KR100567893B1 - Wafer transfer - Google Patents

Wafer transfer Download PDF

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KR100567893B1
KR100567893B1 KR1020010016715A KR20010016715A KR100567893B1 KR 100567893 B1 KR100567893 B1 KR 100567893B1 KR 1020010016715 A KR1020010016715 A KR 1020010016715A KR 20010016715 A KR20010016715 A KR 20010016715A KR 100567893 B1 KR100567893 B1 KR 100567893B1
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forks
fork
alignment
wafer transfer
semiconductor
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KR1020010016715A
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KR20020076669A (en
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최원근
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동부아남반도체 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 웨이퍼 트랜스퍼에 관한 것으로서, 가이드부재(13c)와 결합되는 제3포크(13)를 포함하는 제1 내지 제5포크(11,12,...,15)와, 제1 내지 제5포크(11,12,....,15)가 결합되는 본체(20)와, 본체(20)로부터 제1 내지 제5포크(11,12,....,15)를 정렬하기 위해 구비되는 다수개의 얼라인볼트(11b,12b,....,15b)를 포함하여, 반도체확산장치의 확산로에 장착되는 보트에 반도체웨이퍼(W)를 이송시키는 웨이퍼 트랜스퍼에 있어서, 제3포크(13)의 가이드부재(13c)의 측면에 제4 및 제5포크(14,15)의 얼라인볼트(14b,15b)와 대응되는 복수의 얼라인홀(40)이 형성된다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer, wherein the first to fifth forks 11, 12,..., 15, including the third forks 13 coupled to the guide member 13c, and the first to fifth. It is provided to align the main body 20 to which the forks 11, 12,..., 15 are coupled, and the first to fifth forks 11, 12,..., 15 from the main body 20. In the wafer transfer including the plurality of alignment bolts (11b, 12b, ..., 15b), which transfers the semiconductor wafer (W) to the boat mounted on the diffusion path of the semiconductor diffusion device, the third fork ( A plurality of alignment holes 40 corresponding to the alignment bolts 14b and 15b of the fourth and fifth forks 14 and 15 are formed on the side surfaces of the guide member 13c of FIG. 13.

따라서, 제3포크를 전진시키지 않고서도 얼라인홀을 통하여 제4 및 제5포크를 간편하게 정렬할 수 있어 작업자의 피로도와 작업시간을 감소시키며, 반도체제조장비의 부품의 파손을 방지하는 효과를 제공한다.Therefore, it is possible to easily align the fourth and fifth forks through the alignment hole without advancing the third fork, reducing the worker's fatigue and working time, and providing the effect of preventing damage to the components of the semiconductor manufacturing equipment. do.

웨이퍼 트랜스퍼, 얼라인홀, 포크, 반도체확산장치      Wafer Transfer, Align Hole, Fork, Semiconductor Diffusion Equipment

Description

웨이퍼 트랜스퍼{WAFER TRANSFER}Wafer Transfer {WAFER TRANSFER}

도 1은 종래의 기술에 따른 웨이퍼 트랜스퍼의 일실시예를 나타낸 사시도,1 is a perspective view showing an embodiment of a wafer transfer according to the prior art,

도 2는 종래의 기술에 따른 웨이퍼 트랜스퍼의 제4 및 제5 포크를 정렬하기 위해 제3 포크를 전진한 상태를 나타낸 사시도,2 is a perspective view showing a state in which the third fork is advanced to align the fourth and fifth forks of the wafer transfer according to the related art;

도 3은 종래의 기술에 따른 웨이퍼 트랜스퍼의 포크가 반도체웨이퍼를 보트에 장착하는 상태를 나타낸 단면도,3 is a cross-sectional view showing a state in which a fork of a wafer transfer according to the prior art mounts a semiconductor wafer on a boat;

도 4는 본 발명에 따른 웨이퍼 트랜스퍼의 일실시예를 나타낸 사시도,4 is a perspective view showing an embodiment of a wafer transfer according to the present invention;

도 5는 본 발명에 따른 웨이퍼 트랜스퍼의 얼라인홀을 도시한 단면도이다.5 is a cross-sectional view illustrating an alignment hole of a wafer transfer according to the present invention.

