KR100603385B1 - Plasma display module - Google Patents

Abstract

According to the present invention, a plasma display module is disclosed. The plasma display module may include a chassis base, a plasma display panel supported at the front of the chassis base to implement an image, a circuit unit supported at the rear of the chassis base and driving the plasma display panel, a connection for electrically connecting the plasma display panel and the circuit unit. A cable, a conductive heat dissipation plate fixed at the rear and grounded to the chassis base, and a conductive medium for electrically connecting the ground lead of the connection cable and the heat dissipation plate. According to the disclosed plasma display module, the ground stability is improved and heat dissipation of the integrated circuit chip is promoted.

Description

Plasma display module

1 is an exploded perspective view showing an example of a typical plasma display panel;

2 is a perspective view showing a part of a conventional plasma display module;

3 is an exploded perspective view showing a plasma display module according to a first embodiment of the present invention;

4 is a perspective view of a part of the plasma display module shown in FIG. 3;

5 and 6 are cross-sectional views taken along lines V-V and VI-VI of the plasma display module shown in FIG. 4;

7 is a perspective view of a portion of a plasma display module according to a second embodiment of the present invention;

8 and 9 are cross-sectional views taken along lines VII-VII and VII-VII of the plasma display module illustrated in FIG. 7,

10 is a cross-sectional view illustrating a modification of the plasma display module illustrated in FIG. 9.

 <Description of the symbols for the main parts of the drawings>

110: front panel 120: rear panel

130: plasma display panel 140: heat dissipation sheet

150,250 chassis base 151,251 reinforcement member

155,255: Connecting cable 155b, 255b: Lead wire

155ba, 255ba: Ground lead 155`, 255`: Ground hole

156,256: conductive medium 161,261: integrated circuit chip

162,262: circuit board 165,265: heat shield for integrated circuit chip

190,290: heat dissipation plate 191,291: conductive fastening member

The present invention relates to a plasma display module, and more particularly, to a plasma display module having improved grounding structure and heat dissipation structure.

The plasma display module is a flat panel display module that displays an image using a gas discharge phenomenon, and is excellent in various display capacities such as display capacity, brightness, contrast, afterimage, and viewing angle. In addition, it is attracting attention as a next-generation flat panel display module that can replace a CRT because of its thin and large screen display.

FIG. 1 illustrates an example of a plasma display panel provided in the plasma display module. For the convenience of description, the plasma display panel 30 is shown in an upward and downward direction. Referring to the drawings, the plasma display panel 30 includes a front panel 10 and a rear panel 20 which is bonded to the front panel 10.

The front panel 10 includes a front substrate 11, a plurality of discharge sustaining electrode pairs 16 formed on a rear surface of the front substrate 11, and a front dielectric layer 14 covering the discharge sustaining electrode pairs 16. And a protective layer 15. Meanwhile, the rear panel 20 includes a rear substrate 21, address electrodes 22 extending to intersect with the discharge sustaining electrode pair 16 on the rear substrate 21, and the address electrode 22. A phosphor layer coated over the partition wall 24 on the front surface of the back dielectric layer 23 and having a rear dielectric layer 23 and a partition wall 24 formed in a stripe pattern on the front surface of the rear dielectric layer 23. (25).

A driving signal is applied to the discharge sustaining electrodes 16 and the address electrodes 22 through a connecting cable 55 electrically connected to a circuit board. For example, one end of the address electrodes 22 may be connected to a connecting cable ( The conductive wire 55 is connected to the conductive lines 55b to receive a driving signal.

2 shows a plasma display module according to the prior art, wherein the connection cable 55 extends to the rear surface of the chassis base 50 and is connected to the circuit board 62. Accordingly, the ground lead 55ba of the connecting cable 55 to which the ground voltage is applied is electrically connected to the ground region of the circuit board 62, and the ground region of the circuit board 62 is grounded to the chassis base 50. , The connecting cable 55 is indirectly grounded.

However, according to the related art, the grounding of the connection cable 55 is indirectly made through the circuit board 62, resulting in an increase in the length of the ground voltage line, resulting in an increase in the line self-resistance and generation in and out of the module. It is vulnerable to noise, which causes a problem that the ground voltage is not kept constant. In addition, the grounding structure is complicated, the stability of the ground is reduced, there is a problem that the ground fault occurs due to external impact or vibration. In particular, since the structure of the plasma display panel tends to be high in recent years, mounting of a larger number of circuit elements and connecting cables is required. Further, an improvement in the grounding structure is required to solve such a problem.

