KR100504108B1 - Vibration measuring equipment of semiconductor device manufacturing equipment - Google Patents
Vibration measuring equipment of semiconductor device manufacturing equipment Download PDFInfo
- Publication number
- KR100504108B1 KR100504108B1 KR1019970068236A KR19970068236A KR100504108B1 KR 100504108 B1 KR100504108 B1 KR 100504108B1 KR 1019970068236 A KR1019970068236 A KR 1019970068236A KR 19970068236 A KR19970068236 A KR 19970068236A KR 100504108 B1 KR100504108 B1 KR 100504108B1
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- vibration
- semiconductor device
- device manufacturing
- measuring device
- permanent magnet
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K1/00—Details of the magnetic circuit
- H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
- H02K1/12—Stationary parts of the magnetic circuit
- H02K1/17—Stator cores with permanent magnets
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K35/00—Generators with reciprocating, oscillating or vibrating coil system, magnet, armature or other part of the magnetic circuit
- H02K35/02—Generators with reciprocating, oscillating or vibrating coil system, magnet, armature or other part of the magnetic circuit with moving magnets and stationary coil systems
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
반도체장치 제조설비에서 공정 중 발생하는 진동의 정도를 측정하기 쉽고, 간편하게 사용할 수 있는 측정기를 제공하는 반도체장치 제조설비의 진동측정기에 관한 것이다. 본 발명은, 반도체장치 제조설비의 진동측정기에 있어서, 원통형 절연체에 소정횟수 고르게 감겨있는 유도코일, 상기 절연체의 내부에 설치되는 영구자석, 진동시 상기 영구자석이 상하 및 좌우방향으로 움직이도록 상기 영구자석의 양방향을 상기 절연체에 연결하는 연결수단 및 상기 유도코일에 연결하여 상기 영구자석이 움직일 때 발생하는 유도기전력을 전류의 세기로 나타내는 디스플레이부를 구비하여 이루어진다. 따라서, 본 발명에 의하면 설비의 진동측정에 있어서 소형화되고, 설치가 쉬운 진동측정장치를 사용함으로써 진동의 강약을 전류계를 통해 간편하게 파악할 수 있는 효과가 있다.The present invention relates to a vibration measuring device of a semiconductor device manufacturing facility which provides a measuring device that is easy to measure the degree of vibration generated during the process in a semiconductor device manufacturing facility and can be used conveniently. The present invention provides a vibration measuring device of a semiconductor device manufacturing facility, comprising: an induction coil wound around a predetermined number of times in a cylindrical insulator, a permanent magnet installed in the insulator, and the permanent magnet moving in a vertical direction in a vertical direction. And a display unit for connecting both directions of the magnet to the insulator and the induction electromotive force generated when the permanent magnet moves by connecting to the induction coil. Therefore, according to the present invention, by using a vibration measuring device that is downsized and easy to install in equipment vibration measurement, the strength and weakness of vibration can be easily grasped through an ammeter.
Description
본 발명은 반도체장치 제조설비의 진동측정기에 관한 것으로서, 보다 상세하게는 반도체장치 제조설비에서 공정 중 발생하는 진동의 정도를 측정하기 쉽고, 간편하게 사용할 수 있는 측정기를 제공하는 반도체장치 제조설비의 진동측정기에 관한 것이다.The present invention relates to a vibration measuring device of a semiconductor device manufacturing facility, and more particularly, to a vibration measuring device of a semiconductor device manufacturing facility, which provides a measuring device that is easy to measure the degree of vibration generated during a process in a semiconductor device manufacturing facility and can be used conveniently. It is about.
반도체장치를 제조하는 라인에서는 각종 설비의 구동에 의해 또는 자연적인 요인에 의해 진동이 발생한다. 진동은 어느 구동장비 마다 발생되기 마련이지만, 특히 미세한 공정을 필요로 하는 반도체장치 제조설비에서의 진동의 영향은 수율을 저하시키는 요인으로 작용하였다.In a line for manufacturing a semiconductor device, vibration is generated by driving various equipment or by natural factors. Vibration is generated in every driving device, but the influence of vibration in the semiconductor device manufacturing equipment, which requires a minute process, acts as a factor of lowering the yield.
이온주입공정은 장비자체의 특성상 빔(Beam)을 스캐닝(Scanning)하는데, 그 스캐닝 방법은 전기적 스캐닝방법과 기계적 스캐닝방법이 대표적인 방법이다. 전기적 스캐닝방법은 중전류 이온주입기에서 많이 채택되고 있으며, 이는 설비의 별 진동없이 사용되고 있으나 고전류 이온주입기와 같은 설비에서 빔을 주사하는 데는 기계적인 스캐닝방법이 채택되어지고 있다.In the ion implantation process, the beam is scanned due to the characteristics of the equipment itself. The scanning method is an electrical scanning method or a mechanical scanning method. Electrical scanning method is widely adopted in the medium current ion implanter, which is used without any vibration of the equipment, but mechanical scanning method is adopted to scan the beam in the equipment such as high current ion implanter.