본 발명은 웨이퍼 트랜스퍼에 관한 것으로서, 더욱 상세하게는 반도체확산장치의 보트에 반도체웨이퍼를 이송적재하기 위한 웨이퍼 트랜스퍼(wafer transfer)에 구비된 제3포크의 가이드부재의 측면에 제4 및 제5포크를 정렬하기 위한 복수의 얼라인홀(align hole)을 구비하여 제4 및 제5포크의 정렬을 간편하게 수행할 수 있는 웨이퍼 트랜스퍼에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer, and more particularly, to fourth and fifth forks on the side surface of a guide member of a third fork provided in a wafer transfer for transferring a semiconductor wafer to a boat of a semiconductor diffusion device. The present invention relates to a wafer transfer having a plurality of alignment holes for aligning the wafers, wherein the fourth and fifth forks can be easily aligned.

일반적으로 반도체 소자를 제조하기 위하여 다양한 공정을 수행하며, 그 중 반도체웨이퍼 표면에 산화막을 형성하거나 이온을 주입하기 위해 반도체확산장치가 사용된다. 반도체확산장치는 반도체웨이퍼 표면에 산화막을 형성하기 위해 반도체웨이퍼를 투입 장착한 후 소정의 압력, 온도 조건에서 반응가스를 주입하게 된다. 반응가스가 주입되면 반도체웨이퍼 표면과 반응가스가 결합하여 산화막을 형성하게 된다. In general, various processes are performed to fabricate a semiconductor device, and among these, a semiconductor diffusion device is used to form an oxide film or implant ions into a semiconductor wafer surface. The semiconductor diffusion apparatus injects and mounts a semiconductor wafer to form an oxide film on the surface of the semiconductor wafer, and then injects a reaction gas at a predetermined pressure and temperature. When the reaction gas is injected, the surface of the semiconductor wafer and the reaction gas are combined to form an oxide film.

산화막을 형성하기 위한 반도체확산장치는 크게 확산로(furnace), 보트(boat) 및 보트승강기로 구성되는데, 특히 보트는 확산공정이 진행될 반도체웨이퍼를 적재하기 위해 사용되며, 이러한 보트에 웨이퍼카세트로부터 반도체웨이퍼를 장착하기 위해 웨이퍼 트랜스퍼(wafer transfer)를 사용하게 된다.The semiconductor diffusion apparatus for forming an oxide film is mainly composed of a diffusion furnace, a boat, and a boat lift, in particular, a boat is used to load a semiconductor wafer to be subjected to a diffusion process, and from such a boat, a semiconductor from a wafer cassette is used. Wafer transfer is used to mount the wafer.

이러한 웨이퍼 트랜스퍼는 반도체웨이퍼 5매를 한꺼번에 이송시킬 수 있는 5매 일괄 이송방식과 반도체웨이퍼를 1매씩 이송하여 적재하는 1매 이송방식(매엽식) 등이 있다.Such wafer transfers include a five-sheet batch transfer method that can transfer five semiconductor wafers at once, and a single-sheet transfer method (leaf type) that transfers and loads semiconductor wafers one by one.

도 1은 종래의 기술에 따른 웨이퍼 트랜스퍼의 일실시예를 나타낸 사시도이다. 도시된 바와 같이 종래의 기술에 따른 웨이퍼 트랜스퍼는 5매 일괄 이송방식과 1매 이송방식을 겸한 웨이퍼 트랜스퍼이며, 웨이퍼 제1 내지 제5의 포크(11,12,...15)와, 포크(11,12,....,15)가 결합되는 본체(20)를 포함한다.1 is a perspective view showing an embodiment of a wafer transfer according to the prior art. As shown in the drawing, the wafer transfer according to the related art is a wafer transfer that combines a five-sheet batch transfer method and a single-sheet transfer method, and includes the first to fifth forks 11, 12,... 11, 12,..., 15 includes a body 20 to which it is coupled.

