KR100506205B1 - A measuring system using an electron beam and a measuring method and an alignment method using thereof - Google Patents

Abstract

The present invention relates to a measuring system, a measuring method, and an alignment method using an electron beam. The measuring system using the electron beam according to the present invention can reduce the electron emission source, a plurality of sensing zones through which electrons of the electron beam emitted from the electron emission source can be electrically conducted, an insulator blocking the flow of electrons, or the flow of electrons. An insulating portion for dividing the respective sensing zones, a connecting portion for electrically connecting electrons collided with the respective sensing zones, and a connecting portion corresponding to the respective sensing zones. It includes a measuring unit for measuring the amount of the electron beam sensed in each detection zone.

Description

A MEASURING SYSTEM USING AN ELECTRON BEAM AND A MEASURING METHOD AND AN ALIGNMENT METHOD USING THEREOF

The present invention relates to a measurement system that can directly detect the electrons of the electron beam emitted from the electron emission source to confirm the relative position of the electron emission source and the electron beam measuring device to determine the relative position of the measurement object.

In addition, the present invention relates to a method for detecting and positioning the object by the electron beam, and more particularly, by measuring the electron beam emitted from the electron emission source in an electron beam measuring device to measure the relative position of the object, furthermore general alignment To make it more efficient and to allow automatic sorting.

In general, in the assembly of a conventional device or system, it is often very important to measure and align the relative positions when assembling the parts. To this end, repetitive methods such as reassembling on the basis of the alignment state by the measuring method such as optical method after assembly in the assembly process is used. Therefore, it is common to repeat the process of assembly, measurement and correction by measurement data. Or it may be assembled using an optical sensor, but when the parts to be aligned are very small and a high level of alignment is required, it is very difficult to repeat the above process and a lot of cost and time are required to align the parts. many. It is also more difficult to measure and correct the confirmation of the assembled state during use.

Accordingly, an object of the present invention to solve the above problems is to measure or align an object by using electron beam emission in a microcolumn and its measuring principle, that is, directly measuring electrons (electron beam) emitted from an electron emission source. It is to provide a measuring system and measuring method using an electron beam that can be more easily.

Another object of the present invention is to provide a method for easier and simpler alignment and further automatic alignment in the alignment of components and the like by using a method of aligning a relative position of an electron emission source and an electron beam meter using sensed data. .

In order to achieve the above object, according to the present invention, a measuring system using an electron beam is a source of electron emission, a plurality of detection zones in which electrons of the electron beam emitted from the electron emission source can be electrically conductive, blocking the flow of electrons An insulator or a low-doped semiconductor capable of reducing the flow of electrons, the insulating portion dividing the respective sensing zones, a connecting portion electrically connecting the electrons collided to the respective sensing zones, and the connecting portions respectively. It is connected corresponding to the detection zone of the and comprises a measuring unit for measuring the amount of the electron beam sensed in each detection zone, respectively.

The position measuring method using the electron beam measurement according to the present invention comprises the steps of providing an electron emission source on the first side of the measurement object, a plurality of detection zones that can be electrically conductive electrons of the electron beam emitted from the electron emission source and Provided to the second side of the measurement object is an electron beam measuring device for detecting the emitted electron beam, including an insulator that blocks the flow of electrons or a low-doped semiconductor that can reduce the flow of electrons, including an insulator for dividing each sensing zone. Detecting the electrons emitted from the electron emission source in each detection zone, checking the position of each detection zone where the electrons are detected by the electron beam measuring device, and measuring the amount of electron beams impinged on each detection zone, And calculating relative positions of the first side and the second side by using the detected data of the detected detection zones and the measurement data of the respective electron collision amounts. It includes.