디스크(Disk)가 1000rpm 이상 회전하는 기계적인 스캐닝방법은 회전중에 디스크의 진동이 뒤따른다. 상기의 진동에 의해 빔라인(Beam Line)의 흔들림 등이 발생하여 공정상의 문제점이 있었다.In a mechanical scanning method in which a disk rotates more than 1000 rpm, vibration of the disk follows. The vibration of the beam line (Beam Line) is generated by the vibration there was a problem in the process.
그러나 종래의 진동을 체크하는 계측장치는 조작방법이 복잡하고, 고비용이며, 사용방법이 쉽지 않아서 실재 라인에서 사용하기에 어려움이 따랐다. 그리고 진동측정장치를 사용하지 않은 상태에서의 진동의 판단은 작업자의 시각이나 촉각에 의한 감각으로 진동의 강약을 판단하는 문제점이 있었다.However, the conventional measuring device for checking the vibration is difficult to use in a real line because the operation method is complicated, expensive, and easy to use. And the determination of the vibration in the state without using the vibration measuring device has a problem of judging the strength of the vibration by the sense of the operator's sight or touch.
따라서, 종래에는 설비에서 발생하는 진동의 크기를 제대로 파악하기가 어려웠고, 손쉽게 이동하여 수시로 진동을 측정하기 못하는 문제점이 있었다.Therefore, in the related art, it was difficult to properly grasp the magnitude of the vibration generated in the facility, and there was a problem in that the vibration was not easily measured at any time.
본 발명의 목적은, 작고 단순한 구성으로 제작된 진동측정기를 제작하여 측정이 용이하지 않은 곳에서도 측정할 수 있는 반도체장치 제조설비의 진동측정기를 제공하는 데 있다.An object of the present invention is to provide a vibration measuring device of a semiconductor device manufacturing equipment that can be measured even in a place where the measurement is not easy by making a vibration measuring device manufactured in a small and simple configuration.
상기 목적을 달성하기 위한 본 발명에 따른 반도체장치 제조설비의 진동측정기는, 반도체장치 제조설비의 진동측정기에 있어서, 원통형 절연체에 소정횟수 고르게 감겨있는 유도코일, 상기 절연체의 내부에 설치되는 영구자석, 진동시 상기 영구자석이 상하 및 좌우방향으로 움직이도록 상기 영구자석의 양방향을 상기 절연체에 연결하는 연결수단 및 상기 유도코일에 연결하여 상기 영구자석이 움직일 때 발생하는 유도기전력을 전류의 세기로 나타내는 디스플레이부를 구비하여 이루어진다.Vibration measuring device of the semiconductor device manufacturing equipment according to the present invention for achieving the above object, In the vibration measuring device of the semiconductor device manufacturing equipment, an induction coil wound evenly a predetermined number of times on a cylindrical insulator, a permanent magnet installed inside the insulator, Display for indicating the induced electromotive force generated when the permanent magnet is moved by connecting the connecting means connecting the bidirectional direction of the permanent magnet to the insulator and the induction coil so that the permanent magnet moves up and down and left and right during vibration. It is made with a part.
그리고, 상기 영구자석은 막대자석으로 이루어짐이 바람직하다.And, the permanent magnet is preferably made of a bar magnet.
그리고, 상기 연결수단은 절연스프링으로 이루어진다.The connecting means is made of an insulating spring.
그리고, 상기 디스플레이부는 전류계를 구비함이 바람직하다.The display unit preferably includes an ammeter.
이하, 본 발명의 구체적인 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
본 발명에 따른 실시예는 도 1 을 참조하면, 원통형 절연체(10)에 코일(12)이 감겨있고, 원통의 내부에는 영구자석(14)이 양단이 절연스프링(16)에 의해 고정되어 설치되어 있다. 코일(12)은 콘넥터(18)에 의해 전류표시회로(20)에 연결된다.1, the coil 12 is wound around a cylindrical insulator 10, and a permanent magnet 14 is fixed to both ends of the cylindrical insulator 10 by an insulating spring 16. have. The coil 12 is connected to the current display circuit 20 by the connector 18.
콘넥터(18)에 연결된 전류표시회로(20)의 일단자는 다이오드(D1)가 가변저항(VR1)과 콘덴서(C1)를 병렬로 연결하여 있고, 가변저항(VR1)에는 전류계(22)와 다이오드(D2)와 다이오드(D3)가 병렬로 연결되는데, 각 다이오드(D2, D3)는 극성이 서로 반대이다.One end of the current display circuit 20 connected to the connector 18 has a diode D1 connecting the variable resistor VR1 and the capacitor C1 in parallel, and the variable resistor VR1 has an ammeter 22 and a diode ( D2) and the diode D3 are connected in parallel, and the diodes D2 and D3 have opposite polarities.
전류표시회로(20)의 다른 일단자는 콘덴서(C1)의 일단자가 다이오드(D2)와 다이오드(D3) 및 전류계(22)와 같은 노드에 연결된 저항(R1)과 병렬로 연결되어 있다.The other end of the current display circuit 20 has one end of the capacitor C1 connected in parallel with a resistor R1 connected to a node such as the diode D2 and the diode D3 and the ammeter 22.