포크(11,12,....,15)는 반도체웨이퍼를 반도체확산장치내의 수직로에 장착되는 보트(30; 도 3에 도시됨)로 이송하는 것으로서, 본체(20)의 정면에 수직으로 포개어져 결합된다. 제1 내지 제5포크(11,12,....,15)중 제3포크(13)는 웨이퍼 트랜스퍼가 반도체웨이퍼를 1매씩 이송할 경우에 사용되는 포크로써, 이러한 제3포크(13)는 제3포크(13)를 독립적으로 동작시키는 가이드부재(13c)가 결합되어 있다. 또한, 제3포크를 제외한 포크들(11,12,....,15)은 각각의 일측에 다수의 고정볼트(11a,12a,14a,15a)로 본체(20)와 결합되어 있으며, 제3포크(13)는 가이드부재(13c)와의 결합을 위해 가이드부재(13c)의 상측면에 고정볼트(13a)로 체결되어 있다. The forks 11, 12,... 15 transfer the semiconductor wafer to a boat 30 (shown in FIG. 3) mounted on a vertical path in the semiconductor diffusion apparatus, and perpendicular to the front of the main body 20. Nested and combined. The third fork 13 of the first to fifth forks 11, 12,..., 15 is a fork used when the wafer transfer transfers the semiconductor wafers one by one, and the third fork 13 The guide member 13c for operating the third fork 13 independently is coupled. In addition, the forks 11, 12, ..., 15 except for the third fork is coupled to the main body 20 by a plurality of fixing bolts (11a, 12a, 14a, 15a) on each side, The three forks 13 are fastened by fixing bolts 13a to the upper side of the guide member 13c for coupling with the guide member 13c.

도 3은 종래의 기술에 따른 웨이퍼 트랜스퍼의 포크가 반도체웨이퍼를 보트에 장착하는 상태를 나타낸 단면도로서 도시된 바와 같이, 제1 내지 제5포크(11,12,....,15)는 반도체웨이퍼(W)를 들고서 보트(30)의 슬롯(31)사이로 진입하게 된다. 따라서, 제1 내지 제5포크(11,12,....,15)의 간격을 정렬할 필요가 있다. 이를 위해 제3포크(13)를 제외한 포크들(11,12,14,15)은 각각의 일측에 포크(11,12,....,15)간의 간격을 정렬하기 위하여 얼라인볼트(align bolt; 11b,12b,14b,15b)를 구비하고 있으며, 제3포크(13)는 가이드부재(13c)의 상측면에 얼라인볼트(13b)를 구비하고 있다. 이러한 얼라인볼트(11b,12b,....,15b)를 회전시킴으로써 제1 내지 제5포크(11,12,....,15)의 간격을 조절한다.3 is a cross-sectional view illustrating a state in which a fork of a wafer transfer according to the prior art mounts a semiconductor wafer on a boat, and the first to fifth forks 11, 12,..., 15 are semiconductors. Picking up the wafer W enters between the slots 31 of the boat 30. Therefore, it is necessary to align the intervals of the first to fifth forks 11, 12, ..., 15. To this end, the forks 11, 12, 14, and 15 except for the third fork 13 are aligned to align the intervals between the forks 11, 12, ..., 15 on each side. bolts 11b, 12b, 14b, and 15b, and the third fork 13 includes an alignment bolt 13b on the upper surface of the guide member 13c. By rotating the alignment bolts 11b, 12b,..., And 15b, the intervals of the first to fifth forks 11, 12,..., 15 are adjusted.

제1 내지 제5포크(11,12,....,15)가 결합되는 본체(20)는 다수의 가이드바(21)를 따라 이동하며, 이를 위해 본체(20)는 모터(미도시)와 연결된 타이밍 벨트(미도시)에 연결되어 모터의 구동력에 의해 동작한다.The main body 20 to which the first to fifth forks 11, 12,..., 15 are coupled moves along a plurality of guide bars 21. For this purpose, the main body 20 is a motor (not shown). It is connected to a timing belt (not shown) connected with and is operated by the driving force of the motor.