An alignment method using electron beam measurement according to the present invention includes providing an electron emission source on a first side of an object to be aligned, a plurality of detection zones and electrons through which electrons of the electron beam emitted from the electron emission source can be electrically conducted. An electron beam measuring device for detecting the emitted electron beam, comprising an insulator to block the flow of electrons or a low-doped semiconductor to reduce the flow of electrons, and including an insulator for dividing the respective sensing zones. Detecting the electrons emitted from the electron emission source in a detection zone, checking the position of each detection zone where the electrons are detected by the electron beam measuring device, and measuring the amount of the electron beam impinged on each detection zone, Calculating the relative positions of the first side and the second side with the measurement data of the position of each detection zone and each electron collision amount, and the identified Moving the first side, the second side, or the first side and the second side according to a relative position.

According to the present invention, when an electron beam emitted from an electron emission source is uniformly split into a detection zone in an electron beam meter, the electron beam uses a principle that can detect the flow and amount of electrons as a current measurement by the flow of electrons. And although the relative position of the electron beam detector is determined by using the position of the electron beam detected in the detection zone of the electron beam detector and the amount of current split in each detection zone. Sensing the emitted electron beam directly in the electron beam measuring device and using the sensed data can be made more precise by applying the technology used in the electron beam micro column. Therefore, if the relative position of the electron emission source and the electron beam measuring device is aligned with a position adjuster such as a positioner of the electron beam micro column, the electron beam measuring system of the present invention may not only check the position but also more precise position control.

Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

1 to 2, first, FIG. 1 is a plan view of an electron beam measuring instrument as an embodiment according to the present invention, and FIG. 2 is a cross-sectional view of the embodiment of FIG. 1 and 2 show that the four sensing zones 11 of the electron beam meter 10 are separated or insulated by the insulation 12, respectively. Each sensing zone 11 and the corresponding measuring instrument 19 are connected by a lead 17 as a connection. The sensing zone 11 may consist of a conductor layer, such as a metal, through which current can flow well, or a semiconductor layer, such as high-doped silicon. As the connection part, the conductor 17 is used in this embodiment, the role of which is only for sending the electrons of the electron beam split into the detection zone 11 to the measuring device 19. Since the measuring device 19 mainly checks the current sent from the connection and measures the amount of current, an ammeter or the like may be used. The insulation 12 is located between each sensing zone 11 to block or reduce the flow of electrons between each sensing zone 11. The width of the insulator 12 is determined by the diameter of the electron beam of electrons emitted from the electron emission source. The width of the insulator 12 is also scattered in the sensing zones 11 adjacent to the insulator 12 even if the electron beam is irradiated to the insulator 12. Since the electron beam is measured to some extent and confirmed by each corresponding measuring device 19, the width of the insulating part 12 may be sufficient to confirm the existence of the electron beam in the adjacent sensing zones 11. It will therefore depend on the electron emission source of the system to be used and the object to be aligned. However, it is desirable to make the width of the insulating portion as small as possible because the insulating portion may be charged by the electron beam and be discharged at any moment. Therefore, it is preferable to select a low-doped semiconductor such as low-doped silicon, which is a material that is not easily charged by the electron beam, and the material of the insulating part 12 may vary depending on the material of the width, but the flow of electrons between the detection zones 11 may be reduced. It is desirable to use it with a minimum width that can be blocked. However, since the discharge in the insulator 12 is instantaneous, if a negligible change in the amount of instantaneous current sensed by the meter 19 is ignored, no problem occurs.

FIG. 3 shows the splitting of the electron beam emitted from an electron emission source (not shown) in the electron beam meter 10 of FIG. Referring to FIG. 3, the electron beam measuring system according to the present invention has been split into the detection zone 11a on the upper left side of the electron beam measuring instrument 10. Accordingly, the measuring device 19a corresponding to the detection zone 11a on the upper left senses the flow of current and measures the amount thereof. Therefore, it is possible to know in which detection zone 11 the electron beam is split and the amount split. If the electron beam is simultaneously split into the upper left and right detection zones 11a and 11b, the measuring devices 19a and 19b will measure the flow and amount of current, respectively. Also, when the electron beam is scattered near the center of the electron beam meter 10, the current and the amount of current are measured in the meter 19a, 19b, 19c, and 19d respectively corresponding to the detection zones 11a, 11b, 11c, and 11d. Done.

