(20)를 끼워 넣게 된다.At this time, the lower elastic leg 20 of the holder of the present invention is inserted into the through hole 101 which is drilled in the substrate from the upper part of the substrate 100.

즉, 탄성다리(20)는 하부의 폭이 관통공(101)내로 수용 가능한 폭으로 구비된 상태에서 관통공(101)입구로 밀어 넣는다.That is, the elastic leg 20 is pushed into the through hole 101 in the state that the width of the lower portion is provided with a width that can be accommodated into the through hole 101.

이에 따라 탄성다리(20)가 신축되면서 관통공(101)에 끼워지는 동시 탄성다리(20)의 끝 부분에 외향으로 절곡된 가압편(21)은 상기 관통공(102)을 통과하여 관통공(101)외부에서 탄성으로 벌려지고 가압편(21)이 관통공(101)외측으로 그 끝단이 위치되어 기판(100) 하부에 지지되면서 끼워진 홀더는 이탈되지 않도록 체결되는 것이다.Accordingly, the elastic piece 20 is stretched and the pressure piece 21 bent outward at the end portion of the simultaneous elastic leg 20 fitted into the through hole 101 passes through the through hole 102 and passes through the through hole ( 101) The holder which is opened elastically from the outside and the pressing piece 21 is positioned outside the through hole 101 and is supported under the substrate 100 is fastened so as not to be separated.

그리고 체결된 홀더의 머리부(10)는 상기 관통공(101)보다 큰 날개(12)로 구성되어 관통공(101)내로 유입되지 않고 기판(100) 상부에 위치된다.And the head portion 10 of the fastened holder is composed of a wing 12 larger than the through hole 101 is located above the substrate 100 does not flow into the through hole 101.

상기에서 체결된 홀더의 통공(11)에 공지된 작업에 의해 전자부품(200)의 리드선(201)을 체결하고 기판(100) 하부 즉, 상기 탄성다리(20)가 관통된 상태의 가압편(21)내에 위치시켜 공지의 무연 솔더링을 실시함으로써 용접하게 되는 것이다.The pressing piece of the state in which the lead wire 201 of the electronic component 200 is fastened and the lower portion of the substrate 100, that is, the elastic leg 20 is penetrated by a known operation in the through hole 11 of the holder fastened above ( 21) to be welded by performing known lead-free soldering.

이러한 작업 중 복수개의 탄성다리(20)에 형성된 고리형의 가압편(21)은 탄성으로 기판(100)의 하부에 고정됨으로 작업중 충격 등으로 홀더가 이동되거나 또 는 이탈되는 것을 방지함과 동시에 끼워지는 부품 리드선(201)의 굵기로 외향으로 벌어져 압착함으로써 솔더시 안정된 체결로 솔더링 작업이 용이하고 견고한 체결성과 자동화작업이 용이하도록 하는 것이다.The annular pressing piece 21 formed on the plurality of elastic legs 20 is fixed to the lower portion of the substrate 100 with elasticity to prevent the holder from being moved or detached due to impact during operation, and is inserted at the same time. The edge of the part lead wire 201 is expanded to the outward by the thickness of the solder to facilitate the soldering work with a stable fastening at the time of soldering and to facilitate the fastening and automation work.

그리고 전자부품의 리드선(201)은 탄성다리(20)의 탄성으로 인한 밀착에 따라 전기의 도통과 안정적인 고정력을 발휘하며 무연 솔더시 솔더합금이 탄성다리(20)와 가압편(21)내로 침투되기 때문에 리드선과의 접속효과를 증대하므로 정확하고 안정적인 결속력으로 단선 및 단락의 우려가 없는 것이다.In addition, the lead wire 201 of the electronic component exhibits electrical conduction and stable fixing force due to the close contact due to the elasticity of the elastic leg 20. The solder alloy is penetrated into the elastic leg 20 and the pressing piece 21 during lead-free soldering. Therefore, the connection effect with lead wire is increased, so there is no fear of disconnection or short circuit with accurate and stable binding force.