이와 같은 구조로 이루어진 종래의 웨이퍼 트랜스퍼의 포크(11,12,....,15)의 정렬은 다음과 같이 이루어진다. 먼저, 포크(11,12,....,15)의 각각을 1차적으로 정렬하게 된다. 이를 위해 스테인레스자를 사용하여 복수의 포크(11,12,....,15)의 좌측에 수직으로 세운 뒤, 제1 내지 제3포크(11,12,13)의 얼라인볼트(11b,12b,13b)를 회전시켜 제1 내지 제3포크(11,12,13)의 간격을 조정한다. 제1 내지 제3포크(11,12,13)의 정렬이 완료되면, 도 2에 도시된 바와 같이, 제3포크(13)와 가이드부재(13c)를 전진시킨 후에 제4 및 제5포크(14,15)의 간격을 제1 내지 제3포크(11,12,13)와 마찬가지로 조정하게 된다.The alignment of the forks 11, 12,..., 15 of the conventional wafer transfer having such a structure is performed as follows. First, each of the forks 11, 12, ..., 15 is aligned first. For this purpose, the stainless bolt is used to vertically set the left side of the plurality of forks 11, 12,..., 15, and then the alignment bolts 11b, 12b of the first to third forks 11, 12, 13. , 13b) is rotated to adjust the intervals of the first to third forks 11, 12, and 13. When the alignment of the first to third forks 11, 12, and 13 is completed, as shown in FIG. 2, the third and third forks 13 and 13c are moved forward, and then the fourth and fifth forks ( The spacing of 14 and 15 is adjusted similarly to the first to third forks 11, 12 and 13.

포크(11,12,....,15)에 대해 1차 정렬이 완료되면, 포크(11,12,....15)의 2차 정렬을 하게 되는데, 포크(11,12,....,15)의 2차 정렬은 웨이퍼 트랜스퍼의 포크(11,12,....,15)가 반도체웨이퍼를 들고 보트(30)의 슬롯(31)에 진입하여 보트(30)의 슬롯(31)의 높이와 포크(11,12,....,15)의 간격이 일치하는지를 확인하며, 보트(30)의 슬롯(31)의 높이가 포크(11,12,....,15)의 간격과 일치하지 않을 경우 웨이퍼 트랜스퍼를 원위치로 오게 하고 다시금 포크(11,12,....,15)의 1차 정렬과 마찬가지로 포크(11,12,....,15)의 각각에 대하여 정렬을 하게 된다.When the primary alignment is completed for the forks 11, 12, ..., 15, the secondary alignment of the forks 11, 12, ... 15 is performed. The secondary alignment of .., 15 is such that the forks 11, 12,..., 15 of the wafer transfer enter the slot 31 of the boat 30 with the semiconductor wafer holding the semiconductor wafer. 31 and the height of the fork (11, 12, ..., 15) coincides with, and the height of the slot 31 of the boat 30 is the fork (11, 12, ..., 15) If it does not coincide with the gaps of), return the wafer transfer to its original position, and again, for each of the forks 11, 12, ..., 15, similar to the primary alignment of the forks 11, 12, .... It will sort on.

그런데, 이와 같은 종래의 기술에 따른 웨이퍼 트랜스퍼는 제3포크를 독립적으로 지지해주는 가이드부재가 제4 및 제5포크의 얼라인볼트를 덮고 있으므로 제4 및 제5포크를 정렬하기 위해서는 제3포크와 가이드부재를 전진시켜야 한다. 이 때 제3포크를 전진할 경우 제3포크의 앞에 보트가 있으므로 작업시 상당한 어려움이 따르며, 특히 제3포크가 보트에 살짝 닿더라도 보트는 쉽게 균형을 잃고 쓰려져 깨지게 되는 문제점이 있다.However, in the wafer transfer according to the related art, since the guide member for supporting the third fork independently covers the alignment bolts of the fourth and fifth forks, in order to align the fourth and fifth forks, Guide member should be advanced. In this case, when the third fork is advanced, the boat is located in front of the third fork, which causes considerable difficulty in working. In particular, even if the third fork is slightly in contact with the boat, the boat easily loses balance and is broken and broken.

본 발명은 상술한 종래의 문제점을 해결하기 위한 것으로서, 본 발명의 목적 은 웨이퍼 트랜스퍼에 있어서 제3포크의 가이드부재의 측면에 복수의 얼라인홀을 구비하여, 제3포크를 전진시키지 않고서도 복수의 얼라인홀을 통하여 제4 및 제5포크를 간편하게 정렬할 수 있는 웨이퍼 트랜스퍼를 제공하는데 있다. SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a plurality of alignment holes in the side surface of the guide member of the third fork in the wafer transfer, without having to advance the third fork. It is to provide a wafer transfer that can easily align the fourth and fifth fork through the alignment hole of.