Although the electron emission source is not separately shown in the accompanying drawings, an electron emission source may be used such as a general electron gun. The electron emission source may emit a conical electron beam as shown in Fig. 3, but it is preferable to use the electron emission source used in the electron beam microcolumn for positioning and / or control of ultra-small and ultra-precision. .

FIG. 4 is a variation of the embodiment of FIG. 1 and is used to reduce the width of the electron beam meter 10 between the sensing zones 11 separated by the insulation 12. In other words, the width of the electron beam measuring device 10 according to the present invention can be minimized by using an adhesive and the like between the detection zones 11.

FIG. 5 is another variation of the embodiment of FIG. 1, wherein the sensing zones are more subdivided than the sensing zones of the FIG. 1 embodiment, and each sensing zone 11 is easier to identify the flow and amount of current than common conductors. It is made up of. In FIG. 5, an electron beam meter 20 uses a typical pn junction consisting of a p-type semiconductor material indicated by reference numeral 21, an n-type semiconductor material indicated by reference numeral 23, and a diffusion shown by reference numeral 22, and each The measuring device 29 corresponding to the pn junction is also connected by the conductive wire 27. Each p-n junction is divided by an insulating portion 25.

The method of measuring, controlling or aligning positions using the electron beam measuring instruments 10 and 20 according to the present invention is very similar in principle, regardless of which electron beam measuring instruments 10 and 20 are used. This will be described below. In the following description, no measurement or alignment target and electron emission source are shown. However, in actual use, the electron emission source should be fixed to the first side of the measurement or alignment object and the electron beam meter should be fixed to the second side. For convenience of explanation, the method of identifying and aligning a relative position of an object is replaced by an electron emission source and a second side by relative positioning and alignment of an electron beam meter, respectively. The fixation of the object with the present electron emitter and electron beam meter may be permanent or temporary. Microcolumn technology also facilitates permanent fixation because the electron emitter and electron beam meter can be as small as a few micrometers. Of course, temporary fixation using clamps is possible, but permanent fixation using gluing, bolts, and clamping is desirable for continuous measurement and alignment.

In Fig. 3, electrons emitted from the electron emission source were detected in the detection zone 11a in the upper left corner. Thus, the flow and amount of electrons in the meter 19a are confirmed. Accordingly, the alignment of the electron emission source and the electron beam meter 10 may be performed by moving the electron emission source and / or the electron beam meter 10, and the movement may be performed by using a position shifter for each situation. Preferably, the use of a positioner, such as a positioner of the electron beam microcolumn, makes it possible to achieve a very small and precise position shift. In the following description, the electron beam measuring device 10 is moved. In this case, the electron beam measuring instrument 10 is moved by a predetermined distance from the left side and the upper side. And if the center of the electron emission source and the electron beam meter 10 are not exactly coincident, electrons will be detected again in the same and / or other sensing zone 11. If detected in the same detection zone, it moves again a predetermined distance and continues the same process. And if it is detected in the other detection zone, the electron beam meter is moved to a distance less than the movement distance opposite to the direction of movement immediately before it, for example, if it is detected in the detection zone 11c on the lower right side, the electron beam meter ( 10) is moved. Continuing to repeat this, the electron beam emitted from the electron emission source will be at the center of the insulation 12 either horizontally or vertically or at the center of the electron beam meter 10. When the electron beam emitted from the electron emission source is simultaneously detected in the plurality of detection zones 11 including the insulators 12 on the horizontal or vertical axis, the electron beam meter may be located at the center of the center of the electron beam meter 10. The electron beam meter 10 is moved toward the center of the center of the beam 10, and when the electrons are detected in the plurality of detection zones 11 including the insulator 12 on the opposite side of the electron beam meter 10, the electron beam meter 10 is moved again. In the opposite direction, the electron beam meter 10 is moved less than before. Repeatedly, the center of the electron beam meter 10 and the electron emission source are aligned. Although the electron beam meter 10 has been described as being moved, the electron beam meter 10 and the electron emitter are relatively located, so that the electron beam meter 10 and the electron beam meter 10 and the electron emitter are simultaneously moved in a predetermined direction and distance. The same effect can be obtained by moving. By repeating the above method, the electron emission source will be located at the center of the electron beam meter.

