KR100584955B1 - Method for processing optical waveguide entrance of printed circuit board - Google Patents

Abstract

The present invention relates to a method for processing an optical waveguide inlet of a printed circuit board, and more particularly, after stacking an optical waveguide and a prepreg on a dynamic layer plate to process the optical waveguide inlet, the temperature at the time of diffuse reflection or pressurization caused by the flow of the adhesive The present invention also relates to an optical waveguide inlet processing method in a printed circuit board (PCB) to prevent delamination caused by an unbalance of pressure.

In addition, according to the present invention, a first step of processing the upper window by pre-routing a predetermined portion of the laminated member to be laminated to an optical waveguide (optical waveguide); A second step of processing the optical waveguide window in the insertion member into which the optical waveguide is inserted and inserting the optical waveguide; A third step of laminating and compressing a bonding agent, the optical waveguide insertion member, and the lamination member on a copper clad laminate (CCL); And a fourth step of cutting one end of the optical waveguide to form a reflective surface of the inlet.

 Optical waveguides, printed circuit boards, reflective surfaces, inlets

Description

Method for processing optical waveguide entrance of printed circuit board             

1 is a view for explaining the flow of the adhesive during the optical waveguide inlet processing of a printed circuit board according to the prior art.

Figure 2 is a view for explaining the delamination caused by the imbalance of the temperature and pressure during the optical waveguide inlet processing of the printed circuit board according to the prior art.

Figure 3 is a flow chart of the inlet processing method of the optical waveguide according to an embodiment of the present invention.

4A to 4E are views for explaining the processing method of the optical waveguide inlet, respectively, according to the first embodiment of the present invention.

5A to 5F are flowcharts of methods of processing inlets of optical waveguides according to the second embodiment of the present invention, respectively.

6A to 6F are views for explaining the processing method of the inlets of the optical waveguide according to the third embodiment of the present invention, respectively.

7A to 7G are views for explaining a processing method of an inlet of an optical waveguide according to a fourth embodiment of the present invention, respectively.

<Explanation of symbols for the main parts of the drawings>

41, 51: SSCCL 43, 55, 62, 76: optical waveguide

44, 45, 52, 54, 56, 63, 64, 66, 73, 74, 78: prepreg

46, 57, 61, 67, 72, 77, 79: CCL

71: heat spread

The present invention relates to a method for processing an optical waveguide inlet of a printed circuit board, and more particularly, after stacking an optical waveguide and a prepreg on a dynamic layer plate to process the optical waveguide inlet, the temperature at the time of diffuse reflection or pressurization caused by the flow of the adhesive The present invention also relates to an optical waveguide inlet processing method in a printed circuit board (PCB) to prevent delamination caused by an unbalance of pressure.

Printed circuit boards (PCBs) are used to easily connect various electronic devices on a printed circuit board according to a predetermined frame, and are widely used in all electronic products such as digital TVs and other home appliances to high-tech communication devices.

Conventionally, when manufacturing a PCB, a circuit pattern is formed on a copper plate to form an inner layer / out layer of the PCB, but recently, a polymer and a glass fiber are used. By inserting an optical waveguide that can transmit and receive signals with light, it is called EOCB (Electro-Optical Circuit Board).

The EOCB is a mixture of electrical and optical signals, so that high-speed data communication within the same board is interfacing to optical signals, and the copper plate can be converted into electrical signals for data storage / signal processing within the device. The PCB which inserted the optical waveguide and the glass plate in the state which formed the circuit pattern.

When forming the optical waveguide as described above, an optical via hole for forming a passage connecting from the outer layer to the inner layer of the PCB and easily transmitting the optical signal is required.

The optical via hole is a medium for connecting the optical signal to the curved surface and the inlet of the optical waveguide element in the inner layer of the PCB, and also the via hole of the PCB which transmits the signal generated from the inside to the external photodiode (PD), VCSEL, etc. Say

In addition, as the use of the Internet and the quality of service have increased, data handling and transmission have increased rapidly. As a result, bandwidth and signal processing are required to increase the speed of optical interfacing. The same EOCB was needed.

In other words, the electrical signal used in the conventional PCB is limited by the characteristics of Electro Magnetic Susceptibility (EMS) during high-speed switching in the gigahertz band, so that optical interfacing without the EMI characteristic is required. will be.

When the optical waveguide is inserted to form a multilayer printed circuit board, when a heat is applied to bond the optical waveguide, the prepreg, which is a thermosetting epoxy resin, flows down and the optical signal flows onto the inlet surface of the optical waveguide.

