KR100496040B1 - Manufacturing method of toughened epoxy resin using polyester waste chips - Google Patents

Manufacturing method of toughened epoxy resin using polyester waste chips Download PDF

Info

Publication number
KR100496040B1
KR100496040B1 KR1019970028098A KR19970028098A KR100496040B1 KR 100496040 B1 KR100496040 B1 KR 100496040B1 KR 1019970028098 A KR1019970028098 A KR 1019970028098A KR 19970028098 A KR19970028098 A KR 19970028098A KR 100496040 B1 KR100496040 B1 KR 100496040B1
Authority
KR
South Korea
Prior art keywords
epoxy resin
polyester waste
chips
polyester
waste chips
Prior art date
Application number
KR1019970028098A
Other languages
Korean (ko)
Other versions
KR19990004095A (en
Inventor
김봉섭
윤인선
Original Assignee
주식회사 휴비스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 휴비스 filed Critical 주식회사 휴비스
Priority to KR1019970028098A priority Critical patent/KR100496040B1/en
Publication of KR19990004095A publication Critical patent/KR19990004095A/en
Application granted granted Critical
Publication of KR100496040B1 publication Critical patent/KR100496040B1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04Epoxynovolacs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00Properties characterising the ingredient of the composition
    • C08L2207/20Recycled plastic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)

Abstract

본 발명은 종래 폐기되어 환경오염원이 되어 왔던 폴리에스테르 폐분칩을 에폭시수지의 개질제로 이용하여 강인화 에폭시수지를 제조하는 방법에 관한 것으로서, 제조되는 개질 에폭시수지는 에폭시 수지의 고유특성인 우수한 내열성과 기계적 특성을 유지하면서 강인성이 우수하여, 내열성 및 기계적 특성과 더불어 내충격성이 함께 요구되는 용도에 효과적으로 적용할 수 있게 된다.The present invention relates to a method for producing toughened epoxy resin using polyester waste chips, which have been disposed of as a source of environmental pollution, as a modifier of an epoxy resin, and the modified epoxy resin produced has excellent heat resistance, which is inherent in epoxy resins. It is excellent in toughness while maintaining mechanical properties, and thus can be effectively applied to applications requiring both heat resistance and mechanical properties and impact resistance.

Description

폴리에스테르 폐분칩을 이용한 강인화 에폭시수지의 제조방법Manufacturing method of toughened epoxy resin using polyester waste chips

본 발명은 폴리에스테르 폐분칩의 이용에 관한 것으로서, 보다 구체적으로는 폴리에스테르 폐분칩을 이용하여 강인화 에폭시수지를 제조하는 방법에 관한 것이다.The present invention relates to the use of polyester waste chips, and more particularly, to a method for producing toughened epoxy resins using polyester waste chips.

최근 산업 및 경제구조의 급격한 발달로 자동차, 항공기 및 일반 가전제품 등 전 분야에 걸쳐서 플라스틱의 사용량이 급격히 증가하고 있다. 특히 엔지니어링 플라스틱의 경우에는, 그들이 갖는 우수한 기계적, 화학적 그리고 전기적 특성 때문에 산업용, 의료용 및 생활용 소재로 널리 사용되고 있는 실정이다. 그러나 이러한 플라스틱들은 폐기후 자연계에서 분해되지 않아 환경오염을 일으키는 등 심각한 사회문제를 야기시키고 있다. 따라서 폐플라스틱의 생분해 및 재활용 연구가 주목을 받고 있다.Recently, due to the rapid development of the industrial and economic structure, the use of plastics is rapidly increasing in all fields such as automobiles, aircrafts and general household appliances. In particular, in the case of engineering plastics, due to their excellent mechanical, chemical and electrical properties, they are widely used as industrial, medical and household materials. However, these plastics do not decompose in nature after disposal, causing serious social problems such as environmental pollution. Therefore, research on biodegradation and recycling of waste plastics has attracted attention.

