KR100640957B1 - Apparatus for moving the image sensor wafer - Google Patents

Apparatus for moving the image sensor wafer Download PDF

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KR100640957B1
KR100640957B1 KR1020040116475A KR20040116475A KR100640957B1 KR 100640957 B1 KR100640957 B1 KR 100640957B1 KR 1020040116475 A KR1020040116475 A KR 1020040116475A KR 20040116475 A KR20040116475 A KR 20040116475A KR 100640957 B1 KR100640957 B1 KR 100640957B1
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wafer
image sensor
groove
transport
present
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KR1020040116475A
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Korean (ko)
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KR20060077573A (en
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한창훈
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동부일렉트로닉스 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers

Abstract

본 발명은 이미지센서 웨이퍼의 운송기구에 관한 것으로, 운반용 홈을 가진 웨이퍼를 운반하기 위한 기구로서, 상기 운반용 홈에 대응하는 돌출부를 가진 간지와 충격흡수대를 포함하여 이루어진 웨이퍼 운반구를 제공하여 운송시 발생할 수 있는 간지와 마이크로렌즈와의 접촉에 의한 오염이나 손상을 방지할 수 있으며, 운송시의 진동이나 흔들림에 의한 웨이퍼 깨짐을 방지할 수 있다.The present invention relates to a transport mechanism of an image sensor wafer, which is a mechanism for transporting a wafer having a transport groove, which provides a wafer transport port including a slip sheet and a shock absorber having a protrusion corresponding to the transport groove, to be generated during transport. It is possible to prevent contamination or damage due to contact between the interleaved paper and the microlens, and to prevent wafer cracking due to vibration or shaking during transportation.

이미지센서, 웨이퍼, 운송Image sensor, wafer, transport

Description

이미지센서 웨이퍼 운송기구{Apparatus for moving the image sensor wafer}Apparatus for moving the image sensor wafer}

도 1은 통상의 CMOS 이미지 센서 웨이퍼의 운반시 적층구조도,1 is a stacked structure diagram of a conventional CMOS image sensor wafer during transportation;

도 2는 본 발명에 따른 운반용 홈이 형성되어 있는 웨이퍼 구조도,2 is a wafer structure diagram in which a conveying groove is formed according to the present invention;

도 3은 본 발명에 따라 웨이퍼와 간지 및 충격흡수대가 조립된 구조를 나타내는 도면,3 is a view showing a structure in which a wafer, an interleaver and an impact absorbing table are assembled according to the present invention;

도 4는 상기 충격흡수대와 웨이퍼 및 간지를 하나의 유닛으로 하여 세개의 유닛을 적층하여 패키징한 구조도이다.4 is a structural diagram in which three units are stacked and packaged using the shock absorber, the wafer, and the interlayer as one unit.

본 발명은 이미지센서 웨이퍼 운송기구에 관한 것으로, 특히 이미지센서 웨이퍼 완성품 제조 후 운송시 깨짐 방지와 오염방지 처리가 되어 있는 이미지센서 웨이퍼 운송기구에 관한 것이다.The present invention relates to an image sensor wafer transport mechanism, and more particularly, to an image sensor wafer transport mechanism that is processed to prevent cracking and contamination during transportation after manufacture of the finished image sensor wafer.

일반적으로 이미지센서는 광학영상을 전기적 신호로 변환시키는 반도체 모듈로서 그 영상신호를 저장 및 전송, 디스플레이 장치로 표시하기 위해 사용한다. 이미지 센서는 실리콘 반도체를 기반으로 한 고체촬상소자(Charge Coupled Device, 이하 "CCD"라 함)와 상보성금속산화막반도체(Complementary Metal Oxide Semiconductor, 이하 "CMOS"라 함)로 크게 두 가지로 분류된다. In general, an image sensor is a semiconductor module that converts an optical image into an electrical signal, and is used to display the image signal with a display device. Image sensors are largely classified into two types: a solid state imaging device (hereinafter referred to as "CCD") based on a silicon semiconductor and a complementary metal oxide semiconductor ("CMOS").

이와 같은 이미지 센서는 로직 공정과 달리 집광 능력을 향상시키기 위한 마이크로 렌즈 공정이 수반되며, 일반적으로 최상층에 형성된다. 이때 완성된 마이크로 렌즈는 젤과 비슷하게 불순물의 흡착이 용이하다.Unlike the logic process, such an image sensor is accompanied by a micro lens process for improving the light collecting capability, and is generally formed on the top layer. At this time, the completed micro lens is easy to adsorb impurities, similar to the gel.

또한 기기의 경량화 및 소형화를 위해 점점 이미지센서의 두께를 낮추도록 요구되고 있다.In addition, to reduce the weight and size of the device is increasingly required to reduce the thickness of the image sensor.

따라서 약 720㎛정도의 웨이퍼를 최종공정 후 약 420㎛정도 후면을 갈아 300㎛로 만들어서 웨이퍼를 이송하게 된다.Therefore, the wafer of about 720㎛ is ground to about 420㎛ after the final process to make 300㎛ to transfer the wafer.

