KR100543539B1 - A heat plate for wafer and a bake apparatus with it - Google Patents

Abstract

The present invention relates to a baking heater for a wafer and a baking apparatus having the same, comprising: a base plate; At least one divided area having an arbitrary width in a central direction from an outer circumference of an upper surface of the base plate; A heating wire part formed in a spiral shape corresponding to an inner part of the area part, and a distance between the adjacent heating wire parts of the heating part is arbitrarily increased and decreased, thereby forming a baking heater and a baking apparatus having the same, thereby heating each unit of divided areas. Calculate and maintain the temperature uniformity of the entire area based on this, making it easy to optimize the design of the wafer of arbitrary size and to place the exhaust panel very close to the wafer to be mounted, minimizing convection during baking process and upper casing By installing a damper panel in the exhaust, it is possible to improve the temperature uniformity by reducing the flow velocity of the fluid and minimizing the vortex due to the increase in the cross-sectional area using the Venturi effect.

Wafer, Bake Heater, Bake Device

Description

Wafer Bake Heater and Baking Apparatus Having Same {A HEAT PLATE FOR WAFER AND A BAKE APPARATUS WITH IT}

1 is a plan view illustrating a bake heater for a wafer of a single-zone type according to an embodiment of the present invention.

2 is a plan view illustrating a baking heater for a multi-zone type wafer according to another embodiment of the present invention.

Fig. 3 is a schematic diagram showing the temperature deviation at 150 ° C., offset −0.10 of the bake heater for a 200 mm wafer of the single-zone type of the present invention.

Fig. 4 is a schematic diagram showing the temperature deviation at 240 ° C., offset −0.24 of the bake heater for the 200 mm wafer of the single-zone type of the present invention.

Fig. 5 is a schematic diagram showing the temperature deviation within the range of 180 ° C. at room temperature of the multi-zone type 300 mm wafer bake heater.

It is sectional drawing which shows the baking apparatus provided with the baking heater for wafers by this invention.

7 is a combined perspective view of the heater assembly.

<< Explanation of symbols for main part of drawing >>

310: lower casing 320: support member

330: shutter ring member 340, 500: lifting member

342: fork pin 350: upper casing

351: exhaust port 352, 354: damper panel

360: heater assembly 370: exhaust panel

400: wafer

The present invention relates to a baking heater for a wafer and a baking apparatus having the same, and more particularly, a heater capable of maintaining a high temperature and high quality wafers by maintaining the entire surface of the wafer at a uniform temperature during a wafer baking process; It is related with the baking apparatus provided with this.

In general, a wafer is manufactured through a plurality of processes such as an ion implantation process, a thin film deposition process, a diffusion process, a photo process, and the like. Among these processes, a photo process for forming desired patterns is an essential process for manufacturing a semiconductor device of a wafer.

In particular, the photo process is to form a pattern of a mask or a reticle on a wafer to selectively define a portion to be etched or implanted and a portion to be protected. The process is done. Here, in addition to the above-described coating process, exposure process, and developing process, the photographic process is a process of HMDS (Hexamethy Disilane) to improve the adhesion between the photosensitive agent and the wafer, before the photosensitive agent is applied, and after removing the moisture or organic solvent on the wafer and applying the photosensitive agent, The baking process etc. which remove the solvent contained in the photosensitive agent are included.

Therefore, in such a baking and cooling process, a chamber type baking and cooling apparatus is used to mount a wafer coated with a photosensitive agent on a baking heater in the chamber to bake and cool the photosensitive agent to a predetermined temperature.

In general, baking and cooling devices are required to maintain the baking and cooling temperatures of the photoresist uniformly because the baking and cooling temperature uniformity of the photoresist has a great influence in the photolithography or etching process when patterning fine patterns. have. For example, if the wafer is mounted in a chamber, how fast the wafer can be brought up to a certain temperature and the temperature of the wafer can be maintained uniformly with minute errors can directly affect the yield of the semiconductor device, so that temperature control is precise and temperature compensation. Fast baking of wafers and cooling devices are required.

Proposed techniques for improving the temperature uniformity during the baking process are disclosed in Korean Patent Registration No. 10-0357471 and Korean Utility Model Registration No. 20-0243530. These techniques have a problem that convection occurs in the space formed between the hot plate and the heat insulating plate (or heat insulating material) embedded in the cover member during the baking process, so that temperature uniformity cannot be easily realized.

In addition, the above-described techniques are described as being formed so that the hot wire is sequentially increased on the upper surface of the hot plate, but is not described as easy to implement at a skilled person level, it is difficult to implement the desired temperature uniformity There is this.

