KR100654085B1 - Process for the production of printedwiring board - Google Patents

Process for the production of printedwiring board Download PDF

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Publication number
KR100654085B1
KR100654085B1 KR1020050072709A KR20050072709A KR100654085B1 KR 100654085 B1 KR100654085 B1 KR 100654085B1 KR 1020050072709 A KR1020050072709 A KR 1020050072709A KR 20050072709 A KR20050072709 A KR 20050072709A KR 100654085 B1 KR100654085 B1 KR 100654085B1
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South Korea
Prior art keywords
circuit board
layer
burr
printed circuit
hole
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KR1020050072709A
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Korean (ko)
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이남규
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주식회사 신화테크
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A fabrication method of a sloop type through hole of a multi layered printed circuit board is provided to reduce the failure rate of products by perfectly removing a burr with a nylon brush. In a fabrication method of a sloop type through hole of a multi layered printed circuit board, a deburring process removes a burr on a nickel-gold plated layer placed on the cross section of a sloop by brushing with a nylon brush after corroding and removing the burr on a copper foil layer exposed on the cross section of the sloop with an alkaline copper etching solution by using a nickel-gold plated layer as a corrosion preventing layer.

Description

다층 인쇄회로기판의 슬루프형 스루홀 제조공법{process for the production of printedwiring board}Process for the production of printedwiring board

도 1은 종래의 인쇄회로기판의 제조공정도에 따른 인쇄회로기판을 나타낸 것으로서, (a1)~ (a5)는 제1공정 내지 제5공정중의 인쇄회로기판의 일부 단면도 이고, (a6)은 제6공정의 인쇄회로기판의 일부 평면도 이며, (a7)은 제7공정으로서 제6공정에 나타낸 도면의 "A"부 확대 사시도 이다.1 shows a printed circuit board according to a manufacturing process diagram of a conventional printed circuit board, wherein (a1) to (a5) are partial cross-sectional views of the printed circuit board during the first to fifth processes, and (a6) to FIG. A part plan view of the printed circuit board of step 6 is shown in (a7) in an enlarged perspective view of the portion "A" in the drawing shown in step 6 as the seventh step.

도 2는 본 발명의 제조공법에 의하여 완성된 다층 인쇄회로기판 제품의 사진이다.2 is a photograph of a multilayer printed circuit board product completed by the manufacturing method of the present invention.

*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

1; 프리프레그 2; 스루홀 3; 구리도금층One; Prepreg 2; Through hole 3; Copper Plating Layer

3a; 동박층 4; 단자접속부 5; 절연층3a; Copper foil layer 4; Terminal connection part 5; Insulation layer

6; 니켈-금도금층 10; 슬루프 20; 버6; Nickel-gold plated layer 10; Sloop 20; Burr

25; 로우터 26; 나일론브러시25; Rotor 26; Nylon brush

본 발명은 다층 인쇄회로기판의 슬루프형 스루홀 제조공법에 관한 것으로, 더 상세하게는 양면 및 다층 인쇄회로기판상의 외곽부 스루홀(through hole)들을 슬루프형(sloop type)으로 천공할 때 발생된 버(burr)를 효과적으로 디버링(deburring)할 수 있도록 하는 다층 인쇄회로기판의 슬루프형 스루홀 제조공법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a slew-type through hole of a multilayer printed circuit board, and more particularly, when the through-holes on the double-sided and multilayer printed circuit boards are drilled into a sloop type. The present invention relates to a method of manufacturing a slew-type through hole of a multilayer printed circuit board that enables effective deburring of burrs.

현재 사용되고 있는 인쇄회로기판은 전자제품의 소형 및 경량화에 따라 보다 다층 고밀도화 하고 있으며, 통상적으로 다층 인쇄회로기판은 4층 이상의 기판이 적층된 것을 말하는 것으로서 제조시 많은 기술과 정밀한 기술들이 요구된다.Printed circuit boards currently used are more multi-layered and densified according to the size and weight of electronic products. In general, multi-layered printed circuit boards are laminated with four or more layers of substrates, and many technologies and precise technologies are required in manufacturing.

