KR100547602B1 - Portable electronic product with waterproof structure and waterproofing method thereof - Google Patents

Abstract

The present invention relates to a portable electronic product having a waterproof structure and a waterproofing method thereof. According to the present invention, a portable electronic product having a waterproof structure includes a casing for forming an accommodating space therein and a waterproofing part to avoid contact with water, moisture, and the like, and a portable electronic product accommodating and coupled to the casing. A core frame comprising: a core frame coupled to the interior component assembly along an outer circumference of the interior component assembly to surround a waterproof portion of the interior component assembly; And a resin molding contacted to the core frame from the outside of the core frame to prevent water, moisture, and the like from penetrating into the waterproof portion from the outside. As a result, the manufacturing cost is not significantly increased and the design of the casing is hardly influenced, and even if exposed to water, it is possible to have a reliable waterproof function that can block the inflow of water and moisture to the circuit components of the internal component assembly. do.

Waterproof, Cell Phone, Core Frame, Resin Molded, Elastomer, Injection Molding, Vacuum Molding

Description

Portable electronic product with waterproof structure and waterproofing method

1 is a partially broken perspective view of a mobile phone according to an embodiment of the present invention,

Figure 2 is a plan view of the interior component assembly of Figure 1,

3 is a right side view of the main assembly component of FIG. 2;

4 is a right side view of the flip embedded assembly of FIG. 2;

5 is a detailed view of the flexible connector of FIG.

6 is a plan view of a built-in component assembly of a mobile phone according to another embodiment of the present invention;

7 is a right side view of the main body assembly of FIG. 6;

8 is a right side view of the flip embedded component assembly of FIG. 6;

9 is a plan view of the upper resin molding coupled to the flip embedded component assembly of FIG. 8;

10 is a left side view of FIG. 9;

11 is a plan view of the lower resin molding coupled to the flip embedded component assembly of FIG. 8;

12 is a left side view of FIG. 11.

* Explanation of symbols for main parts of the drawings

  1: cell phone 10: casing                 

    11 body casing 12 button ball

    13: connection part 15: flip casing

    17: hinge connection 20, 120: assembly of the internal parts

21, 121: main assembly parts 22: main body printed circuit board

    22a: self antenna jack 22b: earphone jack

    22c: external antenna 22d: contact

    23: keypad 23a: signal input button

25, 125: flip embedded component assembly 26: liquid crystal display (LCD)

    27 speaker 28 liquid crystal display circuit board

    29: flexible connector 30, 130: core frame

    31: Euro groove 39: Protective member

40, 140: resin molding 41: buffer protrusion

 50: insulation buffer (= EVA Sponge)

 60: electromagnetic shield sheet 131: bite protrusion

132: bite groove 133: inclined portion

134: incision groove 135: ultrasonic welding projection

170: rubber coating layer

The present invention relates to a portable electronic product having a waterproof structure and a waterproof method thereof, and more particularly, to a portable electronic product having a waterproof structure having a waterproof function that does not lose its function even when exposed to water or the like. It is about.

Portable electronics such as mobile phones, personal digital assistants (PDAs), notebook computers, liquid crystal TVs, portable radios, CD players, MP3 players, etc. It can be used freely while moving. By the way, these portable electronic products are exposed to water while they are being carried. For example, if the portable electronic products are dropped into water or rained and wet, most products are not waterproof. If the water flows into the circuit parts inside the casing and the circuit parts come into contact with water, they lose their function and are prone to breakdown. Therefore, it is necessary to prevent such a failure, and furthermore, convenience will be increased if it can be carried on the beach or public baths, so that even if the portable electronic products are exposed to water, the inflow of water or moisture into the circuit components, etc. is blocked. Therefore, there is a need for a portable electronic product having a waterproof structure to prevent the circuit parts and the like from contacting with water.

By the way, in the conventional portable electronic products, especially the conventional mobile phone, there is a problem that the waterproof design is hardly made, and even if it is exposed to water a little, it is broken or damaged and cannot operate properly. In addition, there are a few products that are designed to be waterproof in consideration of these problems, but since they mainly adopt a method of sealing the gaps of casings of portable electronic products, it is practically difficult to seal all the gaps through which water penetrates. It is not able to achieve sufficient waterproofing, and in order to seal all the gaps of the casing, the size of the portable electronic products has to be increased, which can impose many constraints on the external design of the portable electronic products, as well as high development cost and manufacturing cost. It was uneconomical and lacked marketability.

Accordingly, the object of the present invention is to solve such problems in the related art, and the manufacturing cost is not significantly increased, and the design of the casing is hardly influenced. It is to provide a portable electronic product having a waterproof structure and a waterproof method capable of providing a reliable waterproof function to block the inflow of water.

The object of the present invention is to provide a portable electronic product having a casing for forming an accommodating space therein and a waterproofing part to avoid contact with water, moisture, and the like, and a built-in component assembly accommodated in the casing. A core frame coupled to the interior component assembly along an outer circumference of the interior component assembly to surround the waterproof portion of the component assembly; And a resin molding contacted to the core frame from the outside of the core frame to prevent water, moisture, and the like from penetrating into the waterproof part from the outside. do.                     