이와 같은 목적을 실현하기 위한 본 발명은, 가이드부재와 결합되는 제3포크를 포함하는 제1 내지 제5포크와, 제1 내지 제5포크가 결합되는 본체와, 본체로부터 제1 내지 제5포크를 정렬하기 위해 구비되는 다수개의 얼라인볼트를 포함하여, 반도체확산장치의 확산로에 장착되는 보트에 반도체웨이퍼를 이송시키는 웨이퍼 트랜스퍼에 있어서, 제3포크의 가이드부재의 측면에 제4 및 제5포크의 얼라인볼트와 대응되는 복수의 얼라인홀이 형성된 것을 특징으로 한다.The present invention for achieving the above object, the first to fifth fork including a third fork coupled to the guide member, the main body to which the first to fifth fork, and the first to fifth fork from the body A wafer transfer for transporting a semiconductor wafer to a boat mounted on a diffusion path of a semiconductor diffusion device, including a plurality of aligning bolts provided to align the first, fourth and fifth on the side of the guide member of the third fork Characterized in that a plurality of alignment holes corresponding to the alignment bolt of the fork is formed.

이하, 본 발명의 가장 바람직한 실시예를 첨부한 도면을 참조하여 본 발명의 기술분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명하기로 한다. DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

도 4는 본 발명에 따른 웨이퍼 트랜스퍼의 일실시예를 나타낸 사시도이다. 한편, 종래와 동일한 구성부재에 대해서는 동일한 도면 부호를 부여하여 설명한다.4 is a perspective view showing an embodiment of a wafer transfer according to the present invention. In the meantime, the same components as in the prior art will be described with the same reference numerals.

도시된 바와 같이, 본 발명에 따른 웨이퍼 트랜스퍼는 가이드부재(13c)와 결합되는 제3포크(13)를 포함하는 제1 내지 제5포크(11,12,....,15)와, 제1 내지 제5포크(11,12,13,....,15)가 결합되는 본체(20)와, 본체(20)로부터 제1 내지 제5포크(11,12,13,....,15)를 정렬하기 위하여 구비되는 다수개의 얼라인볼트(11b,12b,....,15b)와, 제3포크(13)의 가이드부재(13c)의 측면에 제4 및 제5포크(14,15)의 얼라인볼트(14b,15b)와 대응되게 형성되는 복수의 얼라인홀(40)을 포함한다.As shown, the wafer transfer according to the present invention includes first to fifth forks 11, 12,..., 15, including a third fork 13 coupled to the guide member 13c, and The main body 20 to which the first to fifth forks 11, 12, 13,..., 15 are coupled, and the first to fifth forks 11, 12, 13,... From the main body 20. And a plurality of alignment bolts 11b, 12b,..., 15b provided to align 15 and the fourth and fifth forks at the side surfaces of the guide member 13c of the third fork 13. 14 and 15 includes a plurality of alignment holes 40 formed to correspond to the alignment bolts 14b and 15b.

포크(11,12,....,15)는 반도체웨이퍼를 보트(30; 도 3에 도시됨)로 이송하는 것으로서, 제1포크 내지 제5포크(11,12,....,15)로 구성되며, 본체(20)의 정면에 수직으로 일정한 간격을 가지도록 포개어져 결합된다. 복수의 포크(11,12,....,15)중 제3포크(13)는 웨이퍼 트랜스퍼가 반도체웨이퍼를 1매씩 이송할 경우에 사용되는 포크이다. 이러한 제3포크(13)에는 제3포크(13)를 독립적으로 동작시키는 가이드부재(13c)가 결합되어 있다.The forks 11, 12,..., 15 transfer the semiconductor wafer to the boat 30 (shown in FIG. 3), and the first to fifth forks 11, 12,..., 15 It is composed of a), and overlapped to have a constant vertically perpendicular to the front of the main body 20 is coupled. The third fork 13 of the plurality of forks 11, 12, ..., 15 is a fork used when the wafer transfer transfers the semiconductor wafers one by one. The third fork 13 is coupled with a guide member 13c for independently operating the third fork 13.

