KR100660321B1 - 시모스 이미지 센서의 마이크로 렌즈 및 그의 제조방법 - Google Patents
시모스 이미지 센서의 마이크로 렌즈 및 그의 제조방법 Download PDFInfo
- Publication number
- KR100660321B1 KR100660321B1 KR1020040117235A KR20040117235A KR100660321B1 KR 100660321 B1 KR100660321 B1 KR 100660321B1 KR 1020040117235 A KR1020040117235 A KR 1020040117235A KR 20040117235 A KR20040117235 A KR 20040117235A KR 100660321 B1 KR100660321 B1 KR 100660321B1
- Authority
- KR
- South Korea
- Prior art keywords
- micro lens
- image sensor
- color filter
- cmos image
- microlens
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000010410 layer Substances 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 6
- 239000011229 interlayer Substances 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 206010034960 Photophobia Diseases 0.000 abstract description 5
- 208000013469 light sensitivity Diseases 0.000 abstract description 5
- 230000001939 inductive effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000004061 bleaching Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000001444 catalytic combustion detection Methods 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 208000017983 photosensitivity disease Diseases 0.000 description 1
- 231100000434 photosensitization Toxicity 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (4)
- 삭제
- 광감지 소자영역, 게이트전극, 층간절연막, 금속배선이 형성된 반도체 기판상에 다수의 컬러필터층을 형성하는 단계;상기 다수의 컬러필터층 상에 오버코팅층을 형성하는 단계;상기 오버코팅층 상에 마이크로 렌즈를 형성하는 단계;상기 마이크로 렌즈와 마이크로 렌즈 사이의 상기 컬러필터층의 경계지역에 상기 오버코팅층을 식각하여 홈을 형성하는 단계;플로우공정을 진행하여 상기 홈을 상기 마이크로 렌즈의 곡면에 연장시키는 단계를 포함하는 것을 특징으로 하는 시모스 이미지 센서의 마이크로 렌즈 제조방법.
- 삭제
- 제 2 항에 있어서,상기 오버코팅층은 O2 플라즈마 방법으로 식각하는 것을 특징으로 하는 시모스 이미지 센서의 마이크로 렌즈 제조방법.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040117235A KR100660321B1 (ko) | 2004-12-30 | 2004-12-30 | 시모스 이미지 센서의 마이크로 렌즈 및 그의 제조방법 |
CNB2005101320455A CN100530668C (zh) | 2004-12-30 | 2005-12-16 | Cmos图像传感器的微透镜及其制造方法 |
US11/319,493 US7279354B2 (en) | 2004-12-30 | 2005-12-29 | Microlens of CMOS image sensor and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040117235A KR100660321B1 (ko) | 2004-12-30 | 2004-12-30 | 시모스 이미지 센서의 마이크로 렌즈 및 그의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060077714A KR20060077714A (ko) | 2006-07-05 |
KR100660321B1 true KR100660321B1 (ko) | 2006-12-22 |
Family
ID=36639398
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040117235A KR100660321B1 (ko) | 2004-12-30 | 2004-12-30 | 시모스 이미지 센서의 마이크로 렌즈 및 그의 제조방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7279354B2 (ko) |
KR (1) | KR100660321B1 (ko) |
CN (1) | CN100530668C (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6979588B2 (en) * | 2003-01-29 | 2005-12-27 | Hynix Semiconductor Inc. | Method for manufacturing CMOS image sensor having microlens therein with high photosensitivity |
KR100649031B1 (ko) * | 2005-06-27 | 2006-11-27 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서의 제조방법 |
KR100718769B1 (ko) * | 2005-11-30 | 2007-05-16 | 매그나칩 반도체 유한회사 | 이미지 센서 및 그 제조 방법 |
KR100782778B1 (ko) * | 2006-08-31 | 2007-12-05 | 동부일렉트로닉스 주식회사 | 이미지 센서의 평탄화층을 제조하는 방법 및 상기 평탄화층을 포함하는 이미지 센서 |
KR20080060484A (ko) * | 2006-12-27 | 2008-07-02 | 동부일렉트로닉스 주식회사 | 이미지 센서 및 그 제조방법 |
KR100802305B1 (ko) * | 2006-12-27 | 2008-02-11 | 동부일렉트로닉스 주식회사 | 이미지 센서 제조방법 |
KR100891075B1 (ko) * | 2006-12-29 | 2009-03-31 | 동부일렉트로닉스 주식회사 | 이미지 센서의 제조방법 |
KR20080062825A (ko) * | 2006-12-29 | 2008-07-03 | 동부일렉트로닉스 주식회사 | 이미지 센서 제조방법 |
JP2008270500A (ja) * | 2007-04-19 | 2008-11-06 | Sharp Corp | 固体撮像素子およびその製造方法、電子情報機器 |
KR100900869B1 (ko) * | 2007-06-25 | 2009-06-04 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
KR100887886B1 (ko) * | 2007-11-05 | 2009-03-06 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
US8530142B2 (en) | 2011-03-15 | 2013-09-10 | Eastman Kodak Company | Flexographic printing plate precursor, imaging assembly, and use |
CN102683375A (zh) * | 2012-06-01 | 2012-09-19 | 昆山锐芯微电子有限公司 | Cmos图像传感器及其制作方法 |
US20230411540A1 (en) * | 2022-06-16 | 2023-12-21 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor device and method of making |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020057277A (ko) | 2000-12-30 | 2002-07-11 | 박종섭 | 이중 렌즈를 구비하는 이미지 센서 및 그 제조 방법 |
US6979588B2 (en) * | 2003-01-29 | 2005-12-27 | Hynix Semiconductor Inc. | Method for manufacturing CMOS image sensor having microlens therein with high photosensitivity |
KR100522827B1 (ko) | 2003-04-29 | 2005-10-18 | 매그나칩 반도체 유한회사 | 광감도를 향상시킨 시모스 이미지센서 제조방법 |
-
2004
- 2004-12-30 KR KR1020040117235A patent/KR100660321B1/ko active IP Right Grant
-
2005
- 2005-12-16 CN CNB2005101320455A patent/CN100530668C/zh not_active Expired - Fee Related
- 2005-12-29 US US11/319,493 patent/US7279354B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN1797780A (zh) | 2006-07-05 |
US7279354B2 (en) | 2007-10-09 |
CN100530668C (zh) | 2009-08-19 |
KR20060077714A (ko) | 2006-07-05 |
US20060145218A1 (en) | 2006-07-06 |
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