KR100615329B1 - Method for preparation of plasma dispaly panel and pdp using the same - Google Patents

Abstract

 The present invention comprises the steps of manufacturing a mold on the glass; Plating a metal on the mold to form a thin film electrode; Laminating the adhesive on a separate polymer film; Attaching and separating the polymer film on the plated thin film electrode to detach the thin film electrode; Coating a plastic adhesive and frit on top of the thin film electrode detached from the polymer film; And forming a bus electrode by transferring the coated thin film electrode to a front substrate. In addition, the present invention discloses a plasma display panel having a mesh type electrode without using ITO by the above manufacturing method.

The bus electrodes manufactured by the present invention are disposed to face each other in the discharge space, and the mesh type electrodes are formed on the front substrate so as to have a line width within a predetermined range, thereby improving light transmittance in the discharge space. The total area of the sustain electrodes located in the discharge space can be reduced to eliminate the discharge delay. In addition, the initial drive voltage can be lowered, whereby the discharge efficiency can be improved.

Description

Method for preparing a plasma display panel and a plasma display panel manufactured using the same {Method for preparation of plasma dispaly panel and PDP using the same}

1 is a cross-sectional view illustrating a cross-sectional structure of a conventional plasma display panel unit cell.

2 is a schematic diagram illustrating an electrode manufacturing method of a plasma display panel according to an exemplary embodiment of the present invention.

3 is an exploded perspective view illustrating a plasma display panel according to an embodiment of the present invention.

4 is a schematic view illustrating the upper electrode structure of FIG. 3.

<Brief description of symbols for the main parts of the drawings>

31.Front board 32.Bus electrode

33.Front dielectric layer 34.Protective layer

310 ... back substrate 320 ... address electrode

330 back dielectric layer 340 bulkhead

350 ... main bulkhead 360 ... sub bulkhead

371R, 371G, 371B ... phosphor layer

The present invention relates to a method of manufacturing a plasma display panel, and more particularly, to a method of manufacturing a plasma display panel having an improved electrode using a transfer film and not using indium tin oxide (ITO).

Typically, a plasma display panel injects and discharges a discharge gas on two substrates having a plurality of electrodes, and then applies a discharge voltage. When the gas emits light between the electrodes due to the discharge voltage, an appropriate pulse voltage is applied. It refers to a display device that addresses a point where two electrodes intersect to implement a desired number, letter, or graphic.

The plasma display panel may be classified into a direct current type and an alternating current type according to a type of a driving voltage applied to a discharge cell, for example, a discharge type, and may be classified into a counter discharge type and a surface discharge type according to the configuration of the electrodes.

The DC plasma display panel has a structure in which all electrodes are exposed to a discharge space, and charges are directly transferred between corresponding electrodes. On the other hand, in the AC plasma display panel, at least one electrode is embedded in the dielectric layer, and instead of direct charge transfer between the corresponding electrodes, the ions and electrons generated by the discharge adhere to the surface of the dielectric layer to form a wall. A voltage may be formed and discharge may be maintained by a sustaining vlotage.

On the other hand, in the opposite discharge type plasma display panel, an address electrode and a scan electrode are provided to face each unit pixel, and addressing discharge and sustain discharge are generated between the two electrodes. On the other hand, in the surface discharge plasma display panel, an address electrode and a sustain electrode corresponding to each unit pixel are provided to generate addressing discharge and sustain discharge.

1 illustrates a unit cell cross-sectional structure of a conventional plasma display panel. Referring to the structure of the plasma display panel with reference to FIG. 1, a discharge sustaining electrode stand 15 is formed on the front glass substrate 14 by pairing a first electrode and a second electrode. The dielectric layer 16 is formed, and the dielectric layer is protected by a thin protective film 17.

On the other hand, inside the front glass substrate, there is a patterned ITO electrode on glass, a bus electrode is formed thereon, and a dielectric layer is printed by a printing method. The front glass substrate and the rear glass substrate face each other with a gap of several tens of micrometers, and an inert gas that generates ultraviolet rays is depressurized and sealed in the gap.