An object of the present invention created to solve the above problems, the heater that can maintain a high temperature and high-quality wafers at the uniform temperature during the wafer baking process and a baking apparatus having the same In providing.

Another object of the present invention is to easily implement an optimal design for a wafer having an arbitrary size by individually calculating the amount of heat of the region of the bake heater divided into at least one and maintaining the overall temperature uniformity based on this. The present invention provides a heater and a baking device having the same.

Still another object of the present invention is to provide a heater and a baking apparatus having the same, which can realize temperature uniformity by minimizing convection during a baking process.

The object of the present invention is a base plate, at least one divided region portion having an arbitrary width in the center direction from the outer periphery of the upper surface of the base plate, and a hot wire formed in a spiral shape corresponding to the inner portion of the region portion And a spacing of adjacent hot wires of the hot wire portion may be arbitrarily increased or decreased by a bake heater for a wafer.

Preferably, the base plate of the present invention is formed with a plurality of through holes spaced apart from each other.

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More preferably, the spacing of the heating wires of the present invention is determined to be arbitrarily increased or decreased depending on the calculated heat capacity calculated by the calculated unit heat amount per volume of the respective area portions in which the heated wire parts are formed and the calculated heat value of the unit heat. do.

More preferably, the spacing of the heating wires of the present invention is determined to be arbitrarily increased or decreased by the resistance value of each heating wire required by the calculated heat capacity.

In addition, another object of the present invention, the lower casing, the support member mounted to the lower casing, the elevating member provided with a plurality of fork pins on the upper side, and correspondingly inserted in the fork pins and embedded to support the support member And a heater assembly, an exhaust panel seated at an upper end of the lower casing, and an upper casing connected to the second elevating member to be opened and closed with the lower casing and having an exhaust port formed at one side thereof. It can be achieved by a baking apparatus having a baking heater for a wafer.

Preferably, the heater assembly of the present invention is assembled by sequentially stacking a first plate, a first heat insulating material, a heater plate, a second heat insulating material, and a second plate, wherein the heater plate comprises a base plate and an upper portion of the base plate. It comprises a region portion divided into at least one or more spaced apart from the outer periphery of the surface in the center direction and spaced apart from each other, and the hot wire portion respectively formed in a spiral shape corresponding to the inner portion of the respective region portions.

More preferably, the space | interval of the mutually adjacent hot wire of the hot wire part by this invention is formed so that it may increase or decrease arbitrarily.                         

More preferably, the spacing of the heating wires of the present invention is determined to be arbitrarily increased or decreased depending on the calculated heat capacity calculated by the calculated unit heat amount per volume of the respective area portions in which the heated wire parts are formed and the calculated heat value of the unit heat. do.

More preferably, the spacing of the heating wires of the present invention is determined to be arbitrarily increased or decreased by the resistance value of each heating wire required by the calculated heat capacity.

Preferably, the heater assembly of the present invention further comprises at least one or more temperature measuring sensors.

Preferably, the upper cover of the present invention includes a plurality of damper panels having a plurality of through holes formed therein.

More preferably, an insulating material is interposed between the damper panels of the present invention.

Preferably, the present invention further comprises a shutter ring member connected to the elevating member to receive the support member, the heater assembly and the exhaust panel.

Hereinafter, the configuration of the present invention with reference to the drawings in detail.

1 is a plan view illustrating a bake heater for a wafer of a single-zone type according to an embodiment of the present invention.

Referring to FIG. 1, a single-zone type wafer heater 100 according to the present invention has a base plate 110 and a hot wire formed in a spiral shape from the outer circumference to a center direction on an upper surface of the base plate 110. It is comprised including the part 120.

The base plate 110 is made of a circular insulating material having an arbitrary thickness. Here, the base plate 110 of the present invention is formed with a plurality of through holes.

The through hole is an assembling through hole 132 for assembling an upper plate and a lower plate (not shown) around the bake heater 100, a through hole 134 for assembling a temperature sensor (not shown), and a fork pin. It is divided into a through hole (136) for (folk pin).

Hot wire portion 120 according to the present invention is formed from the outer periphery to the portion where the outermost through holes 132, 134 are formed in the same interval of the adjacent hot wires are all the same, based on the through holes (132, 134) The spacing is significantly increased and then the spacing is reduced again, and then the inside of the through holes 132 and 136 is formed to increase rapidly.

2 is a plan view illustrating a baking heater for a multi-zone type wafer according to another embodiment of the present invention.