Here, the resin molding may be configured to be injection molded to a predetermined thickness by inserting the interior component assembly combined with the core frame and to be coupled to the core frame during injection molding.

And an insulation buffer installed between the core frame and the interior component assembly to insulate and cushion the interior component assembly, and an electromagnetic shielding sheet mounted between the insulation buffer and the core frame to prevent electromagnetic interference. It is more advantageous to protect the circuit components of the embedded component assembly during injection molding, and it is possible to achieve efficient space utilization in the design of portable electronic products because there is no need for separate electromagnetic interference design, and the insulation buffer is YB sponge It is preferable that it is (EVA Sponge).

In addition, the resin molding is more preferably an elastomer (ELASTOMER) molding, because in the case of the elastomer (ELASTOMER) it is well bonded to the plastic surface during injection molding to maintain a very high adhesion and airtightness.

In addition, a portion of the outer surface of the resin molding is provided with a buffering protrusion formed to protrude outward from the outer surface, so that the buffering protrusion acts as a buffer even when the internal component assembly is installed in the casing and receives an external impact. It is advantageous to protect the resin molding, and the cutout line for dividing the resin molding may be provided on the outer surface of the resin molding, which is generally replaced by the entire internal component assembly in case of failure or the like. In order to facilitate the removal of the resin molding in case of need to remove and repair, flow path grooves to smooth the flow of the resin during injection molding by recessing the outer surface of the core frame by a predetermined depth from the outer surface to the inside It is preferable for injection molding of the resin molding that this is formed, The inner surface portion of the core frame, there may be provided reinforcing rib for reinforcing the strength of the core frame.

On the other hand, the resin molding is preferably vacuum-molded to have an inner surface shape corresponding to the outer shape of the interior component assembly coupled to the core frame and then coupled to the core frame.

Here, it is advantageous in the work process that the resin molding is combined with the core frame by ultrasonic welding.

Then, the rubber coating layer is applied to at least a portion of the outer surface of the resin molding; if configured to further include a more waterproof can be ensured.

The core frame may include an upper core frame and a lower core frame coupled to each other, and the resin molding may include an upper resin molding and a lower resin molding ultrasonically fused to the upper core frame and the lower core frame, respectively. Preferably, a bite protrusion is formed along the periphery of the edge portion of the upper core frame and the lower core frame, and a bite groove corresponding to the bite protrusion is formed on the other.

And, if the end of at least one of the end of the upper core frame and the end of the lower core frame is configured to have an inclined portion of the outer surface so that the thickness becomes thinner toward the outside, the upper core frame and the lower core frame mutually V-shaped cutout groove is formed in the coupling portion to be coupled, so that the resin molding can be easily cut along the cutout when the resin molding is removed when the internal component assembly is broken.

On the other hand, according to another field of the present invention, there is provided a waterproof method of a portable electronic product having a casing to form a receiving space therein, and a water-proof portion to avoid contact with water, moisture, etc. and a built-in component assembly accommodated in the casing. The method comprising: coupling a core frame along an outer circumference of the interior component assembly to surround the waterproof portion of the interior component assembly; And a circumference of the core frame and the interior of the interior parts assembly using an interior parts assembly having the core frame coupled therein as an insert to prevent penetration of water and moisture from the outside into the waterproof part of the interior parts assembly. Provided is a waterproof method for a portable electronic product comprising a; injection molding a resin molding to a predetermined thickness along at least a part of the circumference.

Here, the interior component assembly further includes a protective portion to avoid contact with the injection mold during injection molding, and before the injection molded resin molding integrally with the core frame and the interior component assembly, the protective portion of the interior component assembly It is preferable to further include the step of installing a protective member in contact with the injection mold at the time of injection molding, and after injection molding, removing the protective member.

The coupling of the core frame to the embedded component assembly may include: mounting an electromagnetic shielding sheet inside the core frame to prevent electromagnetic interference before coupling the core frame to the embedded component assembly; And installing a heat insulating buffer in the core frame in contact with the outer surface of the electromagnetic shielding sheet.

In addition, according to the present invention, in the waterproof method of a portable electronic product having a casing for forming a receiving space therein, and a water-proof portion to avoid contact with water, moisture, etc. and a built-in component assembly accommodated in the casing. Providing a core frame coupled along an outer circumference of the interior component assembly to surround the waterproof portion of the interior component assembly; Providing a resin molding having an inner surface shape corresponding to an outer shape of the interior component assembly to which the core frame is coupled and having a predetermined thickness by vacuum molding; Coupling the resin molding to the core frame; And coupling the internal component assembly to the core frame to which the resin molded article is coupled.

The method may further include applying a rubber coating layer to at least a portion of an outer surface of the resin molding after the interior component assembly is bonded to the core frame to which the resin molding is bonded.

