KR100625938B1 - Bond integrity test system for wire bonder - Google Patents

Abstract

The present invention relates to a bond integrity test system of wire bonding equipment, and more particularly to a wire spool holder assembly of a bond integrity test system.

That is, the present invention relates to a wire spool during construction of a bond integrity test system for determining whether wire bonding between a bonding pad of a semiconductor chip and a substrate is properly performed during wire bonding and whether the lead supply is continuously supplied well without being cut off. The structure of the holder assembly has been newly improved from the conventional brush slip ring contact method to the rotary electrical connector contact method, which prevents carbon powder, etc. from falling into the material, and at the same time prevents noise in the resistance measurement signal fed back to the BITS board. It was intended to provide a bond integrity test system of wire bonding equipment that prevents mixing and allows bond integrity testing to be completed.

Bond Integrity Test System, BITS Board, Swivel Electrical Connector, Brush Slip Ring Contact, Semiconductor Package, Wire Bonding

Description

Bond Integrity Test System for Wire Bonder

1 is an exploded perspective view illustrating a wire spool holder assembly in a bond integrity test system of a wire bonding apparatus according to the present invention;

Figure 2a, 2b, 2c is an assembled perspective view showing a wire spool holder assembly of the bond integrity test system of the wire bonding equipment according to the present invention, an assembly perspective view showing a state before the motor and the wire spool holder is mounted,

2d is a schematic diagram showing an internal structure of a rotary electrical connector applied to a wire spool holder assembly according to the present invention;

3 is an assembled perspective view showing the wire spool holder assembly in the bond integrity test system of the wire bonding equipment according to the present invention, the assembled perspective view showing the pre-mounted state of the motor,

4 is an assembled perspective view showing the wire spool holder assembly in the bond integrity test system of the wire bonding equipment according to the present invention, the assembled perspective view showing a complete assembly state,

5 is a circuit connection diagram of the bond integrity test system of the wire bonding equipment, illustrating a principle that can reduce the contact resistance;

6 is an exploded perspective view showing a wire spool holder assembly in a conventional bond integrity test system;

7 is an assembled perspective view showing a wire spool holder assembly in a conventional bond integrity test system;

8 is a side view showing contact friction between the brush slip ring of the wire spool holder assembly and the spool holder shaft in a conventional bond integrity test system;

9 is a waveform diagram illustrating that noise occurs due to contact friction between a brush slip ring of a wire spool holder assembly and a spool holder shaft in a conventional bond integrity test system;

10 is a system diagram illustrating a bond integrity test system of wire bonding equipment;

11 and 12 are waveform diagrams comparing before and after improvement of the bond integrity test system of the wire bonding equipment,

<Explanation of symbols for the main parts of the drawings>

10: BITS Board 12: Wire

14: wire spool holder 16: motor

18: wire spool 20: rotary electrical connector

22: power transmission case 24: the first mounting hole

26: 2nd mounting hole 28: 3rd mounting hole

30: spool shaft 32: auxiliary shaft

34: 1st helical gear 36: main shaft

38: second helical gear 40: bearing

42: wiring 44: fixture

46: rotating body 48: conductive mercury

50: rotation axis 52: support end

54: main end wire fixed end 56: auxiliary end wire fixed end

60 through hole 62 support plate

64: contact brush

The present invention relates to a bond integrity test system of a wire bonding apparatus, and more particularly, a wire spool holder during construction of a bond integrity test system for determining whether wire bonding between a bonding pad of a semiconductor chip and a substrate is properly performed during a wire bonding process. The new structure has been improved from the conventional brush slip ring contact method to the rotary electrical connector contact method, which prevents carbon powder, etc. from falling down, and prevents the error signal caused by noise. The bond integrity test system of the wire bonding equipment to be made.

In general, a semiconductor package includes a chip attaching process for mounting a semiconductor chip in a chip attaching region of a substrate (a printed circuit board, a circuit film, and a lead frame), and a wire connecting a bonding pad of the semiconductor chip and a wire bonding region of the substrate with a wire. It is manufactured through the bonding process and the molding process performed in order to protect a semiconductor chip, a wire, etc. from the exterior.

With reference to Figure 10 attached to the configuration for the equipment (hereinafter referred to as wire bonder) for the wire bonding briefly as follows.

