KR100524479B1 - Flexible board - Google Patents
Flexible board Download PDFInfo
- Publication number
- KR100524479B1 KR100524479B1 KR1019980030518A KR19980030518A KR100524479B1 KR 100524479 B1 KR100524479 B1 KR 100524479B1 KR 1019980030518 A KR1019980030518 A KR 1019980030518A KR 19980030518 A KR19980030518 A KR 19980030518A KR 100524479 B1 KR100524479 B1 KR 100524479B1
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- KR
- South Korea
- Prior art keywords
- reinforcing plate
- coating layer
- base film
- flexible substrate
- flip
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
Abstract
본 발명의 연성기판은 피복층의 상면 선단부에 보강판을 설치하고 아울러 보강판에 손잡이를 형성하도록 구성된다.The flexible substrate of the present invention is configured to provide a reinforcing plate at the top end of the coating layer and to form a handle on the reinforcing plate.
따라서, 본 발명은 보강판의 손잡이를 잡고 도전 패턴의 콘택부와 플립록타입 커넥터와의 전기적 접속을 정확하게 이룩할 수 있다.Accordingly, the present invention can accurately make electrical connection between the contact portion of the conductive pattern and the flip-lock type connector by holding the handle of the reinforcing plate.
또한, 본 발명은 연성기판의 취급 도중에 보강판에 의해 베이스필름 이나 피복층의 파손을 방지하여 연성기판에 대한 제조원가의 상승을 억제할 수 있다.In addition, the present invention can prevent the damage of the base film or the coating layer by the reinforcing plate during the handling of the flexible substrate, it is possible to suppress the increase in manufacturing cost for the flexible substrate.
Description
본 발명은 연성기판에 관한 것으로, 더욱 상세하게는 피복층의 상면 선단부에 손잡이를 갖는 보강판을 설치하여 플립록타입 커넥터와의 정확한 접속을 가능하게 하고 아울러 베이스필름 이나 피복층의 파손을 방지하도록 한 연성기판에 관한 것이다.The present invention relates to a flexible substrate, and more particularly, to install a reinforcing plate having a handle at the top end of the coating layer to enable accurate connection with a flip-lock type connector and to prevent damage to the base film or coating layer. It relates to a substrate.
일반적으로 알려진 바와 같이, 액정표시장치의 연성기판(flexible printed circuit)은 고밀도 3차원 배선 및 고신뢰성과 내굴곡성을 갖는 일종의 인쇄회로기판으로서 전자제품의 데이터 전송용 인터페이스 부품으로서 주로 사용된다.As is generally known, a flexible printed circuit of a liquid crystal display device is a kind of printed circuit board having high-density three-dimensional wiring and high reliability and flex resistance, and is mainly used as an interface component for data transmission of electronic products.
특히 박막 트랜지스터 액정표시장치의 모듈에 있어서, 연성기판은 시스템 인터페이스 또는 모듈 내부의 소오스 드라이브용 인쇄회로기판과 게이트 드라이브용 인쇄회로기판간의 인터페이싱에 사용되는데, 연성기판의 피복층 상에 조립된 수직 연결용 직선 타입 커넥터를 인쇄회로기판 상의 소켓에 삽입하는 방식과, 연성기판의 에지부에 형성된 솔더접합을 위한 개방영역을 수평 연결용 플립록타입(flip lock type) 커넥터에 슬라이딩시키는 방식으로 사용되고 있다.Particularly in the module of the thin film transistor liquid crystal display device, the flexible board is used for the interface between the printed circuit board for the source drive and the printed circuit board for the gate drive in the system interface or the module, for vertical connection assembled on the cover layer of the flexible board. It is used to insert a straight type connector into a socket on a printed circuit board, and to slide an open area for solder joint formed in the edge portion of the flexible board to a flip lock type connector for horizontal connection.
