KR100551465B1 - Annealing apparatus with staged cooling system and vacuum insulation type oven for enamel coating process - Google Patents

Abstract

The present invention relates to an annealing device for an enamel coating process consisting of a sequential cooling device and a vacuum insulated annealing oven, the purpose of which is to increase the ductility of the copper wire used in the enamel coating process to stretch the tension applied to the copper wire during the process It is to provide an annealing device for increasing the rate, uniform the surface and inside of the copper wire to complete a high quality copper wire coating process. An annealing device comprising an oven and a cooling device includes a forced convection device for forced convection of waste heat gas supplied from the outside to maintain uniform temperature inside the oven and to reduce energy consumption required to increase the temperature inside the oven. It is installed on the inner copper wire supply side of the oven, the electric preheating unit for heating the copper wire while controlling the temperature inside the oven, the vacuum insulation means for minimizing the heat loss of the heated air in the oven to the outside, the copper wire from the oven An annealing oven having a vacuum insulation structure composed of a copper wire feeding device for supplying the inside; The annealing copper wire connected to the rear end of the annealing oven of the vacuum insulation structure is configured to gradually cool to an upper layer composed of vertical multistage, and the inside is configured of a sequential cooling device in which a reducing gas is supplied to maintain a reducing atmosphere.

Electric Heater, Annealing, Sequential Cooling, Vacuum Insulation, Enamel Coating

Description

Annealing Apparatus with Staged Cooling System and Vacuum Insulation Type Oven for Enamel Coating Process}             

1 is a schematic diagram showing the configuration of a vacuum insulation annealing oven of a sequential cooling method according to the present invention,

Figure 2 is a cross-sectional view showing the arrangement of the copper wire transfer pipe and the electric preheater for transferring the copper wire of the vacuum insulation annealing oven according to the present invention,

Figure 3 is a detailed view showing the vacuum insulation oven and forced convection flow according to the present invention,

Figure 4 is a detailed view showing the heating plate and the transfer method of the sequential cooling device constituting the vacuum insulation annealing oven of the sequential cooling method according to the present invention,

5 is a detailed view showing the cooling water and the transfer method of the sequential cooling device constituting the vacuum insulation annealing oven of the sequential cooling method according to the present invention.

<Description of the symbols for the main parts of the drawings>

(1) Electric preheating unit (2) Vacuum annealing oven

(3): Sequential cooling part (4): Forced convection circulation part

(5): copper wire transfer guide device (6): drawing machine

(7): reducing gas supply device (8): copper wire

(9): drawing machine guide pulley (10): coating machine guide pulley

(21): vacuum insulator

(25): copper feed pipe

(31): perforated plate

(32): heating plate (33): cooling water

34: cooling water tank 35: feed pulley

(41): gas for forced convection (42): annealing oven exhaust gas

The present invention relates to an annealing device for an enamel coating process consisting of a sequential cooling device and a vacuum insulated annealing oven, and in detail, a desired thickness through a fresh machine before performing the step of coating and drying the enamel on the copper wire surface in the enamel coating process. Annealing of copper wire to reduce the damage of products caused by tension and to obtain high quality coating through surface heat treatment by heating the copper wire extracted by using a certain temperature to lower the hardness of the internal structure of the copper wire to improve the ductility and increase the elasticity ratio. The present invention relates to an annealing apparatus configured to minimize energy consumption by applying a vacuum insulation technique and a forced flow of waste gas to an oven.

The copper heat treatment process is called annealing or annealing. The temperature and processing time of the annealing vary depending on the type and thickness of the copper to be processed and the intended use of the product.

In general, thick copper or rolled products are worked by bright annealing to match copper hardness while performing annealing while heating to a low temperature for a long time in a closed oven and slowly cooling. The most important point in such bright annealing is that all processing conditions must proceed in an oxygen-free atmosphere where no oxygen is present. Therefore, most hermetic ovens are annealed by heating with electricity and supplying reducing gas such as RX gas from the outside. Recently, annealing ovens have been developed that can unify the supply of heating and reducing gas through catalytic combustion. have.

On the other hand, the volume of the object to be annealed, such as copper wire or thin plate, is small and the volume of heat is small, and the work is mainly performed in a continuous process in the copper product that does not require long annealing operation.

Continuous annealing ovens are generally processed at temperatures as high as 50 ° C.-100 ° C. to allow for proper annealing in a short time instead of short heating times compared to closed annealing ovens. Even in the continuous process, most of the annealing process should proceed in an atmosphere where oxygen is not present, and if the remaining oxygen is 0.1% or more, the copper surface is oxidized. In the continuous process, a burner is installed at the outlet of the annealing target to prevent oxygen from flowing into the heating oven.

