KR100617195B1 - method for fabrication OLED of adhesion type - Google Patents

Abstract

The present invention is to fabricate an adhesive OLED having a physical contact enhanced by heat generation due to impact or driving. The adhesive OLED includes a bottom plate on which a pixel switch element, a pixel driving element, and the like are formed, and an organic material is stacked. An adhesive type OLED manufacturing method comprising an upper plate and adhering the upper plate and the lower plate to be electrically connected to each other, wherein the metal thin film for fusion is formed on at least one of the contact surfaces of the upper plate and the lower plate to be electrically connected to each other. And electrically contacting each other by contacting the upper plate and the lower plate through the formed fusion metal thin film, and heating the two substrates in contact for a predetermined time to 50 to 250 ° C. to fuse the fusion metal thin film. It consists of including.

Active Matrix Organic EL, OLED, Adhesive Organic EL

Description

Method for fabrication OLED of adhesion type

1 (a) to 1 (e) are views showing a method of manufacturing an adhesive OLED according to the prior art.

2 (a) to 2 (f) are views showing a method of manufacturing an adhesive OLED according to the present invention.

* Explanation of symbols for main parts of the drawings

10, 80: transparent substrate 20: semiconductor material

30 source-drain region 40 gate insulating film

50 gate electrode 60 interlayer insulating film

70: metal electrode 70 ': pixel electrode

90: anode electrode 100: insulating film

110: partition 120: spacer

130: hole injection layer 140: hole transport layer

150: light emitting layer 160: electron transport layer

170: electron injection layer 180: cathode electrode

190: Sealant 200, 200 ': Fusion metal thin film

210: heating plate

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive active matrix organic EL display, and more particularly, to an OLED fabrication method which minimizes defects due to thermal stress by introducing and fabricating a metal electrode that can be fused at low temperature to a contact point.

In general, an adhesive organic EL display (AM OLED) is composed of a lower plate on which a pixel switching element, a pixel driving element, and the like are formed, and an upper plate on which an organic material is stacked, and the upper and lower plates are bonded to each other to be electrically conductive. To implement the display.

At this time, the lower plate of the active-type adhesive organic EL display (AM OLED) is largely composed of a switching thin film transistor for switching each pixel portion, a driving thin film transistor, a storage capacitor, and a pixel electrode.

1 (a) to 1 (e) illustrate a method of fabricating an adhesive OLED according to the prior art, and show a plan view of the pixel portion in FIG. 1 (c), which will be described in detail with reference to the section A-A '. Is as follows.

FIG. 1 (a) is a view illustrating a lower plate manufacturing process in which a driving thin film transistor is built in a conventional adhesive OLED manufacturing.

As shown in FIG. 1A, a semiconductor material 20 such as silicon to be used as an active layer of a thin film transistor is formed and patterned on a transparent substrate 10 such as glass. After the gate insulating film 40 is formed thereon, the gate electrode 50 is deposited and then patterned. An impurity such as P is injected into a portion of the semiconductor layer 20 and heat-treated to form a thin film transistor and a source-drain region 30 to form an N-MOS.

Next, an interlayer insulating film 60 is deposited on the gate electrode 50, and a portion of the gate insulating film 40 and the interlayer insulating film 60 on the source-drain region 30 of the transistor is etched to form a contact hole. The lower plate is completed by depositing and patterning metal to form the metal electrode 70 and the pixel electrode 70 '.

Next, referring to Figure 1 (b) will be described as the top plate production.

FIG. 1B is a view illustrating a manufacturing process of the top plate in the conventional adhesive OLED fabrication.

As shown in FIG. 1B, a transparent conductive material having a high work function such as ITO and IZO is formed on the transparent substrate 80 such as glass as the anode electrode 90. In addition, after the insulating film 100 is formed using an insulating material such as polyimide on a portion of the anode electrode 90, the partition wall 110 is formed on the insulating film 100.

Next, an island-shaped spacer 120 is formed inside the pixel region using another insulating material, and then the hole injection layer 130 and the hole transport layer 140 are formed on the anode electrode 90. In addition, organic materials such as the emission layer 150, the electron transport layer 160, and the electron injection layer 170 are sequentially deposited.