Meanwhile, an integrated circuit chip 61 is mounted on the connection cable 55 to convert driving signals generated from a plurality of circuit elements mounted on the circuit board 62 and apply the same to the panel electrodes. ) Is tightly fixed between the two (51, 90) by the heat dissipation plate (90) engaging the reinforcing member (51) at its rear. In the integrated circuit chip 61, a large amount of heat is generated during driving. If they are not removed quickly, it is difficult to expect a smooth driving of the plasma display module. Therefore, the heat dissipation plate 90 in close contact with the integrated circuit chip 61 is formed of a metal material having excellent thermal conductivity, so that heat generated in the integrated circuit chip 61 is quickly discharged to the outside. By the way, according to the related art in which the contact between the heat dissipation plate 90 and the integrated circuit chip 61 is planar, the contact area between the both of the heat dissipation plate 90 is limited to one surface. There is a limit to improve the heat dissipation performance, in particular, a large number of integrated circuit chips must be mounted to drive the plasma display panel 30 to be high-definition, there is a great need to improve the heat dissipation structure.

The present invention has been made to solve the above problems, and an object thereof is to provide a plasma display module having an improved grounding structure.

Another object of the present invention is to provide a plasma display module having an improved heat dissipation structure of an integrated circuit chip.

In order to achieve the above objects and other objects, the plasma display module of the present invention,

Chassis base;

A plasma display panel supported in front of the chassis base and configured to implement an image;

A circuit unit supported behind the chassis base and driving the plasma display panel;

A connection cable electrically connecting the plasma display panel and the circuit unit;

A conductive heat dissipation plate fixed at the rear of the connection cable and grounded to the chassis base; And

And a conductive medium electrically connecting the ground lead of the connection cable and the heat dissipation plate.

In the present invention, preferably, a conductive reinforcement member is installed on the rear surface of the chassis base, the heat dissipation plate is fastened to the reinforcement member, and the connection cable is tightly fixed between the reinforcement member and the heat dissipation plate. Here, the heat dissipation plate is preferably fastened to the reinforcing member by a conductive fastening member.

In the present invention, preferably, the connection cable includes a plurality of conductive wires extending in a longitudinal direction and communicating a predetermined electrical signal, and insulating layers formed on both surfaces of the conductive wires, and formed between the conductive wires and the heat dissipation plate. A portion of the insulating layer is covered to expose the ground lead, and the conductive medium is interposed between the exposed ground lead and the heat dissipation plate.

In addition, in the present invention, preferably, the connection cable is mounted with an integrated circuit chip for converting the driving signal generated in the circuit portion to be applied to the plasma display panel, the integrated circuit chip is provided on the heat dissipation plate and the chassis base back It is fixed between the reinforcing members. Here, the integrated circuit chip is preferably inserted into the inlet portion formed in the intaglio on the heat dissipation plate.

On the other hand, the plasma display module according to another aspect of the present invention,

Chassis base;

A plasma display panel supported in front of the chassis base and configured to implement an image;

A circuit unit supported behind the chassis base and driving the plasma display panel;

A connection cable electrically connecting the plasma display panel and the circuit unit;

A conductive reinforcement member grounded to the chassis base and in close contact with the connection cable; And

And a conductive medium electrically connecting the ground lead of the connection cable and the reinforcing member.

In the present invention, preferably, the connection cable includes a plurality of conductive wires extending in a longitudinal direction and communicating a predetermined electrical signal, and insulating layers formed on both surfaces of the conductive wires, and formed between the conductive wires and the reinforcing member. A portion of the insulating layer is covered to expose the ground lead, and the conductive medium is interposed between the exposed ground lead and the heat dissipation plate.

Next, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. 3 is an exploded perspective view showing a plasma display module according to a first embodiment of the present invention. For convenience of description, illustration of the heat dissipation plate described later in FIG. 3 is omitted. Referring to the drawings, the plasma display module is interposed between the plasma display panel 130 to implement the image, the chassis base 150 for supporting the plasma display panel 130, the display panel 130 and the chassis base 150 It includes a heat dissipation sheet 140.