종래의 수평연결용 연성기판은 도 1에 도시된 바와 같이, 베이스필름(1)의 하부면 상에 도전 패턴들(3)이 형성되고, 소오스 드라이브용 인쇄회로기판(도시 안됨)의 플립록타입 커넥터(도시 안됨)에 접속될 도전 패턴들(3)의 콘택부가 노출되도록 도전 패턴들(3)을 보호하기 위한 피복층(10)이 접착제(도시 안됨)에 의해 베이스필름(1)의 하부면 상에 접착되고, 게이트 드라이브용 인쇄회로기판(도시 안됨)에 체결되도록 베이스필름(1)과 피복층(10)의 타측 선단부 양측 가장자리에 체결홀들(5)이 형성되는 구조를 갖는다. 물론, 게이트 드라이브용 인쇄회로기판의 접속단자들에 접속될, 도전 패턴들(3)의 콘택부가 노출되어야 함은 당연하다.In the conventional flexible substrate for horizontal connection, as shown in FIG. 1, conductive patterns 3 are formed on the lower surface of the base film 1, and a flip-lock type of a printed circuit board (not shown) for a source drive is shown. A coating layer 10 for protecting the conductive patterns 3 is exposed on the bottom surface of the base film 1 by an adhesive (not shown) so that the contact portions of the conductive patterns 3 to be connected to the connector (not shown) are exposed. And fastening holes 5 are formed at both edges of the other front end portion of the base film 1 and the coating layer 10 so as to be bonded to the printed circuit board (not shown) for the gate drive. Of course, the contact portion of the conductive patterns 3, which will be connected to the connection terminals of the printed circuit board for the gate drive, must be exposed.
여기서, 베이스필름(1)과 피복층(10)은 절연성 필름, 예를 들어 폴리이미드계 필름로 이루어지며 인장강도, 유전율, 표면저항율, 난연성 등과 인자들이 우수하여야 한다.Here, the base film 1 and the coating layer 10 is made of an insulating film, for example, a polyimide-based film, and should be excellent in tensile strength, dielectric constant, surface resistivity, flame retardancy, and the like.
도전 패턴들(3)은 구리 재질로 이루어지며 입자 형성방향에 따라 입자밀도가 상이하며 전해도금 또는 용융사출 방식으로 제조된다.The conductive patterns 3 are made of copper, and have different particle densities according to the direction of particle formation, and are manufactured by electroplating or melt injection.
상기 접착제로는 아크릴, 에폭시, 또는 페놀수지 등이 사용될 수 있고, 연성기판의 내열성 결함 요인으로 작용한다.Acrylic, epoxy, or phenol resin may be used as the adhesive, and act as a defect in heat resistance of the flexible substrate.
이와 같이 구성된 종래의 연성기판의 경우, 작업자가 연성기판과의 전기적 연결이 이루어지는, 플립록타입 커넥터(도시 안됨)의 헤더를 손으로 열고 나서 연성기판을 손으로 잡고 도전패턴들(3)의 콘택부를 상기 플립록타입 커넥터의 헤더로 슬라이딩시켜 삽입시킨다.In the conventional flexible board configured as described above, the operator opens the header of the flip-lock type connector (not shown) by which the electrical connection with the flexible board is made by hand, and then holds the flexible board by hand to make contact with the conductive patterns 3. The part is slid into the header of the flip lock connector to be inserted.
따라서, 도전 패턴들(3)의 콘택부와 플립록타입 커넥터의 접속단자들과의 전기적 접속이 이루어진다.Thus, electrical connection is made between the contact portion of the conductive patterns 3 and the connection terminals of the flip lock type connector.
여기서, 베이스필름(1)과 피복층(10)은 절연성 필름, 예를 들어 폴리이미드계 필름로 이루어지며 인장강도, 유전율, 표면저항율, 난연성 등과 인자들이 우수하여야 한다. 도전 패턴들(3)은 구리 재질로 이루어지며 입자 형성방향에 따라 입자밀도가 상이하며 전해도금 또는 용융사출 방식으로 제조된다. 접착제는 아크릴, 에폭시, 또는 페놀수지 등이 사용될 수 있고, 연성기판의 내열성 결함 요인으로 작용한다.Here, the base film 1 and the coating layer 10 is made of an insulating film, for example, a polyimide-based film, and should be excellent in tensile strength, dielectric constant, surface resistivity, flame retardancy, and the like. The conductive patterns 3 are made of copper, and have different particle densities according to the direction of particle formation, and are manufactured by electroplating or melt injection. Acrylic, epoxy, or phenol resin may be used as the adhesive and act as a defect in heat resistance of the flexible substrate.
