KR100647479B1 - apparatus for storing a gas bottle - Google Patents

Abstract

An apparatus for storing, in a cabinet unit, a gas container filled with gases for use in semiconductor manufacturing. The gas container is stored in the cabinet. At this time, the gas container is accommodated in the receiving portion having a concave shape on one surface. Then, the outside of the gas container is supported by using a buckle. At this time, the gas container is heated using a heating unit built in the accommodation unit. Therefore, the temperature of the gas used for manufacturing a semiconductor device can be easily adjusted by heating the gas container which stores the said gas.

Description

Apparatus for storing a gas bottle

1 is a block diagram illustrating an apparatus for storing a gas container according to an embodiment of the present invention.

It is a block diagram which shows the gas container accommodated in the accommodating part of FIG. 1 apparatus.

3 is a view showing a state where the receiving portion of the device of Figure 1 is installed in the cabinet.

4 is a cross-sectional view illustrating the buckle of FIG. 2.

Explanation of symbols on the main parts of the drawings

10: cabinet 12: receiving unit

13 heating unit 14 control unit

16: monitor 20: gas container

24: buckle 25: buckle heating portion

30: adhesive member 240a: teflon

240b: aluminum

The present invention relates to an apparatus for storing a gas container, and more particularly, to an apparatus for storing a gas container filled with gases used for semiconductor manufacturing in a cabinet unit.

In recent years, with the rapid spread of information media such as computers, semiconductor devices are also rapidly developing. In terms of its function, the semiconductor device is required to operate at a high speed and to have a large storage capacity. Accordingly, the manufacturing technology of the semiconductor device is being developed to improve the degree of integration, reliability, and response speed.

In the manufacture of the semiconductor device, most of them use chemical reactions or chemical phenomena. Therefore, chemical or gas is mainly used in the production.

Here, the gas used in the semiconductor device has variables such as flow rate, pressure or time. Specifically, the semiconductor device is manufactured by performing unit processes such as film formation, pattern formation, metal wiring formation, and the like. In this case, the unit processes vary the characteristics of a chemical reaction or chemical phenomenon. Therefore, the gas is to adjust the flow rate, pressure or time according to the characteristics of the unit processes.

Gases used in the semiconductor device may be classified according to pressure, phase, and chemical properties. That is, the pressure is classified into a low pressure gas or a high pressure gas, and the like. The pressure is classified into a compressed gas, a liquefied gas, and the like, and the chemical properties are classified into a flammable gas, a corrosive gas, or an inert gas.

Further, the gas is filled in a cylinder type gas container and provided to each unit process for manufacturing the semiconductor in a state of being stored in a cabinet containing the gas container.

Herein, the liquefied gas among the gases is filled in the gas container in a state in which a liquid state and a gas state appear simultaneously. At this time, a gas having a liquid state is filled in the lower part of the gas container, and a gas having a gas state is filled in the upper part of the gas container. Further, the liquefied gas is classified as a low pressure gas because the filling pressure has a state of 200 psig or less.

Therefore, when the liquefied gas filled in the gas container and stored in the cabinet is provided to the apparatus for performing each unit process, the filling pressure is low, and thus the correlation between the amount and pressure of the liquefied gas should be taken into consideration. Therefore, when the usage amount of the liquefied gas is large, the pressure of the liquefied gas is increased, and the liquefied gas with the increased pressure is provided. At this time, the pressure of the liquefied gas is increased by heating the liquefied gas. This is by gaseous state spinning of Boyle-Charles.

Here, the heating of the liquefied gas mainly takes place on a supply path (piping) provided from the cabinet to the device. That is, the effect of heating the liquefied gas is obtained by heating the supply path.

An example of heating the gas on the feed path is disclosed in US Pat. No. 5,019,159 to Muller et al., Et al.

However, control of the heating temperature of the gas is not easy when the gas is heated on the providing path. This is because the indirect heating method of heating the providing path is adopted. And, when the cabinet and a plurality of devices are connected, the amount of use of the gas increases. At this time, the gas passes through the providing path in a liquid state. Therefore, even when the providing path is heated, the device may be provided with liquid gas.

Therefore, the temperature control for heating the gas is not easy by adopting an indirect heating method as the heating method for raising the pressure of the gas. As a result, it is not possible to provide the device with a gas adjusted to optimal conditions. Therefore, the gas condition employing the heating method serves as a source of failure in the manufacture of semiconductor devices in recent years requiring fine process conditions, and causes a problem of lowering the reliability of the manufacturing of semiconductor devices.

SUMMARY OF THE INVENTION An object of the present invention is to provide an apparatus for storing a gas container for heating the gas container storing the gas to easily control the temperature of the gas used in the manufacture of the semiconductor device.