And, the resin molding material is advantageous in that the transparent polyester resin does not cover the field of view even if the resin molding is placed on the LCD portion of the mobile phone, the resin molding is coupled to the core frame by ultrasonic welding It is advantageous in method.

The core frame may include an upper core frame and a lower core frame coupled to each other, and the resin molding may include an upper resin molding and a lower resin molding ultrasonically fused to the upper core frame and the lower core frame, respectively. And, one of the edge portion of the upper core frame and the lower core frame is formed with a bite projections along the periphery of the edge portion and the other can be configured to form a bite groove corresponding to the bite protrusions.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The present invention is an accommodating space inside a variety of portable electronic products such as mobile phones, personal digital assistants (PDAs), notebook computers, liquid crystal TVs, portable radios, CD players, MP3 players, and the like. If the casing to form a, and a portable electronic product having a waterproof portion to avoid contact with water and has a built-in component assembly that is accommodated in the casing can be applied in various ways, it will be described below by applying to a mobile phone.

1 is a partially broken perspective view of a mobile phone according to an embodiment of the present invention, Figure 2 is a plan view of the internal component assembly of Figure 1, as shown in these drawings, the mobile phone 1 according to an embodiment of the present invention ) Is a casing (10) to form a receiving space therein, the interior parts assembly 20 that is housed and coupled to the casing (10) having a waterproof portion to avoid contact with water, and the waterproofing of the interior parts assembly (20) The core frame 30 coupled to the interior component assembly 20 so as to enclose a part, and the Yves sponge (EVA SPONGE) 50 which is an insulation buffer installed between the core frame 30 and the interior component assembly 20. The electromagnetic shielding sheet 60 mounted between the EVA SPONGE 50 and the core frame 30 and the core frame 30 and the interior component assembly are disposed on the outer surface of the core frame 30. 20) an elastomer (ELASTOMER) (40) which is an injection molded resin molded integrally with The.                     

 The casing 10 has a main body casing 11 in which a plurality of signal input buttons 23a are provided for a user to input data, and a flip casing 15 in which a liquid crystal display (LCD) is installed. . The main body casing 11 is housed in the main body assembly assembly 21 to be described later, the flip casing 15 is housed in the flip embedded component assembly 25 to be described later.

The main body casing 11 has a button hole 12 cut out according to the position of the plurality of signal input buttons 23a so that the plurality of signal input buttons 23a can be exposed to the outside, and the flip casing 15 and the hinge connection. The connecting portion 13 is provided. The flip casing 15 is provided with a screen hole 16 cut out to expose the liquid crystal display (LCD) 26 to the outside, and a hinge connection portion 17 hinged to the main body casing 11. have. The flip casing 15 is opened and closed relative to the main body casing 11 by using the longitudinal center line of the hinge connecting portion 17 as the rotation axis.

FIG. 3 is a right side view of the main assembly component of FIG. 2, FIG. 4 is a right side view of the flip embedded component assembly of FIG. 2, and FIG. 5 is a detailed view of the flexible connector of FIG. The embedded component assembly 20 shown in detail in FIGS. 2 to 5 is generally electrically connected and coupled to a printed circuit board 22 and 28 and a printed circuit board 22 and 28. It includes the functional parts such as the self antenna jack 22a, the earphone jack 22b, the external antenna jack 22c, the contact 22d, the speaker 27 and the like, it means. Concept of the waterproof design of the mobile phone according to an embodiment of the present invention, to avoid the conventional waterproof design concept to block each gap of the casing 10 of the mobile phone, the exposure is required, such as parts connected to the external device It is a new concept to block the contact of water and circuit parts by enclosing the parts of the interior parts assembly 20 except the parts by injection molded resin moldings made of the same material as the elastomer (ELASTOMER) 40. In the case of the folding cellular phone 1 as in the present embodiment, the internal component assembly 20 includes the internal component assembly 21 accommodated in the main body casing 11 and the internal component provided in the flip casing 15. The assembly 25 may be largely divided, and thus, for the sake of clarity in the description, the main assembly component 21 and the flip assembly component 25 will be referred to, respectively. The component assembly in the state is the same as the interior component assembly 20 defined above. In consideration of this, in a portable electronic product such as a flip-type mobile phone, the main body embedded part assembly 21 and the flip embedded part assembly 25 have a built-in part assembly 20, which is integrally formed, and an elastomer injection molding is performed here. It is easy to see that this will apply.

The main body embedded component assembly 21 includes a main body printed circuit board 22 and a keypad 23 electrically connected to the main body printed circuit board 22 on the front surface of the main body printed circuit board 22. The keypad unit 23 is a part having a plurality of signal input buttons 23a for inputting data by the user. In the case where the main body assembly includes water, the keypad 23 may be connected to the main body printed circuit board 22 even though water is in contact with the surface of the keypad unit 23. Since it cannot penetrate, the core frame 30 and the resin molding, that is, the elastomer ELASTOMER 40 do not need to be disposed on the outer surface. Therefore, the surface of the keypad 23, the end of the contact 22d, the end of the external antenna 22c, and the like, which are to be connected to an external device, are excluded from the waterproofing portion of the main body interior assembly 21, thereby eliminating an elastomer (ELASTOMER) ( 40) shall not be molded in this part. In the case of the contact 22d, the waterproof contact disclosed in the Utility Model Registration No. 198490 'Terminal structure having a waterproof structure' possessed by the present applicant is used, and the inside of the external antenna 22c or the inside of the earphone jack 22b is used. Since the waterproofing technology is already in a state of the art, it is used.