A wire feeding part, that is, a wire spool holder assembly 100, in which the wire is retractably wound; A diverting rod 200 for guiding the feeding direction of the wire toward the capillary and an air guide 300 for guiding the wire; A tensioner 400 for adjusting the tension of the wire; A capillary 500 in which a through hole of a small diameter is formed to be a final supply path of the wire to the material; It is configured to include an EFO wand 600 and the like to apply a high voltage to the discharged to the wire drawn to the lower end of the capillary to make a ball shape.

Therefore, ball bonding (also referred to as primary bonding) to the bonding pads of the semiconductor chip and stitch bonding (also referred to as secondary bonding) to the bonding region of the substrate are performed by the continuous sorting operation of the capillary.

On the other hand, the upper portion of the capillary 500 is a wire clamp 700 for cutting out the wire at the time when the primary and secondary bonding is finished.

The wire bonder having such a configuration and operation includes a Bond Integrity Test System (BITS) that determines in real time whether the wire is properly connected between the bonding pad of the semiconductor chip and the wire bonding area of the substrate.

The bond integrity test system is a system for determining in real time whether the wire is drawn out to the capillary without a short circuit and the wire bonding is properly performed during the wire bonding process for the material.

Herein, the bond integrity test system will be described in detail.

As shown in FIG. 10, a system diagram schematically illustrating a bond integrity test system of wire bonding equipment, the bond integrity test system of the wire bonder is substantially used to control the current flow of the BITS board 10 embedded in the wire bonder. It is done by

In order to control the current flow of the BITS board 10, a portion (wire spool holder assembly 100, a diverting rod 200, and a wire clamp 700) generating resistance by contacting a wire is connected in a state capable of energizing. do.

That is, the BITS board 10 and the wire spool holder assembly 100 are electrically connected by wiring, and the BITS board 10 and the diverting rod 200 are electrically connected by wiring. The BITS board 10 and the wire clamp 700 are electrically connected to each other by wiring.

Therefore, when the current is applied through each wire in the BITS board 10, the current flows to the wire 12 wound on the spool of the wire spool holder assembly 100, the diverting rod 200 and the Current flows through the wire 12 in contact with the diverting rod 200, and current flows through the wire clamp 700 and the wire 12 in contact with the wire clamp 700. ) Flows through the semiconductor chip or substrate of the material to the ground region (which is provided in the wire bonder).

At this time, the electrical contact resistance of the wire is generated, as shown in the circuit connection diagram of FIG. 5, the contact resistance of the wire spool holder assembly 100 (as described below, the spool shaft of the wire spool holder). Contact resistance between the contact brush and the contact brush), the contact resistance with the diverting rod 200, and the contact resistance with the wire clamp 700 are generated.

At this time, each contact resistance value is detected by the BITS board 10 as a feedback signal, and if it is within the reference value range, normal wire bonding proceeds. If it is outside the reference value range, it is determined that the wire bonding does not proceed properly.

That is, the presence of normal contact resistance means that the wire is properly drawn out to the capillary and finally the wire is bonded to the chip or the substrate, and thus, the normal wire bonding is in progress.

Here, look at the configuration of a conventional wire spool holder assembly as follows.

6 is an exploded perspective view showing the wire spool holder assembly in the conventional bond integrity test system, and FIG. 7 is a perspective view showing the assembled state thereof.

The conventional wire spool holder assembly adopts the electric connection method to the BITS board 10 and the wire 12 as a brush slip ring contact method. The configuration of the wire spool holder 14 is divided into the center. A support plate 62 in the form of a square plate having a through hole 60 into which the spool shaft 30 is inserted, a motor 16 mounted on the rear surface of the support plate 62, and a front surface of the support plate 62. It consists of a wire spool holder 14 to be mounted.

A contact brush 64 having an elastic force in the lateral direction as an inverted "U" shape is attached to one surface (the side opposite to the wire spool holder) around the through hole 60 of the support plate 62.

In this case, the contact brush 64 is connected to the BITS board 10 by wiring.

The wire spool holder 14 is a hollow cylindrical plastic molded body of which one side is open, and a plurality of auxiliary end wire fixing ends 56 are protrudingly attached to a circumferential surface thereof, and one side of the wire spool holder 14 is capable of energizing the fixing end 56. The metal spool shaft 30 is formed to protrude, and the main end wire fixing end 54 capable of conducting electricity to the spool shaft 30 is attached to the opposite side.

Therefore, the spool shaft 30 of the wire spool holder 14 is inserted through the through hole 60 of the support plate 62 and is coupled to the rotation shaft of the motor.