An apparatus for storing a gas container of the present invention for achieving the above object is provided in a cabinet for storing a gas container for filling gas, one surface that the gas container is interviewed has a concave shape, to accommodate the gas container An accommodation unit for the storage unit, a heating unit for heating the gas container housed in the accommodation unit, and installed at the same height on both sides of the accommodation unit, when the gas container is accommodated in the accommodation unit. It includes a buckle for supporting the gas container by surrounding the outer periphery of the gas container from both sides of the receiving portion.

And a control unit connected to the heating unit and controlling a temperature heated by the heating unit, and a monitor connected to the control unit and monitoring a temperature controlled by the control unit, thereby heating the gas more easily. It is possible to adjust the temperature of the gas by the heating.

The receptacle is made of a stainless steel material, is installed in the cabinet using an adhesive member made of Teflon material, embedded in the buckle, the buckle heating for heating the gas container when supporting the gas container with the buckle In this case, the buckle is made of a Teflon material, and formed to surround the outer surface of the buckle with aluminum tape to maximize the heating efficiency when heating the gas.

The accommodating portion is partitioned into at least two or more, and the accommodating portion divided into two or more may include a heating portion for heating the gas container to different temperatures, thereby efficiently heating the gas.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

1 is a block diagram illustrating an apparatus for storing a gas container according to an embodiment of the present invention.

Referring to FIG. 1, the illustrated device includes a cabinet 10. At this time, the cabinet 10 is a cabinet 10 for storing a gas container filled with a gas used for semiconductor manufacturing. Thus, the cabinet 10 is connected with the device for manufacturing the semiconductor. That is, it has a structure which is connected with the gas container of the said cabinet 10 and the said manufacturing apparatus by the conveying member containing piping etc., and provides the manufacturing apparatus with the gas filled in the said gas container through the said conveying member.

In addition, the cabinet 10 is provided with a receiving portion 12 for receiving the gas container when storing the gas container. At this time, the receiving portion 12 has a concave shape on one surface. Therefore, the gas container has a configuration in which the gas container is interviewed on one surface having a concave shape.

It is a block diagram which shows the gas container accommodated in the accommodating part of FIG. 1 apparatus.

Referring to FIG. 2, the gas container 20 is accommodated in the accommodation part 12. At this time, the gas container 20 is supported by a buckle (buckle) 24, the buckle 24 is installed at the same height on both sides of the receiving portion (12). Accordingly, the gas container 20 is accommodated in the container 12, and then connected to surround the outer portion of the gas container 20 using the buckle 24. Therefore, the gas container 20 can be easily accommodated and supported in the accommodation portion 12 through the fastening of the buckle 24.

In addition, the accommodating part 12 includes a heating part 13 for heating the gas container 20 accommodated in the accommodating part 12. The heating unit 13 is composed of a coil (not shown) and a member (not shown) for supplying power to the coil. Accordingly, the heating unit 13 supplies power to the coil, and has a configuration of heating the gas container 20 as an electrical resistance applied to the coil.

Here, the receiving portion 12 is divided into at least two or more. Therefore, the heating sections 13a, 13b, 13c are also embedded in each of the receiving sections 12 partitioned into two or more. This is for heating by varying the temperature depending on the position where the gas container 20 is accommodated. That is, the lower part of the gas container 20 is for heating to a higher temperature than the upper part of the gas container 20. As such, it is preferable that the accommodation portion 12 partitioned into at least two or more sections is partitioned into three parts. Therefore, it is preferable that the heating parts 13a, 13b, 13c are also provided in each of the three parts.

And by dividing the said accommodating part 12, the said buckle 24a, 24b, 24c is also provided in three parts. At this time, the buckle 24 has a configuration that can be adjusted in length according to the gas container (20). This length adjustment is made by forming a plurality of grooves in the portion to fasten the buckle 24, by fastening by the grooves.

3 is a view showing a state where the receiving portion of the device of Figure 1 is installed in the cabinet.

Referring to FIG. 3, the receiving part 12 is installed in the cabinet 10. Here, the accommodating part 12 is made of stainless steel, and the accommodating part 12 is installed in the cabinet 10 by using an adhesive member 30 made of a teflon material. do. In this case, the adhesive member 30 selects the teflon material to minimize heat transfer to the cabinet 10.

4 is a cross-sectional view illustrating the buckle of FIG. 2.