On the other hand, in the case of the flip embedded component assembly 25, a speaker 27, a liquid crystal display (LCD) 26, and the like are electrically provided on a printed circuit board 28 of a liquid crystal display (LCD). The liquid crystal display (LCD) glass surface is water resistant because the liquid surface does not penetrate into the printed circuit board 28 of the liquid crystal display (LCD) 26 even though it is in contact with water. In addition, the connector contact end for connection with the flexible connector 29 to be described later is excluded from the waterproof portion. The keypad 23 and the liquid crystal display (LCD) glass surface, which are excluded from the waterproof portion of the above-described interior component assembly 20, will be described later, but are blocked by a separate protective member 39 during injection molding. Injection molded.

In addition, the folding cellular phone has a flexible connector 29 for connecting the main body embedded component assembly 21 and the flip embedded component assembly 25. In the case of the flexible connector 29, the connector contact end must be exposed for electrical connection. Therefore, the elastomer (ELASTOMER) 40 is not molded in this part.

The core frame 30 is coupled to the interior component assembly 20 so as to surround the waterproof portion of the interior component assembly 20. Typically, the plastic frame (PLASTIC FRAME: PBT + Glass Fiber 20%) of the material is made of two parts of the upper core frame 30 and the lower core frame 30 having a thin thickness, the interior component assembly 20 The upper core frame 30 and the lower core frame 30 are coupled to each other and the internal component assembly 20 so as to surround the waterproof portion of the upper core frame 30 and the lower core frame 30. The core frame 30 may be largely divided into a core frame installed on an outer surface of the main body assembly part 21 and a core frame installed on an outer surface of the flip embedded part assembly 25, and thus, for description purposes, The body core frame and the flip core frame will be referred to as the respective reference numerals.

The outer surface of the core frame 30 is formed with a grid-shaped flow path groove 31 recessed inwardly by a predetermined depth, which is to facilitate the flow of the resin during injection molding. In addition, since the thickness of the core frame 30 is thin, a reinforcing rib (not shown) is provided in a portion of the inner surface of the core frame 30 to reinforce the strength of the core frame 30.

Between the core frame 30 and the interior component assembly 20, a thermal insulation buffer (EVA SPONGE) (50) is installed, the electromagnetic wave between the EVA SPONGE (50) and the core frame (30) Shielding sheet 60 is installed. The electromagnetic shielding sheet 60 is a sheet for shielding electromagnetic waves to prevent electromagnetic interference (EMI), and is made by coating a PVC sheet on a copper sheet or an aluminum sheet, and having a core frame 30 shape. Molded parts are used in consideration of the arrangement of circuit components. The EVA SPONGE 50, which is an insulation buffer, covers the circuit components while blocking the circuit components on the printed circuit boards 22 and 28, and the core frame 30 side surface is flat. The electromagnetic shielding sheet 60 is placed on this flat surface. As such, the YB sponge 50 is mainly mounted for the purpose of providing a flat surface so that the electromagnetic shielding sheet 60 may be installed, but the printed circuit board (ELASTOMER) insert (INSERT) injection molding ( It also serves to protect circuit components (IC, chip resistors, chip capacitors) of 22, 28, etc. from heat and pressure.

The ELASTOMER molding 40, which is a resin molding, is disposed on the outer surface of the core frame 30 and is injection molded integrally with the core frame 30 and the interior component assembly 20, wherein a part of the outer surface is molded. The area, mainly eight corners and the necessary portion, is formed to be provided with a buffer projection 41 formed to protrude outward from the outer surface. The buffer protrusion 41 serves to prevent internal circuit components from being damaged by external shock. In this embodiment, the material of the resin molding is an elastomer (ELASTOMER), which in the case of the elastomer (ELASTOMER) is welded to the plastic surface, that is, the surface of the core frame 30 during injection molding very high adhesion and This is because confidentiality is maintained.