그러나, 작업자가 연성기판 자체를 직접 손으로 잡고 취급하므로 도전 패턴들(3)의 콘택부와 플립록타입 커넥터의 접속단자들과의 오정합으로 인한 접속불량이 자주 발생하여 왔다. 이러한 접속불량이 발생하면, 작업자가 이를 해결하기 위해 연성기판을 손으로 잡고 플립록타입 커넥터로부터 뽑아낸 후 다시 연성기판을 플립 록 타입 커넥터로 슬라이딩시켜 삽입시켜 왔다.However, since a worker directly handles and handles the flexible board by hand, a poor connection has often occurred due to a mismatch between the contact portion of the conductive patterns 3 and the connection terminals of the flip-lock type connector. In order to solve such a connection failure, the operator has grabbed the flexible board by hand, pulled it out of the flip lock type connector, and then slides the flexible board back into the flip lock type connector.
그러므로, 종래의 연성기판은 플립록타입 커넥터과의 전기적 접속이 정상적으로 이루어지도록 하는데 작업상의 번거로움이 많았다.Therefore, the conventional flexible substrate has a lot of trouble in working to make the electrical connection with the flip-lock type connector normally.
또한, 연성기판의 베이스필름이나 피복층은 재질 특성상 취약하므로 연성기판을 취급하는 도중에 도전 패턴들의 콘택부에 해당하는 영역의 베이스필름이나 피복층의 파손이 쉽게 발생하고 파손된 연성기판을 새로운 연성기판으로 교체하는데 따른 제조원가 상승이 불가피하였다.In addition, since the base film or the coating layer of the flexible substrate is vulnerable in terms of material properties, breakage of the base film or coating layer in the areas corresponding to the contact portions of the conductive patterns occurs easily during handling of the flexible substrate, and the damaged flexible substrate is replaced with a new flexible substrate. Increasing manufacturing costs were inevitable.
따라서, 본 발명의 목적은 연성기판을 플립록타입 커넥터에 전기적 연결할 때, 연성기판을 보강하여 파손을 방지하도록 한 것이다.Accordingly, an object of the present invention is to prevent the breakage by reinforcing the flexible substrate when the flexible substrate is electrically connected to the flip-lock type connector.
본 발명의 다른 목적은 연성기판과 플립록타입 커넥터의 오연결을 방지하도록 한 것이다.Another object of the present invention is to prevent misconnection of the flexible substrate and the flip-lock type connector.
본 발명의 또 다른 목적은 다음의 상세한 설명 및 첨부된 도면에 의해 보다 명확해질 것이다.Another object of the present invention will become more apparent from the following detailed description and the accompanying drawings.
이와 같은 목적을 달성하기 위해 본 발명은 피복층의 상면 선단부에 베이스필름과 피복층을 보강하기 위한 보강판이 설치되도록 구성된다.In order to achieve the above object, the present invention is configured such that a reinforcing plate for reinforcing the base film and the coating layer is provided at the front end of the coating layer.
바람직하게는, 보강판은 자신의 상부면 중앙부가 소정 형태로 개방되도록 제거되어 손잡이를 갖는다.Preferably, the reinforcement plate is removed so that its upper surface center portion is opened in a predetermined shape and has a handle.