도 1은 종래의 다층 인쇄회로기판의 제조공정을 설명하기 위한 도면으로서, 다층 인쇄회로기판을 제조하기 위해서는 먼저 에폭시수지로 된 원판의 단면 또는 양면에 동입힘 적층판(copper clad laminate)을 제조하고 이들을 드릴링공정과 에칭공정 등을 거쳐서 소망하는 패턴으로 배선이 인쇄된 회로기판을 마련한다.BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view for explaining a manufacturing process of a conventional multilayer printed circuit board. In order to manufacture a multilayer printed circuit board, first, a copper clad laminate is manufactured on one or both surfaces of an original plate made of epoxy resin. Through the drilling process and the etching process, a circuit board printed with wiring in a desired pattern is prepared.

그리고 다층 인쇄회로기판을 제조하기 위한 제1공정에서는 상기 회로기판들 사이에 접합부재인 프리프레그(1;prepreg)등을 넣고 핫프레스(hot press)로 가열압착하여 하나로 적층된 다층 인쇄회로기판을 제작한다.In the first process for manufacturing a multilayer printed circuit board, a prepreg (1), which is a joining member, is inserted between the circuit boards, and a single multilayer printed circuit board is manufactured by hot pressing using a hot press. do.

제2공정에서는 이와같이 제작된 다층 인쇄회로기판에 로우터(25;router) 등 드릴링머신을 이용하여 소정의 위치에 스루홀(2;through hole)을 천공한다. 이때 상기 스루홀(2)들은 배선패턴의 외곽부를 따라 일정간격으로 형성함으로써 추후에 설명될 제6공정에서 슬루프형으로 가공할 수 있다. 상기 스루홀(2)들의 직경은 0.25㎜, 피치(pitch)는 0.35㎜ 까지 형성하는 것이 가능하다.In the second process, a through hole 2 is drilled in a predetermined position by using a drilling machine such as a rotor 25 on the multilayer printed circuit board manufactured as described above. In this case, the through holes 2 may be formed at a predetermined interval along the outer portion of the wiring pattern, so that the through holes 2 may be processed into a slew type in the sixth process to be described later. The through holes 2 may have a diameter of 0.25 mm and a pitch of 0.35 mm.

제3공정에서는 천공된 스루홀(2)과 회로기판의 외층 표면에 다시 구리도금을 하여 15~30㎛의 구리도금층(3)을 형성한 후 배선패턴에 따라 에칭을 한다.In the third step, copper plating is performed on the perforated through hole 2 and the outer surface of the circuit board to form a copper plating layer 3 having a thickness of 15 to 30 μm, and then etching is performed according to the wiring pattern.

제4공정에서는 회로기판의 표면보호와 배선회로 사이의 쇼트를 방지하기 위하여 절연층(5)을 인쇄하게 된다. 이때 절연층(5)은 배선회로에 반도체 소자를 실장하기 위하여 동표면을 노출시켜야 하는 단자접속부(4)를 제외하고 회로기판의 외층 표면을 전체적으로 피복하게 된다.In the fourth step, the insulating layer 5 is printed in order to protect the surface of the circuit board and prevent a short circuit between the wiring circuits. At this time, the insulating layer 5 entirely covers the outer layer surface of the circuit board except for the terminal connecting portion 4 which must expose the copper surface in order to mount the semiconductor element in the wiring circuit.

제5공정에서는 상기 슬루프(10)홀 및 회로기판의 단자접속부(4)에 니켈-금도금을 실시한다. 이때 통상적으로 니켈-금도금층(6)의 두께는 3~5㎛정도 이다.In the fifth step, nickel-gold plating is performed on the hole 10 and the terminal connecting portion 4 of the circuit board. At this time, the thickness of the nickel-gold plated layer 6 is usually about 3 ~ 5㎛.