Referring to FIG. 2, the multi-zone type bake heater 200 according to the present invention is divided into a plurality of base plates 210 and a plurality having an arbitrary width in a center direction from the outer circumference of the upper surface of the base plate 210. And the hot wire portions 222a and 224a formed in a spiral shape corresponding to the inner portions of the region portions 222 and 224.

The base plate 210 is made of a circular insulating material having an arbitrary thickness. Here, the base plate 210 of the present invention is formed with a plurality of through holes.

The through hole is an assembling through hole 232 for assembling an upper plate and a lower plate (not shown) around the bake heater 200, a through hole 234 for assembling a temperature sensor (not shown), and a fork pin. It is divided into a through hole (236) for (folk pin).

The area portions 222 and 224 are divided into a plurality of upper surfaces of the base plate 210, for example, divided into two. Here, the region portions 222 and 224 have an area (square stripe shape) having an arbitrary width in the center direction from the outer circumference of the base plate 210 and are formed spaced apart from each other.

The hot wire portions 222a and 224a are each formed in a spiral shape on the inner side of the corresponding region portions 222 and 224. Here, the hot wires 222a and 224a all have the same center, and more specifically, are formed in a spiral shape so as to converge to the center of the base plate 110.

Here, the heating wires 222a formed in the first region 222 are all formed with the same spacing of the heating wires, and the heating wires 224a formed in the second region 224 are through holes 232 and 234. The gap is increased while decreasing and then decreases again, and then the gap is formed equally after increasing and decreasing while passing through the innermost through hole 236.

The bake heaters 100 and 200 of the present invention compare the total heat amount of the bake heaters 100 and 200 with the heat capacity of the wafer (not shown) by the cross-sectional area calculation method or the heater capacity calculation method to uniform the temperature. It is configured to maintain the last name.

For example, the technical idea of the present invention is to maintain the temperature uniformity of a wafer having an arbitrary size by calculating calories for each of the divided region portions 222 and 224 individually and summing the total calories. It is easy to optimize design. That is, the present invention has the advantage that it is easy to control for each region.

That is, the spacing of the heating wires according to the present invention is preferably formed to be arbitrarily increased or decreased depending on the calculated heat capacity calculated by the calculated unit heat amount per volume of the respective area portions in which the heated wire parts are formed and the calculated heat value of the calculated unit heat. Do. Moreover, the spacing of the heating wires according to the present invention is preferably formed to be arbitrarily increased or decreased by the resistance value of each heating wire required by the calculated heat capacity.

Here, the method for designing a wafer heater for a wafer according to the present invention will be briefly described using a formula representing a volume formula of an object, a weight formula of an object, and a calorie formula of an object, wherein the unit of the formula is MKS The system was used.

V: volume (mm ³ ), r: radius, h: thickness, A: area (mm ² )

W: mass (kg), ρ: specific gravity of the object

Q: calories, m: mass, c: specific heat of the object, ΔT: change in temperature

After the heat capacity of the object to be heated by the above equations (1), (2) and (3), the capacity of the bake heater is calculated to design the bake heater.

3 and 4 are schematic diagrams showing temperature deviations at 150 ° C., offset −0.10 and 240 ° C., and offset −0.24 of the bake heater for the 200 mm wafer of the single-zone type of the present invention, and FIG. It is a schematic diagram which shows the temperature variation within the range of 180 degreeC from room temperature of the baking heater for 300 mm wafers of a multi-zone type.

First, the measuring equipment used for this measurement is the PROCESS PROBE 1840 of SensArray Corporation of the United States, it is revealed in advance that this embodiment is installed in a typical baking apparatus.

The specification of this measuring device is briefly described as follows.

Measurable diameter: 50 mm (2 in) to 300 mm (12 in)

Temperature measuring range: 0 ℃ ~ 250 ℃

Accuracy: ± 0.03 ℃

Table 1 summarizes the results of FIGS. 3 and 4, and shows that the temperature variation of the 200 mm wafer bake heater is very small.

A typical bake heater for wafers has an accuracy of about ± 1 ° C. for each measurement temperature, while in the embodiment of the present invention, very good temperature uniformity of 0.14 ° C. at 150 ° C. and at least 0.42 ° C. at most 0.44 ° C. at 240 ° C. It has been confirmed to maintain the last name.

Table 2 summarizes the results of FIG. 5 and shows that the temperature variation of the 300 mm wafer bake heater of the present invention is very small. In the examples of the present invention, it was found to maintain very good temperature uniformity of about 0.09 ° C, 0.16 ° C, 0.17 ° C and 0.21 ° C at 100 ° C, 120 ° C, 150 ° C and 180 ° C, respectively.