Looking at the coupling structure of the main body component assembly 21, the core frame 30 and the elastomer (ELASTOMER) 40 with reference to Figure 3, the keypad portion of the printed circuit board of the main body assembly (21) ( 23) Yves sponge 50 is provided on the opposite side, and electromagnetic shielding sheet 60 is provided in contact with the outer surface of the Yves sponge 50. The main body core frame 30 is coupled to the main body internal parts assembly 21 so as to surround the waterproof portion of the main body internal parts assembly 21, and the outer surface of the main body core frame 30 is disposed between the main body core frames 30. An elastomer (ELASTOMER) 40, which is a resin molding for blocking the gap and the gap between the main body core frame 30 and the keypad portion 23, is injection molded. Since the surface of the keypad 23 does not need to be injection molded in the elastomer (ELASTOMER) 40, the main body core frame 30 is not installed. Therefore, when the keypad 23 and the injection mold are in direct contact with each other during injection molding, the keypad 23 may be damaged, so that the keypad 23 is not directly in contact with the injection mold during injection molding. The protective member 39 is removed from the keypad 23 after the plastic case, which is a protective member 39, is attached to the keypad 23. In addition, a portion, such as an area 'A', that is, a portion where the external antenna 22c and the like are installed is in close contact with the outer surface of the external antenna 22c and has a radius that is slightly narrower than the outer surface of the outer antenna 22c near the outside of the outer antenna 22c end. The elastomer (ELASTOMER) 40 is formed to be bent inwardly so as to form a hole having a hole to block a gap into which water or the like is introduced.

As shown in FIG. 4, the coupling structure between the core frame 30 and the elastomer (ELASTOMER) 40 in the flip embedded component assembly 25 is similar to that in the main assembly component 21. The YB sponge 50 is provided on the back side of the liquid crystal display (LCD) 26 of the flip embedded component assembly 25, and the electromagnetic shielding sheet 60 is formed on the outer surface of the YB sponge 50. ) Is installed. The flip core frame 30 is provided to surround the waterproof portion of the flip embedded component assembly 25, and the gap between the flip core frame 30 and the flip core frame 30 are provided on the outer surface of the flip core frame 30. 30) and an elastomer (ELASTOMER) 40, which is a resin molding for blocking a gap between the liquid crystal display (LCD) 26 and the like, is provided by injection molding. On the surface of the liquid crystal display (LCD) 28, the liquid crystal display (LCD) 28 may be damaged if the liquid crystal display (LCD) 28 is directly in contact with the injection mold during injection molding. Therefore, during the injection molding, the plastic case and the protection member 39 including the plastic case and the heat dissipation buffer are attached on the surface of the liquid crystal display (LCD) 28 to prevent direct contact with the injection mold, and then the plastic case Remove the thermal shock absorber in order. In this case, the same portion as the 'B' region, that is, the portion to which the flexible connector 29 is connected is formed such that the elastomer 40 is bent inward to have a hole having a diameter smaller than that of the flexible connector 29. In this way, the flexible connector 29 enters and is connected to the hole so as to block a gap into which water and moisture are introduced.

5 is a detailed view of the flexible connector of FIG. 2, wherein the flexible connector 29 includes a connector plug 29a and a flexible printed circuit board (PCB) 29b. In the case of the flexible connector 29, the insert (ELASTOMER) 40 is inserted into the outer surface of the flexible printed circuit board (PCB) 29b without inserting the core frame 30.

 By such a configuration, a waterproof method of a portable electronic product having a waterproof structure according to an embodiment of the present invention will be described.

First, the component assembly is assembled to prepare the interior component assembly 20 by completing the inspection of all operating states. Next, the electromagnetic shielding sheet 60 is mounted inside the core frame 30 and the EVA SPONGE 50 is installed to be in contact with the outer surface of the electromagnetic shielding sheet 60. Then, the electromagnetic shielding sheet 60 is installed. Core frame 30 equipped with EVA SPONGE 50 is installed to surround the waterproof portion of the internal component assembly 20.                     

Subsequently, in the case of the main body integrated component assembly 21, a plastic case serving as a protective member 39 is attached to the surface of the keypad 23, and in the case of the flip embedded component assembly 25, a liquid crystal display (Liquid Crystal Display); On the surface of the LCD 26, a protective member 39 consisting of a heat dissipation buffer and a plastic case thereon is attached.

Subsequently, the interior component assembly 20 is inserted into a specially manufactured injection mold, and then an elastomer (ELASTOMER) 40 is injection molded to completely seal the waterproof part of the interior component assembly 20. At this time, each connector for external connection, the earphone jack (22b), the external antenna (22a) and the like portion of the elastomer (ELASTOMER) 40 is formed as 'A' part of Figure 3 or 'B' part of FIG. Be sure to ELASTOMER (40) When forming the mold, the mold is formed so that a separation cutout line (not shown) is provided on the outer surface of the resin molding, and the separation cutout line (not shown) is formed on the outer surface of the resin molding. Be prepared.

The internal component assembly 20 in which the elastomer (ELASTOMER) 40 is integrally formed has all functions, and water does not come into contact with the circuit components of the printed circuit boards 22 and 28. It will have a perfect waterproof function, such an internal component assembly 20 is housed in the casing 10 to complete the assembly of the mobile phone (1).