특히 가압편(21)은 “∪"자 형으로 솔더합금이 리드선과 잘 융착 되도록 유도하는 중요한 역할을 한다.In particular, the pressing piece 21 has an “∪” shape and plays an important role in inducing the solder alloy to be fused to the lead wire well.

이상과 같이 본 발명은 통상의 PCB기판에 형성된 관통공에 본 발명의 홀더를 체결하고 이 홀더에 전자부품의 리드선을 삽입 고정함으로 리드선이 견고한 체결로 안정적인 접속을 이루며 부품이 바른 상태로 지지되는 특징과 가압편(21)이 솔더링시 솔더합금이 안정적인 융착을 유도하는 형상으로 솔더링 부의 높은 신뢰성을 보장할 수 있다.As described above, the present invention fastens the holder of the present invention to a through hole formed in a conventional PCB board, and inserts and fixes the lead wire of the electronic component in the holder, so that the lead wire is secured by a secure fastening and the parts are supported in the correct state. The overpressure piece 21 may ensure a high reliability of the soldering portion in a shape that induces a stable fusion of the solder alloy when soldering.

특히 본 발명은 종래의 선행기술에서의 문제점을 개선함으로서 충격에서도 홀더가 이탈되는 폐단을 방지하는 효과가 기대되는 것이며 또한 솔더부가 정확하고 견고하며, 안정성 있게 결합되어 전자제품의 신뢰성을 크게 향상시켜 줄 수 있는 유용한 발명인 것이다. In particular, the present invention is expected to have the effect of preventing the closing end of the holder is separated from the impact by improving the problems in the prior art and also the solder portion is precisely, firmly and stably coupled to greatly improve the reliability of electronic products It is a useful invention that can be.

Claims (1)

통공을 형성한 머리부와, 이 머리부에서 일체로 연결된 탄성다리를 구성하고 탄성다리가 관통공에서 고정되도록 절곡된 턱을 구비하여 전자기기의 리드선을 결속하기 위한 전자부품 솔더용 고정홀더에 있어서,In the fixing part for soldering electronic components for binding the lead wire of the electronic device, having a head formed with a through hole and a jaw bent so that the elastic leg is fixed in the through hole. , 상기 통공을 구비한 머리부에서 하향된 탄성다리를 구성하되, 탄성다리의 끝단을 외향으로 절곡시킨 고리형의 가압편을 일체로 구성시켜 기판의 관통공을 통과한 상태에서 가압편이 확장됨으로 기판에 견고한 체결을 이룰 수 있도록 구성한 전자부품 솔더용 고정홀더.The elastic leg which is downwardly formed at the head having the through hole is constituted, but the annular pressing piece having the end of the elastic leg bent outward is integrally formed so that the pressing piece is expanded in the state passing through the through hole of the substrate. Fixing holders for soldering electronic components, designed to achieve a tight connection.
KR1020050079887A 2005-08-30 2005-08-30 Fixing holder for electronic assembly KR100665194B1 (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
KR101421553B1 (en) * 2008-02-22 2014-07-22 엘지이노텍 주식회사 Soldering Support Device

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JPS5334648U (en) 1976-08-31 1978-03-27
JPS5750498A (en) 1980-09-11 1982-03-24 Matsushita Electric Ind Co Ltd Both-side wired board
JPH03127775A (en) * 1989-10-11 1991-05-30 Monsanto Co Method for synthesis of mannodylimycin deriv ative
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JPS5334648U (en) 1976-08-31 1978-03-27
JPS5750498A (en) 1980-09-11 1982-03-24 Matsushita Electric Ind Co Ltd Both-side wired board
JPH03127775A (en) * 1989-10-11 1991-05-30 Monsanto Co Method for synthesis of mannodylimycin deriv ative
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Publication number Priority date Publication date Assignee Title
KR101421553B1 (en) * 2008-02-22 2014-07-22 엘지이노텍 주식회사 Soldering Support Device

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