The plasma display panel 130 serves as an image display unit for displaying an image, and the front panel 110 and the rear panel 120 are bonded to each other. Here, the plasma display panel 130 may be formed in the structure described with reference to FIG. 1, and description thereof will be omitted. The plasma display panel 130 is coupled to the chassis base 150 with the heat dissipation sheet 140 interposed by a double-sided tape 145 attached along the edge of the heat dissipation sheet 140. Here, the heat dissipation sheet 140 is in close contact with the plasma display panel 130 and the chassis base 150 to transfer heat generated from the plasma display panel 130 to the chassis base 150.

The chassis base 150 serves as a heat sink of the plasma display panel 130 and has a large area to become a ground area. To this end, the chassis base 150 is made of a material such as aluminum (Al) having excellent thermal and electrical conductivity. In addition, the chassis base 150 serves as a support structure of the plasma display panel 130 provided with a glass material, and for reinforcing strength, a reinforcing member 151 may be installed on a rear surface of the chassis base 150. The chassis base 150 may be manufactured by die casting or press working.

A circuit unit for driving the plasma display panel 130 is mounted to the rear of the chassis base 150, and the circuit unit includes circuit boards 162 on which a plurality of circuit elements are mounted. The connection cable 155 for transmitting the driving signal and the power generated by the circuit unit to the plasma display panel 130 is mounted to extend forward from the rear of the chassis base 150.

4 is a partially enlarged perspective view of the plasma display module illustrated in FIG. 3, and FIGS. 5 and 6 are cross-sectional views taken along the lines V-V and VI-VI of FIG. 4, respectively. As a connecting cable 155 for electrically connecting the circuit board 162 at the rear side and the plasma display panel at the front side, a connecting cable called a tape carrier package (TCP) may be used, and a plurality of conductors may be used for the connecting cable 155. The fields 155b are formed in the longitudinal direction of the connection cable 155, and at least some of the conductive lines 155b pass through the integrated circuit chip 161 mounted on the connection cable 155. For reference, the integrated circuit chip 161 converts the driving signal generated from the circuit board 162. The ground lead 155ba of the connection cable that maintains the ground voltage is exposed to the outside through a ground hole 155 ′ formed by covering a predetermined area of the connection cable 155.

The heat dissipation plate 190 mounted at the rear of the integrated circuit chip 161 connects the connection cable 155 and the integrated circuit chip 161 mounted thereto to the chassis base 150, more specifically, the reinforcing member 151. It presses against and fixes it. That is, the heat dissipation plate 190 is coupled to the reinforcement member 151 by the conductive fastening means 191 fastened to the reinforcement member 151 through the screw hole formed in the heat dissipation plate 190, the connection cable ( The 155 and the integrated circuit chip 161 are interposed between the reinforcing member 151 and the heat dissipation plate 190, thereby being closely fixed. As a result, the high heat generated in the integrated circuit chip 161 is conducted to the reinforcing member 151 and the heat dissipation plate 190, and is discharged to the outside through the outer surfaces of the 151 and 190 or the chassis base 150. To this end, the reinforcing member 151 and the heat dissipation plate 190 is preferably formed of a metal material having excellent thermal conductivity, for example, the reinforcing member 151 is a steel (鋼材) in consideration of strength, heat radiation The plate 190 may be formed of aluminum.

Meanwhile, as shown in FIG. 4, each connection cable 155 may be fixed by one heat dissipation plate 190, or although not illustrated, two or more connection cables may be simultaneously connected by one heat dissipation plate. It can also be fixed. Since the reinforcing member 151 and the heat dissipation plate 190 formed of a metal material have electrical conductivity, the connection cable 155 may be directly grounded to the chassis base 150 as described below.

As can be seen in Figure 5, the integrated circuit chip 161 and the reinforcing member 151 is interposed between the heat dissipation material 165 for the integrated circuit chip to the integrated circuit chip 161 and the connecting cable 155 to the reinforcing member (151). ) On the Since the temperature of the integrated circuit chip 161 rises to approximately 70 ° C. to 90 ° C. during operation, the heat dissipation material 165 for the integrated circuit chip is preferably a heat dissipation material having a high thermal conductivity. For example, thermal grease, a resin material containing a thermally conductive medium, and the like. Heat transferred to the reinforcement member 151 by the heat dissipation member 165 for the integrated circuit chip is conducted to the chassis base 150 or is released into the air through the reinforcement member 151.