제6공정은 제2공정에서 실시한 스루홀(2)들을 따라 도면에서 점선으로 표시한 바와같이 슬루프(10)를 형성하는 공정이다. 상기 스루홀(2)들은 제2공정에서 회로기판상의 외곽부, 즉 일련의 배선패턴의 외곽부에 스루홀(2)들을 일정 간격으로 형성되어 있으므로 이들의 절반이 절개(切開)되도록 로우터(25)로 절개하여 슬루프(10)를 형성하게 된다. 이와같이 슬루프(10)를 형성하게 되면 스루홀(2)들은 반원형 요철로 형성된다. 이와같이 슬루프(10)를 로우터(25)로 절개하는 과정에서 회로기판의 절단면에 생긴 버(20;burr)가 생기게 된다.The sixth step is a step of forming the slop 10 along the through holes 2 performed in the second step as indicated by the dotted lines in the figure. The through holes 2 are formed at regular intervals in the outer part of the circuit board, that is, in the outer part of the series of wiring patterns in the second process, so that the rotors 25 are cut in half. ) To form a loop 10. When the slop 10 is formed in this way, the through holes 2 are formed of semicircular irregularities. In this way, a burr 20 is formed on the cut surface of the circuit board in the process of cutting the slop 10 into the rotor 25.

제7공정은 디버링(deburring)하는 공정으로서, 종래에는 로우터(25)로 슬루 프(10)단면을 2회 이상 왕복하여 연마한 후에 나일론브러시(26)로 브러싱하여 버(20;burr)를 제거함으로서 다층 인쇄회로기판의 제조 및 슬루프형 스루홀(2) 제조를 위한 주요공정을 완료하였다.The seventh step is a deburring process. In the related art, the cross section of the slop 10 is reciprocated twice or more with the rotor 25 and then brushed with a nylon brush 26 to remove burrs 20. In this way, the main processes for the manufacture of the multilayer printed circuit board and the manufacture of the slew-type through hole (2) were completed.

이와같은 공정을 거쳐 형성된 반원형 요철로 된 스루홀(2)과 칩(chip)형 반도체가 표면 실장되는 단자접속부(4)는 상호 회로연결되어 있다. 이때의 스루홀(2)은 메인보드 등에 미리 납땜된 소켓에 착탈식으로 탑재하기 위한 것이며 다층 인쇄회로기판의 슬루프형 스루홀(2)을 제조하는 공법의 특징이다.The semi-circular uneven through-holes 2 formed through such a process and the terminal connecting portion 4 on which the chip-type semiconductor is surface mounted are interconnected with each other. At this time, the through hole 2 is detachably mounted on a socket pre-soldered to a main board or the like, and is a feature of a method of manufacturing a slew type through hole 2 of a multilayer printed circuit board.

그러나, 종래의 제6공정에서 슬루프(10) 가공시 절단면에 생긴 버(20)가 드릴링 방향에 따라 스루홀(2)로 밀려들어가게 됨으로 제7공정에서 버(20)를 제거하기 위하여 로우터(25)로 수차례 연마하고 나일론브러시(26)로 브러싱하더라도 상대적으로 질기고 두꺼운 동박층(3a)의 버(20)가 잘 제거되지 않아서 최종 검사공정에서 육안검사시 많은 불량이 발생되고 있다.However, in the conventional sixth process, the burr 20 generated at the cutting surface during the processing of the slop 10 is pushed into the through hole 2 according to the drilling direction, so that the rotor 25 is removed to remove the burr 20 in the seventh process. Even after polishing several times with) and brushing with a nylon brush 26, the burr 20 of the relatively tough and thick copper foil layer 3a is not easily removed, and many defects are generated during visual inspection in the final inspection process.

또한, 제7공정에서 디버링을 위하여 로우터(25)를 통상 3회이상 왕복주행시켜야 함으로 디버링작업시간이 과다하게 소요되고 다층 인쇄회로기판의 연속제조공정 시간이 지연되는 폐단이 있었다. In addition, since the rotor 25 is normally reciprocated three times or more for the deburring in the seventh process, the deburring time is excessively consumed, and the continuous manufacturing process time of the multilayer printed circuit board is delayed.