At this time, the outer diameter surface of the spool shaft 30 of the wire spool holder 14 is in a state in which the inner surface of the contact brush 64 of the support plate 62 is in electrical contact with each other.

On the other hand, the wire spool 18 is stored in the outer diameter surface of the wire spool holder 14 is wound around the wire spool 18, the end wire (wire end) of the wire wound on the wire spool 18 is the main end It is fixed to the wire fixing end 54 or the auxiliary end wire fixing end 56.

Therefore, the current signal applied from the BITS board 10 is connected to the wiring → contact brush 64 → spool shaft 30 of the wire spool holder 14 → main end wire fixing end 54 or auxiliary end wire fixing end ( 56) flows into the wire wound on the wire spool (18).

At this time, when the current signal is applied from the BITS board 10, the contact resistance in the wire spool holder assembly is determined as the contact resistance between the spool shaft 30 of the wire spool holder 14 and the contact brush 64. Done.

That is, when the coaxial wire spool holder 14 rotates with the rotation of the motor 16, the wire 12 is released from the spool 18 fastened to the wire spool holder 14 while the diverting rod ( The wire 12 is supplied to the capillary 500 via the 200, the air guide 300, and the wire clamp 700. Finally, the wire between the semiconductor chip and the substrate is moved up and down by the capillary 500. The bonding process is in progress.

The following problems have been caused by the conventional wire spool holder assembly made of such a configuration and operation.

When the coaxial wire spool holder rotates with the rotation of the motor, the contact brush and the spool shaft of the wire spool holder are in contact friction with each other.

That is, as shown in FIG. 8, as the spool shaft 30 of the wire spool holder 14 rotates, its outer diameter surface continuously touches the inner surface of the contact brush 64.

Due to this continuous contact friction, there is a problem that the coating surface of the spool shaft 30 is worn to fall toward the material generating chromium and carbon powder.

When the carbon powder falls on the material, it causes a fatal effect on the quality of the semiconductor chip and the substrate itself, and eventually causes a defect of the semiconductor package.

In particular, when the worn spool shaft 30 continuously rubs the inner surface of the contact brush 64, the resistance measurement signal is fed back to the BITS board 10 due to the increased frictional resistance. At this time, as shown in the waveform diagram of FIG. 9, noise is mixed together to act as a fake signal, and thus there is a problem of stopping the operation rate of the wire bonder.

The present invention has been researched and developed in order to solve the above problems. Whether the wire bonding between the bonding pad of the semiconductor chip and the substrate is properly performed during the wire bonding process, and whether the drawing out of the wire is continuously supplied well without being cut off. The structure of the wire spool holder assembly is newly improved from the conventional brush slip ring contact method to the rotary electrical connector contact method during the configuration of the bond integrity test system to be judged, thereby preventing carbon powder from falling and causing defects. The goal is to provide a bond integrity test system for wire bonding equipment that ensures that the bond integrity test is completed by preventing noise from mixing into the resistance measurement signal fed back to the BITS board.

In order to achieve the above object, the present invention provides a wire spool holder assembly for a bond integrity test system including a motor and a wire spool holder, comprising: power transmission means for transmitting a rotational force of the motor to a wire spool holder; It is attached to the power transmission means, and provides a bond integrity test system of the wire bonding equipment, characterized in that it comprises a rotary electrical connector for generating a contact resistance to the current signal of the BITS board at the same time the rotation of the wire spool holder.

In a preferred embodiment, the power transmission means has a first mounting hole through which the shaft of the motor is inserted and a second mounting hole through which the rotary electric connector is mounted, and on the opposite side thereof, the second mounting hole. A power transmission case coinciding in a straight direction and having a third mounting hole through which the spool shaft of the wire spool holder is inserted; And a shaft and a gear assembly arranged inside the power transmission case so as to simultaneously transmit the rotational force of the motor to the spool shaft and the rotary electrical connector of the wire spool holder.

In a more preferred embodiment, the shaft and the gear combination includes an auxiliary shaft connected to the motor shaft; A first helical gear coupled to the auxiliary shaft; A main shaft for coaxially connecting the rotary electrical connector and the spool shaft of the wire spool holder; A second helical gear mounted to the main shaft and engaged with the first helical gear; It is attached to both ends of the main shaft is characterized in that consisting of a bearing supported on the inner wall surface of the power transmission case.

In a preferred embodiment, the rotary electrical connector includes a fixture to which wires connected to the BITS board are attached; A rotating body rotatably connected to the stationary body and energized; Characterized in that the bearing means for allowing a free rotation of the rotating body relative to the fixed body.

