KR100594695B1 - Manufacturing method of probe having center hole - Google Patents

Abstract

The present invention relates to a method for manufacturing a hollow probe having excellent responsiveness to an electrode pad and easy to cope with electrode pads of highly integrated electronic devices. It relates to a method for manufacturing a hollow probe produced by processing the end portion with a laser beam after forming a.

To this end, in the present invention, preparing a cylindrical specimen of a conductive metal material having a predetermined elongation, the specimen is fixed to a first jig in which a tapered first through hole is formed, and the upper surface is pressed to press the specimen. In the first step of passing through the through-hole to extend, the elongated specimen is fixed to a second jig in which a tapered second through-hole is formed so as to be smaller than the first through-hole. The second step of forming a central hole in the center of the specimen while extending through the second through-hole, and applying the laser beam to the lower end of the specimen while rotating the specimen to open the center hole to the outside Disclosed is a method of manufacturing a hollow probe including a third step of manufacturing a tip by cutting the lower end of the main body.

Hollow, Probe, Tip, Contact, Elongation

Description

Manufacturing method of probe having center hole

1A to 1E are views for explaining a method of manufacturing a hollow probe according to an embodiment of the present invention.

FIG. 2A is a perspective view illustrating the hollow probe manufactured by FIGS. 1A to 1E, and FIG. 2B is a bottom view.

Figure 3a is a view for explaining a hollow probe produced by another embodiment of the present invention, Figure 3b is a view for explaining a hollow probe manufactured by another embodiment of the present invention.

4A is a side cross-sectional view illustrating a state in which a hollow probe manufactured by an embodiment of the present invention is in contact with a general electrode pad, and FIG. 4B illustrates a hollow probe manufactured by an embodiment of the present invention. It is sectional drawing for demonstrating the state which contacted the type electrode pad.

<Description of Symbols for Main Parts of Drawings>

10: Psalm 11: the central hole

12: 1st pressure rod 14: 2nd pressure rod

15: third pressure bar 16: body portion

18: contact portion 20: incision

22: tip portion 30, 32: pad

51: The First Jig 52: The Second Jig

53: third jig 60: laser light source

The present invention relates to a probe of a probe card used in a probe device for inspecting the electrical characteristics of an object under test, such as a semiconductor device, and more particularly, to form a central hole therein by applying a physical impact to the center of the specimen. The present invention relates to a method for manufacturing a hollow probe produced by processing an end portion of a stretched disc using a laser beam after stretching.

Generally, in the manufacture of semiconductor devices, a plurality of semiconductor devices are formed on a semiconductor wafer using a precision photolithography technique or the like, and are then cut for each device.

In such a semiconductor device manufacturing process, conventionally, a probe device is used to measure the electrical characteristics of a semi-finished semiconductor device in the state of a semiconductor wafer, and only after the test results are determined to be good, it is a post-process such as packaging. The productivity is improved by sending to the.

In such a test, a probe tip is brought into contact with an electrode pad of a semiconductor wafer, and electrical test is measured by a tester through the probe tip.

In recent years, semiconductor devices are becoming more and more minute, and the degree of integration of circuits is increasing, the size of electrode pads is miniaturized, and the intervals between the electrode pads are also very narrow.

Therefore, there is a need for hundreds of probe tips in a limited space of the probe card, and at the same time, there is a need for a technique for accurately and stably contacting the probe tips with the center of the electrode pad.

The probe tip, which has been used in such a conventional probe card, is formed by bending a tip portion of a rod-shaped probe tip to be thinly processed, and a needle type formed by flattening the contact end contacting the electrode pad of the semiconductor wafer by sanding. come.

However, such a needle type probe tip exhibits problems such as poor contact with electrode pads and limitations in arrangement. Therefore, the applicant has a hollow probe fixed vertically to a printed circuit board as disclosed in Korean Patent No. 267835. Suggested a tip.

An object of the present invention is that the probe tip in contact with the electrode pad is perpendicular to the electrode pad and has self-elasticity, thereby eliminating the slip of the probe tip when the electrode pad contacts the electrode pad, and thus contacting with the electrode pad repeated by the contact pressure. It is to provide a method of manufacturing a hollow probe tip to greatly improve the inspection efficiency by improving the, and the probe tips are arranged vertically to correspond to the highly integrated semiconductor wafer.

In order to achieve the above object, in the present invention, the step of preparing a cylindrical specimen of a conductive metal material having a predetermined elongation, the specimen is fixed to the first jig in which the tapered first through-hole is formed, the upper surface A first step of pressurizing and passing the specimen through the through-hole to fix the stretched specimen to a second jig in which a second tapered through-hole is formed to be smaller than the first through-hole, The second step of extending the specimen through the second through hole and forming a central hole at the center of the specimen, while applying a laser beam to the bottom of the specimen while rotating the specimen; It provides a method of manufacturing a hollow probe comprising a third step of manufacturing a tip (tip) by cutting the lower end of the body portion so that the hole is opened to the outside.