6 is a plan view of an internal component assembly of a mobile phone according to still another embodiment of the present invention, FIG. 7 is a right side view of the main body interior assembly of FIG. 6, and FIG. 8 is a right side view of the flip interior component assembly of FIG. 6. . The same reference numerals are used for the same components as those of the above-described embodiment, and the numerals added with '100' to the reference numerals described in the embodiment are indicated for the somewhat changed components. As shown in these figures, unlike the above-described embodiment in which the resin molding 40 is injection molded to a predetermined thickness by inserting the embedded component assembly 20 to which the core frame 30 is coupled, the present embodiment In the above, the upper resin molding 140 and the lower resin molding 140 are separately vacuumed so as to have an inner surface shape corresponding to the outer shape of the interior component assembly 120 coupled to the upper core frame 130 and the lower core frame 130. After molding, each resin molding 140 is bonded to each core frame 130 by ultrasonic welding, and the upper resin molding 140 and the lower resin molding 140 are respectively bonded to the upper core frame by ultrasonic welding ( 130 and the lower core frame 130 are combined to accommodate the internal component assembly 120 therein, and further, a rubber coating layer 170 is formed on the outer surface of the resin molding 140. In the present embodiment, the casing 10 and the interior component assembly without the waterproofing process are the same as in the above-described embodiment, and thus description thereof will be omitted and only the portions different from the above-described embodiment will be described.

In the present embodiment, the core frame 130 includes an upper core frame 130 and a lower core frame 130 that are coupled to face each other as in the above-described embodiment. And the edge of the upper core frame 130, the chamfer 131 is formed along the periphery of the edge portion, the edge of the lower core frame 130, the edge of the upper core frame 130 along the periphery of the edge portion A bite groove 132 corresponding to the bite protrusion 131 is formed. Accordingly, when the upper core frame 130 and the lower core frame 130 are combined, the bite protrusion 131 and the bite groove 132 are engaged with each other, so that the lower core frame 130 and the upper core frame 130 are coupled without gaps. Will be. In addition, the ends of the upper core frame 130 and the lower core frame 130 has an inclined portion 133 whose outer surface is inclined so that the thickness becomes thinner toward the outside, the upper core frame 130 and the lower core frame 130. When the mutual coupling, the V-shaped cutout groove 134 is formed on the surface of the portion facing each other, that is, the coupling surface. This is in principle, in the case of failure, in general, the entire interior parts assembly 120 is replaced, but the resin molding 140 along this incision groove 134 in case it needs to be repaired by removing the resin molding 140. This is to facilitate the separation of the resin molding 140 by cutting. In addition, the outer surface of the upper core frame 130 and the lower core frame 130 has a plurality of ultrasonic welding projections 135 protruding from the resin molding 140 to facilitate the ultrasonic welding.

In addition, the resin molding 140 in the present embodiment is molded into a desired shape by vacuum molding separately from the core frame 130. FIG. 8 is a plan view of the upper resin molding coupled to the flip embedded component assembly, FIG. 9 is a left side view of FIG. 8, FIG. 9 is a plan view of the lower resin mold coupled to the flip embedded component assembly, and FIG. It is a left side view. The upper and lower resin moldings 140 of the body interior component assembly 121 are similar to the upper resin molding 140a and the lower resin molding 140b of the flip embedded component assembly 125 are molded as shown in these figures. Also molded according to the required shape. That is, the resin molding 140 is molded to have an inner surface shape corresponding to the outer shape of the internal component assembly 120 to which the core frame 130 is coupled.

Vacuum molding is a type of plastic molding process, in which a plastic sheet edge is pressed into a lower mold with a clamp and heated from above with a heater to draw air from the mold when it is sufficiently softened. Therefore, in the present embodiment, a transparent synthetic resin plate such as polyester, polycarbonate, and ABS (acrylonitrile butadiene styrene copolymer) resin is installed in a mold for vacuum molding, and is subjected to heating, vacuum molding, and cutting process. It is prepared to the desired form as shown in FIG. At this time, since the resin molding 140 is usually transparent in this embodiment, the resin molding 140 has a shape that can cover the liquid crystal display (LCD) surface portion without being cut, unlike the above-described embodiment. And in the case of the resin molding 140 for coupling with the core frame 130 coupled to the keypad portion 123 side of the main body assembly assembly 121, the resin molding 140 is inserted by inserting the manufactured resin molding 140 ) And the keypad unit 123 may be integrally formed.

The molded upper resin molding 140 and the lower resin molding 140 are respectively coupled to the upper core frame 130 and the lower core frame 130 by ultrasonic welding, and the resin molding 140 is bonded to the ultrasonic welding. The upper core frame 130 and the lower core frame 130 coupled by each other are coupled to accommodate the internal component assembly 120 therein. When the coupling is completed, the gap of the coupling portion is sealed by the bite coupling of the bite protrusion 131 and the bite groove 132 of the upper core frame 130 and the lower core frame 130, the upper core frame 130 and the lower core frame Since the resin molding 140 is in a state of being in contact with the outer side of the 130, the waterproof structure is primarily achieved.

The rubber coating layer 170 is formed on the outer surface of the resin molding 140. The rubber coating layer 170 is a rubber-based spray paint, which has a surface strength that is lower than that of the above-described Elastomer, but has excellent strength for use in the internal structure, and is excellent in workability and adhesiveness. This is good and has excellent waterproofing ability. The rubber coating layer 170 supplements the primary waterproof structure by the resin molding 140 secondarily, thereby making it more waterproof.