본 발명은 슬루프 가공공정중 절단면에 생긴 버를 알카리성 동부식액을 사용하여 두꺼운 노출된 동박층의 버를 석택적으로 제거한 후에 얇고 제거가 용이한 니켈-금도금층의 버는 나일론브러시로 제거함으로서 버를 효과적으로 완벽하게 제거 함과 동시에 디버링 작업시간을 신속하게 진행실킬 수 있는 다층 인쇄회로기판의 슬루프형 스루홀 제조공법을 제시하고자 한다.According to the present invention, after burrs formed on the cutting surface during the slewing process are removed by using a copper eastern liquor, the burrs of the thin exposed copper foil layer are removed by the nylon brush. The present invention proposes a slew-type through-hole manufacturing method for multilayer printed circuit boards that can be completely removed and the deburring time can be accelerated.

다층 인쇄회로기판상에 인쇄된 배선패턴의 외곽부에 스루홀들을 일정간격으로 형성하여 슬루프형으로 가공할 수 있게 한 후, 천공된 스루홀과 회로기판의 배선패턴에 따라 회로기판의 외층 표면에 15~30㎛의 구리 도금층을 형성하고, 동표면을 노출시켜야 하는 단자접속부를 제외하고 회로기판의 외층 표면에 절연층을 인쇄한 다음, 상기 슬루프홀 및 회로기판의 단자접속부에 3~5㎛정도의 니켈-금도금층을 순차적으로 형성하고, 배선패턴의 외곽부에 형성한 상기 스루홀들의 절반이 절개(切開)되어 반원형 요철이 되도록 스루홀들을 따라서 로우터로 절개하여 슬루프를 형성하며, 로우터로 드릴링 하는 작업중에 상기 슬루프 단면에 생긴 버를 제거하기 위한 디버링(deburring)공정을 포함하는 다층 인쇄회로기판의 슬루프형 스루홀 제조공법에 있어서, 상기 디버링공정은 먼저 니켈-금도금층을 부식방지층으로 활용하여 알카리성 동부식액으로 슬루프 단면에 노출되어 있는 동박층의 버를 부식시켜 제거한 후, 나일론브러시로 브러싱하여 슬루프 단면에 있는 니켈-금도금층의 버(burr)를 제거하는 것에 특징이 있다.Through holes are formed in the outer part of the wiring pattern printed on the multilayer printed circuit board at a predetermined interval so that they can be processed into a loop shape, and then formed on the surface of the outer layer of the circuit board according to the perforated through holes and the wiring pattern of the circuit board. A copper plating layer having a thickness of 15 to 30 µm is formed, and an insulating layer is printed on the outer layer surface of the circuit board except for the terminal connection portion to which the copper surface is exposed, and then about 3 to 5 µm at the terminal connection portion of the slew hole and the circuit board. A nickel-gold plated layer was formed sequentially, and half of the through holes formed in the outer portion of the wiring pattern were cut to form a loop by cutting through the rotor along the through holes so as to form semicircular irregularities. In the slew-type through-hole manufacturing method of a multilayer printed circuit board comprising a deburring process for removing burrs formed on the cross-section of the slew during operation The deburring process first utilizes a nickel-gold plated layer as an anti-corrosion layer, and removes copper burrs exposed to the slop cross section with alkaline eastern saline solution, and then removes the burrs of the nickel-gold plated layer on the slop cross section by brushing them with a nylon brush. It is characterized by the removal of burrs.

이하, 본 발명의 구체적인 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

종래기술 설명에서 설명한 제6공정 까지는 본 발명의 공정과 동일하므로 구체적인 설명을 생략하기로 하며, 종래기술의 제7공정에 해당되는 디버링공정에서 큰 차이점이 있으므로 본 발명의 특징부인 디버링공정을 중점적으로 설명하기 로 한다.Since the sixth process described in the prior art description is the same as the process of the present invention, a detailed description thereof will be omitted, and since there is a big difference in the deburring process corresponding to the seventh process of the prior art, the deburring process, which is a feature of the present invention, is mainly focused on. Let's explain.