Checking the alignment of the electron emitter and the electron beam meter 10 is generally carried out at each detection zone 11a, 11b, 11c, 11d of the electron beam meter 10 because the flow distribution of electrons from the electron emitter is spread out. The amount of electron flow will be constant. In other words, the amount of current measured by each of the measuring devices 19a, 19b, 19c, and 19d may be the same, or a difference in the amount of current may exist within an allowable range. As a result, the center of the electron emission source and the electron beam meter 10 is located on the concentric axis.

In this state, if the current amount in each measuring device 19 is checked, the distance between the center of the electron beam measuring device 10 and the electron emission source can be checked, although in this embodiment, the detection zone 11 is divided into four zones. It may be difficult. However, each detection zone 11 of the electron beam meter 10 is subdivided. In general, the electron beam is distributed and radiated by the electrons, and when the electron beam is constant, the distance between the center of the electron beam meter 10 and the electron emission source are constant. Since the amount of current sensed by the measuring device 19 and the number of detected detection zones 11 are changed according to the distance of, and the collision amount of electrons emitted from the electron beams of each detection zone 11 also changes, This can be confirmed. If you make a hole in the center of the electron beam meter, you can check this with only four detection zones. Because the amount of electrons passing through the center hole of the electron beam meter 10 varies depending on the distance between the electron beam meter 10 and the electron emission source, the amount of current measured in each detection zone 11 is prepared in advance. This ensures sufficient vertical spacing alignment. That is, if the amount of current sensed by the measuring device 19 is smaller than the reference value, the interval may be narrowed by a predetermined distance, and the opposite case may be widened. Accordingly, the electron beam meter 10 and / or the electron emitter may be moved up and down in order to adjust the height interval between the electron beam meter 10 and the electron emitter using data related to the height.

In the automatic alignment method, the electron emission source and the electron beam measuring device 10 check the alignment after the movement of the electron emission source and / or the electron beam emitter, and when the alignment is not performed, the electron beam emitted from the electron emission source is detected. Repeating the above method using the positional data between 10) can automatically align the center of the electron emission source and the electron beam meter 10.

By the above-described alignment method, the alignment or position control of the X-Y-Z three axes of the alignment target can be performed. In the embodiment according to the present invention, as the detection zones are subdivided, the data on the relative position between the electron emission source and the electron beam measuring device can be accurately confirmed and the alignment time can be shortened. That is, by using the relative coordinate data obtained by measuring the collision amount of the electrons identified in each detection zone, horizontal and vertical alignment may be performed at once. In addition, since the collision amount of electrons of the electron beam and the number of detection zones detected by the electron beam measuring unit are changed according to the change of the inclination of the electron beam measuring unit, the tilt adjustment is also possible.

In addition, it is possible to check which zones are more easily and easily detected by using a semiconductor circuit lamp under the metal film lamp without using the measuring devices 19 corresponding to the detection zone 11. That is, when various means for detecting the flow of electrons are included in the electron beam measuring device 10, the above-described method of the present invention can be used.

In addition, the above-described electron beam measuring device (10, 20) is made in the form of a rectangle in the accompanying drawings, but can be manufactured in other shapes as required, such as circular.

The above-described measuring system, measuring method and alignment method using an electron emission source and an electron beam meter are only embodiments. That is, those skilled in the art can make various embodiments by the detailed description of the present invention described above. In other words, the amount of electrons detected in the detection zone can be changed to various other materials that can accurately send to the measuring instrument. Also, the connection between the sensing zone and the measuring instrument can be made by direct contact instead of wires or converted into other signals. Various amplification methods such as checking the relative current amount in the measuring unit by amplification can be applied to the system according to the present invention. That is, the system and method according to the present invention can be modified and implemented in various configurations or methods according to the situation by the technical idea of the present invention. In addition, in the above-described description, the detection zone of the electron beam meter is divided into four zones in the embodiment of FIG. 1, but the zones may be divided into a sufficient number of zones by those skilled in the art according to the embodiment of the present invention. In addition, if the data of the relative position according to the position and current amount of the detection zone detected in each zone is prepared in advance, the relative position and moving distance of the object can be easily checked using the relevant data secured by those skilled in the art and the computer program More precise relative position and travel distance can be calculated. Therefore, it is possible to reduce the number of repetitions of the step by calculating the movement distance in each alignment more accurately.