By such a configuration, a waterproof method of a portable electronic product having a waterproof structure according to another embodiment of the present invention will be described.

First, assembling the component assembly to complete the inspection of all operating conditions to provide the interior component assembly 120, the shape corresponding to the shape of the interior component assembly 120, the upper core frame 130 and the lower core frame ( 30) is prepared by injection molding.

In addition, the upper resin molding 140 and the lower resin molding 140 having inner shapes corresponding to the outer shapes of the upper core frame 130 and the lower core frame 130 are provided by vacuum molding. Typically, a transparent synthetic resin plate such as polyester, polycarbonate, ABS resin is installed in a mold for vacuum molding, and manufactured into a desired shape through processing, vacuum molding, and cutting process. In this case, as described above, in the case of the upper resin molding 140 coupled to the upper core frame 130 of the main assembly component 121, the manufactured upper resin molding 140 is inserted into the upper resin molding 140. The keypad portion 123 is molded in one piece.

Next, each of the upper core frame 130 and the lower core frame 130 is disposed inside each of the upper resin molding 140 and the lower resin molding 140 and then bonded to each other by ultrasonic fusion.

Then, the resin molding 140 combines the upper and lower core frames 130 to accommodate the internal component assembly 120 in the ultrasonically fused core frame 130. At this time, the edges of the upper and lower core frame 130 is formed along the periphery of the rim protrusion 131 and the bleeding groove 132, respectively, so that the bleeding protrusion 131 is coupled to the bleed groove 132 The upper and lower core frame 130 is kept coupled, thereby primarily achieving a waterproof structure.

Then, rubber painting is applied to the outer surface of the resin molding 140. First, the interior jig assembly 120 in which the core frame 130 and the resin molding 140 are coupled to the automatic jig is installed, and then the coating is applied to the outer surface of the resin molding 140 by spraying to obtain a rubber coating layer ( 170) and dry and waterproof test. The completed interior component assembly 120 has all functions as such, and water does not come into contact with the circuit components of the printed circuit board, thereby having a perfect waterproof function, and casing the interior component assembly 120. Accommodate coupling to (10) to complete the assembly of the mobile phone (1).

As described above, the waterproof parts of the interior component assemblies 20 and 120 accommodated in the casing 10 are inserted into the interior component assembly 20 coupled to the core frame 30, and an elastomer such as ELASTOMER is used. The injection molded resin molding 40 or a polycarbonate (polycarbonate), etc. as a material by molding by vacuum molding and then surrounded by a resin molding 140 bonded to the core frame 130, manufacturing cost It does not significantly increase and hardly affects the design of the casing 10, and has a reliable waterproof function that can block the inflow of water and moisture to the circuit components of the internal component assembly 20 and 120 even when exposed to water. It becomes possible.                     

In the above-described embodiment, the clamshell-type mobile phone has been described above. However, if the portable electronic product has a casing and a waterproof part and has a built-in component assembly accommodated in the casing, a flip-type mobile phone is also possible, and furthermore, personal digital assistants (PDAs). Also, various portable electronic products such as notebook computers, liquid crystal TVs, portable radios, CD players, MP3 players, etc. also form a resin molding which couples the core frame to the internal component assembly and contacts the core frame from the outside of the core frame. Of course, it is possible to provide a sure waterproof function.

In addition, in the above-described embodiment, the material of the injection molded resin molded product is an elastomer (ELASTOMER) by inserting the internal component assembly having the core frame coupled thereto. However, the injection molding is well fused to the surface of the core frame. As long as the material can maintain very high adhesion and airtightness, other resins can be used.

In addition, in the above-described embodiment, when the resin molding is separately molded and bonded to the core frame, the molding is performed by vacuum molding. However, if the resin molding of the desired shape can be molded, blow molding may be performed. Naturally, it is also possible that the separately molded resin molding is ultrasonically fused to the core frame, but it is natural that it can be adhesively bonded.

In addition, in the above-described embodiment, the insulation buffer is EVA SPONGE. However, as long as the insulation and cushioning material can be used, other types of materials such as nonwoven fabric may be used, and in the above-described embodiment, Although the insulation buffer and the electromagnetic shielding sheet have been described above separately, it is natural that the insulation buffer and the electromagnetic shielding sheet may be integrally provided if a material having both functions.

As described above, according to the present invention, the manufacturing cost is not significantly increased and the design of the casing is hardly influenced, and even if exposed to water, it is possible to block the inflow of water and moisture into the circuit components of the internal component assembly. Provided are a portable electronic product having a waterproof structure and a waterproofing method for providing a waterproof function.