Referring to FIG. 6, the connection cable 155 is formed on a plurality of conductive wires 155b through which a predetermined electrical signal is communicated, and on the front and rear surfaces of the conductive wires 155b so that the conductive wires 155b may be separated from an external environment. The first insulating layer 155a and the second insulating layer 155c are protected and insulated. Referring to the drawings, the ground lead 155ba is exposed through the ground hole 155 ′ formed by covering a portion of the second insulating layer 155c, and the exposed ground lead 155ba and the heat radiation plate 190 are exposed. The conductive medium 156 is connected to each other. As such, the ground lead 155ba is electrically connected to the heat dissipation plate 190, and the heat dissipation plate 190 is electrically connected to the reinforcing member 151 and the chassis base 150 through the conductive fastening member 191. The connection cable 155 is grounded to the chassis base 150. Here, for example, an anisotropic conductive film (ACF) may be used as the conductive medium 156. The anisotropic conductive film is formed by dispersing fine particles of conductive particles in an epoxy resin in a film or paste state. It is manufactured by, to be coupled to each other by pressurization. In addition, a conductive bump or the like may be used as the conductive medium. The conductive medium 156 is applied not only between the ground lead 155ba and the heat dissipation plate 190, but also across the contact surfaces of the entire connecting cable 155 and the heat dissipation plate 190, as shown in FIG. 6. Heat generated from the integrated circuit chip 161 may be effectively conducted to the heat dissipation plate 190.

According to the present invention, the connection cable 155 is not directly grounded through the circuit board, but is directly grounded through the heat dissipation plate 190. As the connection cable 155 is directly grounded, the influence of the voltage change due to the ground line self-resistance and the noise caused by the electromagnetic waves generated inside and outside the device is canceled, and the ground voltage can be kept constant. Through this, an accurate driving signal can be stably applied to the panel electrode, and thus, a desired image can be smoothly implemented. In addition, since the connection cable 155 has a simple grounding structure in which the connection cable 155 is directly grounded without passing through the circuit board, its stability is improved, and stable plasma display module can be driven despite external shock or vibration.

7 is an exploded perspective view of a portion of a plasma display module according to a second embodiment of the present invention, and FIG. 8 is a cross-sectional view taken along the line VII-VII of FIG. 7. The plasma display module of the present embodiment has substantially the same components that perform substantially the same functions except for the technical matters described below with the plasma display module shown in FIG. In the present embodiment, the recess 290 ′ engraved in a shape that matches the integrated circuit chip 261 is formed on the heat dissipation plate 290, and the integrated circuit chip 261 is formed on the lead 290 ′. By being inserted, the contact area between the integrated circuit chip 261 and the heat dissipation plate 290 is increased. Heat generated in the integrated circuit chip 261 is conducted to the heat dissipation plate 290 through a contact surface with the heat dissipation plate 290, and is dissipated by natural convection on its outer surface. Here, since the integrated circuit chip 261 inserted into the inlet 290 ′ of the heat dissipation plate performs heat transfer through the increased contact area, the heat dissipation performance is improved. Meanwhile, an integrated circuit chip heat dissipation material 265 (see FIG. 8) may be interposed between the integrated circuit chip 261 and the heat dissipation plate 290. The heat dissipation material 265 may include a thermal grease or a thermal grease. , A resin material or the like containing a heat conductive medium can be used. Meanwhile, the connection cable 255 and the integrated circuit chip 261 may be fixed on the reinforcing member 251 by the heat dissipation grease 257, and the heat dissipation grease 257 may be generated in the integrated circuit chip 261. It functions to conduct heat to the reinforcing member 251.

9 is a cross-sectional view taken along line VII-VII of the plasma display module illustrated in FIG. 7. As shown in the figure, a part of the second insulating layer 255c of the connection cable 255 is removed to form a ground hole 255 ', and the ground lead 255ba is exposed through the ground hole 255'. In addition, a conductive medium 256, for example, an anisotropic conductive film is interposed between the exposed ground conductor 255ba and the heat dissipation plate 290 to electrically connect the two 255ba and 290. Since the heat dissipation plate 290 is coupled to the reinforcing member 251 through the conductive fastening means 291, the connection cable 255 is grounded to the chassis base through the reinforcing member 251.