However, due to the nature of the process, due to the lack of a suitable slow cooling method in a reducing atmosphere, the method of quenching the annealed copper using water or oil and then skin pass is adopted. It is difficult to obtain proper ductility through processing, and there is a big disadvantage that some foreign matter may occur on the copper surface.

The technical field of the present invention is a technique for continuous annealing of thin copper wire processed by a drawing machine as a preliminary step for enamel coating. This technology has been studied much outside the country such as the United States, Japan and Italy.

In the 1980s, when the United States was in the midst of textile technology, R & D was mainly underway, and the oven and annealing system for annealing consisted of relatively monotonous systems. An electric heating plate was used to control the temperature of the inside of the oven and to control the temperature for the annealing of the oven. The electric heating plates were divided into parts and arranged to have a relatively small temperature difference in the transport direction of the copper wire.

However, as the transfer speed of the copper wire increases and the length of the oven increases, the number of electric heating plates required increases, thereby increasing energy consumption and complicating the control method for controlling the increased electric heating plates.

In addition, in order to prevent surface oxidation of copper wires, a cooling system was adopted to lower the temperature of copper wires by passing the heated copper wires directly through water.

In Europe, the development of enamel coating systems is mainly active in Italy. The Italian enamel system technology is focused on the development of drying ovens for drying coating liquids and drawing devices for adjusting the thickness of copper wires for processing, and the technology for annealing ovens is relatively inadequate. The annealing oven apparatus uses most of the heating methods mentioned above. Recently, as part of a technology for reducing energy consumption by reducing the number of heating plates, the heating plates are removed and electric heaters are installed on both sides to perform annealing by controlling the temperature by natural convection. There is a problem that the temperature deviation is large and the time required for temperature rise is increased.

The cooling method uses the above-mentioned water quenching method, and uses a technology of introducing water vapor to create an oxygen-free atmosphere inside the guide for transporting copper wire.

Enamel coating technology in Asia, including Japan, is relatively backward compared to Western countries. In particular, in Korea, most of the technologies are at the level of using or imitating advanced technologies, and technology development for annealing ovens among enamel coating systems is hardly made, and thus imported devices are used as they are. Even if a new annealing oven is manufactured by imitating imported devices, there is a lack of basic knowledge and basic data on annealing.

Since the cooling methods of both domestic and foreign annealing oven technologies are quenched by passing the heated copper wire through water once, the oxidation of the surface by the residual oxygen atmosphere which may occur in the continuous process during the cooling of the copper wire Although there is an advantage to prevent, but it is difficult to achieve the softening of suitable copper wire tissue through slow cooling.

In addition, in the structure of the oven, an electric heating plate is installed for each part to maintain the temperature inside the oven for annealing the copper wire, and thus the energy consumption is high, and the heating plate is installed on the oven wall so that no matter how well the insulation There is a disadvantage that the heat loss of the furnace increases.

And since most of the water vapor is used as an atmosphere medium for copper wire annealing, small unstained stains often occur on the surface of the copper wire, which is likely to cause uneven coating on the copper wire surface, which has a detrimental factor on product quality. Can be.

An object of the present invention for solving the above problems is to increase the ductility of the copper wire used in the enamel coating process to increase the stretch rate for the tension applied to the copper wire during the process, and to uniform the surface and internal structure of the copper wire To provide an annealing device for completing a high quality copper wire coating process.

The purpose of the present invention as described above is to convert the heating method by a large number of electric heating plate installed on the outer wall of the oven, which is a disadvantage in the existing annealing device to the mixing method of forcibly convection of the high temperature waste gas generated in the process with the electric heater installed locally. Reduce consumption, use the vacuum insulation method to insulate the oven, minimizing the range of temperature variations inside the oven, which may be insufficient for the above heating method,

In cooling, the annealed copper wire goes through more cooling stages to improve the ductility of the copper wire structure, thereby increasing the copper stretching rate to the tension that the copper wire receives in the whole process,

In addition, by providing a reducing gas instead of water vapor to the annealing atmosphere gas to minimize the phenomenon of copper surface that can be generated by the water vapor is achieved by providing an annealing device that can improve the quality of the surface processing by annealing the copper wire before coating.