폴리에틸렌테레프탈레이트(PET)와 같은 폴리에스테르 섬유용 칩(Chip) 생산공정중에서 PET 분칩이 발생하게 되는데, 이러한 분칩들은 섬유공정중에 재사용할 수 없어 그대로 버려지고 있는 실정이다.PET chip chips are generated during the production process of polyester fiber chips such as polyethylene terephthalate (PET). These chips are discarded as they are not reusable during the fiber process.

이러한 폴리에스테르 폐분칩은 중합된 폴리에스테르 칩의 저장 및 수송시에 칩과 기벽과의 마찰에 의하여 생기는 것으로서 이 분칩을 분리·제거해 주지않고 방사공정으로 넘어가게 되면 용융불량으로 인한 방사팩(Pack)압 상승을 초래하여 공정이 불안하게 되고 결국 연신공정에서의 단사 및 염·가공공정에서의 염색 불균일 등의 문제가 발생하게 된다.These waste chips are produced by friction between chips and wall during storage and transportation of polymerized polyester chips. If these chips are passed to spinning process without separating and removing these chips, spin pack due to melt defect Increasing the pressure causes the process to become unstable, resulting in problems such as single yarns in the stretching process and uneven dyeing in the salt and processing processes.

한편, 에폭시수지는 경화제와 반응하여 불용·불융성의 열경화물이 되는 대표적인 열경화성수지로서 기계적, 전기적 및 화학적특성의 우수성 때문에 접착제, 코팅제, 전기절연제 그리고 복합재료의 매트릭스 등으로 사용되고 있다. 그러나 에폭시 수지는 본질적으로 취성을 갖고 있기 때문에 내충격성이 요구되어 있는 용도에는 그 적용이 제한되어 왔다.On the other hand, epoxy resin is a representative thermosetting resin that reacts with a curing agent to become an insoluble and insoluble thermosetting resin, and is used as an adhesive, a coating agent, an electrical insulation agent, and a matrix of a composite material because of its excellent mechanical, electrical, and chemical properties. However, since epoxy resins are inherently brittle, their application has been limited to applications requiring impact resistance.

이러한 에폭시수지의 취성을 보완하기 위한 시도로 카르복실 말단 부타디엔 아크릴고무나 아민말단 부타디엔 아크릴고무와 같은 액상고무에 의한 개질과 폴리에틸렌테레프탈레이트 및 폴리페닐렌옥사이드 같은 엔지니어링플라스틱에 의한 개질, 그리고 폴리에테르이미드, 폴리에테르설폰, 폴리설폰과 같은 슈퍼엔지니어링 플라스틱에 의한 개질이 행하여지고 있다.In an attempt to compensate for the brittleness of the epoxy resin, modification by liquid rubber such as carboxyl terminal butadiene acrylic rubber and amine terminal butadiene acrylic rubber, modification by engineering plastics such as polyethylene terephthalate and polyphenylene oxide, and polyetherimide Modification by super engineering plastics, such as polyether sulfone and polysulfone, is performed.

전자에 의한 개질방법은 내충격성이란 관점에서 보면 상당히 우수한 성능을 보이지만 에폭시수지의 고유특성인 내열성 및 기계적특성을 떨어뜨리는 단점이 있다. 그래서 최근에는 에폭시의 고유특성은 유지시키고 내충격성을 발현케하는 엔지니어링 또는 슈퍼 엔지니어링 플라스틱에 의한 개질이 활발히 연구되고 있다.The former modification method shows a very good performance in terms of impact resistance, but has the disadvantage of lowering heat resistance and mechanical properties, which are inherent to epoxy resins. Therefore, in recent years, modifications by engineering or super engineering plastics that maintain the intrinsic properties of epoxy and develop impact resistance have been actively studied.