이송시 약간의 진동이나 흔들림에도 웨이퍼의 깨짐이 발생하기 쉽기 때문에, 운송시 웨이퍼 하부에 스폰지를 넣고, 웨이퍼 위에는 간지를 끼어서 운반하는 것이 일반적이다. Since the wafer is easily cracked even after slight vibration or shaking during the transfer, it is common to put a sponge under the wafer during transportation and to put a slip sheet on the wafer.

도 1은 통상의 CMOS 이미지 센서 웨이퍼의 운반시 적층구조이다.1 is a stacked structure in transport of a conventional CMOS image sensor wafer.

모든 공정을 거쳐 완성된 CMOS 웨이퍼(10) 상단에 마이크로렌즈(12)가 형성되어 있으며, 이의 상단에는 간지(14)가 위치되어 있고, 하단에 스폰지(16)가 위치하는 형태를 보여주고 있다. 이 웨이퍼는 최종 가공된 후 후면가공(BACK GRINDING)을 하고나서 하단에 스폰지가 위치하고, 상부에 간지가 직접 닿는 구조이다.The microlens 12 is formed on the top of the CMOS wafer 10 which has been completed through all the processes, and an interlayer 14 is positioned on the upper end thereof, and the sponge 16 is positioned on the lower end thereof. The wafer is back processed (BACK GRINDING) after the final processing, the sponge is located at the bottom, and the kanji directly touches the top.

이러한 구조의 운송 형태는 간지가 웨이퍼 상부, 특히 마이크로렌즈와 직접 닿기 때문에 간지에 유발되는 불순물에 의해서 이미지 센서의 수율 감소가 초래된다.The transport mode of this structure results in a decrease in the yield of the image sensor due to impurities caused by the interleaver because the interleaver is in direct contact with the wafer top, in particular the microlens.

상기한 문제점을 해소하기 위한 본 발명은, 이미지센서 웨이퍼를 안전하게 운송하기 위한 운반구를 제공함에 그 목적이 있다.The present invention for solving the above problems, the object is to provide a transport for transporting the image sensor wafer safely.

상기 목적을 달성하기 위한 본 발명의 웨이퍼 운반구는, 운반용 홈을 가진 웨이퍼를 운반하기 위한 기구에 있어서, 상기 운반용 홈에 대응하는 돌출부를 가진 간지와 충격흡수대를 포함하여 이루어진 것을 특징으로 한다. The wafer carrier of the present invention for achieving the above object is characterized in that the mechanism for conveying a wafer having a conveying groove, comprising a slip sheet and a shock absorbing table having a projection corresponding to the conveying groove.

상기 돌출부의 두께는 홈의 크기 보다 작게 형성하고 높이는 홈의 깊이보다 크게 형성한 것이 바람직하다.The protrusion is preferably formed smaller than the size of the groove and the height is formed larger than the depth of the groove.

그리고, 상기 충격흡수대와 웨이퍼 및 간지를 하나의 유닛으로 하여 여러 개의 유닛을 적층하여 패키징 할 수 있다.In addition, the shock absorber, the wafer, and the interleaver may be packaged by stacking a plurality of units.

즉, 본 발명에 따른 웨이퍼 운반구는 종래의 간지를 요철이 있는 플라스틱으로 하여, 플라스틱이 요철과 웨이퍼에 형성된 홈을 밀착시켜 운송시 마이크로렌즈와 플라스틱이 접촉이 안되게 하는 것이다. 이 간지는 반드시 플라스틱에 제한되는 것은 아니다.In other words, the wafer carrier according to the present invention is to use a conventional slipper plastic with unevenness, the plastic is in close contact with the groove formed in the unevenness and the wafer so that the microlens and the plastic does not contact during transportation. This sheet is not necessarily limited to plastics.

한편 밀착된 웨이퍼와 플라스틱을 운반상자의 외부 클램프를 이용하여 운반 시 흔들림을 방지하여 웨이퍼의 깨짐을 방지할 수 있다. On the other hand, by using the outer clamp of the wafer and the plastic close contact box to prevent shaking during transportation can be prevented from breaking the wafer.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 보다 상세하게 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 운반용 홈(20)이 열십자 모양으로 형성되어 있는 웨 이퍼(W)를 나타내는 도면으로, 본 발명의 운반 상자를 이용하기 위해 홈(20)이 형성되어 있음을 볼 수 있다. 이때 홈의 폭 넓이는 130~50㎛정도로 형성하며 홈의 깊이는 약 2㎛정도로 한다.Figure 2 is a view showing a wafer (W) is formed in a cross shape of the carrying groove 20 according to the present invention, it can be seen that the groove 20 is formed to use the carrying box of the present invention. have. At this time, the width of the groove is formed to about 130 ~ 50㎛ and the depth of the groove is about 2㎛.

간지로서의 플라스틱, 동일한 패턴으로 상기 폭보다 10㎛/사이드 정도 작게 요철을 만든다.Plastic as an interlayer paper, irregularities are made to be about 10 탆 / side smaller than the width in the same pattern.