제3포크(13)를 제외한 포크들(11,12,14,15)은 각각의 일측에 다수의 고정볼트(11a,12a,14a,15a)로 본체(20)와 결합되어 있으며, 제3포크(13)는 가이드부재(13c)의 상측면에 고정볼트(13a)로 체결되어 있다. 또한, 제3포크(13)를 제외한 포크들(11,12,14,15)은 각각의 일측에 정렬을 위하여 다수의 얼라인볼트(11b,12b,....,15b)를 구비하고 있으며, 제3포크(13)는 가이드부재(13c)의 상측면에 얼라인볼트(13b)를 구비하고 있다. 따라서, 각각의 포크(11,12,....,15)는 얼라인볼트(11b,12b,....,15b)의 회전에 의하여 보트(30)의 슬롯(31; 도 3에 도시됨)의 높이에 상응하도록 간격을 조절하게 된다.The forks 11, 12, 14, and 15 except for the third fork 13 are coupled to the main body 20 by a plurality of fixing bolts 11a, 12a, 14a, and 15a on each side thereof, and the third fork 13 is fastened to the upper surface of the guide member 13c by a fixing bolt 13a. In addition, the forks 11, 12, 14, and 15 except for the third fork 13 have a plurality of alignment bolts 11b, 12b,..., 15b for alignment on each side. The third fork 13 has an alignment bolt 13b on the upper surface of the guide member 13c. Thus, each fork 11, 12,..., 15 is a slot 31 of the boat 30 by rotation of the alignment bolts 11b, 12b,..., 15b, as shown in FIG. 3. To adjust the spacing to correspond to the height of the

제3포크(13)의 가이드부재(13c)의 측면에는 제4 및 제5포크(14,15)의 얼라인볼트(14b,15b)에 대응되는 복수의 얼라인홀(40)이 구비된다. 제3포크(13)의 가이드부재(13c)가 제3포크(13)의 아래에 위치한 제4 및 제5포크(14,15)의 외측에 구비되어 제4 및 제5포크(14,15)의 얼라인볼트(14b,15b)를 덮고 있다. 따라서, 가이드부 재(13c)의 얼라인홀(40)을 통하여 제4 및 제5포크(14,15)의 얼라인볼트(14b,15b)를 정렬할 수 있다.A plurality of alignment holes 40 corresponding to the alignment bolts 14b and 15b of the fourth and fifth forks 14 and 15 are provided at the side surfaces of the guide member 13c of the third fork 13. The guide member 13c of the third fork 13 is provided on the outer side of the fourth and fifth forks 14 and 15 positioned below the third fork 13 so that the fourth and fifth forks 14 and 15 are provided. The alignment bolts 14b and 15b. Accordingly, the alignment bolts 14b and 15b of the fourth and fifth forks 14 and 15 may be aligned through the alignment holes 40 of the guide member 13c.

또한, 얼라인홀(40)은 도 5의 본 발명에 따른 웨이퍼 트랜스퍼의 얼라인홀을 도시한 단면도에서와 같이, 얼라인홀(40)의 입구쪽에 가이드홈(41)이 형성되는 것이 바람직하다. 이 가이드홈(41)은 얼라인홀(40)의 입구쪽에 0.2 내지 2 mm의 모따기에 의해 형성된다. 따라서, 정렬도구(미도시)를 사용하여 제4 및 제5포크(14,15)의 얼라인볼트(14b,15b)를 회전시키고자 할 경우 정렬도구는 가이드홈(41)에 의해 가이드됨으로써 얼라인홀(40)의 진입이 용이해진다.In addition, the alignment hole 40, as shown in the cross-sectional view showing the alignment hole of the wafer transfer according to the present invention of Figure 5, it is preferable that the guide groove 41 is formed in the inlet side of the alignment hole 40. . The guide groove 41 is formed by a chamfer of 0.2 to 2 mm at the inlet side of the alignment hole 40. Accordingly, when the alignment bolts 14b and 15b of the fourth and fifth forks 14 and 15 are rotated using the alignment tool (not shown), the alignment tool is guided by the guide groove 41 to freeze. Entry of the in-hole 40 is facilitated.