여기서, 폴리에틸렌테레프탈레이트에 의한 개질의 경우 PET가 결정성 고분자이므로 에폭시수지와의 용융블랜딩에 의해서 혼합해야 하는 데, PET가 용융되기 위해서는 270℃이상의 고온에서 이를 행해야 하는 바, 이 온도에서는 보통 에폭시 수지의 경화반응이 너무 빨라 용융혼합중에 겔화가 일어날 수 있다. 그러나 본 발명에서는 180℃정도의 온도에서 에폭시수지를 예열시킨 다음 여기에 PET분칩을 분산시켜 혼합하므로 앞서 기술한 문제점이 야기되지 않는다.Here, in the case of the modification by polyethylene terephthalate, PET is a crystalline polymer, so it must be mixed by melt blending with an epoxy resin, but in order to melt the PET, this should be performed at a high temperature of 270 ° C. or higher. The curing reaction is so fast that gelation may occur during melt mixing. In the present invention, however, the epoxy resin is preheated at a temperature of about 180 ° C., and the PET powder chips are dispersed and mixed therein, so that the aforementioned problems are not caused.

상기한 바와 같은 폴리에스테르 폐분칩을 활용하기 위한 본 발명자들의 연구에서, 폴리에스테르 섬유용 칩 생산공정중에서 얻어지는 폴리에스테르 폐분칩은 하기 화학식 1로 표기되는 환형올리고머(주로 3량체) 상태로 고온의 융점을 가지고 있어, 일반 PET칩의 용융온도에서는 용융되지 않아 폴리에스터 섬유에는 치명적인 피해를 주는 것이지만, 에폭시수지와 블랜딩하면 PET가 갖는 기계적 특성을 살려 에폭시 매트릭스에 파우더 형태로 분산을 시키면서 필러(filler)역할을 하여 외부에서 충격을 줄 때, 충격에너지를 흡수하게 되어 에폭시수지의 취성적인 성질을 개선시킨다는 사실을 알게되었다. 한편, 이러한 PET에 의한 에폭시수지의 강인화는 에폭시 매트릭스에 PET가 분산되어 있는 상태로 PET의 입자사이즈가 작은 분칩의 경우가 굴곡강도나 파되에너지 면에서 우수한 효과를 보여주고 있다.In the study of the present inventors for utilizing the polyester waste chip as described above, the polyester waste chip obtained during the polyester fiber chip production process has a high melting point in a cyclic oligomer (mainly trimer) state represented by the following formula (1). It does not melt at the melting temperature of ordinary PET chips, which causes fatal damage to polyester fibers, but blending with epoxy resin makes it a filler while dispersing it in the form of powder in the epoxy matrix by utilizing the mechanical properties of PET. When the impact from the outside, the impact energy is absorbed to improve the brittle properties of the epoxy resin. On the other hand, the toughening of the epoxy resin by PET shows excellent effects in terms of flexural strength and fracture energy in the case of the minute chips having a small particle size of PET with PET dispersed in the epoxy matrix.

[화학식 1][Formula 1]

Figure pat00001
Figure pat00001

따라서, 본 발명은 폴리에스테르 폐분칩을 개질제로 이용하여 강인화 에폭시수지를 제조하는 것을 목적으로 한다.Therefore, an object of the present invention is to produce toughened epoxy resin using polyester waste chips as a modifier.

상기한 목적을 달성하기 위한 본 발명에 의하면, 예열된 에폭시 수지 70∼95중량%에 폴리에스테르 폐분칩 30∼5중량%를 가하여 혼합하는 공정과, 결과의 혼합물에 에폭시 경화제를 투입하고 가열하에 경화시키는 공정을 포함하는 것을 특징으로 하는 폴리에스테르 폐분칩을 이용한 강인화 에폭시수지의 제조방법이 제공된다.According to the present invention for achieving the above object, the process of adding 30 to 5% by weight of polyester waste chips to 70 to 95% by weight of the preheated epoxy resin, and adding the epoxy curing agent to the resulting mixture and curing under heating Provided is a method for producing a toughened epoxy resin using a polyester waste powder chip comprising a step of making the powder.

이하, 본 발명을 보다 상세하게 설명하기로 한다.Hereinafter, the present invention will be described in more detail.