도 3은 본 발명에 따라 웨이퍼와 간지 및 충격흡수대가 조립된 구조를 나타내는 도면으로, 본 발명에 따른 마이크로렌즈(22)가 형성되어 있으며 운반을 위한 홈(20)이 형성되어 있는 웨이퍼(24)의 상단에 상기 홈(20)에 대응되게 돌출된 돌출부를 갖는 플라스틱 간지(26)가 위치하며, 하단에는 충격흡수대(28)가 위치하여 충격을 흡수할 수 있도록 되어 있다. 상기 충격흡수대(28)는 스폰지나 이와 유사한 형태로 진동과 흔들림에 의한 충격을 흡수할 수 있는 재질이면 모두 사용 가능하다.3 is a view illustrating a structure in which a wafer, an interleaver, and an impact absorbing table are assembled according to the present invention, in which a microlens 22 according to the present invention is formed and a groove 20 for transporting is formed. The plastic slip sheet 26 having a protrusion projecting to correspond to the groove 20 is located at the upper end of the shock absorber 28 is positioned at the lower end to absorb the shock. The shock absorbing table 28 may be used as long as it is a material that can absorb shocks due to vibration and shaking in a sponge or similar form.

도 4는 상기 충격흡수대(28)와 웨이퍼(24) 및 간지(26)를 하나의 유닛으로 하여 세 개의 유닛을 적층하여 패키징한 구조도로서, 이와 같이 하나의 운반상자에 여러 개의 유닛을 적층하여 패키징 할 수 있다.FIG. 4 is a structural diagram in which three units are stacked and packaged using the shock absorber 28, the wafer 24, and the slip sheet 26 as one unit. Thus, packaging is performed by stacking several units in one transport box. can do.

이와 같이 본 발명에 따른 웨이퍼의 홈에 대응되는 돌출부를 갖는 간지로 인해 간지와 마이크로렌즈가 직접 접촉할 위험이 해소되어 오염문제가 없다.As described above, due to the separator having a protrusion corresponding to the groove of the wafer according to the present invention, the risk of direct contact between the separator and the microlens is eliminated, and there is no contamination problem.

본 발명에 따른 운반용 홈을 가진 웨이퍼를 운반하기 위한 기구로서, 상기 운반용 홈에 대응하는 돌출부를 가진 간지와 충격흡수대를 포함하여 이루어진 웨이퍼 운반구는 운송시 발생할 수 있는 간지와 마이크로렌즈와의 접촉에 의한 오염이나 손상을 방지할 수 있으며, 운송시의 진동이나 흔들림에 의한 웨이퍼 깨짐을 방지할 수 있다.An apparatus for transporting a wafer having a conveying groove according to the present invention, wherein the wafer conveying device including a slip sheet and a shock absorbing band having a protrusion corresponding to the conveying groove is formed by contact between the slip sheet and the microlens that may occur during transportation. Contamination or damage can be prevented, and wafer breakage due to vibration or shaking during transportation can be prevented.

Claims (3)

운반용 홈을 가진 웨이퍼를 운반하기 위한 기구에 있어서,A mechanism for carrying a wafer having a carrying groove, 상기 운반용 홈에 대응하는 돌출부를 가진 간지, 충격흡수대 및 상기 웨이퍼를 하나의 유닛으로 하여 여러개의 유닛을 적층하여 패키징한 것을 포함하는 것을 특징으로 하는 웨이퍼 운반구.Wafer carrying device comprising a package of a plurality of units stacked with a slip sheet having a projection corresponding to the conveying groove, the shock absorbing table and the wafer as a unit. 제1항에 있어서, 상기 돌출부의 두께는 홈의 크기 보다 작게 형성하고 높이는 홈의 깊이보다 크게 형성한 것을 특징으로 하는 웨이퍼 운반구.The wafer carrier of claim 1, wherein a thickness of the protrusion is smaller than a size of the groove, and a height is larger than a depth of the groove. 삭제delete
KR1020040116475A 2004-12-30 2004-12-30 Apparatus for moving the image sensor wafer KR100640957B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6119865A (en) 1998-11-12 2000-09-19 Oki Electric Industry Co., Ltd. Accommodation container and accommodating method
EP1139435A2 (en) 2000-03-28 2001-10-04 Omnivision Technologies Inc. Chip scale packaging for optical image sensing integrated circuits
US20020144927A1 (en) * 2001-04-10 2002-10-10 Brooks Ray G. IC wafer cushioned separators
JP2004262546A (en) 2002-09-06 2004-09-24 Epak Internatl Inc Plastic buffering material for packaging

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6119865A (en) 1998-11-12 2000-09-19 Oki Electric Industry Co., Ltd. Accommodation container and accommodating method
EP1139435A2 (en) 2000-03-28 2001-10-04 Omnivision Technologies Inc. Chip scale packaging for optical image sensing integrated circuits
US20020144927A1 (en) * 2001-04-10 2002-10-10 Brooks Ray G. IC wafer cushioned separators
JP2004262546A (en) 2002-09-06 2004-09-24 Epak Internatl Inc Plastic buffering material for packaging

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