본 발명의 제1공정에서 제6공정은 순서와 방법에서 종래와 같으며, 종래와 동일한 공정은 도 1을 참조하여 설명하기로 한다.The sixth step in the first step of the present invention is the same as the conventional one in the order and method, and the same step will be described with reference to FIG.

즉, 접합부재인 프리프레그(1;prepreg)등을 넣고 핫프레스(hot press)로 가열압착하여 하나로 적층된 다층 인쇄회로기판을 제작하는 제1공정과, 다층 인쇄회로기판상에 인쇄된 배선패턴의 외곽부에 스루홀(2)들을 일정간격으로 형성하여 슬루프형으로 가공할 수 있게 하는 제2공정과, 천공된 스루홀(2)과 회로기판의 배선패턴에 따라 회로기판의 외층 표면에 15~30㎛의 구리도금층(3)을 형성하는 제3공정과, 동표면을 노출시켜야 하는 단자접속부(4)를 제외하고 회로기판의 외층 표면에 절연층(5)을 인쇄하는 제4공정과, 상기 슬루프(10)홀 및 회로기판의 단자접속부(4)에 3~5㎛정도의 니켈-금도금층(6)을 순차적으로 형성하는 제5공정과, 배선패턴의 외곽부에 형성한 상기 스루홀(2)들의 절반이 절개(切開)되어 반원형 요철이 되도록 스루홀(2)들을 따라서 로우터(25)로 절개하여 슬루프(10)를 형성하는 제6공정이 종래와 같다.That is, the first step of manufacturing a multilayer printed circuit board laminated by putting a prepreg (eg, prepreg), etc., which is a joining member, and hot pressing into a single press, and the wiring pattern printed on the multilayer printed circuit board According to the second process of forming through holes (2) at the outer part to be processed in a slop shape, and according to the wiring patterns of the perforated through holes (2) and the circuit board, 15 to A third step of forming the copper plating layer 3 having a thickness of 30 μm, a fourth step of printing the insulating layer 5 on the outer layer surface of the circuit board except for the terminal connecting portion 4 which should expose the copper surface, and A fifth step of sequentially forming a nickel-gold plated layer 6 having a thickness of about 3 to 5 μm in the slew 10 hole and the terminal connecting portion 4 of the circuit board, and the through hole formed in the outer portion of the wiring pattern ( Half of the 2) is cut into the rotor 25 along the through holes 2 so as to become semicircular irregularities. The sixth step of cutting to form the loop 10 is the same as in the prior art.

본 발명의 제7공정은 로우터(25)로 드릴링 하는 작업중에 슬루프(10) 단면에 생긴 버(20)를 제거하기 위한 디버링(deburring)공정으로서, 먼저 니켈-금도금층(6)을 부식방지층으로 활용하여 알카리성 동부식액으로 슬루프(10) 단면에 노출되 어 있는 동박층(3a)의 버(20)를 부식시켜 제거한 후, 나일론브러시(26)로 브러싱하여 슬루프(10) 단면에 있는 니켈-금도금층(6)의 버(20;burr)를 제거하는 것이다.The seventh process of the present invention is a deburring process for removing the burrs 20 formed on the cross section of the slop 10 during the drilling of the rotor 25, first of which the nickel-gold plated layer 6 is used as the corrosion protection layer. The copper copper layer (3a) exposed to the cross section of the slop (10) by alkaline eastern saline solution to corrode and removed, and then brushed with a nylon brush (26) to nickel-gold plating on the cross section of the slop (10) The burr 20 of the layer 6 is removed.