The present invention to achieve the object as described above and to perform the problem for removing the conventional defects is to stabilize the structure of the increased copper wire through the drawing machine used in the enamel coating drying process, to increase the ductility of the copper wire copper wire in the coating process In the annealing device consisting of an oven and a cooling device for increasing the expansion rate of

Forced convection of the waste heat gas supplied from the outside to maintain uniform temperature inside the oven and reduce the energy consumption required to increase the temperature inside, and is installed on the inner copper wire supply side of the oven to control the temperature inside the oven An annealing oven having a vacuum insulation structure including an electric preheater for heating the copper wire, a vacuum insulation means for minimizing heat loss of the heated air in the oven, and a copper wire supply device for feeding the copper wire from the drawing machine into the oven;

It is connected to the rear end of the annealing oven of the vacuum insulation structure is composed of a vertical multi-stage so that the annealed copper wire is gradually cooled toward the upper layer, the inside is composed of a sequential cooling device that is supplied with a reducing gas to maintain a reducing atmosphere. do.

The basic configuration used in the present invention configuration as described above is an annealing of the electrical preheating unit (1) for controlling the temperature inside the oven, and the vacuum insulation structure designed to minimize the external discharge of heat generated from the electrical preheating unit (1) An oven 2, a sequential cooling device 3 connected to a rear end of the annealing oven 2 of the vacuum insulation structure to gradually cool the annealed copper wire, and a temperature inside the annealing oven 2 of the vacuum insulation structure. It is composed of a forced convection device (4) for uniformizing and a copper wire transfer guide device (5) for transferring the copper wire annealed in the annealing oven (2) of the vacuum insulation structure.

Hereinafter, the configuration and the operation of the embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Figure 1 shows a schematic diagram showing the configuration of a vacuum insulated annealing oven of a sequential cooling method according to the present invention. Referring to the configuration, the copper wire 8 for annealing is suitable for work in an unprocessed state. In order to be processed to thickness, it is first conveyed by the drawing machine guide pulley 9 to the drawing machine 6 which adjusts the thickness of copper wire again.

The copper wire supplied to the drawing machine is increased to a desired thickness and then enters the annealing oven 2 of the vacuum insulation structure through the copper wire transfer guide device 5.

The copper wire transfer guide device 5 for guiding the copper wire 8 to the annealing oven 2 of the vacuum insulation structure is manufactured in a nozzle type to minimize the distance from the copper wire 8 as shown in FIG. The inflow was minimized and the internal pressure was maintained at + by the reducing gas introduced in small amounts by the reducing gas supply device 7 into the sequential cooling device 3 so that external air inflow was hardly generated.

The copper wire 8 which has passed through the copper wire transfer guide device 5 is heated in an annealing oven 2 of a vacuum insulation structure and then transferred to a sequential cooler 3, where each temperature is slowly cooled while passing through different layers. Passed through the cooling water 33 contained in the cooling water tank 34 and finally through the coater guide pulley 10 is moved to the enamel coating drying oven.

In FIG. 1, reference numeral 4 denotes a forced convection device, 21 is a vacuum insulation unit, 24 is a guide plate, 26 is a heat insulating material, 31 is a porous plate, 35 is a feed pulley, 41 is forced convection gas, and 42 is annealing. Oven flue gas 35 is a feed pulley, the details of which are mentioned in the description of FIG.

Figure 2 is a cross-sectional view showing the arrangement of the copper wire transfer pipe and the electric preheater for transferring the copper wire of the vacuum insulation annealing oven according to the present invention.

Two copper wire conveying pipes 25 for transporting the copper wire 8 are installed on the left and right sides with respect to the center of the annealing oven 2 of the vacuum insulation structure, and are combined with the copper wire transfer guide device 5 in a separate type.

The copper wire transfer guide device 5 was manufactured in the form of a nozzle to minimize the gap with the copper wire 8 so as to block the outside air while maintaining the internal pressure at + as described above.

In the electric preheating unit 1, two U-shaped electric heaters are respectively installed, one above and one below the copper wire transfer pipe 25 to adjust the temperature inside the annealing oven 2 of the vacuum insulation structure.

The portion where the copper wire conveying pipe 25 and the copper wire conveying guide device 5 are combined, and the portion where the fuselage and the terminal of the electric preheating part 1 are combined, work when the initial copper wire 8 is connected to the feed pulley 35. In order to facilitate and to replace the electric preheating unit (1), it was configured as a separate type.

The connection part was sealed.

In FIG. 2, reference numeral 21 denotes a vacuum insulation unit, 22 is a blocking device, 23 is a fixing bolt, and 26 is a heat insulating material.