FIG. 6 is a cross-sectional view showing a baking apparatus with a wafer baking heater according to the present invention, and FIG. 7 is a combined perspective view showing the heater assembly.

6 and 7, the baking apparatus according to the present invention includes a lower casing 310, a supporting member 320 mounted on the lower casing 310, and a plurality of fork pins 342 installed at an upper side thereof. A heater assembly 360 corresponding to the first elevating member 340, the fork pin 342 and embedded to support the support member 320, and an exhaust panel 370 seated on the upper end of the lower casing 310. And an upper casing 350 connected to the second elevating member 500 so as to be opened and closed with the lower casing 310 and having an exhaust port 351 formed at one side thereof.

The lower casing 310 is a hollow structure in which the upper side is opened.

The support member 320 is attached to both upper ends of the lower casing 310 and the lower part is bent downward. Here, the lower portion of the support member 320 is supported by the lower casing 310 and supported by the support member.

The plurality of fork pins 342 are coupled to the upper portion of the first elevating member 340 and are supported by the lower casing 310.

The heater assembly 360 is assembled by sequentially stacking a first plate 361, a first heat insulating material 363, a heater plate 365, a second heat insulating material 367, and a second plate 369. The sensor 361 is built in. Here, a plurality of through holes are formed in the first plate 361, the first heat insulating material 363, the second heat insulating material 367, and the second plate 369, and each of the through holes is an assembly through hole and a temperature sensor ( 361) The assembling through hole, the through hole for the fork pin 234, or a detailed description thereof will be omitted.

In addition, since the heater plate 365 of the heater assembly 360 has the same configuration as the bake heater 100 and 200 of the present invention described above, a detailed description thereof will be omitted.

The lower surface of the heater assembly 360 is fastened to be spaced apart from the support member 320 by a support member.

The exhaust panel 370 is seated at both ends of the support member 320 described above, so that the space between the upper surface of the wafer 400 seated on the upper surface of the heater assembly 360 and the lower surface of the exhaust panel 370 is narrow. Therefore, it is possible to prevent heat loss due to convection in the baking process, thereby improving temperature uniformity.

The upper casing 350 is connected to the second elevating member 500 so as to be opened and closed with the lower casing 310, and an exhaust port 351 is formed at an upper side thereof. In addition, a plurality of through holes are formed in the upper casing 350, and two damper panels 352 and 354 are embedded therein. Here, an insulating material is interposed between the damper panels 352 and 354.

The damper panels 352 and 354 minimize the eddy current by reducing the flow velocity of the fluid due to the increase in the cross-sectional area using the venturi effect during the exhaust.

In addition, the exhaust port 242 is in communication with one side of the upper casing 350 to exhaust the moisture or the solvent of the photoresist, which has been deposited on the surface of the wafer 400, to the outside during the baking process.

In addition, the shutter ring member 330 is provided to accommodate the support member 32, the heater assembly 360, and the exhaust panel 370, and is lifted by the first lifting member 340. Here, the shutter ring member 330 is provided to prevent heat loss due to outside air.

Here, a brief description of the operation relationship of the baking apparatus according to the present invention.

The initial state is a state in which the fork pin 342, the exhaust panel 370, and the shutter ring member 330 are raised. Herein, when the wafer 400 is supplied to the baking apparatus, the fork pin 342 receiving the wafer from the robot (not shown) is raised because it enters a feeding device (not shown) such as a robot.

In addition, the exhaust panel 370 has a flow of air to one place when dust or the like is extracted from the equipment to remove foreign matters when the temperature is applied to the wafer 400. It should be raised with the fork pin 342.

In addition, the shutter ring member 330 must be maintained in an elevated state to block outside air that affects the temperature change of the bake.

From the above-described initial state, the operation sequence of the baking apparatus according to the present invention will be briefly described.

1. Lowering of the shutter ring member 330: The shutter ring member 330 is lowered so that the wafer can be supplied.

2. Wafer 400 Loading (Loading): The wafer 400 is seated on the upper end of the fork pin 342 from the robot.

3. Rising shutter ring member 330, lower fork pin 342 and exhaust panel 370.

The shutter ring member 330 is raised to block the air, and the fork pin 342 is lowered to seat the wafer 400 on the upper surface of the heater assembly 360. At this time, the exhaust panel 370 and the fork pin 342 are also lowered together.