1 is a view for explaining the flow of the adhesive during the optical waveguide inlet processing of a printed circuit board according to the prior art.

Referring to FIG. 1, when heat is applied to join an optical waveguide, prepreg on the corresponding surface of the inlet of the optical waveguide flows down and is deposited on the inlet of the optical waveguide, thereby causing diffuse reflection of the optical waveguide.

2 is a view for explaining the delamination caused by the imbalance of the temperature and pressure during the optical waveguide inlet processing of the printed circuit board according to the prior art.

Referring to FIG. 2, when a heat is applied to bond an optical waveguide, a difference in pressure and temperature occurs in a stepped portion, and a delamination of an inlet occurs.

As a means for solving the above problems, an object of the present invention is to process the inlet of the optical waveguide after laminating the prepreg to prevent the diffuse reflection of the inlet by the falling of the prepreg to prevent the inlet of the optical waveguide Its purpose is to provide a processing method.

In addition, the present invention provides a method for processing the inlet of the optical waveguide in which the inlet of the optical waveguide is processed after the prepreg is laminated, thereby preventing the occurrence of delamination of the inlet due to the pressure difference between the stepped portion and the temperature. Its purpose is to provide.

The present invention for achieving the above object is a first step of processing the upper window by pre-routing a predetermined portion of the laminated member laminated to an optical waveguide (optical waveguide); A second step of processing the optical waveguide window in the insertion member into which the optical waveguide is inserted and inserting the optical waveguide; A third step of laminating and compressing a bonding agent, the optical waveguide insertion member, and the lamination member on a copper clad laminate (CCL); And a fourth step of cutting one end of the optical waveguide to form a reflective surface of the inlet.

Now, with reference to the drawings of Figure 3 will be described in detail with respect to the inlet processing method of the optical waveguide according to an embodiment of the present invention.

Figure 3 is a flow chart of the inlet processing method of the optical waveguide according to an embodiment of the present invention.

Referring to FIG. 3, in the method of processing the inlet of the optical waveguide according to the present invention, first, a predetermined portion of a copper clad laminate (CCL) and a prepreg laminated and bonded to an upper portion of the optical waveguide is pre-processed ( Pre-routing) to process the upper window (S10).

Thereafter, the waveguide insertion window for inserting the optical waveguide on the copper clad laminate (CCL) for optical waveguide insertion is processed (S11).

Next, after the optical waveguide is inserted into the dynamic laminated plate processed with the waveguide insertion window (S12), the laminated layer is sequentially stacked from the lowest to the dynamic laminated plate, the prepreg and the dynamic waveguide into which the optical waveguide is inserted, the prepreg, and the dynamic laminated plate. It is compressed (S13).

Thereafter, the inlet of the optical waveguide is processed to 45 degrees using a cutting device to form a reflective surface (S14), and the PCB is manufactured by a subsequent PCB manufacturing process (S15).

As a result, after the insertion and bonding of the optical waveguide are completed, the inlet of the optical waveguide is cut with a cutting device to form a reflective surface. 1) The process of the process is easier than in the conventional method, and 2) It is designed to solve the light reflection caused by the falling down and the adhesion of foreign matters. 3) It has the effect of monitoring the delamination of the optical waveguide due to the temperature and pressure imbalance.

4A to 4E are views for explaining a method of processing the optical waveguide inlet, respectively, according to the first embodiment of the present invention.

First, FIG. 4A is a diagram illustrating a pre-processed SSCCL. The pre-processing of the SSCCL 41 is to secure a space in which the reflective surface of the optical waveguide can be processed, and is processed 5 mm larger than the existing size. Here, SSCCL 41 means that one side of both copper foils of CCL was removed.

At this time, the router bit or the drill bit 42 is cut as shown to expose the corresponding site.

Although not shown, the prepreg for inserting the optical waveguide is processed to process the window for inserting the optical waveguide, and the optical waveguide is inserted.

4B shows the machining position of the SSCCL 41 when stacked and shows where the optical waveguide is exposed within the machining position.

4B shows that the optical waveguide is located at the center of the machining position of the SSCCL 41. According to the prior art, the inlet of the optical waveguide is located in the center portion of the SSCCL, but in the present invention, the inlet of the optical waveguide is not located in the central portion of the processing portion of the SSCCL, because the inlet of the optical waveguide has not been formed yet.