Then, an AC voltage is applied between the first electrode and the second electrode forming the discharge sustaining electrode stand, and when it reaches the discharge start voltage, an electric force line is generated and the inert gas is dissociated into electrons and ions by the electric force line. When it recombines, ultraviolet rays are generated, and the phosphor 13 which has been irradiated with the ultraviolet rays is colored.

The sustain electrode 15 is a sustain electrode having protrusions of tooth shape on the upper substrate, not shown. At this time, the sustain electrode 15 is made of a transparent electrode on which indium oxide or tin oxide is deposited, for example, an indium tin oxide (ITO) electrode. ITO electrodes are used in a variety of LCD, solar cells, etc. as a transparent electrode material.

Since sufficient wall charges must be accumulated on the entire surface of the sustain electrode, the initial driving voltage becomes high, and more than necessary power is consumed to lower the discharge efficiency. In order to realize surface discharge, transparent materials are used in spite of being expensive because other materials are used to hinder the transmission of light and thereby reduce the efficiency of plasma generation. Therefore, designing the discharge to occur without using the transparent electrode may reduce the cost and the process. Efforts have been made to configure the discharge to occur only with the bus electrode without using the transparent electrode.

However, in the case of the electrode pattern using the exposure paste process, if the line width of the bus electrode is reduced in order to improve the light transmittance, there is a problem in that the condensation rate after firing is large and the possibility of disconnection is large.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and provides a method of manufacturing a plasma display panel, which is composed of only a mesh bus electrode without using ITO, and the possibility of disconnection of the electrode is reduced by using the transfer method. There is a purpose.

Another object of the present invention is to provide a plasma display panel having a mesh type electrode manufactured by a transfer method to lower initial driving voltage and improve discharge efficiency.

In order to achieve the above object, the present invention,

Manufacturing a mold on the glass;

Plating a metal on the mold to form a thin film electrode;

Laminating the adhesive on a separate polymer film;

Attaching and separating the polymer film on the plated thin film electrode to detach the thin film electrode;

Coating a plastic adhesive and frit on top of the thin film electrode detached from the polymer film; And

It provides a method of manufacturing a plasma display panel having a mesh-type electrode comprising the step of transferring the coated thin film electrode to a front substrate to form a bus electrode.

In order to achieve the above another object, the present invention,

Front substrate;

A bus electrode formed on a lower surface of the front substrate;

A front dielectric layer filling the bus electrode;

A passivation layer formed on a lower surface of the front dielectric layer;

A rear substrate disposed to face the front substrate;

An address electrode formed on an upper surface of the rear substrate;

A back dielectric layer filling the address electrode;

Barrier ribs formed on the rear dielectric layer to partition discharge spaces; And

It includes; red, green, blue phosphor layer applied in the discharge space partitioned by the partition wall,

The line width of the bus electrode is provided by the plasma display panel having a mesh-type electrode arranged to face each other in the discharge space by using the transfer method.

Hereinafter, the present invention will be described in detail.

The present invention comprises the steps of manufacturing a mold on the glass; Plating a metal on the mold to form a thin film electrode; Laminating the adhesive on a separate polymer film; Attaching and separating the polymer film on the plated thin film electrode to detach the thin film electrode; Coating a plastic adhesive and frit on top of the thin film electrode detached from the polymer film; And transferring the coated thin film electrode to a front substrate to form a bus electrode.

It is preferable that the line width of the bus electrode is 5 to 40 µm and the thickness is 1 to 5 µm.

It is preferred that the metal is at least one selected from Ag, Pt and CrOx.

The polymer film is preferably polyethylene terephthalate.

The present invention also provides a front substrate; A bus electrode formed on a lower surface of the front substrate; A front dielectric layer filling the bus electrode; A passivation layer formed on a lower surface of the front dielectric layer; A rear substrate disposed to face the front substrate; An address electrode formed on an upper surface of the rear substrate; A back dielectric layer filling the address electrode; Barrier ribs formed on the rear dielectric layer to partition discharge spaces; And red, green, and blue phosphor layers applied in the discharge space partitioned by the partition wall.