In particular, the bearing means is conductive mercury filled in the interior of the fixture to enable electricity to be connected to the wiring connected to the BITS board, one end is contained in the mercury and the other end is projected to the back of the fixture and the rotating body and It is characterized by consisting of a rotating shaft coupled.

In addition, the outer peripheral surface of the second mounting hole of the power transmission case is characterized in that the support end of the semi-circular cross-section that serves as the support of the rotary electrical connector is further formed integrally.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view illustrating a wire spool holder assembly in a bond integrity test system of a wire bonding apparatus according to the present invention, FIG. 3 is an assembled perspective view illustrating a pre-mounting state of a motor, and FIG. Assembly perspective view.

As described above, the wire spool holder assembly of the bond integrity test system includes a motor 16 which transmits rotational force to the wire spool holder, and a wire spool holder 14 into which the wire wound spool 18 is inserted into the outer diameter surface. It is configured to include.

The present invention newly improves the structure of the wire spool holder assembly during the configuration of the bond integrity test system from the conventional brush slip ring contact method to the rotary electric connector contact method to prevent the phenomenon of carbon powder falling on the material and causing a defect. At the same time, the focus is on preventing noise from mixing into the resistance measurement signal fed back to the BITS board.

To this end, according to the present invention, the power transmission means for transmitting the rotational force of the motor 16 to the wire spool holder 14 and the current signal of the BITS board 10 at the same time as the rotation of the wire spool holder 14; It is provided with a rotary electrical connector 20 for generating a contact resistance.

The power transmission means consists of a power transmission case 22 and a shaft and gear assembly arranged inside the case.

The power transmission case 22 has a first mounting hole 24 into which a shaft of the motor 16 is inserted, and a second mounting hole 26 into which the rotary electric connector 20 is mounted, on one side thereof. It is formed in parallel to each other, and the opposite side is a rectangular in parallel with the second mounting hole 26 and the third mounting hole 28 through which the spool shaft 30 of the wire spool holder 14 is inserted. It is molded into a sieve structure.

The shaft and the gear combination are installed in a predetermined arrangement in the power transmission case 22, and the auxiliary shaft 32 is connected to the shaft of the motor 16 inserted through the first mounting hole 24. ) Is rotatably arranged, and the first helical gear 34 is integrally attached to the end of the auxiliary shaft 32.

In addition, the main shaft 36 is arranged right next to the auxiliary shaft 32 in the power transmission case 22, one end of the main shaft 36 is the second mounting hole 26 Is connected to the rotary electrical connector 20, and the other end is connected to the spool shaft 30 of the wire spool holder 14 through the third mounting hole (28).

In this case, a second helical gear 38 meshing with the first helical gear 34 is integrally attached to a predetermined position of the main shaft 36.

In addition, bearings 40 supported on the inner wall surface of the power transmission case 22 are fastened to both ends of the main shaft 36.

Here, the rotary electric connector connected to the main shaft through the second mounting hole of the power transmission case is as follows.

2A, 2B, and 2C are attached perspective views showing the wire spool holder assembly according to the present invention, which is a state before the motor and the wire spool holder are mounted, and a perspective view showing the assembled state of the rotary electric connector.

The rotary electrical connector 20 is a fixture 44 connected by the BITS board 10 and the wiring 42 and a rotor 46 connected to the fixture 44 so as to be rotatable and energized. The bearing means which allows the free rotation of the rotating body 46 is interposed at the joining position of this fixed body 44 and the rotating body 46.

Substantially, the configuration connected to the main shaft 36 through the second mounting hole 26 of the power transmission case 22 becomes the rotation body 46 of the rotary electrical connector 20.

Therefore, the fixture 44 which receives the current signal from the BITS board 10 maintains the fixed state without rotation because the wire 42 is connected, and is electrically connected to the fixture 44 at the same time. Only the rotor 46 connected to the main shaft 36 is to rotate.

At this time, the bearing means interposed between the fixed body 44 and the rotating body 46, as shown schematically in Figure 2d, the fixed body so as to enable electricity to the wiring 42 connected to the BITS board 10 44, a casing formed inside, a conductive mercury 48 filled in the casing, and one end of the conductive mercury 48 are protruded, and the other end protrudes through the back surface of the casing to rotate the rotating body. It consists of a rotation shaft 50 connected with 46.