본 발명의 제조방법에 있어서, 폴리에스테르 분칩과 에폭시수지의 혼합에서 에폭시 수지는 70∼95중량%로 하고 폴리에스테르 폐분칩은 30∼5중량%로 배합하는 것이 바람직하다. 만일 폴리에스테르 폐분칩의 배합비율이 30중량%를 초과하게 되면 강인성은 향상시킬 수 있지만 에폭시 수지의 고유특성인 내열성 및 기계적 특성이 저하하게 되고, 폴리에스테르 폐분칩의 배합비율이 5중량% 미만인 경우에는 강인성 향상효과가 미미하게 된다. 또한, 폴리에스테르 폐분칩과 에폭시수지는 가급적 균일하게 혼합한 후에 경화제와 혼합하는 것이 요구되는데 이를 위해서는 에폭시수지를 미리 예열된 시킨 후에 폴리에스테르 분칩과 혼합하는 것이 바람직하다.In the manufacturing method of this invention, it is preferable to mix | blend an epoxy resin with 70-95 weight% and polyester waste chip | tip with 30-5 weight% in the mixing of a polyester powder chip and an epoxy resin. If the blending ratio of the polyester waste chips exceeds 30% by weight, the toughness can be improved, but the heat resistance and mechanical properties, which are inherent to the epoxy resin, are lowered, and the blending ratio of the polyester waste chips is less than 5% by weight. The toughness improvement effect is insignificant. In addition, the polyester waste chip and the epoxy resin is required to be mixed with the curing agent after mixing as uniformly as possible. For this purpose, it is preferable to preheat the epoxy resin before mixing with the polyester chip.

이와 같이 균일하게 혼합된 폴리에스테르 폐분칩/에폭시수지 혼합물은 경화제와 혼합하게 되는데, 혼합중에 에폭시 수지의 경화가 일어나지 않도록 폴리에스테르 폐분칩/에폭시수지 혼합물의 온도를 약간 낮춘 상태에서 경화제와 혼합하는 것이 바람직하다. 경화제의 혼합에 의해 얻어진 폴리에스테르 폐분칩/에폭시수지/경화제 혼합물은 가열하기 전에 상기 혼합물중에 내포된 기포를 제거하여 가열후에 균일한 경화물이 생성되도록 하는 것이 바람직하다. 가열경화시의 온도는 180∼220℃가 적합하다.The uniformly mixed polyester waste chip / epoxy resin mixture is mixed with a curing agent, and mixing with the curing agent is performed by lowering the temperature of the polyester waste chip chip / epoxy resin mixture slightly to prevent curing of the epoxy resin during mixing. desirable. It is preferable that the polyester waste chip / epoxy resin / curing agent mixture obtained by mixing the curing agent removes air bubbles contained in the mixture before heating to produce a uniform cured product after heating. 180-220 degreeC is suitable for the temperature at the time of heat hardening.

상술한 바와 같은 본 발명에 의해 제조되는 개질 에폭시수지는 에폭시 수지의 고유특성인 우수한 내열성과 기계적 특성을 유지하면서 강인성이 향상되어 내열성 및 기계적 특성과 더불어 내충격성이 함께 요구되는 용도에도 그 적용범위를 넓힐 수 있게 된다.The modified epoxy resin prepared according to the present invention as described above, while maintaining the excellent heat resistance and mechanical properties that are inherent to the epoxy resin, the toughness is improved, so that the application range is also required for applications requiring both heat resistance and mechanical properties as well as impact resistance. It can be widened.

상술한 바와 같은 본 발명의 특징 및 기타의 장점은 후술되는 실시예의 기재로부터 보다 명백하게 될 것이다. 물론, 본 발명은 하기 실시예에 한정되지 않는다.Features and other advantages of the present invention as described above will become more apparent from the description of the embodiments described below. Of course, the present invention is not limited to the following examples.