Subsequently, a top plate is completed by depositing a conductive material having a low work function such as aluminum to the cathode electrode 180.

When the upper plate and the lower plate is manufactured as described above, the two displays are attached to each other as shown in FIG.

Figure 1 (d) is a view showing the adhesive OLED manufacturing method through the bonding of the produced top and bottom plate.

As shown in FIG. 1D, the cathode 180 formed on the spacer 120 is brought into contact with the pixel electrode 70 ′ formed on the lower plate when the upper plate and the lower plate are bonded to each other. do.

At this time, the method of joining the upper plate and the lower plate is made to seal the inside using a sealant (sealant 190) and then made a vacuum as shown in Figure 1 (e).

As such, when the upper and lower plates are vacuum-bonded to maintain physical contact, it is very important to ensure uniformity to have the same contact strength on all pixels.

개의 서브 픽셀을 갖는 것이 보통이므로 모든 픽셀이 지속적으로 일정한 접촉 강도에 따른 전류 특성이 유지되기 어려워질 수 있다. However, even with one display module,

Since it is common to have three subpixels, it may be difficult for all pixels to maintain current characteristics consistent with constant contact intensity.

Therefore, when the heat generated by the impact or driving is severe, a sub pixel having a low physical contact strength may have a problem in that dead pixels are generated due to contact drop.

Therefore, the present invention has been made to solve the above problems, the object of the present invention is to produce an adhesive OLED with a physical contact is enhanced by heat generated by the impact or driving.

Another object of the present invention is to introduce a metal thin film having a low melting point capable of thermal fusion or ultrasonic fusion to the two electrode parts in contact with the fusion after bonding to minimize the occurrence of defects (pixel defects) of the pixel due to thermal stress It is.

Adhesive OLED manufacturing method according to the present invention for achieving the above object is characterized in that the adhesive OLED is composed of a lower plate formed with a pixel switch element, a pixel driving element and the like, and an upper plate on which the organic material is laminated, In the adhesive type OLED manufacturing method for adhering the upper plate and the lower plate to be electrically connected to each other, forming a fusion metal thin film on at least one of the contact surface of the upper plate and the lower plate to be electrically connected to each other; Contacting the upper plate and the lower plate through the formed metal thin film for fusion and electrically conducting each other; and heating the two substrates in contact with each other for a predetermined time to 50 to 250 ° C. to fuse the metal thin film for fusion. have.

In this case, the fusion metal thin film is a metal having a melting point of less than 250 ℃, preferably In, Sn.

Another feature of the method of manufacturing an adhesive OLED according to the present invention for achieving the above object is the step of manufacturing a lower plate in which a thin film transistor for driving is embedded on a transparent substrate and an insulating film is deposited on the front surface, and first fusion bonding on the insulating film. Forming a metal thin film, forming an island-shaped spacer in the pixel region, and depositing organic materials of a hole injection layer, a hole transport layer, a light emitting layer, an electron transfer layer, and an electron injection layer on the front surface in order. Forming a second fusion metal thin film on the electron injection layer; and bonding the lower plate and the upper plate to the second fusion metal thin film formed on the electron injection layer and the first fusion formed on the lower plate. And contacting the metal thin film to be fused by heat to electrically conduct each other.

At this time, it is preferable to form any one of a metal electrode and a pixel electrode between the insulating film and the first fusion metal thin film.

The method may further include forming a cathode electrode between the electron injection layer and the second fusion metal thin film.

In this case, the electrically conducting may include sealing using a sealant in a vacuum state inside the upper plate and the lower plate, and bonding the two substrates bonded for a predetermined time using a heating plate or other controlled heating method. It is preferably made comprising a step of fusion bonding the first, second fusion metal thin film by heating to about 50 ~ 250 ℃.

In addition, the electrically conducting may include sealing using a sealant in a vacuum state inside the upper plate and the lower plate, and applying ultrasonic waves to both ends of the upper plate and the lower plate to form the first and second fusion metal thin films. It is preferable to include a step of generating and fusion local frictional heat on the contact.

Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments with reference to the accompanying drawings.

A preferred embodiment of the adhesive OLED manufacturing method according to the present invention will be described with reference to the accompanying drawings. In this case, the same reference numerals are used when the names used in the drawings according to the related art are the same as the description of the present invention.