Thus, when the rotating body 46 rotates, the rotating shaft 50 is free to rotate while being contained in a conductive mercury 48 that serves as a kind of bearing, the fixing body 44 is fixed without rotation Will remain intact.

On the other hand, the outer peripheral surface of the second mounting hole 26 of the power transmission case 22 is integrally formed with a support end 52 of a semi-circular cross section, thereby fixing / supporting the rotary electrical connector 20. Done.

The motor 16 and the wire spool holder 14 are mounted on the power transmission case 22 provided as described above, and the motor 16 is mounted on the first shaft of the power transmission case 22. It is connected to the auxiliary shaft 32 therein through the hole 24, the mounting of the wire spool holder 14 is the wire through the third mounting hole 28 of the power transmission case 22 It is made in connection with the spool shaft 30 of the spool holder 14.

Of course, a wire wound spool 18 is fastened to an outer diameter surface of the wire spool holder 14, and end wires (wire ends) of the wire wound on the spool 18 are connected to the wire spool holder 14. It is fixed to the main end wire fixing end 54 or the auxiliary end wire fixing end 56 provided.

Here, the operation state of the wire spool holder assembly of the present invention having the configuration as described above will be described.

When power is applied to the motor 16, the auxiliary shaft 32 in the power transmission case 22 rotates with the rotation of the motor shaft, and the first helical gear 34 attached to the auxiliary shaft 32 The main shaft 36 rotates together with the rotation of the second helical gear 38 engaged therewith.

Subsequently, the spool shaft 30 connected to the main shaft 36 rotates, and at the same time, the wire spool holder 14 and the wire wound spool 18 rotate together.

Accordingly, the wire is released from the spool 18 and the wire is supplied to the capillary 500 via the diverting rod 200, the air guide 300, and the wire clamp 700 in order, and finally the catch The wire bonding process between the bonding pad of the semiconductor chip and the wire bonding region of the substrate is performed by the vertical movement of the filler 500.

During this wire bonding process, the bond integrity test system proceeds simultaneously as follows.

The current signal applied from the BITS board 10 is the fixed body 44 of the rotary electrical connector 20 → the conductive mercury 48 in the fixed body 44 → the rotating body 46 contained in the conductive mercury 48. Rotation shaft 50 of the rotating body 46 main shaft 36 in the power transmission case 22 spool shaft 30 of the wire spool holder 14 fixing the main end wire of the wire spool holder 14 End 54 or secondary end wire fixing end 56 flows to wire 12 wound on wire spool 18.

Continuously, the current delivered to the wire 12 is transmitted to the end of the wire 12 drawn out through the capillary 500 and at the same time the wire bonding is performed, the ground region through the material including the semiconductor chip and the substrate. Will flow into the.

At this time, when a current signal is applied from the BITS board 10, the contact resistance of the wire spool holder assembly 100 is the contact resistance between the fixed body 44 and the rotating body 46 of the rotary electrical connector 20. Will be judged.

Accordingly, a contact resistance (= contact between the fixed body 44 of the rotary electric connector 20 and the rotating body 46) generated by the wire spool holder assembly 100 while a current signal is applied from the BITS board 10. Resistance), the contact resistance between the wire 12 and the diverting rod 200 as described above, and the contact resistance between the wire 12 and the wire clamp 700 are generated.

At this time, each contact resistance value is fed back to the BITS board 10 and detected. If it is within the reference value range, it is determined that normal wire bonding proceeds, and if it is outside the reference value range, the wire bonding does not proceed properly.

On the other hand, the reason that the noise is fed back to the BITS board 10 is the main cause of the change in the contact resistance value, it is preferable to maintain the low resistance value of the total resistance value so that such a change in contact resistance is not large.

That is, as shown in the circuit connection diagram of FIG. 5, the contact resistance of the wire spool holder assembly 100, the contact resistance between the wire 12 and the diverting rod 200, the wire 12 and Since the contact resistance between the wire clamps 700 is connected in parallel, even if one of the contact resistance values is reduced, the total resistance value is lowered.

Therefore, according to the present invention, there is a limit in lowering the contact resistance value between the wire 12 and the diverting rod 200 and the contact resistance value between the wire 12 and the wire clamp 700. This is to reduce the contact resistance of 100).

As a theoretical basis, the contact resistance of the wire spool holder assembly 100 is R1, the contact resistance between the wire 12 and the diverting rod 200 is R2, and the contact resistance between the wire 12 and the wire clamp 700 is R3. Assume that R1 &lt; R2, R3, the total resistance value R = (R1 x R2 x R3) / (R1 x R2) + (R2 x R3) + (R1 x R3).