The bus electrode provides a plasma display panel having a mesh type electrode formed using the transfer method and disposed to face each other in a discharge space.

It is preferable that the line width of the said bus electrode is 5-40 micrometers, and thickness is 1-5 micrometers.

The bus electrode is preferably at least one metal selected from Ag, Pt, and CrOx.

It is preferable that an adhesive agent and a frit are interposed between the bus electrode and the front substrate.

In the present invention, the sustain electrode is composed of only a mesh bus electrode without using ITO. In the case of using an ITO transparent electrode, the light transmittance is 75 to 90%, and in the case of an ITOless electrode, a transmittance of 80% or more of the ITO electrode may be secured. In order to obtain such transmittance with only the bus electrode without using the ITO electrode, the line width of the bus electrode should be within the range of 5-40 μm.

In order to perform the exposure paste process, a paste composition should be prepared. The paste composition includes frit as well as a metal component forming an electrode, and the frit and the metal are in a physically mixed state, so that expansion or contraction by heat occurs during the development and firing process, and thus an error limit generated in the line width It is not easy to reduce.

When the exposure paste process is used, the minimum line width that can be produced is 20 μm, and considering the error of the line width, it is formed within the range of 15 to 25 μm. Since the condensation rate after baking is 11% or less compared with the initial pattern width through the development and the baking process, the range of the line width is in the range of 13 to 23 µm. In such a case, it is possible to see a disconnection state after firing if viewed on a minimum value basis.

Therefore, in consideration of the process, the reliability of the process may be ensured at 40 μm or more in the case of the exposure electrode. In consideration of the above error, when the line width is set to 40 μm or more, the transmittance of light is remarkably inferior in the mesh type electrode. Accordingly, there is a need for a method of manufacturing a plasma display panel having a mesh type electrode which reduces the line width and reduces the risk of shrinkage or expansion, thereby improving light transmittance.

In the case of forming the mesh type electrode using the transfer method as in the present invention, since the electrode is made of pure metal only, it is possible to ensure high transmittance even at a small line width without expansion or contraction after firing.

2 illustrates a method of manufacturing a plasma display panel having a mesh type electrode according to an embodiment of the present invention.

Referring to the drawings, the adhesive 21 is attached to the upper portion of the glass substrate 22 to produce a mold. The mold can be produced by etching the glass paste. When the mold is manufactured, the line width of the bus electrode is considered in consideration of the design. This is because the width between the molds becomes the line width of the mesh type electrode used in the present invention.

The line width of the bus electrode may vary depending on the properties of the mold, but is preferably 5 to 40 μm. If the line width is less than 5 mu m, it is not easy in the manufacturing process. If the line width is more than 40 mu m, the total area of the bus electrode is increased, which is not preferable because the transmittance of light is significantly lowered.

It is preferable that the thickness of an electrode is 1-5 micrometers. If the thickness is out of range, it is difficult to secure the flatness of the dielectric coating on the electrode, and the dielectric will be thickened to secure the flatness or roughness, so that the capacitance will be large and the power loss will be large.

In addition, bus electrodes having various mesh shapes can be manufactured according to the shape of the mold fabrication. One example of the mesh type electrode is shown in FIGS. 3 and 4.

The metal material 23 used as an electrode is plated between the molds to form a thin film electrode. The metal material to be used is composed of pure metal only as the material which constitutes the electrode, and at least one metal selected from Ag, Pt, and CrOx is preferable.

The adhesive 25 is laminated on the separately prepared polymer film 24. The polymer film 24 used is preferably polyethylene terephthalate (PET). The thin film electrode 23 is detached by attaching and detaching the polymer film 24 having the adhesive 25 laminated thereon on top of the metal plated thin film electrode 23.

A plastic adhesive and a frit 26 are coated on the thin film electrode 23 detached from the polymer film 24. The plastic adhesive and frit 26 are for attaching the thin film electrode 23 to a front substrate.