The adhesive OLED according to the present invention is composed of a lower plate on which a pixel switch element, a pixel driving element, and the like are formed, and an upper plate on which organic substances are stacked, and the upper plate and the lower plate are bonded to each other to be electrically connected to each other. Implement.

At this time, the lower panel of the active-type adhesive organic EL display (AM OLED) is largely composed of a switching thin film transistor for switching each pixel portion, a driving thin film transistor, a storage capacitor, and a pixel electrode.

2 (a) to 2 (f) are views showing a method of manufacturing an adhesive OLED according to the present invention.

As shown in FIG. 2A, first, a semiconductor material 20 such as silicon to be used as an active layer of a thin film transistor is formed and patterned on a transparent substrate 10 such as glass. After the gate insulating film 40 is formed thereon, the gate electrode 50 is deposited and then patterned to be formed only on the semiconductor material 20. The source-drain regions 30 of the thin film transistors are formed in portions of the semiconductor material 20, respectively.

The interlayer insulating film 60 is deposited on the gate electrode 50, and the gate insulating film 40 and a portion of the interlayer insulating film 60 are etched on the source-drain region 30 of the thin film transistor to form a contact hump. After depositing and patterning the metal to form the metal electrode 70 and the pixel electrode 70 ', the bottom plate is completed by adding a metal thin film 200' for fusion.

At this time, the metal type that can be used is a metal having a melting point of 250 ℃ or less, for example, In, Sn and the like is possible.

Next, the top plate of the active-type adhesive organic EL display (AM OLED) first forms a spacer 120 using an insulating material in an island shape on a transparent substrate 80 such as glass. Thereafter, a high work function such as ITO and IZO and a transparent conductive material are formed as the anode electrode 90 and then patterned.

Subsequently, an insulating film 100 is formed on the edge of the anode electrode 90 and a portion around the spacer 120 formed by using an insulating material such as polyimide.

In addition, organic materials such as a hole injection layer 130, a hole transport layer 140, a light emitting layer 150, an electron transport layer 160, and an electron injection layer 170 are sequentially deposited on the anode electrode 90.

Next, the upper plate is completed by depositing a conductive material having a low work function such as aluminum to the capacitor electrode 180 and then adding a metal thin film 200 for fusion.

In this case, a metal having a melting point of 250 ° C. or less may be used as the metal type, and an example thereof may be In, Sn, or the like.

In this case, another material is not deposited on the fusion metal thin film 200 formed on the formed spacer 120 using a shadow mask.

That is, the metal thin film 200 formed on the spacer 120 is exposed, so that this portion can be in electrical contact with the fusion metal thin film 200 'formed on the lower plate.

When the upper and lower plates are manufactured in this manner, the two displays manufactured as shown in FIG. 2 (b) are bonded to each other to be bonded to each other, and the upper plate fusion metal thin film 200 formed on the spacer 120 is formed on the lower plate. The metal thin film 200 'is brought into contact with and electrically connected to each other.

In this way, the upper and lower plates are bonded to each other by vacuuming and then sealing using a sealant (sealant 190).

Then, as shown in Figure 2 (c), using a heating plate 210 or other controlled heating method by heating the two substrates bonded for a predetermined time to about 50 ~ 250 ℃ about the upper plate and lower plate fusion metal thin film 200 ( 200 ') are fused (200 ").

At this time, in another method, after sealing the upper plate and the lower plate using a sealant (sealant) in the vacuum state inside, and then applying ultrasonic waves to both ends of the upper plate and the lower plate fusion metal thin film 200 for the upper plate and the lower plate ( Local frictional heat is generated at the contact portion 200 ') to be fused (200 ").

As another embodiment, as shown in FIG. 2 (d), when the upper plate fusion metal electrode 200 and the lower plate pixel electrode 70 ′ have good adhesive strength and can be integrated during thermal or ultrasonic welding, only the upper plate fusion metal electrode 200 may be integrated. ), And then the two substrates bonded for a predetermined time using a heating plate 210 or other controlled heating method is heated to about 50 ~ 250 ℃ to fusion the metal thin film 200 for the top plate fusion.