For example, if R1 = 5Ω, R2 = 100Ω, R3 = 100Ω, the total resistance R = 50000/11000 = 4.55Ω <5Ω.

As such, by greatly lowering the contact resistance of the wire spool holder assembly 100, noise may be prevented from mixing when the resistance measurement signal is fed back to the BITS board 10.

The actual resistance measurement value is kept at a low fixed value below 1Ω.

Thus, according to the present invention, by improving the conventional brush slip ring contact method of increasing the contact resistance value to the rotary electrical connector contact method, it is possible to greatly reduce the contact resistance value of the wire spool holder assembly.

On the other hand, as an experimental example of the present invention, the oscilloscope was connected to the connection terminal of the BITS board, and the waveforms of the conventional brush slip ring contact method and the rotary electrical connector contact method of the present invention were observed. As shown in FIG. 11, it can be seen that noise is generated in the conventional brush slip ring contact method, and no noise is generated in the rotary electrical connector contact method of the present invention.

In addition, as shown in the accompanying waveform diagram of Fig. 12 showing the AC BITS analysis, it can be seen that the noise is generated in the conventional brush slip ring contact method, and the noise is not generated at all in the rotary electrical connector contact method of the present invention. It can be seen that the signal output.

As a result of these experiments, it was found that the rotary electrical connector contact method according to the present invention could prevent noise from mixing when the resistance measurement signal was fed back to the BITS board. The phenomenon of stopping can be prevented.

In addition, it is possible to completely solve the problem that the carbon powder is generated in the conventional brush slip ring contact method falling to the material to prevent the defect of the semiconductor package.

As described above, according to the bond integrity test system of the wire bonding equipment according to the present invention, the structure of the wire spool holder assembly during the configuration of the bond integrity test system is newly renewed from the conventional brush slip ring contact method to the rotary electric connector contact method. By improving, it is possible to prevent a phenomenon in which carbon powder or the like falls on the material and causes a defect.

In particular, by preventing noise from mixing into the resistance measurement signal fed back to the BITS board, the bond integrity test can be completed completely.

Claims (6)

A wire spool holder assembly for a bond integrity test system comprising a motor and a wire spool holder, Power transmission means for transmitting the rotational force of the motor to a wire spool holder; And a rotary electrical connector mounted to the power transmission means and configured to generate a contact resistance to a current signal of the BITS board simultaneously with the rotation of the wire spool holder. The method according to claim 1, The power transmission means is: The first mounting hole into which the shaft of the motor is inserted and the second mounting hole into which the rotary electric connector is mounted are formed in one side thereof, and the opposite side of the wire spool holder coincides linearly with the second mounting hole. A power transmission case having a third mounting hole through which the spool shaft is inserted; Bond integrity test system of the wire bonding equipment, characterized in that consisting of a shaft and gear assembly arranged inside the power transmission case to transmit the rotational force of the motor to the spool shaft and the rotary electrical connector of the wire spool holder at the same time. The method according to claim 1 or 2, The shaft and gear combination is: An auxiliary shaft connected to the motor shaft; A first helical gear coupled to the auxiliary shaft; A main shaft for coaxially connecting the rotary electrical connector and the spool shaft of the wire spool holder; A second helical gear mounted to the main shaft and engaged with the first helical gear; Bond integrity test system of the wire bonding equipment, characterized in that consisting of a bearing attached to both ends of the main shaft is supported on the inner wall surface of the power transmission case. The method according to claim 1 or 2, Bond integrity test system of the wire bonding equipment, characterized in that the support portion of the semi-circular cross-section that serves as the support for the rotary electrical connector is further formed integrally on the outer peripheral surface of the second mounting hole of the power transmission case. The method according to claim 1, The rotary electrical connector is: A fixture to which wires connected to the BITS board are attached; A rotating body rotatably connected to the fixed body and energized; Bond integrity test system of the wire bonding equipment, characterized in that consisting of a bearing means to allow free rotation of the rotating body relative to the fixture. The method according to claim 5, The bearing means is: Conductive mercury filled in the fixture to enable electricity to be connected to the BITS board; Bond integrity test system of the wire bonding equipment, characterized in that the one end is contained in the mercury and the other end is composed of a rotating shaft protruding to the rear surface of the fixture and coupled to the fixture.

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