KR100588915B1 - Frame assembly of electronic products - Google Patents

Abstract

The present invention relates to a frame assembly for an electronic device, the bottom cover 40 of which one side is opened, the main chassis 30 is inserted into the opening side of the bottom cover 40 and is seated on the main chassis 30 In the frame assembly for an electronic device including the deck 10, the bottom cover 40 and the deck 10 is formed with first and second corresponding screw holes 42 and 12, respectively, the main chassis 30 A truncated cone-shaped coupling portion 32 is formed in which a screw hole 34 is formed in which the first and second corresponding screw holes 42 and 12 are screwed together, and the first or second corresponding screw holes 42 and 12 are provided. Inserting a screw from any one of the side is characterized in that the fastening integrally with the coupling portion (32). Therefore, the frame assembly for an electronic device according to the present invention is configured to form a single screw hole in which the screw holes formed in the engaging portion of the main chassis and the corresponding screw holes formed in the bottom cover and the deck coincide with each other to insert a single screw. By combining them together, the bottom cover and the deck can be individually assembled to separate the main chassis, eliminating the redundancy process that is combined by using separate screws, and the cost is reduced by reducing the number of screws. Fixed time is reduced by placing the bottom cover of the bottom cover to expose the bottom cover separately and eliminating the delay of repositioning the bottom face of the bottom cover downward to screw the deck again. Are integrally joined together so that they are grounded across multiple screws The closer the ground is made, the easier the dispersion of noise is.

Description

FRAME ASSEMBLY OF ELECTRONIC PRODUCTS

1 is an exploded perspective view showing a frame assembly for a conventional electronic device,

2 is a perspective view showing the gist of the engaging portion of the frame assembly for an electronic device according to the present invention;

3 is a cross-sectional view showing a modified embodiment of the engaging portion of the frame assembly for an electronic device according to the present invention.

<Description of Symbols for Main Parts of Drawings>

10 deck 12: second corresponding screw hole

20: substrate 30: main chassis

32: coupling portion 34: screw hole

40: bottom cover 42: first corresponding screw hole

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a frame assembly for an electronic device, and more particularly, to a bottom cover constituting a housing, a main chassis seated on a bottom cover, and a board or deck such as a main PCB mounted on the main chassis and grounded to the bottom cover. (DECK) relates to a frame assembly for an electronic device having a structure that can be integrally coupled by a single screw.

Generally, a frame assembly for an electronic device includes a housing exposed to the outside, a main chassis provided as a kind of coupling part in which various components are placed, and various organic coupling parts located on the main chassis and performing specific functions. The deck and the main chassis and the housing are preferably electrically connected to one another and are grounded to disperse noise such as static electricity.

Since such a plurality of frames are equipped with sensitive and fragile precision components, such as electronic components, they must have a rigid coupling structure that is organically coupled according to the operating relationship but is less affected by vibration or external shock. In addition, the ground state should be good for the dispersion of noise, and preferably, a space-efficient structure should be formed for the compact configuration.

In particular, the deck on which various electronic components are installed is seated on the main chassis and grounded to the bottom cover, so that precise and sensitive electronic components installed on the deck are more stably supported by the main chassis, and noise such as static electricity is dispersed through the bottom cover. It is important to be configured for good electrical operation, and there is a need for a structure and method for achieving good coupling for this purpose.

In general, the coupling structure of the deck, the main chassis and the bottom cover is integrally formed by screwing the deck and the bottom cover to the main chassis, respectively, through coupling portions and corresponding screw holes provided in the main chassis.

1 is an exploded perspective view showing a frame assembly for a conventional electronic device.

As shown, the frame assembly for a sperm device includes a bottom cover 40, a main chassis 30 installed inside the bottom cover 40, and a deck 10 coupled to the main chassis 30.

Preferably a main PCB 20 is added between the main chassis 30 and the deck 10 for control of the electronic component.

The bottom cover 40 has a generally rectangular shape and has a structure in which at least one side is opened.

The main chassis 30 seated inside through the open portion of the bottom cover 40 is provided with a plurality of decks 10 on which a group of electronic components provided according to functions is mounted.

The deck 10 is connected to a main PCB to which a signal is acquired and preferably added by an interface means for guiding the medium and contacting for data recording / reproducing, for example in the case of a recording / reproducing apparatus for video and audio data, for transmitting data. It has a structure to perform a function.

In general, the main chassis 30 is manufactured in a smaller size to be seated therein in a shape corresponding to the seating portion of the bottom cover 40, and a plurality of first corresponding screw holes 42 formed in the bottom cover 40. ) Has a coupling part 32 having a first screw hole 32a corresponding to one side thereof, and the other side of the coupling part 32 is a second corresponding screw hole 12 formed in the deck 10 to be seated and coupled thereto. The second screw hole (32b) is inserted into and fastened by a screw correspondingly coupled to).