In addition, in order to achieve the above object, in the present invention, preparing a cylindrical specimen of a conductive metal material having a predetermined elongation, the specimen is fixed to a first jig with a tapered first through hole, the upper surface A first step of pressing the test piece through the first through hole and extending the test piece; fixing the extended test piece to a second jig in which a second tapered through hole is formed to be smaller than the first through hole, and having an upper surface thereof. A second step of pressurizing the specimen to pass through the second through-hole to extend the third step; forming a central hole by applying a laser beam in the direction of the central axis of the elongated specimen, and rotating the specimen to Hollow type comprising a fourth step of manufacturing a tip by applying a laser beam to the bottom to cut the lower end of the main body portion so that the central hole is open to the outside It provides a method for producing a probe.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A to 1E are views for explaining a method of manufacturing a hollow probe according to an embodiment of the present invention.

In the method of manufacturing the hollow probe tip according to the present invention, as shown in FIG. 1A, first, a specimen 10 made of a metal material having good elongation such as copper (Cu), aluminum (Al), gold (Au), or the like is prepared. do. At this time, the specimen 10 is made of a cylindrical shape.

As a next step, as shown in FIG. 1B, the specimen 10 is fixed to the first jig 51, and then the pressure is applied to the upper end of the specimen 10 using a first pressurizing rod 12. 1 Passes through hole 51h of jig 51. At this time, the end of the first pressure rod 12 is used as the industrial diamond is molded. In addition, the jig 51 is made of a ceramic material. A central hole 11 of a predetermined diameter is formed in the upper center portion of the specimen 10 of a predetermined soft material by the pressure of the first pressing rod 12, and the length of the specimen 10 while passing through the through hole 51h. Is elongated.

Subsequently, as shown in FIG. 1C, the specimen 10 having the length extended through the above steps is fixed to the second jig 52 having a smaller through hole 52h than the first jig 51. Thereafter, a pressure is applied to the upper end of the test piece 10 by using the second pressing rod 14 to pass the through hole 52h of the second jig 52. Here, the through hole 52h uses a taper having a diameter smaller than that of the through hole 51h of the first jig 51. In addition, the second pressing rod 14 uses a smaller diameter than the first pressing rod 12.

Next, as illustrated in FIG. 1D1, the third jig 10 having a smaller through hole 53h than the case of the second jig 52 may be obtained. 53), and by applying pressure to the upper end of the specimen 10 by using the third pressure bar 15, the length of the thinner is elongated and the central hole 11 is formed in the center thereof. To make. Here, the through hole 53h is smaller in diameter and tapered than the through hole 52h of the second jig 52. The diameter of the outlet of the through hole 53h finally corresponds to the diameter of the hollow probe according to the present invention. In addition, the third pressure bar 15 is preferably about 1/2 of the diameter of the through hole 53h.

Meanwhile, instead of manufacturing the hollow specimen using the third pressurizing rod 15, as shown in FIG. 1D2, a separate diameter larger than the through hole 53h of the third jig 53 is provided. After pressing the specimen 10 by using a pressure bar (not shown) to extend the length thereof, the specimen (from the laser light source unit 60 installed in the vertical upward direction of the finally extended specimen 10) 10) A hollow specimen may be manufactured by forming a central hole 11 by firing a laser in a central axial direction.

On the other hand, in the present embodiment, but the pressure rod is used for the specimen 10, it will be obvious that other physical means other than the pressure rod can be used.

In addition, as a pressurization method, the method of applying a physical shock repeatedly can also be used.

In addition, lubricating oil may be used to facilitate the passage of the specimen 10 through each of the through holes 51h, 52h, and 53h and to minimize the generation of frictional heat.

As a next step, it is overcoated with a rigid material such as nickel-cobalt, tungsten or nickel chromium.

As a final step, as shown in Figure 1e, a hollow specimen prepared through the process shown in Figure 1d1 or 1d2 is placed on a laser processing table, the upper end portion is cut using a laser, the hollow specimen While rotating, a tip is formed by applying a laser beam to the lower end and cutting it. In this case, as shown in FIGS. 2A and 2B, the tip portion 22 opens the center hole 11 to the outside by applying a laser beam to the lower end of the main body portion 16, and the tip portion 22 is inside. And a contact portion 18 protruding to the outside by the recess 20 and the recess 20 of the recess 20.

In addition, the contact portion 18 may be selectively formed in a shape that can easily contact the pad of the inspection object, such as a quadrangle, a triangle, and a trapezoidal shape.

In addition, the laser light source unit 60 may use a femto second laser (Femto second laser) device capable of precision processing, the laser beam generated in the femto second laser device is a pulse of 10 ^-14 to 10 ^-16 SEC ), Preferably with a pulse of ^10-15 sec. The use of a femtosecond laser in the processing of the hollow flat specimen does not dissolve the medium, unlike other general processing, but because it breaks away the chemical bonds of the medium and blows it away. Because of this. In addition, according to the femtosecond laser, the pulse width is extremely short, while the peak power is very high, so that it is possible to absorb a very high light intensity and multiphoton in the material, thereby increasing the precision of processing.