The thin film plating electrode 23 coated with the plastic adhesive and the frit 26 is transferred to the front substrate 27 to form a bus electrode. The bus electrode according to the present invention is characterized in that a frit film is interposed between the front substrate and the pure metal material because the bus electrode according to the present invention uses a component such as frit for plating the pure metal component and attaching it to the front substrate. The frit film serves to firmly attach the metal electrode to the front substrate.

According to the invention, the front substrate; A bus electrode formed on a lower surface of the front substrate; A front dielectric layer filling the bus electrode; A passivation layer formed on a lower surface of the front dielectric layer; A rear substrate disposed to face the front substrate; An address electrode formed on an upper surface of the rear substrate; A back dielectric layer filling the address electrode; Barrier ribs formed on the rear dielectric layer to partition discharge spaces; And red, green, and blue phosphor layers applied in the discharge space partitioned by the partition wall, wherein the line widths of the bus electrodes are arranged to face each other in the discharge space using the transfer method. It provides a plasma display panel having a.

3 illustrates a plasma display panel 30 according to an embodiment of the present invention.

Referring to the drawings, the plasma display panel 30 is provided with a front substrate 31 and a rear substrate 310 which is provided to face the front substrate 31.

Bus electrodes 32 are formed on the bottom surface of the front substrate 31 to be spaced apart from each other by a predetermined interval. The bus electrodes 32 are arranged in a strip shape.

The bus electrode 32 is a mesh type electrode 40 disposed to face each other in the discharge space. The front dielectric layer 33 is formed on the bottom surface of the front substrate 31 on which the electrodes 32, 41, and 42 are formed. On the lower surface of the front dielectric layer 33, a protective film layer 34 such as a magnesium oxide film is coated on the entire surface.

The address electrode 320 is formed on the upper surface of the alignment substrate 310 disposed to face the front substrate 31 at a predetermined interval. The address electrode 320 is disposed in a direction orthogonal to the direction in which the bus electrode 32 is formed. A back dielectric layer 330 is formed on the upper surface of the address electrode 320 to fill it.

A partition wall 340 having a square delta type structure is formed on the top surface of the rear dielectric layer 330 to partition a discharge space and prevent cross talk. The partition wall 340 includes a main partition wall 350 and a sub partition wall 360 extending from both sides of the main partition wall 350 to both side walls.

The main partition walls 350 are spaced apart from each other in a direction orthogonal to the address electrode 320. The main partition wall 350 has a strip shape. The main partition wall 350 coincides with the position of the opaque bus electrode 32. Accordingly, the bus electrode 32 is disposed on the main partition wall 350 when the plasma display panel 30 is sealed, so that the bus electrode 32 is not exposed to the discharge space, thereby improving the aperture ratio.

The sub partition 360 is disposed in a direction orthogonal to the main partition 350. The sub barrier rib 360 may be formed of substantially the same material as the main barrier rib 350, and may be advantageously manufactured in an integrated process. The sub barrier rib 360 is formed in parallel with a direction in which the address electrode 320 is formed from both sidewalls of the main barrier wall 350. The sub partition 360 is connected between adjacent main partitions 350.

Red, green, and blue phosphor layers 371R, 371G, and 371B are formed inside the partition wall 340. The red, green, and blue phosphor layers 371R, 371G, and 371B are respectively applied to all regions in the discharge space formed by the combination of the main barrier rib 350 and the sub barrier rib 360.

In this case, the mesh patterns 41 and 42 of the bus electrodes 32 formed on the lower surface of the front substrate 31 may be manufactured to have a line width of 5 to 40 μm.

Since the transfer electrode is made of pure metal, it does not condense even after firing and there is no possibility of disconnection. In addition, it is possible to secure transmittance at a small line width. It is possible to produce the line width of 5 to 40 µm or less with the thickness of the electrode being 5 µm or less. In the planar structure of the electrode, it is possible to design in the direction of reducing the electrode width at the edge of the high density of the plasma and reducing the line width at the center side, thereby reducing the capacitance in this case.

FIG. 4 illustrates electrodes formed on the front substrate 31 of the plasma display panel 30 of FIG. 3.

Here, the same reference numerals as in the above-described drawings indicate the same members having the same function.