4. Baking: The wafer 400 is heated in a baking device for a period of time.

5. Lower the shutter ring member 330, raise the fork pin 342 and exhaust panel 370

The shutter ring member 330 is lowered to allow the wafer 400 to be taken out and seats the wafer 400 on the surface of the heater assembly 360. In addition, the exhaust panel and the fork fin 342 are raised together in an upward direction from the surface of the heater assembly 360.

6. Wafer unloading: The robot takes out the wafer 400.

7. Rising shutter ring member 330: Raise the shutter ring member 330 to minimize the heat loss of the baking apparatus until the next wafer 400 enters.

8. Standby state: The wafer 400 is kept in the standby state (the same state as the initial state) until it is re-baked and then baked.

Although the present invention described above is limited to one embodiment, the present invention is not limited thereto, and the present invention may be easily modified by those of ordinary skill in the art to which the present invention pertains. It is obvious that it belongs to the technical idea.

The present invention having the above configuration has the following effects.

First, the present invention is easy to optimize the design of the wafer having an arbitrary size by calculating the heat amount in each divided area unit to maintain the temperature uniformity of the entire area based on this.

Second, the present invention can improve the temperature uniformity by minimizing convection during the baking process by placing the exhaust panel very close to the wafer to be mounted.

Third, the present invention can realize high quality wafer production and high yield of wafers by improving the temperature uniformity of the wafer during the baking process.

Fourth, the present invention can improve the temperature uniformity by installing a damper panel in the upper casing to reduce the flow rate of the fluid to minimize the vortex due to the increase in the cross-sectional area using the venturi effect when exhausting.

Claims (14)

A base plate; At least one divided area having an arbitrary width in a central direction from an outer circumference of an upper surface of the base plate; It includes a hot wire portion formed in a spiral shape corresponding to the inner portion of the region portion, The baking heater for a wafer, characterized in that the interval between the adjacent hot wires of the hot wire portion is formed to increase or decrease arbitrarily. The method of claim 1, The base plate is a baking heater for a wafer, characterized in that a plurality of through holes spaced apart from each other. delete The method of claim 1, Wherein the spacing of the heating wires is determined to be arbitrarily increased or decreased depending on a calculated value of the unit heat quantity required for each volume of the region portion in which the respective heating wire portions are formed and the calculated heat capacity calculated by the calculated value of the unit heat quantity. The method of claim 4, wherein The spacing of the heating wire is a baking heater for a wafer, characterized in that it is determined by the resistance value of each heating wire required by the calculated heat capacity to be arbitrarily increased or decreased. A lower casing; A support member mounted to the lower casing; A lifting member provided with a plurality of fork pins in an upper portion thereof; A heater assembly correspondingly inserted into the fork pin and embedded to be supported with the support member; An exhaust panel seated on an upper end of the lower casing; A baking apparatus having a baking heater for a wafer, which is connected to a second lifting member and coupled to the lower casing so as to be opened and closed, and includes an upper casing having an exhaust port formed at one side thereof. The method of claim 6, The heater assembly is assembled by sequentially stacking a first plate, a first heat insulating material, a heater plate, a second heat insulating material, a second plate, The heater plate, A base plate; At least one region portion having a predetermined width in a central direction from an outer circumference of an upper surface of the base plate and spaced apart from each other; A baking apparatus having a wafer heater for a wafer, characterized in that it comprises a hot wire portion corresponding to each of the inner portion of each of the region portion formed in a spiral shape. The method of claim 7, wherein A baking apparatus having a baking heater for a wafer, characterized in that the spacing between adjacent hot wires of the hot wire portion is arbitrarily increased or decreased. The method of claim 8, The spacing of the heating wires is a wafer for baking, characterized in that it is arbitrarily increased and decreased depending on the calculated heat capacity calculated by the calculated value of the unit heat amount per volume of each of the region portion in which the heating wire portion is formed. Baking apparatus with a heater. The method of claim 9, The gap between the heating wire is determined by the resistance value of each heating wire required by the calculated heat capacity, the baking apparatus having a wafer heater for a wafer, characterized in that it is formed to increase or decrease arbitrarily. The method of claim 7, wherein The heater assembly is a baking device having a baking heater for a wafer, characterized in that further comprises at least one sensor for measuring the temperature. The method of claim 6, The top cover is a baking device having a baking heater for a wafer, characterized in that a plurality of damper panel is formed with a plurality of through-holes are built. The method of claim 12, The baking apparatus provided with the baking heater for the wafer characterized by the interposition of the said insulating material between the said damper panels. The method of claim 6, And a shutter ring member connected to the elevating member to receive the support member, the heater assembly, and the exhaust panel.

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