〈실시예 1〉<Example 1>

하기 화학식 2로 표기되는 2관능성 에폭시 수지 95g을 180℃로 예열한 후에 상기 화학식 1의 환형 트라이머가 주성분인 폴리에틸렌테레프탈레이트 폐분칩 5g을 첨가하여 충분히 혼합하였다. 결과의 혼합물을 140℃로 온도를 낮춘후 여기에 경화제로서 디페닐디아민설폰(DDS)을 31g 첨가하여 혼합하고, 혼합중에 생긴 기포를 진공오븐으로 제거하였다. 탈기포된 혼합물을 180~220℃로 미리 예열된 몰드에 부어 3시간 동안 경화반응을 행하였다. 얻어진 시편의 굴곡강도와 파괴에너지를 측정하여 하기 표 1에 나타내었다.After preheating 95 g of the bifunctional epoxy resin represented by the following Chemical Formula 2 to 180 ° C., 5 g of polyethylene terephthalate waste chips containing the cyclic trimer of Chemical Formula 1 as a main component was added and mixed well. The resultant mixture was cooled to 140 ° C., and 31 g of diphenyldiamine sulfone (DDS) was added thereto as a curing agent, and the bubbles formed during the mixing were removed by a vacuum oven. The degassed mixture was poured into a mold preheated to 180-220 ° C. and cured for 3 hours. The flexural strength and fracture energy of the obtained specimens were measured and shown in Table 1 below.

[화학식 2][Formula 2]

Figure pat00002
Figure pat00002

〈실시예 2〉<Example 2>

에폭시수지/PET 분칩의 혼합 중량비를 90/10으로 한 것을 제외하고는 실시예 1과 동일한 절차를 반복하였다.The same procedure as in Example 1 was repeated except that the mixing weight ratio of epoxy resin / PET chip was 90/10.

〈실시예 3〉<Example 3>

에폭시수지/PET 분칩의 혼합 중량비를 80/20으로 한 것을 제외하고는 실시예 1과 동일한 절차를 반복하였다.The same procedure as in Example 1 was repeated except that the mixing weight ratio of epoxy resin / PET chip was 80/20.

〈실시예 4〉<Example 4>

에폭시수지/PET 분칩의 혼합 중량비를 70/30으로 한 것을 제외하고는 실시예 1과 동일한 절차를 반복하였다.The same procedure as in Example 1 was repeated except that the mixing weight ratio of epoxy resin / PET chip was 70/30.

〈비교예 1〉<Comparative Example 1>

에폭시 수지만으로 실시예 1과 동일한 조건에서 경화반응을 행하여 시편을 제조하였다. 얻어진 시편의 굴곡강도와 파괴에너지를 측정하여 하기 표 1에 나타내었다.The specimen was prepared by curing under the same conditions as in Example 1 using only epoxy resin. The flexural strength and fracture energy of the obtained specimens were measured and shown in Table 1 below.

〈비교예 2〉<Comparative Example 2>

PET 폐분칩 대신에 PET 팰렛을 사용한 것을 제외하고는 실시예 1과 중량비 및 혼합방법은 동일한 절차를 반복하였다.Example 1 and the weight ratio and mixing method was repeated, except that PET pellets were used instead of PET waste chips.

[표 1]TABLE 1

Figure pat00003
Figure pat00003

※ 에폭시수지 / PET 팰렛 (중량비)※ Epoxy resin / PET pallet (weight ratio)

표 1에서 보듯이 에폭시수지/폴리에스테르분칩의 비율이 95∼70/5∼30 중량%로 혼합될 경우 굴곡강도가 크며, 파괴에너지도 또한 높아 강인한 에폭시수지가 제조됨을 알 수 있다.As shown in Table 1, when the ratio of the epoxy resin / polyester powder chip is mixed in the range of 95 to 70/5 to 30 wt%, the bending strength is high and the breaking energy is also high.