In addition, the coupling portion 32 of the main chassis 30 is formed with a protrusion 32c inserted for the stable mounting of the deck 10 or the substrate 20 such as the main PCB seated on the coupling portion 32 and Corresponding holes or grooves are formed in the deck 10 or the substrate 20 to be inserted or inserted into each other, thereby limiting horizontal movement.

Operation of a conventional frame assembly for an electronic device having such a structure is performed as follows.

The main chassis 30 is seated in the bottom cover 40 in conformity with the shape such that the first corresponding screw hole 42 formed in the bottom cover 40 and the first screw hole 32a coincide with each other, and the bottom cover ( The first screw hole 32a is formed in the coupling part 32 such that the screw fastened through the first corresponding screw hole 42 to the coupling part 40 is integrally coupled with the coupling part 32 of the main chassis 30. Inserted to reach up to).

The deck 10 seated on the upper side of the main chassis 30 has a second screw hole in which the second corresponding screw hole 12 formed in the deck 10 is formed in the engaging portion 32 of the main chassis 30. When positioned so as to correspond to 32b) and properly disposed, the screw inserted through the second corresponding screw hole 12 reaches the second screw hole 32b while the main chassis 30 and the deck 10 are integrally formed. To be combined.

Preferably, the protrusion 32c is formed at the coupling portion 32 of the main chassis 30 so that the substrate 20 or the deck 10 is partially inserted or inserted to restrict movement in the horizontal direction and more stable mounting is performed. .

Accordingly, the conventional frame assembly for an electronic device has a bottom cover 40 and a deck 10 with respect to the first and second screw holes 32a and 32b formed above and below the coupling portion 32 of the main chassis 30. The first and second corresponding screw holes 42 and 12 formed in the corresponding coupling are respectively coupled to each other to be integrally engaged by being fastened by screws.

However, the frame assembly as described above is provided with screws separately because the fastening of the screws must be made separately for the bottom cover 40 and the deck 10 coupled to the upper and lower sides of the main chassis 30, respectively. Since the cost and the respective fastening process must be performed, the process efficiency is lowered. In particular, in order to couple the bottom cover 40, a screw is inserted into the first corresponding screw hole 42 from the bottom surface of the bottom cover 40. Since it is coupled by inserting and fastening to the first screw hole 32a of the coupling part 32, the frame assembly must be positioned so that the bottom of the bottom cover 40 is exposed, and then the frame assembly is again mounted to engage the deck 10. Since the bottom of the bottom cover 40 must be rearranged downward, the process efficiency is further lowered due to the occurrence of a delay time for repositioning the frame assembly. It was going.

The present invention is to solve the above-mentioned conventional problems, an object of the present invention is to integrally combine the housing such as the bottom cover, the deck mounted inside the housing, the substrate or deck such as the main PCB coupled to the deck integrally The present invention provides a frame assembly for an electronic device that simplifies a process and a structure for minimizing a delay time and minimizes a delay time, thereby achieving a more effective assembly process and a cost reduction due to a reduction in the number of components.

The present invention for achieving the above object, in the frame assembly for an electronic device comprising a bottom cover which is open on one side, a main chassis inserted into the bottom side of the bottom cover, and a deck seated on the main chassis, the bottom cover The first and second corresponding screw holes are formed in the deck and the main chassis, respectively. The main chassis is provided with a truncated cone-shaped coupling part in which a screw hole is formed in which the first and second corresponding screw holes are screwed together. The screw is inserted from any one side of the corresponding screw hole is characterized in that it is integrally fastened together with the coupling portion.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

The same parts as in FIG. 1 will be denoted by the same reference numerals and description thereof will be omitted.

Figure 2 is a perspective view showing the gist of the engaging portion of the frame assembly for an electronic device according to the present invention, Figure 3 is a cross-sectional view showing a modified embodiment of the engaging portion of the frame assembly for an electronic device according to the present invention.

As shown, the frame assembly for an electronic device according to the present invention is largely provided with a bottom cover 40, a main chassis 30 seated on the bottom cover 40, and a deck 10 mounted on the main chassis 30. It includes.

The main chassis 30 is conical and has a coupling portion 32 having a truncated cone shape in which a sharp head is cut, and the coupling portion 32 has a through hole 34 penetrating the center thereof. The deck 10 and the bottom cover 40 are each screwed through the upper and lower openings of 34.

Preferably, a through hole having a diameter corresponding to the diameter of the middle portion of the body of the coupling portion 32 which is truncated conical of the main chassis 20 is formed, and is supported and mounted as the coupling portion 32 is inserted through the through hole. The main PCB may further include a substrate 20.