In another embodiment, as shown in FIG. 2 (e), when the lower electrode fusion metal electrode 200 'and the cathode electrode 180 of the upper plate have good adhesive strength and can be integrated during thermal or ultrasonic welding, only the lower plate fusion metal electrode After the 200 'is formed, the two substrates bonded to each other for a predetermined time by using the heating plate 210 or other controlled heating method are heated to about 50 to 250 ° C. so that the metal thin film 200' for the upper plate is fused. do.

2 (f) shows that the upper electrode fusion metal electrode 200 and / or the lower electrode fusion metal electrode 200 'are respectively a cathode electrode 180 of the upper plate, a metal electrode of the lower plate and a pixel electrode 70, 70'. When the electroluminescent properties are similar to each other, a case in which at least one of the cathode electrode 180 and / or the lower metal electrode and the pixel electrode 70 and 70 'layers of the upper plate is excluded is shown as another embodiment.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the spirit of the present invention.

Therefore, the technical scope of the present invention should not be limited to the contents described in the embodiments, but should be defined by the claims.

As described above, in the adhesive OLED manufacturing method according to the present invention, when the upper and lower plates are vacuum-bonded to maintain physical contact, it is practically difficult to secure uniformity so that all pixels have the same contact strength. In the case of manufacturing as in the present invention, in addition to the bonding force by the vacuum, it is integrated in the form of a metal having a soft contact portion by heat fusion can reinforce the property to maintain the bonding. As a result, even when the heat generated by the impact or driving is severe, it is possible to minimize a case in which dead pixels are generated due to contact loss or incompleteness.

Claims (9)

Adhesive OLED is composed of a bottom plate on which a pixel switch element, a pixel driving element, and the like are formed, and an upper plate on which organic materials are laminated, and in the adhesive OLED fabrication method in which the top plate and the bottom plate are bonded to each other to be electrically conductive. , Forming a fusion metal thin film on at least one or more of the contact surfaces of the upper plate and the lower plate to be electrically conductively bonded to each other; Contacting the upper plate and the lower plate through the formed fusion metal thin film to electrically conduct each other; Bonding the two substrates contacted for a predetermined time to 50 ~ 250 ℃ fusion welding the metal thin film comprising the adhesive OLED manufacturing method comprising a. The method of claim 1, The fusion metal thin film is an adhesive OLED manufacturing method, characterized in that the metal having a melting point of less than 250 ℃. The method of claim 2, The fusion metal thin film is an adhesive OLED manufacturing method, characterized in that In, Sn. Manufacturing a lower plate on which a thin film transistor for driving is embedded on a transparent substrate and an insulating film is deposited on the front surface; Forming a first fusion metal thin film on the insulating film; Forming a top plate by forming an island-shaped spacer in the pixel region, and depositing organic materials of a hole injection layer, a hole transport layer, a light emitting layer, an electron transfer layer, and an electron injection layer in order on the front surface; Forming a second fusion metal thin film on the electron injection layer; Bonding the lower plate and the upper plate, contacting the second fusion metal thin film formed on the electron injection layer and the first fusion metal thin film formed on the lower plate, and fusion bonding by heat to electrically conduct each other. Adhesive type OLED manufacturing method characterized in that. The method of claim 4, wherein The method of claim 1 further comprising the step of forming any one of a metal electrode and a pixel electrode between the insulating film and the first fusion metal thin film. The method of claim 4, wherein The method of claim 1, further comprising forming a cathode electrode between the electron injection layer and the second fusion metal thin film. 5. The method of claim 4, wherein said electrically conducting step Sealing the upper and lower plates using a sealant in a vacuum state therein; A method of manufacturing an adhesive OLED comprising the step of fusion bonding the first and second fusion metal thin films by heating two substrates bonded for a predetermined time using a heating plate or other controlled heating method to about 50 to 250 ° C. . 5. The method of claim 4, wherein said electrically conducting step Sealing the upper and lower plates using a sealant in a vacuum state therein; A method of manufacturing an adhesive OLED comprising the steps of applying ultrasonic waves to both ends of the upper and lower plates to generate localized frictional heat at the contact portions of the first and second fusion metal thin films. The method of claim 4, wherein The first and second fusion metal thin film is an adhesive OLED manufacturing method, characterized in that the metal having a melting point of less than 250 ℃.

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