Figure 3 shows a detailed view of the annealing oven and forced convection flow of the vacuum insulation structure according to the present invention.

The annealing oven 2 of the vacuum insulation structure is largely comprised of the electrical preheating part 1, the vacuum insulation part 21, the copper wire conveyance pipe 25, and the forced convection apparatus 4. As shown in FIG.

In addition, as shown, the annealing oven 2 of the vacuum insulation structure has a double tube structure, and vacuum treatment is performed between the outer tube and the inner tube to minimize the discharge of heat inside the oven to the outside, and the vacuum thickness. Regardless of the length of the oven, the heat dissipation is minimized and the size is appropriately designed to minimize the temperature variation inside.

The outer tube was insulated again using a heat insulator 26.

The copper feed pipe 25 was connected to the sequential cooling device 3 in combination, and the leakage was prevented by the blocking device 22 and the blocking fixing bolt 23.

At the outlet of the annealing oven 2 of the vacuum insulation structure, a forced convection device 4 was installed so as to uniformly control the temperature inside the oven as soon as possible.

The fluid passing through the forced convection device 4 introduces the forced convection gas 41, which is a high-temperature waste exhaust gas discharged from the enamel coated drying oven, to reduce waste energy while reducing energy consumption by the electric preheating unit 1. Reusable. Forced convection waste gas is discharged to the annealing oven exhaust gas 42,

In addition, a guide plate 24 is installed inside the annealing oven 2 of the vacuum insulation structure to prevent the high temperature waste gas from being immediately discharged, and to be in contact with the electric heater installed therein, thereby annealing the vacuum insulation structure. It was comprised so that temperature control of the oven 2 could be made easy.

Figure 4 is a detailed view showing the heating plate and the transfer method of the sequential cooling device constituting the vacuum insulation annealing oven of the sequential cooling method according to the present invention, the copper wire 8 processed in the annealing oven (2) of the vacuum insulation structure ) Is transferred to the sequential cooling device (3) through the copper transport pipe (25).

In the sequential cooling device (3) is provided with an electric heating plate 32 to adjust the temperature of the entire inside of the cooling device to adjust the temperature differently for each position on the vertical line, the electric heating plate 32 is introduced into the interior Since the gas amount is relatively small, the power consumption is relatively low in the steady state.

Inside the sequential cooling system (3), a small amount of reducing gas such that the internal pressure can be maintained at + is supplied by the reducing gas supply device (7) to maintain an oxygen-free atmosphere. Reducing gas of (3) was configured to be transferred to the upper compartment through the porous plate 31 separating each layer.

In addition, a transport pulley 35 is installed inside to allow the transport of the copper wire 8 to the upper compartment.

The sequential cooling device (3) can be configured in a cartridge type to adjust the number of floors according to the desired temperature section design.

Figure 5 is a detailed view showing the cooling water and the transfer method of the sequential cooling device constituting the vacuum insulation annealing oven of the sequential cooling method according to the present invention, the copper wire 8 and the reducing gas transferred from the lower compartment is the same method. It is carried by the porous plate 31 installed in the air, and the cooling water tank 34 containing the cooling water 33 is installed on the porous plate to finally cool the copper wire 8 that has been cooled and enamel through the coater guide pulley 10. The coating was configured to transfer to a drying oven.

The present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by any person having ordinary skill in the art without departing from the gist of the present invention claimed in the claims. Of course, such changes will fall within the scope of the claims.

As described above, the present invention controls the temperature of the oven for annealing, by using a mixture of a method of forcing convection of a high temperature waste gas exhausted in the enamel coating process and the temperature rise by the electric heater. While reducing the energy consumption due to the use of, there is an advantage to minimize the temperature deviation inside the oven.

In addition, the present invention has the advantage of reducing the non-uniformity of the internal temperature that can be insufficient by the above heating method (mixed use of electric heater and forced convection) by minimizing heat loss to the outside through the vacuum insulation method.

In addition, the present invention is an atmosphere medium for annealing, by using a method of introducing a small amount of reducing gas, such as RX gas which can be produced by nitrogen, or reduced combustion of the catalyst in order to anneal copper in the oxygen-free atmosphere. There is an advantage of minimizing the stain phenomenon of the copper surface.

In addition, the present invention has the advantage of devising the structure of the copper wire guide in the form of a nozzle so that the outside oxygen is not introduced by the internal pressure by the supply of reducing gas.