제1 내지 제5포크(11,12,....,15)가 결합되는 본체(20)는 다수의 가이드바(21)를 따라 이동하며, 이를 위해 본체(20)는 모터(미도시)와 연결된 타이밍 벨트(미도시)에 연결되어 모터의 구동력으로 동작한다. 따라서, 모터의 구동력에 의해 제1 내지 제5포크(11,12,....,15)는 반도체웨이퍼를 웨이퍼카세트로부터 반도체확산장치의 보트(30)내로 로딩/언로딩하게 된다. The main body 20 to which the first to fifth forks 11, 12,..., 15 are coupled moves along a plurality of guide bars 21. For this purpose, the main body 20 is a motor (not shown). It is connected to a timing belt (not shown) connected to operate with the driving force of the motor. Therefore, the first to fifth forks 11, 12,..., 15 are loaded / unloaded from the wafer cassette into the boat 30 of the semiconductor diffusion device by the driving force of the motor.

상술한 바와 같이 본 발명의 바람직한 실시예에 따르면, 제3포크(13)와 결합된 가이드부재(13c)에 얼라인홀(40)을 구비함으로써 제4 및 제5포크(14,15)의 정렬을 용이하게 수행할 수 있다.According to a preferred embodiment of the present invention as described above, the alignment of the fourth and fifth forks 14 and 15 by providing the alignment hole 40 in the guide member 13c coupled to the third fork 13. Can be easily performed.

상술한 바와 같이, 본 발명에 따른 웨이퍼 트랜스퍼는 제3포크의 가이드부재의 측면에 복수의 얼라인홀을 구비하여 제3포크를 전진시키지 않고서도 얼라인홀을 통하여 제4 및 제5포크를 간편하게 정렬할 수 있으며, 이로 인해 작업자의 피로도 와 작업시간을 감소시키며, 반도체제조장비의 부품의 파손을 방지하는 효과를 제공한다.As described above, the wafer transfer according to the present invention includes a plurality of alignment holes on the side surface of the guide member of the third fork so that the fourth and fifth forks can be easily moved through the alignment holes without advancing the third fork. This can reduce the worker's fatigue and work time, and prevent the breakage of components of semiconductor manufacturing equipment.

이상에서 설명한 것은 본 발명에 따른 웨이퍼 트랜스퍼를 실시하기 위한 실시예에 불과한 것으로서, 본 발명은 상기한 실시예에 한정되지 않고, 이하의 특허청구범위에서 청구하는 바와 같이 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변경 실시가 가능한 범위까지 본 발명의 기술적 정신이 있다고 할 것이다.What has been described above is only an embodiment for carrying out wafer transfer according to the present invention, and the present invention is not limited to the above-described embodiment, and without departing from the gist of the present invention as claimed in the following claims. Anyone with ordinary knowledge in the field of the present invention will have the technical spirit of the present invention to the extent that various modifications can be made.

Claims (2)

가이드부재와 결합되는 제3포크를 포함하는 제1 내지 제5포크와, 상기 제1 내지 제5포크가 결합되는 본체와, 상기 본체로부터 상기 제1 내지 제5포크를 정렬하기 위해 구비되는 다수개의 얼라인볼트를 포함하여, 반도체확산장치의 확산로에 장착되는 보트에 반도체웨이퍼를 이송시키는 웨이퍼 트랜스퍼에 있어서,A plurality of first and fifth forks including a third fork coupled to the guide member, a main body to which the first and fifth forks are coupled, and a plurality of first and fifth forks arranged from the main body. In the wafer transfer including the alignment bolt, to transfer the semiconductor wafer to the boat mounted on the diffusion path of the semiconductor diffusion device, 상기 제3포크의 가이드부재의 측면에 상기 제4 및 제5포크의 얼라인볼트와 대응되는 복수의 얼라인홀이 형성된 것을 특징으로 하는 웨이퍼 트랜스퍼.And a plurality of alignment holes corresponding to the alignment bolts of the fourth and fifth forks on side surfaces of the guide member of the third fork. 제 1 항에 있어서, 상기 얼라인홀의 입구쪽에 가이드홈이 형성된 것을 특징으로 하는 웨이퍼 트랜스퍼.The wafer transfer of claim 1, wherein a guide groove is formed at an inlet of the alignment hole.
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