따라서, 본 발명은 보강판의 손잡이를 잡고 연성기판을 플립록타입 커넥터에 밀어 넣을 때 연성기판의 콘택부와 플립록타입 커넥터의 접속단자들이 정확하게 접속되고, 아울러 연성기판의 파손을 방지할 수 있다.Therefore, in the present invention, when the flexible board is held by the handle of the reinforcing plate and the flexible board is pushed into the fliplock type connector, the contact portion of the flexible board and the connection terminals of the fliplock type connector are correctly connected, and the breakage of the flexible board can be prevented. .
이하, 본 발명에 의한 연성기판을 첨부된 도면을 참조하여 상세히 설명하기로 한다. 종래의 부분과 동일한 부분에는 동일한 부호를 부여한다.Hereinafter, a flexible substrate according to the present invention will be described in detail with reference to the accompanying drawings. The same code | symbol is attached | subjected to the part same as a conventional part.
도 2를 참조하면, 본 발명의 연성기판은 도전 패턴들(3)의 콘택부 상에 위치하도록 피복층(10)의 상면 선단부에 피복층(10)과 베이스필름(1)을 보강하기 위한 보강판이 설치된 것을 제외하면, 도 1의 구조와 동일하다.Referring to FIG. 2, the flexible substrate of the present invention is provided with a reinforcing plate for reinforcing the coating layer 10 and the base film 1 at the top end of the coating layer 10 so as to be positioned on the contact portions of the conductive patterns 3. Except that, the structure is the same as that of FIG.
여기서, 보강판(20)은 외부 스트레스 보완용으로 사용되며 유연성, 납접성, 접착성이 우수한 접착성 폴리이미드계 필름으로 이루어진다. 또한, 보강판(20)은 글라스 에폭시, 폴리에스터계 필름 등으로 이루어질 수도 있다.Here, the reinforcing plate 20 is used to compensate for the external stress and is made of an adhesive polyimide film having excellent flexibility, solderability, and adhesion. In addition, the reinforcing plate 20 may be made of glass epoxy, polyester film, or the like.
이와 같이 구성되는 본 발명의 연성기판을 인터페이스로서 액정표시장치 모듈의 소스 드라이브용 인쇄회로기판(도시 안됨)과 게이트 드라이브용 인쇄회로기판(도시 안됨)을 전기적으로 연결할 때 작업자가 플립록타입 커넥터(도시 안됨)의 헤더를 손으로 열고 나서 보강판(20)에 해당하는 연성기판의 부분을 손으로 잡고 도전 패턴들(3)의 콘택부를 예를 들어 소스 드라이브용 인쇄회로기판(도시 안됨)의 플립록타입 커넥터의 헤더에 슬라이딩시켜 삽입한다.When the flexible board of the present invention configured as an interface is connected to a printed circuit board (not shown) for a source drive of a liquid crystal display module and a printed circuit board for a gate drive (not shown), an operator may use a flip-lock type connector ( Open the header of the not shown) by hand, and then grasp the portion of the flexible board corresponding to the reinforcement plate 20 by hand and flip the contact portion of the conductive patterns 3, for example, the printed circuit board (not shown) for the source drive. Slide it into the header of the lock type connector.
따라서, 도전패턴들(3)의 콘택부와 플립록타입 커넥터의 전기적 접속이 이루어진다.Thus, the electrical connection between the contact portion of the conductive patterns 3 and the flip lock type connector is made.
이때, 보강판(20)은 베이스필름(1)과 피복층(10)에 비하여 경질이므로 취급 도중에 도전 패턴들(3)의 콘택부에 해당하는, 베이스필름(1) 또는 피복층(10)의 부분의 파손을 방지할 수 있다.At this time, since the reinforcing plate 20 is harder than the base film 1 and the coating layer 10, the reinforcing plate 20 corresponds to the contact portion of the conductive patterns 3 during handling. Breakage can be prevented.
한편, 연성기판을 플립록타입 커넥터로부터 이탈시킬 때에도 마찬가지로 보강판(20)에 의해 연성기판의 파손을 방지할 수 있다.On the other hand, when the flexible substrate is separated from the flip-lock type connector, the reinforcement plate 20 can prevent damage to the flexible substrate.