The bottom cover 40 has a first corresponding screw hole 42 formed at a corresponding position of the lower opening of the screw hole 34 so as to be accessed from below the engaging portion 32 of the main chassis 30 and engaged by the screw. Prepared.

The deck 10 is provided with a second corresponding screw hole 12 formed at a corresponding position of the upper opening of the screw hole 34 so that the deck 10 is accessed from above the engaging portion 32 of the main chassis 30 and engaged by the screw. do.

As shown in FIG. 3, according to a modified embodiment of the present invention, a screw hole 34 formed in the coupling part 32 of the main chassis 30 is raised to form a larger area. The inner peripheral surface has an increased shape so that it can be screwed by.

Similarly, the first corresponding screw hole 34 of the bottom cover may also be formed to be raised to increase the fastening area with the screw.

Operation of the frame assembly for an electronic device having such a structure is performed as follows.

The bottom cover 40 and the deck 10 are disposed to correspond to the screw holes 34 formed in the engaging portion 32 of the main chassis 30, and the first corresponding screw holes 42 of the bottom cover 40 are disposed. The lower opening of the screw hole 34 coincides with the second corresponding screw hole 12 of the deck 10 coincides with the lower opening of the screw hole 34.

Therefore, the screw hole 34 and the first and second corresponding screw holes 12 form a single through hole, so that a single screw is inserted into the main chassis 30, the bottom cover 40, and the deck 10. ) Are integrally combined.

According to one embodiment, the coupling portion 32 of the main chassis 30 is formed in a conical truncated cone shape in which the head is cut, such that a substrate 20 such as a main PCB is installed below the deck 10. In this case, the coupling part 32 is inserted into the through hole formed at the corresponding position so that the substrate 20 is supported by being caught in the middle of the body of the coupling part 32.

According to another modified embodiment, both end surfaces of the coupling portion 32 of the main chassis 30 are concave and the first or second corresponding screw holes 12 and 42 are recessed. The inner circumferential surface of the first or second corresponding screw holes 12 and 42 is formed to be raised inwardly of the cross section, so that the screw is fastened to a larger area when the screw is inserted, thereby making a more rigid and stable coupling.

Since the coupling portion 32 and the first and second corresponding screw holes 42 and 41 are grounded to each other at the time of coupling, noise such as static electricity generated from the deck 10 or the substrate 20 or introduced from the outside may be caused by the coupling portion. Transmission and dispersion through the bottom cover 40 to the bottom cover 40 further suppresses electromagnetic malfunction and interference of noise.

Further, in the modified example, the shape of the first or second corresponding screw holes 42 and 12 which are formed to be raised is more closely and effectively grounded because the noise is facilitated as the contact area with the screw is increased.

According to the preferred embodiment of the present invention as described above, the screw holes formed on both sides of the coupling portion formed in the main chassis and the bottom cover and deck coupled on both sides corresponding to each other are integrally coupled by a single screw to separate each When fastening with screws, the increased cost and the number of processes are omitted and assembly is easy.

What has been described above is only one embodiment for implementing the frame assembly for an electronic device according to the present invention, the present invention is not limited to the above-described embodiment, the subject matter of the present invention as claimed in the following claims Without departing from the technical spirit of the present invention to the extent that any person of ordinary skill in the art to which the present invention pertains various modifications can be made.

As described above, the frame assembly for an electronic device according to the present invention is configured to form a single screw hole in which the screw holes formed in the engaging portion of the main chassis and the corresponding screw holes formed in the bottom cover and the deck coincide with each other. Integral by inserting screws eliminates the overlapping process of using separate screws to separately mount the bottom cover and deck to the main chassis, more efficiently assembled and reduced cost by reducing the number of screws The fixed time is reduced by placing the bottom cover of the bottom cover to expose the bottom cover separately and eliminating the delay of repositioning the bottom face of the bottom cover downward to screw the deck again. Are integrally joined by a single screw, Compared to that, the closer the ground is, the easier the dispersion of noise is.

Claims (3)

In the frame assembly for an electronic device comprising a bottom cover that is open at one side, a main chassis inserted into the opening side of the bottom cover, and a deck seated on the main chassis, The bottom cover and the deck are each formed with a first and second corresponding screw holes, The main chassis is provided with a truncated cone coupling portion in which a screw hole is formed in which the first and second corresponding screw holes are screwed together. Is integrally fastened together with the engaging portion by inserting a screw from any one of the first or second corresponding screw hole Frame assembly for electronics. The method of claim 1, The coupling portion, the first and second corresponding screw holes, Grounded together when integrally fastened Frame assembly for an electronic device, characterized in that. The method according to claim 1 or 2, An end portion of the coupling portion is formed as a concave portion, The first or second corresponding screw hole has a bracket shape which is raised into the recess to increase the area of the inner peripheral surface Frame assembly for an electronic device, characterized in that.

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