10 illustrates a modification of the plasma display module shown in FIG. 9. In the present modification, a predetermined portion of the first insulating layer 255a formed on the connection cable 255 is coated, and the ground conductor 255ba exposed through the coating portion of the first insulating layer 255a is formed of the conductive medium 256. It is electrically connected to the reinforcing member 251 through. Therefore, the connection cable 255 is grounded to the chassis base through the reinforcing member 251, and the grounding path is shortened as compared with the plasma display module shown in FIG.

According to the plasma display module of the present invention, the following effects can be achieved.

First, the connection cable is not grounded through the circuit board, but is directly grounded to the chassis base, thereby reducing the length of the ground line. Therefore, it is possible to cancel the influence of the voltage change due to the ground line self-resistance and the noise caused by electromagnetic waves generated inside and outside the device to keep the ground voltage constant. As a result, an accurate driving signal can be stably applied to the panel electrode, and a desired image can be smoothly implemented. In addition, by providing a simple grounding structure that does not pass through the circuit board, the grounding stability is improved, and stable plasma display module can be driven despite external shock or vibration.

Second, since the integrated circuit chip is inserted into the inlet formed in the heat dissipation plate, the contact area between the integrated circuit chip and the heat dissipation plate can be increased. Therefore, heat dissipation of the integrated circuit chip can be promoted through the increased contact surface.                     

Although the present invention has been described with reference to the embodiments shown in the accompanying drawings, it is merely exemplary, and various modifications and equivalent other embodiments are possible for those skilled in the art to which the present invention pertains. You will understand the point. Therefore, the true scope of protection of the present invention should be defined by the appended claims.

Claims (12)

Chassis base; A plasma display panel supported in front of the chassis base and configured to implement an image; A circuit unit supported behind the chassis base and driving the plasma display panel; A connection cable electrically connecting the plasma display panel and the circuit unit; A conductive heat dissipation plate fixed at the rear of the connection cable and grounded to the chassis base; And And a conductive medium electrically connecting the ground lead of the connection cable and the heat dissipation plate. The method of claim 1, A conductive reinforcement member is installed on the rear surface of the chassis base, the heat dissipation plate is fastened to the reinforcement member, and the connection cable is fixed between the reinforcement member and the heat dissipation plate. The method of claim 2, And the heat dissipation plate is fastened to the reinforcing member by a conductive fastening member. The method of claim 1, The connection cable may include a plurality of conductive wires extending in a longitudinal direction and communicating a predetermined electrical signal, and insulating layers formed on both surfaces of the conductive wires, and a portion of the insulating layer formed between the conductive wires and the heat radiating plate may be coated. And a conductive medium interposed between the exposed ground conductor and the heat dissipation plate. The method of claim 1, The conductive medium is a plasma display module, characterized in that the anisotropic conductive film. The method of claim 1, The conductive medium is a plasma display module, characterized in that the conductive bump. The method of claim 1, The connecting cable is mounted with an integrated circuit chip for converting the driving signal generated in the circuit portion to be applied to the plasma display panel, the integrated circuit chip is fixed between the heat dissipation plate and the reinforcing member installed on the chassis base back Plasma display module. The method of claim 7, wherein The integrated circuit chip is mounted toward the heat dissipation plate, the plasma display module, characterized in that the heat dissipation material for the integrated circuit chip is interposed between the heat dissipation plate and the integrated circuit chip. The method of claim 8, And the integrated circuit chip is inserted into an inlet portion formed in a recess on the heat dissipation plate. The method of claim 1, And the integrated circuit chip is mounted toward the reinforcing member, and a heat dissipation material for the integrated circuit chip is interposed between the integrated circuit chip and the reinforcing member. Chassis base; A plasma display panel supported in front of the chassis base and configured to implement an image; A circuit unit supported behind the chassis base and driving the plasma display panel; A connection cable electrically connecting the plasma display panel and the circuit unit; A conductive reinforcement member grounded to the chassis base and in close contact with the connection cable; And And a conductive medium for electrically connecting the ground lead of the connection cable and the reinforcing member. The method of claim 11, The connection cable may include a plurality of conductive wires extending in a longitudinal direction and communicating a predetermined electrical signal, and insulating layers formed on both sides of the conductive wires, and a portion of the insulating layer formed between the conductive wires and the reinforcing member may be coated. And a conductive medium interposed between the exposed ground conductor and the heat dissipation plate.

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