FIG. 4C is a vertical cross-sectional view of the AA ′ portion shown in FIG. 4B and includes a SSCCL 41, a first prepreg 44 into which an optical waveguide 43 is inserted, a second prepreg 45, and a CCL 46. ) Is a cross-sectional view in which the SSCCL 41 is lined by the interval d.

4D is a cross-sectional view of the optical waveguide multilayer printed circuit board after bonding, and illustrates a state in which the first prepreg 44 and the second prepreg 45 are joined. Substantially, the copper laminate 46, the optical waveguide 43, the first prepreg 44 and the second prepreg 45 are bonded at a predetermined temperature and pressure at a time after the positions are aligned.

At this time, according to the prior art, since the prepregs 44 and 45 are bonded to the optical waveguide 43, the prepreg may be covered on the spherical surface into which the optical signal is introduced.

However, in the present invention, as shown in FIG. 4E, after the prepregs 44 and 45 are bonded to the optical waveguide 43, the reflective surface is formed and polished at a 45 degree angle using a route bit or a drill. The problem of the prior art can be prevented.

5A to 5F are flowcharts of a method of processing an inlet of an optical waveguide according to a second embodiment of the present invention, respectively.

First, FIG. 5A is a diagram showing the pre-processing of the SSCCL 51. Like the SSCCL 41 of the first embodiment described above, the pre-processing of the SSCCL 51 allows the inlet of the optical waveguide to be machined. For sake. Here, SSCCL 51 means that one side of both copper foils of CCL was removed. That is, CCL is normally copper foil laminated on the epoxy insulating film 51a, and is formed on both sides of the epoxy insulating film 51a, but the SSCCL 51 has copper foil 51b formed only on one side thereof. As in the first embodiment, the SSCCL 51 is cut into the shape as shown using the router bit or the drill bit 53 to expose the corresponding site.

FIG. 5B is a diagram showing a prepreg 54 to be pre-processed, wherein the prepreg 54 is pre-processed at the junction between the optical waveguide and the SSCCL 52 and the step between the joint surface of the optical waveguide and the joint surface of the SSCCL. It is to prevent the occurrence. As in the first embodiment, the router bit or the drill bit 53 is cut as shown to expose the site. At this time, the prepreg 54 is a high viscosity epoxy resin.

5C to 5E are diagrams respectively illustrating a bonding top surface at the time of bonding, a cross section before bonding, and a cross section after bonding. 5C shows the machining position and the joining position of the SSCCL 51. FIG. 5D is a vertical cross-sectional view taken along the line BB ′ shown in FIG. 5C. Referring to FIG. 5D, at the bottom, a CCL 57, a second prepreg 56 at an upper portion thereof, a prepreg 52 having an optical waveguide 55 inserted thereon, and a first prepreg 54 at an upper portion thereof. The SSCCL 51 is stacked thereon.

FIG. 5F is a view for explaining a process of processing the inlet of the optical waveguide after the bonding. After the second prepreg 56 and the SSCCL 51 are bonded to the optical waveguide 55, a 45-degree angle is used by using a route bit or a drill. By forming a reflective surface and polishing, it is possible to prevent such a problem of the prior art.

As a result, after the SSCCL 51 and the second prepreg 56 are bonded to the optical waveguide 55, the inlet of the optical waveguide 55 is processed to form a reflecting surface, thereby forming a second prepreg on the spherical surface into which the optical signal is introduced. Legs 56 will not be covered and the PCB will be fabricated by subsequent PCB fabrication processes.

6A to 6F are views for explaining a processing method of an inlet of an optical waveguide according to a third embodiment of the present invention, respectively.

FIG. 6A is a top view of the first CCL, in which an optical window into which an optical signal is introduced is formed in a predetermined area m of the first CCL 61.

6B shows a top view with the first CCL 61 and the optical waveguide 62 attached thereto.

Next, FIG. 6C shows the preprocessing of the prepreg 64 as in the first embodiment described above, to prevent the generation of steps between the bonding surface of the optical waveguide and the bonding surface of the thermosetting resin. As in the first embodiment, the router bit or drill bit 65 is cut as shown to expose the site.

FIG. 6D is a cross-sectional view before the optical waveguide 62 is bonded, in which the third CCL 67 is positioned at the bottom, the second prepreg 66 is positioned thereon, and the optical waveguide 62 is inserted thereon. Two CCLs 63 are located, a first prepreg 64 is located thereon, and a first CCL 61 is located thereon.

Then, it is compressed as can be seen in FIG. 6E.

FIG. 6F is a view for explaining the process of processing the inlet of the optical waveguide after bonding. After the second prepreg 66 and the optical waveguide 62 are bonded to each other, the reflection surface is formed at a 45 degree angle using a route bit or a drill. The polishing can be prevented such a problem of the prior art.