Claims (18)

In a portable electronic product having a casing to form a receiving space therein, and a waterproof part to avoid contact with water, moisture, etc., and a built-in component assembly accommodated in the casing, A core frame coupled to the interior component assembly along an outer circumference of the interior component assembly to surround the waterproof portion of the interior component assembly; And And a resin molding contacted to the core frame from the outside of the core frame to prevent water, moisture, and the like from penetrating into the waterproof part from the outside. The method of claim 1, The resin molded product is a portable electronic product having a waterproof structure, characterized in that the injection molded in a predetermined thickness by inserting the interior component assembly combined with the core frame and is coupled to the core frame during injection molding. The method of claim 2, And a heat insulation buffer installed between the core frame and the interior component assembly to insulate and cushion the interior component assembly, and an electromagnetic shielding sheet mounted between the insulation buffer and the core frame to prevent electromagnetic interference. Portable electronic products having a waterproof structure. The method of claim 3, The insulation buffer is a portable electronic product having a waterproof structure, characterized in that the sponge (EVA Sponge). The method of claim 2, The resin molded article is an elastomer (ELASTOMER) molded article characterized in that the portable electronic product having a waterproof structure. The method of claim 2, A portion of the outer surface of the resin molding is provided with a buffer protrusion formed to protrude from the outer surface to the outside, and a splitting line for dividing the resin molding is provided on the outer surface of the resin molding. The side surface is formed with a flow path groove recessed by a predetermined depth from the outer surface to the inside to facilitate the flow of the resin during injection molding, and a portion of the inner surface of the core frame is provided with a reinforcing rib for reinforcing the strength of the core frame. Portable electronic products having a waterproof structure, characterized in that. The method of claim 1, The resin molding is a portable electronic product having a waterproof structure, characterized in that the vacuum molded to have an inner surface shape corresponding to the outer shape of the interior component assembly coupled to the core frame and is coupled to the core frame. The method of claim 7, wherein The resin molding is a portable electronic product having a waterproof structure, characterized in that coupled to the core frame by ultrasonic welding. The method of claim 7, wherein And a rubber coating layer applied to at least a portion of an outer surface of the resin molding. The method of claim 7, wherein The core frame includes an upper core frame and a lower core frame coupled to each other, and the resin molding includes an upper resin molding and a lower resin molding ultrasonically fused to the upper core frame and the lower core frame, respectively. Portable frame having a waterproof structure, characterized in that a bite protrusion is formed along the periphery of the edge portion of the upper core frame and the lower core frame and the bite groove corresponding to the bite protrusion is formed on the other Electronic products. The method of claim 10, At least one of the end portion of the upper core frame and the end of the lower core frame is a portable electronic product having a waterproof structure, characterized in that the outer surface is inclined inclined so as to become thinner toward the outside. In the waterproof method of a portable electronic product having a casing to form a receiving space therein, and a water-proof portion to avoid contact with water, moisture, etc. and a built-in component assembly accommodated in the casing, Coupling a core frame along an outer circumference of the interior component assembly to surround the waterproof portion of the interior component assembly; And Periphery of the core frame and the interior of the interior parts assembly by inserting the interior parts assembly in which the core frame is coupled to prevent water and moisture from penetrating into the waterproof part of the interior parts assembly from the outside. And injection molding the resin molding to a predetermined thickness along at least a part of the circumference. The method of claim 12, The interior component assembly further includes a protective part to avoid contact with the injection mold during injection molding, Before the injection molding of the resin molding integrally with the core frame and the interior component assembly, a protective member for contacting the injection mold at the time of injection molding is installed on the protective part of the interior component assembly, and the injection molding is performed. The waterproof method of a portable electronic product further comprising the step of removing the member. The method according to claim 12 or 13, Coupling the core frame to the embedded component assembly, Before coupling the core frame to the embedded component assembly, Mounting an electromagnetic shielding sheet inside the core frame to prevent electromagnetic interference; And And installing a heat insulating buffer on the core frame to be in contact with the outer surface of the electromagnetic shielding sheet. In the waterproof method of a portable electronic product having a casing to form a receiving space therein, and a water-proof portion to avoid contact with water, moisture, etc., and a built-in component assembly accommodated in the casing, Providing a core frame coupled along an outer circumference of the interior component assembly to surround the waterproof portion of the interior component assembly; Providing a resin molding having an inner surface shape corresponding to an outer shape of the interior component assembly to which the core frame is coupled and having a predetermined thickness by vacuum molding; Coupling the resin molding to the core frame; And Coupling the embedded component assembly to the core frame to which the resin molding is coupled. The method of claim 15, Bonding the interior assembly to a core frame to which the resin molding is bonded, and then applying a rubber coating layer to at least a portion of an outer surface of the resin molding; waterproofing method of a portable electronic product further comprising: . The method of claim 15, The resin molding material is a transparent polyester resin, wherein the resin molding is combined with the core frame by ultrasonic welding. The method of claim 17, The core frame includes an upper core frame and a lower core frame coupled to each other, and the resin molding includes an upper resin molding and a lower resin molding ultrasonically fused to the upper core frame and the lower core frame, respectively. Portable frame having a waterproof structure, characterized in that a bite protrusion is formed along the periphery of the edge portion of the upper core frame and the lower core frame and the bite groove corresponding to the bite protrusion is formed on the other How to waterproof electronic products.

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