In addition, the present invention in the method of cooling the heat-treated copper, refrain from the quenching method by water or oil that has been used previously, the temperature is different depending on the location, the cooling atmosphere is filled with reducing gas rather than water vapor Slowly lower the temperature of the copper surface through a cartridge-type cooling device, and then pass water to ensure proper ductility of the copper tissue by slow cooling to improve the elasticity of the copper wire in the entire enameling process and to minimize the occurrence of surface stains. It is a useful invention having the advantage that it is an invention that is expected to be greatly industrial use.

Claims (10)

In the annealing apparatus consisting of an oven and a cooling device for stabilizing the structure of the increased copper wire through the drawing machine used in the enamel coating drying process, increase the ductility of the copper wire to increase the stretching rate of the copper wire in the coating process, Forced convection of the waste heat gas supplied from the outside to maintain uniform temperature inside the oven and reduce the energy consumption required to increase the temperature inside, and is installed on the inner copper wire supply side of the oven to control the temperature inside the oven An annealing oven having a vacuum insulation structure including an electric preheater for heating the copper wire, a vacuum insulation means for minimizing heat loss of the heated air in the oven, and a copper wire supply device for feeding the copper wire from the drawing machine into the oven; The annealing copper wire connected to the rear end of the annealing oven of the vacuum insulation structure is configured to gradually cool to an upper layer composed of vertical multi-stage, and the inside is composed of a sequential cooling device in which a reducing gas is supplied to maintain a reducing atmosphere. An annealing apparatus for an enamel coating process comprising a sequential cooling apparatus and a vacuum insulated annealing oven. The method of claim 1, The annealing oven of the vacuum insulation structure has a circular shape in the form of a double tube while the outer tube of the double tube is composed of a vacuum insulation unit, Install an electric heater of pipe type at the inlet side of the inner pipe of the double pipe to heat the copper feed pipe connected to the sequential cooling system through the inner pipe, and configure the electric preheating unit to heat the copper wire inside the copper feed pipe. , An annealing device for an enamel coating process comprising a sequential cooling device and a vacuum insulation annealing oven, characterized in that both side portions of the double pipe are sealed. The method of claim 2, An annealing device for an enamel coating process comprising a sequential cooling device and a vacuum insulation annealing oven, characterized by further comprising an insulation layer around the outer surface of the vacuum insulation unit. The method according to claim 1 or 2, The copper wire transfer pipe for transferring the copper wire is installed on the left and right with respect to the center of the annealing oven of the vacuum insulation structure, and the sequential cooling device and vacuum insulation annealing oven, characterized in that configured to be assembled separately from the copper wire transfer guide device. Annealing apparatus for enamel coating process consisting of. The method according to claim 1 or 2, The copper wire transfer guide device has a sequential cooling device and a vacuum, characterized in that formed in the form of a nozzle to minimize the distance between the copper wire to block the outside air while maintaining the pressure of the inner tube of the annealing oven of the vacuum insulation structure to + Annealing apparatus for an enamel coating process comprising an adiabatic annealing oven. The method according to claim 1 or 2, The electrical preheating unit is a sequential cooling device and vacuum insulation annealing oven, characterized in that a total of two U-shaped electric heaters are installed at the top and bottom of the copper wire transfer pipe to adjust the internal temperature of the annealing oven of the vacuum insulation structure. Annealing apparatus for an enamel coating process comprised. The method according to claim 1 or 2, The forced convection device is composed of a sequential cooling device and a vacuum insulation annealing oven, characterized in that the convection gas flows into the outlet portion of the copper wire, and the tube outgoing the annealing oven exhaust discharged after circulating the inside of the oven. Annealing device for enamel coating process. The method according to claim 1 or 2, An annealing device for an enamel coating process comprising a sequential cooling device and a vacuum insulation annealing oven, characterized in that a guide plate for inducing forced convection air supplied into the annealing oven of the vacuum insulation structure is installed. The method of claim 1, The sequential cooling device is configured to adjust the temperature of the cooling device by installing an electric heating plate on the bottom, Sequential cooling system and vacuum insulation annealing, characterized in that the perforated plate is installed on each layer boundary so that the heat transfer between the upper and lower layers and the transfer of the reducing gas supplied through the reducing gas supply device is smoothly formed in an oxygen-free atmosphere. Annealing apparatus for the enamel coating process consisting of an oven. The method according to any one of claims 1 to 9, The sequential cooling system and vacuum insulation annealing oven are provided on the top floor of the multistage sequential cooling system, in which the coolant for final cooling of the copper wire supplied while changing the path by a plurality of transfer pulleys and a cooling water tank containing the cooling water are installed. Annealing apparatus for enamel coating process consisting of.

Images