As shown in FIG. 2A, the hollow probe manufactured according to the embodiment of the present invention has a good elongation rate such as copper (Cu), aluminum (Al), gold (Au), and the like. By applying pressure to the center, the pillar-shaped main body portion 16 provided with the central hole 11 is provided. At this time, the main body 16 may be formed in a cylindrical shape.

Then, the main body 16 is rotated and a laser beam is applied to the lower end of the main body 16 to cut the lower end of the main body 16 in a predetermined shape so that the central hole 11 is opened to the outside. A tip portion 22 having a portion 20 and a contact portion 18 is provided.

In this case, the contact portion 18 may be modified into various shapes such as a quadrangle shape as shown in FIG. 2A, a triangular shape as shown in FIG. 3A, and a trapezoidal shape as shown in FIG. 3B.

4A is a cross-sectional view illustrating a state in which the hollow probe manufactured by an embodiment of the present invention contacts a flat electrode pad, and FIG. 4B is a ball type hollow probe manufactured by an embodiment of the present invention. It is sectional drawing for demonstrating the state which contacted the electrode pad.

The hollow probe manufactured by the present invention is in downward contact with the surface of the flat electrode pad 30 of FIG. 4A or the ball type electrode pad 32 of FIG. 4B.

In this case, as the hollow probe presses the electrode pads 30 and 32, the contact portion 18 of the tip portion 22 of the probe is expanded and opened to the outside, and has a predetermined length in a shape surrounding the electrode pads 30 and 32. It slides and comes in contact with the electrode pads 30 and 32.

When the probe is raised upward, the contact portion 18 of the probe is restored to its original position by its elastic force.

The hollow probe produced by the present invention has an effect excellent in correspondence with a ball type electrode pad having a ball shape on its surface.

In addition, since the vertical type, not only can be installed in a high density on the printed circuit board of the probe card, it is also easy to cope with the small size electrode pad of the electronic device which is highly integrated by the high density arrangement.

In addition, there is an effect that can be easily responded to a short pitch interval between the pad and the pad of the highly integrated electronic device.

Although the present invention has been described in detail with respect to the embodiments described, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, and such modifications and modifications belong to the appended claims. will be.

Claims (10)

Preparing a cylindrical specimen of a conductive metal material having a predetermined elongation; A first step of fixing the specimen to a first jig in which the first tapered through hole is formed, and pressing the upper surface of the specimen to pass the specimen through the through hole to extend the specimen; The elongated specimen is fixed to a second jig having a second tapered through hole formed to be smaller than the first through hole, and presses a central portion of the upper surface to pass the specimen through the second through hole to extend the same. A second step of forming a central hole in the center of the specimen, A third step of manufacturing a tip by applying a laser beam to a lower end of the test piece while rotating the test piece, thereby cutting the lower end of the main body to open the center hole to the outside. Manufacturing method. The method of claim 1, Interposed between the first step and the second step, the specimen extending through the first step is fixed to the jig in which the tapered through hole is formed to be smaller than the first through hole and larger than the second through hole, And pressing the central portion of the upper surface to pass the specimen through the through-hole to extend the hollow probe at least once. According to claim 1 or 2, wherein the specimen, Hollow probe manufacturing method comprising a material of any one of copper, aluminum, gold. The method according to claim 1 or 2, An intervening step between the second and third steps, the method further comprising overcoating the specimen with a rigid material. The method of claim 1, A method of manufacturing a hollow probe, characterized in that using a femto second laser (Femto second laser) as the laser beam. Preparing a cylindrical specimen of a conductive metal material having a predetermined elongation; A first step of fixing the specimen to a first jig having a tapered first through hole, pressing the upper surface of the specimen to pass the specimen through the first through hole, and extending the specimen; A second step of fixing the stretched specimen to a second jig having a second tapered through hole formed to be smaller than the first through hole, pressing the upper surface to pass the specimen through the second through hole, and extending the specimen; A third step of forming a central hole by applying a laser beam in a direction of the central axis of the stretched specimen, A fourth step of manufacturing a tip by applying a laser beam to a lower end of the specimen while cutting the lower part of the body to open the center hole to the outside while rotating the specimen. Manufacturing method. The method of claim 6, Interposed between the first step and the second step, the specimen extending through the first step is fixed to the jig in which the tapered through hole is formed to be smaller than the first through hole and larger than the second through hole, And pressing the central portion of the upper surface to pass the specimen through the through-hole to extend the hollow probe at least once. The method of claim 6 or 7, wherein the specimen, Hollow probe manufacturing method comprising a material of any one of copper, aluminum, gold. The method according to claim 6 or 7, An intervening step between the second and third steps, the method further comprising overcoating the specimen with a rigid material. The method of claim 6, A method of manufacturing a hollow probe, characterized in that using a femto second laser (Femto second laser) as the laser beam.

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