The systems and methods according to the invention make it easier to make relative positions and / or alignments of objects. In addition, automatic alignment of objects becomes possible. In addition, when the system according to the present invention is permanently fixed to an object, the relative position can be grasped and controlled in real time, and thus, when the relative position of the object changes over time, it becomes easier to control.

Those skilled in the art will recognize that the present invention is limited to specific embodiments, which are only for illustrative purposes and do not limit the scope of the present invention, and the scope of the present invention can be modified and modified without departing from the scope of the appended claims. Will understand.

1 is a plan view of an electron beam measuring instrument according to the present invention;

2 is a cross-sectional view of the embodiment of FIG.

3 is a plan view in which an electron beam is scanned in the embodiment of FIG.

4 is a cross-sectional view as a modification of the embodiment of FIG.

FIG. 5 is a sectional view of still another modification of the embodiment of FIG. 1; FIG.

<Explanation of symbols for the main parts of the drawings>

10, 20: electron beam measuring instrument

11: detection zone

12: insulation

19: measuring instrument

Claims (6)

Electron emission source; A plurality of sensing zones through which electrons in the electron beam emitted from the electron emission source can be electrically conducted; An insulator configured to divide the respective sensing zones by an insulator blocking the flow of electrons or a low-doped semiconductor capable of reducing the flow of electrons; A connection portion for electrically connecting the electrons collided with each of the detection zones; And  A measuring unit connected to each of the sensing zones by the connecting unit and measuring an amount of the electron beam sensed in each of the sensing zones; Position measurement system using electron beam measurement comprising a. The position measuring system using electron beam measurement according to claim 1, wherein the sensing zone is made of a conductor such as a metal or a high-doped semiconductor. The position measuring system using electron beam measurement according to claim 1, wherein each sensing zone comprises a p-n junction. Providing an electron emission source to the first side of the measurement object; Each sensing zone is divided into a plurality of sensing zones through which electrons of the electron beam emitted from the electron emission source can be electrically conducted, and an insulator blocking the flow of electrons or a low-doped semiconductor that can reduce the flow of electrons. Providing an electron beam measuring device for sensing the emitted electron beam including an insulating portion to the second side of the measurement object; Sensing electrons emitted from the electron emission source in each detection zone; Checking the position of each sensing zone where the electrons are sensed by the electron beam measuring device and measuring an amount of the electron beam impinged on each sensing zone; And Calculating relative positions of the first side and the second side using the detected position of each sensing zone and the measurement data of each electron collision amount; Position measuring method using electron beam measurement comprising a. Providing an electron emission source to a first side of the object to be aligned; Each sensing zone is divided into a plurality of sensing zones through which electrons of the electron beam emitted from the electron emission source can be electrically conducted, and an insulator blocking the flow of electrons or a low-doped semiconductor that can reduce the flow of electrons. Providing an electron beam measuring device for sensing the emitted electron beam including an insulating portion to the second side of the alignment target; Detecting electrons emitted from the electron emission source in a detection zone; Checking the position of each sensing zone where the electrons are sensed by the electron beam measuring device and measuring an amount of the electron beam impinged on each sensing zone; Calculating relative positions of the first side and the second side using the detected position of each sensing zone and the measurement data of each electron collision amount; And Moving the first side, the second side, or the first side and the second side in accordance with the identified relative position; Alignment method using an electron beam measurement comprising a. The method of claim 5, further comprising comparing the data of the relative position of the first side and the second side with the data according to a predetermined relative position, wherein the electron emission source and the electron beam meter are not aligned. And repeating from the sensing step again and terminating the alignment when the electron emission source and the electron beam meter are aligned.