상기 알카리성 동부식액의 종류는 CuNH₄Cl 등이 있는데, 제6공정을 완료한 다층 인쇄회로기판을 알카리성 동부식액에 부식시키면 동이 노출된 부분만 부식된다. 즉, 제3공정에서는 회로기판의 동표면을 노출시켜야 하는 단자접속부(4)를 제외한 모든 외면에 절연층(5)을 형성하고 제4공정에서는 슬루프(10)홀 및 회로기판의 단자접속부(4)에 3~5㎛정도의 니켈-금도금층(6)을 형성하였으므로 알카리성 동부식액에 의하여 슬루프(10) 단면에 노출되어 있는 동박층(3a)의 버(20)만 제거된다. 이 동박층(3a)의 버(20)는 회로기판과의 부착력이 강하고 질기며 상대적으로 두꺼운 층이므로 나일론 브러시(26)로는 잘 제거되지 않지만 알카리 동부식액에 의하여 효과적으로 제거된다. 또한, 이 동박층(3a)의 버(20)가 스루홀(2)에 밀려들어가 있는 경우에도 알카리 동부식액으로 부식시키는데 지장이 없다.The type of alkaline eastern solution is CuNH 등 Cl, etc. When the multi-layer printed circuit board having completed the sixth step is eroded to the alkaline eastern solution, only copper is exposed. That is, in the third process, the insulating layer 5 is formed on all outer surfaces of the circuit board except for the terminal connection part 4 which should expose the copper surface of the circuit board. In the fourth process, the hole 10 and the terminal connection part 4 of the circuit board are formed. Since the nickel-gold plated layer 6 having a thickness of about 3 to 5 μm is formed in the c), only the burr 20 of the copper foil layer 3a exposed to the cross section of the slop 10 is removed by alkaline eastern solution. Since the burr 20 of the copper foil layer 3a is a strong, tough and relatively thick layer with the circuit board, it is not easily removed by the nylon brush 26 but is effectively removed by the alkaline eastern solution. Moreover, even when the bur 20 of this copper foil layer 3a is pushed in the through-hole 2, it does not interfere with corrosion by alkaline eastern food solution.

이와같이 본 발명의 제7공정에서는 1차적으로 동박층(3a)의 버(20)를 화학적으로 부식시키고 2차적으로 얇고 제거가 용이한 니켈-금도금층(6)의 버(20)는 나일론브러시(26)로 물리적으로 제거하게 된다.Thus, in the seventh step of the present invention, the burr 20 of the nickel-gold plated layer 6 which chemically corrodes the burr 20 of the copper foil layer 3a and is secondly thin and easy to remove is made of nylon brush ( 26) to be physically removed.

본 발명의 제7공정의 1단계와 2단계로 버(20)를 제거하는 작업은 다층 인쇄회로기판의 공정단계별 이송중에 자동적으로 연속작업을 할 수 있다. 도 2는 이와같은 공정을 통하여 완성된 다층 인쇄회로기판 제품의 사진이다.Removing the burr 20 in the first step and the second step of the seventh process of the present invention can automatically perform the continuous operation during the transfer step by step of the multilayer printed circuit board. 2 is a photograph of a multilayer printed circuit board product completed through such a process.

상술한 바와같이, 본 발명은 슬루프(10) 가공공정중 절단면에 생긴 버(20)를 알카리성 동부식액을 사용하여 두꺼운 노출된 동박층(3a)의 버(20)를 석택적으로 제거한 후에 얇고 제거가 용이한 니켈-금도금층(6)의 버(20)는 나일론브러시(26)로 제거함으로 버(20)가 완벽하게 제거되어 제품의 불량률을 감소시키며 1단계와 2단계를 다층 인쇄회로기판의 공정단계별 이송중에 자동적으로 연속작업을 실시할 수 있으므로 전체적인 공정시간을 단축시킬 수 있다As described above, the present invention thinly removes the burr 20 of the thick exposed copper foil layer 3a after alkaline removal of the burr 20 formed on the cut surface during the processing of the sloop 10 by using an alkaline eastern solution. The burr 20 of the easy nickel-gold plated layer 6 is removed by the nylon brush 26 to completely remove the burr 20, thereby reducing the defect rate of the product. Continuous operation can be performed automatically during the transfer of each process step, reducing overall process time