As a result, after the second prepreg 66 and the optical waveguide 62 are joined, the inlet of the optical waveguide 62 is processed to form a reflective surface, so that the second prepreg 66 is formed on a spherical surface into which the optical signal is introduced. It will not be covered and the PCB will be manufactured by a subsequent PCB manufacturing process.

7A to 7H are views for describing a processing method of an inlet of an optical waveguide, respectively, according to the fourth embodiment of the present invention.

First, FIG. 7A is a view illustrating cutting a predetermined region by etching after processing the heat spreader 71. The heat spreader 71 is formed of an alloy component copper (cu), and high heat during bonding. It is inserted between each layer to be discharged to the outside in a short time, and serves as a ground from a circuit point of view.

FIG. 7B shows the prefabrication of the first prepreg 74, after which the first prepreg 74 is for bonding the epoxy surface of the heat spreader heat sink and the first CCL 72.

FIG. 7C is a top view in which the heat spreader 71 is formed, and q denotes a bonding position of the optical waveguide as an optical window. The heat spreader 71 may serve as a heat sink for dissipating heat as a metal layer.

FIG. 7D is a cross-sectional view illustrating a state in which the optical waveguide 76 is bonded to the second CCL 77, and FIG. 7E is a cross-sectional view of the preprocessed first prepreg 74 and the heat spreader 71 before bonding. 7f shows the cross section after the bonding. In FIG. 7D, the upper copper foil 72c of the first CCL 72 may have a shape in which a predetermined portion is removed in advance in order to improve bonding performance.

Referring to FIG. 7E, the third CCL 79 is positioned at the bottom, and the third prepreg 78 is stacked thereon, and the second CCL 77 having the optical waveguide 76 inserted thereon is stacked thereon. The second prepreg 73 is stacked thereon, the heat spreader 71 is stacked thereon, and the first prepreg 74 is stacked thereon, and the first CCL 72 is stacked thereon. ) Are stacked.

FIG. 7G is a view for explaining a process of processing an inlet of an optical waveguide after bonding, and after forming the reflective surface, the inlet of the optical waveguide is processed at a 45 degree angle.

As a result, a heat spreader 71 is formed, the first prepreg 74 is pre-processed, and after forming an optical window, the heat spreader 71 is joined to the optical waveguide 76, and then the reflecting surface of the inlet of the optical waveguide 76 is formed. As a result, the third prepreg 78 is not covered with the spherical surface into which the optical signal is introduced.

The optical waveguide inlet processing method according to the present invention is not limited to the above embodiments, and various modifications and changes can be made without departing from the technical gist of the invention.

According to the present invention as described above there is an effect to facilitate the position alignment when inserting the waveguide by processing the reflective surface of the inlet at an angle of 45 degrees after the insertion of the optical waveguide.

In addition, according to the present invention, the inlet of the optical waveguide is inserted into the PCB in an unformed state at an angle of 45 degrees, and laminated in a batch, and then processed and polished at 45 degrees in a PCB state, thereby preventing light reflection problems due to the flow of adhesive during lamination. There is an effect that can be solved.

In addition, according to the present invention there is an effect to reduce the delamination caused by the imbalance of the temperature and pressure during lamination.

Claims (8)

A first step of processing the upper window by pre-routing a predetermined portion of the laminated member laminated to the optical waveguide (optical waveguide); A second step of processing the optical waveguide window in the insertion member into which the optical waveguide is inserted and inserting the optical waveguide; A third step of laminating and compressing a bonding agent, the optical waveguide insertion member, and the lamination member on a copper clad laminate (CCL); And A fourth step of cutting one end of the optical waveguide to form a reflective surface of the inlet; Inlet processing method for an optical waveguide comprising a. The method of claim 1, And said lamination member is a dynamic layer plate. The method of claim 1, And the laminated member is SSCCL. The method of claim 1, The insertion member is a prepreg optical waveguide inlet processing method, characterized in that. The method of claim 1, The insertion member is an optical waveguide inlet processing method, characterized in that the CCL. The method of claim 1, The bonding agent is a prepreg optical waveguide inlet processing method, characterized in that. The method of claim 1, The reflection surface at the inlet of the optical waveguide is processed using a router bit or a drill bit. The method of claim 1, A fifth step of cutting an area of the heat spreader by etching to form an optical window; And And a sixth step of laminating the heat spreader between the lamination member and the insertion member.

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