Referring to FIG. 4, the buckle 24 is illustrated, and the buckle 24 is also provided with a buckle heating unit 25 for heating the gas container 20. The buckle heating portion 25 is also composed of a coil (not shown) and a member (not shown) for supplying power to the coil, and the gas container 20 by an electrical resistance applied by supplying power to the coil. ) Is heated. Therefore, the buckle 24 is composed of a Teflon material (240a), the outer surface of the buckle 24 is made of a form wrapped around the aluminum tape (240b). That is, the buckle 24 also selects the Teflon material 240a and the aluminum tape 240b to minimize heat transfer to the outside. In addition, when partitioning the accommodating part 12 into at least two or more, the buckle heating part 25 embedded in the buckle 24 also has a configuration for heating the gas container 20 at different temperatures.

In addition, a control unit 14 for controlling the heating temperature when the gas container 20 is heated using the heating unit 13 and the buckle heating unit 25 is provided. Therefore, the heating temperature is controlled through the control unit 14. Even when the receiving part 12 is divided into three parts, and the heating part 13 and the buckle heating part 25 are respectively provided, the heating part 13 and the buckle heating are performed by the control part 14. Temperature control of the section 25 is possible. The control unit 14 is connected to a monitor 16 capable of monitoring the heating temperature by the heating unit 13 and the buckle heating unit 25. Accordingly, the heating temperature for heating the gas container 20 can be continuously monitored. In addition, a temperature sensor (not shown) may be installed in the heating unit 13 and the buckle heating unit 25, and the temperature may be controlled by sensing by the temperature sensor.

The gas container 20 accommodated in the accommodating part 12 is preferably a gas container 20 filled with a liquefied gas, and thus the heating part considers a temperature variation of the gas filled in the gas container 20. The lower portion has a configuration in which the gas container 20 is heated to a temperature higher than the upper portion. At this time, by adjusting the length and resistance of the coil constituting the heating portion 13 and the buckle heating portion 25, it is possible to configure the temperature according to the position.

An example of providing gas by the apparatus for storing the above-described gas container 20 is as follows. First, the gas container 20 filled with the liquefied gas is transferred to the cabinet 10. The gas container 20 is accommodated in the receiving portion 12 of the cabinet 10. At this time, the gas container 20 is in contact with one surface of the receiving portion 12 is concave. Then, the gas container 20 is surrounded by the buckle 24 and then the buckle 24 is fastened. As a result, the gas container 20 is supported by the receiving portion 12.

Subsequently, power is supplied to the heating unit 13 and the buckle heating unit 25. Accordingly, the heating part 13 and the buckle heating part 25 are heated by an electrical resistance. Therefore, the gas container 20 is heated. At this time, the gas container 20 of the lower part is heated to a temperature higher than the gas container 20 of the upper part. Then, the gas filled in the gas container 20 is transferred to a device for manufacturing a semiconductor. At this time, the temperature for heating the gas container 20 is controlled through the control unit 14 and the monitor 16.

As a result, it is possible to continuously provide a gas that optimally considers a correlation between the amount of gas used in the semiconductor manufacturing apparatus and the supply pressure for providing the gas. This is possible by adopting a method of directly heating the gas container 20. That is, because the thermal loss is minimized, and temperature control is easy. In addition, even when the amount of the gas increases, the gas container 20 may be directly heated to easily provide a gas in which the pressure is optimally adjusted.

Therefore, according to the present invention, it is possible to provide the apparatus with the gas adjusted under the optimum conditions. Therefore, the present invention can be actively applied to the manufacture of recent semiconductor devices requiring a fine process. Accordingly, by minimizing the defective source due to the gas conditions, it can be expected to improve the reliability of the semiconductor device manufacturing.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand that you can.

Claims (8)

An accommodating part installed in a cabinet for storing a gas container for filling gas, the one surface of which the gas container is interviewed has a concave shape, is divided into at least two, and a receiving part for accommodating the gas container; A heating unit which is built in each compartment of the receiving unit and heats the gas container to different temperatures; And It is installed at the same height on both sides of the receiving portion, and includes at least one buckle for supporting the gas container by surrounding the outer periphery of the gas container from both sides of the receiving portion when receiving the gas container in the receiving portion Apparatus for storing a gas container, characterized in that. The apparatus of claim 1, further comprising a control unit connected to the heating unit and controlling a temperature heated by each heating unit, and a monitor connected to the control unit and monitoring a temperature controlled by the control unit. A device for storing a gas container. The gas container as claimed in claim 1, wherein the receiving portion is made of stainless steel and installed in the cabinet using an adhesive member made of teflon. delete 2. The apparatus of claim 1, further comprising a buckle heating portion embedded in the buckle and heating the gas container when supporting the gas container with the buckle. According to claim 1, wherein the buckle is a device for storing a gas container, characterized in that the length is adjustable according to the gas container. The apparatus of claim 1, wherein the buckle is made of Teflon material and surrounds the outer surface of the buckle with aluminum tape. The apparatus of claim 1, wherein the gas vessel comprises a gas vessel for storing liquefied gas.

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