Referring to the drawings, a strip-shaped bus electrode 32 is formed on the front substrate 31. The bus electrodes 32 are arranged such that a plurality of bus electrodes 32 ₁ , 32 ₂ , 32 ₃ ... 32 _n-1 , 32 _n are spaced apart by a predetermined interval in a parallel direction. In this case, the main partition wall 350 (see FIG. 3) is positioned on the rear substrate 310 at the position corresponding to the bus electrode 32. The main partition wall 350 is exactly in position with the bus electrode 32 and is not shown in the drawing.

Sub barrier ribs 360 are disposed on both sidewalls of the main barrier rib 350, and the sub barrier rib 360 is positioned in a direction orthogonal to the bus electrode 32. The sub partitions 360 are disposed to be spaced apart from each other by the main partitions 350 adjacent to each other.

The main partition 350 and the sub partition 360 form a rectangular closed delta structure. Accordingly, the plasma display panel 30 is formed with a discharge space S divided into the main and sub barrier ribs 350 and 360.

Here, the mesh electrode 41 protruding from the bus electrode 32 ₁ to both sidewalls in a direction parallel to the direction in which the sub barrier rib 360 is formed from the bus electrode 32, and the first bus electrode ( 32 ₁ ) mesh-shaped bus electrodes 42 protruding from the second bus electrodes 32 ₂ adjacent to the sidewalls. The common and scan electrodes 42 are repeatedly formed along both sidewalls of the bus electrode 42.

In addition, the mesh type electrode 41 protruding from the adjacent bus electrode 42, that is, the first bus electrode 32 ₁ , and the mesh type electrode 42 protruding from the adjacent second bus electrode 32 _{2 are} provided. Are provided to face each other in the same discharge space (S). Opposing mesh-shaped electrodes 41 and 42 are arranged to be spaced apart from each other at a predetermined interval without being contacted by a tip.

It is preferable that the line width w of the bus electrode 40 in a mesh form is 5 to 40 micrometers.

Since the mesh 40 is integrally manufactured with the bus electrode 32, the mesh 40 may simplify the manufacturing process and may be advantageous. In this case, the sustain electrode 40 is not an ITO electrode, which is a transparent electrode, but an ITOless electrode to which ITO is not applied.

To this end, the mesh type electrode 40 may be selected from at least one metal selected from Ag, Pt, and CrOx, and is preferably an opaque metallic conductive material made of silver or a mixed material of silver.

Since the mesh type electrode 40 is opaque, the aperture ratio can be reduced in the discharge space S partitioned into the main partition wall 350 and the sub partition wall 360, but the line width within 5 to 40 micrometers as described above. Since it is formed to hold (w), the influence on the aperture ratio is insignificant.

The operation of the plasma display panel 30 having the above structure is as follows.

First, when a predetermined pulse voltage is applied to the scan electrode 42 of the front substrate 31 and the address electrode 320 of the rear substrate 310, an address discharge occurs and wall charges are generated on the inner wall of the discharge space S. FIG. Is formed.

When the driving voltage is applied to the adjacent bus electrode 33, that is, the first bus electrode 32 ₁ and the second bus electrode 32 ₂ adjacent thereto in the state where the wall charge is generated, the same discharge space S Discharge occurs in the meshed electrodes 41 and 42 disposed oppositely. That is, the mesh electrodes 41 and 42 cause discharge in the discharge space S due to the voltage difference of the wall charges.

The discharge causes surface discharge in the discharge regions of the front dielectric layer 33 and the dielectric protective layer 34 to generate ultraviolet rays. The fluorescent material of the red, green, and blue phosphor layers 371R, 371G, and 371B coated in the discharge space S partitioned into the main partition wall 350 and the sub partition wall 360 by the generated ultraviolet rays is excited. Color display is made.

That is, while space electrons present in the discharge cell are accelerated by the applied driving voltage, helium (Ne), which is an inert mixed gas filled with a pressure of about 400 to 500 Torr in the discharge cell, is mainly composed of helium (Ne). He), Xenon (Xe) gas and the like is added to the collision with the phening mixed gas.