Claims (1)

다층 인쇄회로기판상에 인쇄된 배선패턴의 외곽부에 스루홀(2)들을 일정간격으로 형성하여 슬루프형으로 가공할 수 있게 한 후, 천공된 스루홀(2)과 회로기판의 배선패턴에 따라 회로기판의 외층 표면에 15~30㎛의 구리도금층(3)을 형성하고, 동표면을 노출시켜야 하는 단자접속부(4)를 제외하고 회로기판의 외층 표면에 절연층(5)을 인쇄한 다음, 상기 슬루프(10)홀 및 회로기판의 단자접속부(4)에 3~5㎛정도의 니켈-금도금층(6)을 순차적으로 형성하고, 배선패턴의 외곽부에 형성한 상기 스루홀(2)들의 절반이 절개(切開)되어 반원형 요철이 되도록 스루홀(2)들을 따라서 로우터(25)로 절개하여 슬루프(10)를 형성하며, 로우터(25)로 절개하는 작업중에 상기 슬루프(10) 단면에 생긴 버(20)를 제거하기 위한 디버링(deburring)공정을 포함하는 다층 인쇄회로기판의 슬루프형 스루홀(2) 제조공법에 있어서,Through holes (2) are formed at regular intervals on the outer side of the wiring pattern printed on the multilayer printed circuit board to be processed in a slop shape, and then according to the wiring patterns of the perforated through holes (2) and the circuit board A copper plating layer 3 having a thickness of 15 to 30 µm is formed on the outer surface of the circuit board, and the insulating layer 5 is printed on the outer surface of the circuit board except for the terminal connection part 4 which should expose the copper surface. The through-holes 2 formed in the slew 10 hole and the terminal connection part 4 of the circuit board are sequentially formed with a nickel-gold plated layer 6 having a thickness of about 3 to 5 μm, and formed in the outer portion of the wiring pattern. A half is cut and cut into the rotor 25 along the through holes 2 to form a semicircular unevenness, so that a slop 10 is formed, and the cross section of the slop 10 is formed during the cutting operation of the rotor 25. Slew of multilayer printed circuit boards including a deburring process to remove burrs 20 In the p-type through-hole (2) manufacturing method, 상기 디버링공정은 먼저 니켈-금도금층(6)을 부식방지층으로 활용하여 알카리성 동부식액으로 슬루프(10) 단면에 노출되어 있는 동박층(3a)의 버(20)를 부식시켜 제거한 후, 나일론브러시(26)로 브러싱하여 슬루프(10) 단면에 있는 니켈-금도금층(6)의 버(20;burr)를 제거하는 것을 특징으로 하는 다층 인쇄회로기판의 슬루프형 스루홀 제조공법.The deburring process first utilizes a nickel-gold plated layer 6 as an anti-corrosion layer to corrode and remove the burr 20 of the copper foil layer 3a exposed to the cross-section of the slough 10 with alkaline eastern solution, and then remove the nylon brush ( 26) A slew-type through hole manufacturing method of a multilayer printed circuit board, wherein the burr (20; burr) of the nickel-gold plated layer (6) in the cross section of the slop (10) is removed by brushing.
KR1020050072709A 2005-08-09 2005-08-09 Process for the production of printedwiring board KR100654085B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101524603B1 (en) * 2013-05-31 2015-06-01 (주)티엔씨 Dummy substrate and package substrate manufacturing method utilizing the same
US11490509B2 (en) 2020-10-20 2022-11-01 Samsung Electronics Co., Ltd. Module substrate and semiconductor module including the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101524603B1 (en) * 2013-05-31 2015-06-01 (주)티엔씨 Dummy substrate and package substrate manufacturing method utilizing the same
US11490509B2 (en) 2020-10-20 2022-11-01 Samsung Electronics Co., Ltd. Module substrate and semiconductor module including the same
US11792921B2 (en) 2020-10-20 2023-10-17 Samsung Electronics Co., Ltd. Module substrate and semiconductor module including the same

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