도 3을 참조하면, 보강판(20)은 자신의 상부면 중앙부가 예를 들어 U형으로 개방되도록 제거되어 손잡이(21)를 갖는 것을 제외하면, 도 2의 구조와 동일한 구조로 이루어진다.Referring to Figure 3, the reinforcing plate 20 is made of the same structure as the structure of Figure 2, except that the central portion of its upper surface is removed to open, for example, U-shaped to have a handle 21.
여기서, 손잡이(21)의 저면에는 보강판(20)을 열압착에 의해 피복층(10)에 접착시키는 열경화성 아크릴 접착제가 제거된다.Here, the thermosetting acrylic adhesive for attaching the reinforcing plate 20 to the coating layer 10 by thermocompression is removed from the bottom of the handle 21.
이와 같이 구성되는 본 발명의 연성기판을 인터페이스로서 액정표시장치 모듈의 소스 드라이브용 인쇄회로기판(도시 안됨)과 게이트 드라이브용 인쇄회로기판(도시 안됨)을 전기적으로 연결할 때 작업자가 보강판(20)의 손잡이(21)의 상측부를 손으로 잡고 도전 패턴들(3)의 콘택부를 예를 들어 소스 드라이브용 인쇄회로기판(도시 안됨)의 플립록타입 커넥터로 슬라이딩시켜 삽입한다.When the flexible substrate of the present invention configured as described above is connected to the printed circuit board (not shown) and the gate drive printed circuit board (not shown) of the liquid crystal display module as an interface, the operator reinforces the plate 20. Holding the upper portion of the handle 21 of the by hand by sliding the contact portion of the conductive patterns 3, for example to the flip-lock connector of the printed circuit board (not shown) for the source drive is inserted.
따라서, 도전 패턴들(3)의 콘택부와 플립록타입 커넥터의 접속단자들과의 전기적 접속이 정확하게 이루어지므로 연성기판을 플립록타입 커넥터에 여러번 끼우고 빼내는 번거로움을 줄일 수 있다.Therefore, since the electrical connection between the contact portion of the conductive patterns 3 and the connection terminals of the flip lock type connector is made accurately, it is possible to reduce the trouble of inserting and removing the flexible board several times in the flip lock type connector.
또한, 보강판(20)은 연성기판을 취급하는 동안 도전 패턴들(3)의 콘택부에 해당하는 베이스필름(1) 이나 피복층(10)의 부분의 파손을 방지할 수 있다.In addition, the reinforcing plate 20 may prevent breakage of portions of the base film 1 or the coating layer 10 corresponding to the contact portions of the conductive patterns 3 while the flexible substrate is handled.
이상에서 살펴 본 바와 같이, 본 발명에 의한 연성기판은 피복층의 상면 선단부에 보강판을 설치하고 아울러 보강판에 손잡이를 형성하도록 구성된다.As described above, the flexible substrate according to the present invention is configured to provide a reinforcing plate at the top end of the coating layer and to form a handle on the reinforcing plate.
따라서, 본 발명은 보강판의 손잡이를 잡고 도전 패턴의 콘택부와 플립록타입 커넥터와의 전기적 접속을 정확하게 이룩할 수 있다.Accordingly, the present invention can accurately make electrical connection between the contact portion of the conductive pattern and the flip-lock type connector by holding the handle of the reinforcing plate.
또한, 본 발명은 연성기판의 취급 도중에 보강판에 의해 베이스필름 이나 피복층의 파손을 방지하여 연성기판에 대한 제조원가의 상승을 억제할 수 있다.In addition, the present invention can prevent the damage of the base film or the coating layer by the reinforcing plate during the handling of the flexible substrate, it is possible to suppress the increase in manufacturing cost for the flexible substrate.
한편, 본 발명은 도시된 도면과 상세한 설명에 기술된 내용에 한정하지 않으며 본 발명의 사상을 벗어나지 않는 범위 내에서 적용 가능함은 이 분야에 통상의 지식을 가진 자에게는 자명한 사실이다.On the other hand, it is obvious to those skilled in the art that the present invention is not limited to the contents described in the drawings and detailed description, and can be applied within the scope without departing from the spirit of the present invention.