Accordingly, 147 nanometers of ultraviolet rays are generated while the inert gas is excited. The generated ultraviolet rays generate visible light as they collide with the fluorescent materials of the phosphor layers 371R, 371G, and 371B applied in the address electrode 320 and the partition wall 340.

At this time, the mesh type electrode 40 protruding from the bus electrode 32 is designed so as not to affect the aperture ratio because the line width is formed within a specific range in one discharge space S, so that high resolution and high contrast can be achieved. The plasma display panel 30 may be provided.

Example

The difference in transmittance is shown in the mesh type bus electrodes with different line widths.

Line width (㎛) Calculated transmittance (%) / cm2 Transmittance (%) / cm2 on measurement 10 91.8 92.4 30 84.6 85.3 40 79.5 79.1 50 75.4 76.1

As shown in Table 1, the results of experiments varying the line width of the bus electrode indicate that the transmittance of light is significantly lowered when the line width of the bus electrode exceeds 40 μm, which is undesirable.

This is because when the line width is 50 μm or more, the transmittance of the panel emitting light is 80% or less, so that the panel does not enter the spec in the 42 inch or 50 inch standard panel. The transmittance of the panel itself must be 80% or more to satisfy the lower limit of the light transmission fall of the post process (when a filter is used). Since the transmittance of the filter is generally about 55%, assuming that the panel's light emission luminance is 1000 nit, the reduction in transmittance by the electrode 20% is 800 nit, and the filter attenuation is 440 nit. This is a slight drop in the final spec of the PDP, but it can be said to be a satisfactory level.

As described above, the plasma display panel having the mesh type electrode of the present invention can obtain the following effects.

First, by manufacturing the bus electrodes by the transfer method, the line width can be adjusted within a certain range and the possibility of disconnection can be reduced within the range of the line width. The aperture ratio can be improved.

Second, by removing the ITO electrode can simplify the manufacturing process and reduce the manufacturing cost.

Third, by forming the mesh type electrode on the front substrate to have a line width within a specific range, the total area of the bus electrodes located in the same discharge space is reduced, thereby eliminating the discharge delay and enabling high-speed addressing. In addition, the initial drive voltage can be lowered, whereby the discharge efficiency can be improved.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (8)

Manufacturing a mold on the glass; Plating a metal on the mold to form a thin film electrode; Laminating adhesive on separate polymer film Attaching and separating the polymer film on the plated thin film electrode to detach the thin film electrode; Coating a plastic pressure sensitive adhesive and a frit on top of the thin film plating electrode detached from the polymer film; And And transferring the coated thin film plating electrode to a front substrate to form a bus electrode. The method of manufacturing a plasma display panel having a mesh type electrode according to claim 1, wherein the line width of the bus electrode is 5 to 50 mu m and the thickness is 1 to 5 mu m. The method of claim 1, wherein the metal is at least one selected from Ag, Pt, and CrOx. The method of manufacturing a plasma display panel having a mesh type electrode according to claim 1, wherein the polymer film is polyethylene terephthalate. Front substrate; A bus electrode formed on a lower surface of the front substrate; A front dielectric layer filling the bus electrode; A passivation layer formed on a lower surface of the front dielectric layer; A rear substrate disposed to face the front substrate; An address electrode formed on an upper surface of the rear substrate; A back dielectric layer filling the address electrode; Barrier ribs formed on the rear dielectric layer to partition discharge spaces; And It includes; red, green, blue phosphor layer applied in the discharge space partitioned by the partition wall, 5. The plasma display panel of claim 1, wherein the bus electrode is formed using any one of the above-mentioned items and has a mesh-type electrode disposed to face each other in a discharge space. The method of claim 5, The line width of the bus electrode is 5 to 50 µm, and the thickness of the bus electrode is 1 to 5 µm. The method of claim 5, And the bus electrode has at least one metal selected from Ag, Pt, and CrOx. The method of claim 5, A plasma display panel having a mesh type electrode, wherein an adhesive and frit are inserted between the bus electrode and the front substrate.

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