전술한 바와 같이 구성된 본 발명에 따른 실시예는 반도체장치 제조설비에 부착되어진 영구자석(14)이 설비의 진동에 의해 상하 또는 좌우로 움직여서 영구자석(14)과 코일(12)에 의해서 발생되는 유도기전력이 전류계(22)에 표시되어 이루어진다.In the embodiment according to the present invention configured as described above, the permanent magnet 14 attached to the semiconductor device manufacturing equipment is moved up and down or left and right by the vibration of the equipment induction generated by the permanent magnet 14 and the coil 12 The electromotive force is displayed on the ammeter 22.
구체적으로, 코일(12)이 감겨있는 원통을 진동의 크기를 파악하고자 하는 설비에 고정하여 설치한다. 그러면 진동에 의해 원통내부의 절연스프링(16)에 연결된 영구자석(14)이 움직이면서 기전력이 발생된다. 이렇게 발생된 기전력은 전류표시회로(20)에 인가되는데, 다이오드(D1)에 의해 정류되고, 콘덴서(C1)에 의해 평활화된다. 가변저항(VR1) 및 저항(R1)을 통해 전압강하되어서 적정량의 전류가 전류계에 흐르도록 제한된다. 각각의 다이오드(D2, D3)에 병렬로 연결된 전류계(22)에 전류의 세기가 표시되어 작업자는 전류의 세기에 따라 그에 비례하는 진동의 세기로 환산함으로써 진동의 강약을 쉽게 판단할 수 있다.Specifically, the coil 12 is wound around the cylinder is fixed to the installation to determine the magnitude of the vibration is installed. Then, electromotive force is generated while the permanent magnet 14 connected to the insulating spring 16 inside the cylinder moves by vibration. The generated electromotive force is applied to the current display circuit 20, rectified by the diode D1, and smoothed by the capacitor C1. The voltage is dropped through the variable resistor VR1 and the resistor R1 so that an appropriate amount of current flows through the ammeter. The strength of the current is displayed on the ammeter 22 connected in parallel to each of the diodes D2 and D3, so that the operator can easily determine the strength and weakness of the vibration by converting the strength of the current into proportional vibration.
전술한 바와 같이 진동의 세기를 측정하는 장치를 소형화하고, 작동이 쉬워서 설비의 다양한 부분의 진동을 측정하는 이점이 있다.As described above, there is an advantage of miniaturizing the device for measuring the intensity of vibration and making it easy to operate to measure the vibration of various parts of the installation.
따라서, 본 발명에 의하면 설비의 진동측정에 있어서 소형화되고, 설치가 쉬운 진동측정장치를 사용함으로써 진동의 강약을 전류계를 통해 간편하게 파악할 수 있는 효과가 있다.Therefore, according to the present invention, by using a vibration measuring device that is downsized and easy to install in equipment vibration measurement, the strength and weakness of vibration can be easily grasped through an ammeter.
이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.
도 1 은 본 발명에 따른 반도체장치 제조설비의 진동측정기의 실시예를 나타내는 도면이다.1 is a view showing an embodiment of a vibration measuring apparatus of a semiconductor device manufacturing apparatus according to the present invention.
※ 도면의 주요 부분에 대한 부호의 설명※ Explanation of codes for main parts of drawing
10 : 원통형절연체 12 : 코일10: cylindrical insulator 12: coil
14 : 영구자석 16 : 절연스프링14: permanent magnet 16: insulated spring
18 : 콘넥터 20 : 전류변환회로18: connector 20: current conversion circuit
22 : 전류계 D1, D2, D3 : 다이오드22: ammeter D1, D2, D3: diode
C1 : 콘덴서 VR1 : 가변저항C1: capacitor VR1: variable resistor
R1 : 저항R1: resistance
Claims (4)
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KR1019970068236A KR100504108B1 (en) | 1997-12-12 | 1997-12-12 | Vibration measuring equipment of semiconductor device manufacturing equipment |
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KR100733317B1 (en) * | 2005-09-22 | 2007-06-28 | 엘지전자 주식회사 | Control device of air conditioner |
KR100887761B1 (en) * | 2007-10-16 | 2009-03-12 | 한국과학기술원 | Apparatus for measuring inertia with haptic feedback and method therefor |
KR100934217B1 (en) * | 2007-12-10 | 2009-12-29 | 한국전자통신연구원 | Microsensor for vibration measurement |
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JPS5756729A (en) * | 1980-09-24 | 1982-04-05 | Namuko:Kk | Impulsive force measuring device |
JPH03118424A (en) * | 1989-09-30 | 1991-05-21 | Aisin Seiki Co Ltd | Vibration sensor |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5756729A (en) * | 1980-09-24 | 1982-04-05 | Namuko:Kk | Impulsive force measuring device |
JPH03118424A (en) * | 1989-09-30 | 1991-05-21 | Aisin Seiki Co Ltd | Vibration sensor |
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