도 1은 종래 기술에 의한 연성기판의 구조를 나타낸 개략도.1 is a schematic view showing the structure of a flexible substrate according to the prior art.
도 2는 본 발명에 의한 연성기판의 구조를 나타낸 개략도.Figure 2 is a schematic diagram showing the structure of a flexible substrate according to the present invention.
도 3은 본 발명의 다른 예에 의한 연성기판의 구조를 나타낸 개략도.3 is a schematic view showing the structure of a flexible substrate according to another embodiment of the present invention.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
1: 베이스 필름 3: 도전 패턴 5: 체결홀 10: 피복층 20: 보강판 21: 손잡이DESCRIPTION OF SYMBOLS 1 Base film 3: Conductive pattern 5: Fastening hole 10: Coating layer 20: Reinforcement board 21: Handle
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980030518A KR100524479B1 (en) | 1998-07-29 | 1998-07-29 | Flexible board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980030518A KR100524479B1 (en) | 1998-07-29 | 1998-07-29 | Flexible board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000009865A KR20000009865A (en) | 2000-02-15 |
| KR100524479B1 true KR100524479B1 (en) | 2006-01-12 |
Family
ID=19545533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980030518A KR100524479B1 (en) | 1998-07-29 | 1998-07-29 | Flexible board |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100524479B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210027323A (en) * | 2014-06-03 | 2021-03-10 | 삼성디스플레이 주식회사 | Flexible circuit film and display apparatus having the same |
| US11452207B2 (en) | 2014-06-03 | 2022-09-20 | Samsung Display Co., Ltd. | Flexible circuit film and display apparatus having the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100821043B1 (en) * | 2006-09-22 | 2008-04-08 | 삼성에스디아이 주식회사 | Flexilble Printed Circuit Board |
| KR102479501B1 (en) * | 2021-02-26 | 2022-12-21 | 삼성디스플레이 주식회사 | Flexible circuit film and display apparatus having the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04331921A (en) * | 1991-05-07 | 1992-11-19 | Seiko Epson Corp | Flexible substrate and packaging method thereof |
| JPH07140479A (en) * | 1993-11-22 | 1995-06-02 | Fujitsu Ltd | Lcd unit |
| JPH1062803A (en) * | 1996-08-23 | 1998-03-06 | Seiko Epson Corp | Liquid crystal display device |
| JPH10123555A (en) * | 1996-10-17 | 1998-05-15 | Matsushita Electric Ind Co Ltd | Liquid crystal display device |
-
1998
- 1998-07-29 KR KR1019980030518A patent/KR100524479B1/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04331921A (en) * | 1991-05-07 | 1992-11-19 | Seiko Epson Corp | Flexible substrate and packaging method thereof |
| JPH07140479A (en) * | 1993-11-22 | 1995-06-02 | Fujitsu Ltd | Lcd unit |
| JPH1062803A (en) * | 1996-08-23 | 1998-03-06 | Seiko Epson Corp | Liquid crystal display device |
| JPH10123555A (en) * | 1996-10-17 | 1998-05-15 | Matsushita Electric Ind Co Ltd | Liquid crystal display device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210027323A (en) * | 2014-06-03 | 2021-03-10 | 삼성디스플레이 주식회사 | Flexible circuit film and display apparatus having the same |
| KR102345678B1 (en) * | 2014-06-03 | 2021-12-31 | 삼성디스플레이 주식회사 | Flexible circuit film and display apparatus having the same |
| US11452207B2 (en) | 2014-06-03 | 2022-09-20 | Samsung Display Co., Ltd. | Flexible circuit film and display apparatus having the same |
| US11653449B2 (en) | 2014-06-03 | 2023-05-16 | Samsung Display Co., Ltd. | Flexible circuit film and display apparatus having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20000009865A (en) | 2000-02-15 |
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