위에 설명한 바와 같이 본 발명은 종래 폐기되어 환경오염을 유발하여 왔던 폴리에스테르 폐분칩을 활용할 수 있게 하고, 또한 에폭시 수지의 고유특성인 우수한 내열성과 기계적 특성을 유지하면서 강인성이 우수하여 내열성 및 기계적 특성과 더불어 내충격성이 함께 요구되는 용도에 효과적으로 적용할 수 있는 고부가가치의 개질 에폭시수지를 제공하는 효과가 있다.As described above, the present invention makes it possible to utilize polyester waste chips that have been conventionally disposed to cause environmental pollution, and also have excellent toughness while maintaining excellent heat resistance and mechanical properties, which are inherent to epoxy resins. In addition, there is an effect of providing a high value-added modified epoxy resin that can be effectively applied to applications requiring impact resistance.

Claims (2)

예열된 에폭시 수지 70∼95중량%에 폴리에스테르 폐분칩 30∼5중량%를 가하여 혼합하는 공정과, 결과의 혼합물에 에폭시 경화제를 투입하고 가열하에 경화시키는 공정을 포함하는 것을 특징으로 하는 폴리에스테르 폐분칩을 이용한 강인화 에폭시수지의 제조방법.Polyester waste comprising the steps of adding 30 to 5% by weight of polyester waste chips to 70 to 95% by weight of the preheated epoxy resin, and adding epoxy curing agent to the resulting mixture and curing under heating. Method for producing toughened epoxy resin using chip chips. 제 1항에 있어서, 경화온도가 180∼220℃인 것을 특징으로 하는 폴리에스테르 폐분칩을 이용한 강인화 에폭시수지의 제조방법.The method for producing toughened epoxy resin using polyester waste chips according to claim 1, wherein the curing temperature is 180 to 220 캜.
KR1019970028098A 1997-06-27 1997-06-27 Manufacturing method of toughened epoxy resin using polyester waste chips KR100496040B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019970028098A KR100496040B1 (en) 1997-06-27 1997-06-27 Manufacturing method of toughened epoxy resin using polyester waste chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970028098A KR100496040B1 (en) 1997-06-27 1997-06-27 Manufacturing method of toughened epoxy resin using polyester waste chips

Publications (2)

Publication Number Publication Date
KR19990004095A KR19990004095A (en) 1999-01-15
KR100496040B1 true KR100496040B1 (en) 2005-10-12

Family

ID=37305217

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970028098A KR100496040B1 (en) 1997-06-27 1997-06-27 Manufacturing method of toughened epoxy resin using polyester waste chips

Country Status (1)

Country Link
KR (1) KR100496040B1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5055532A (en) * 1985-01-22 1991-10-08 The Dow Chemical Company Polymer-modified vinylized epoxy resins
JPH0820708A (en) * 1994-07-06 1996-01-23 Mitsubishi Chem Corp Epoxy resin composition and prepreg prepared therefrom
JPH08225666A (en) * 1995-02-20 1996-09-03 Toray Ind Inc Prepreg and composite material
JPH0995599A (en) * 1995-09-29 1997-04-08 Nippon Zeon Co Ltd Epoxy resin composition, and prepreg and molded product produced using the same
KR100270399B1 (en) * 1993-12-31 2000-11-01 조민호 The epoxy resin composition using prepreg

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5055532A (en) * 1985-01-22 1991-10-08 The Dow Chemical Company Polymer-modified vinylized epoxy resins
KR100270399B1 (en) * 1993-12-31 2000-11-01 조민호 The epoxy resin composition using prepreg
JPH0820708A (en) * 1994-07-06 1996-01-23 Mitsubishi Chem Corp Epoxy resin composition and prepreg prepared therefrom
JPH08225666A (en) * 1995-02-20 1996-09-03 Toray Ind Inc Prepreg and composite material
JPH0995599A (en) * 1995-09-29 1997-04-08 Nippon Zeon Co Ltd Epoxy resin composition, and prepreg and molded product produced using the same

Also Published As

Publication number Publication date
KR19990004095A (en) 1999-01-15

Similar Documents

Publication Publication Date Title
CN1263596C (en) Method of forming conductive polymeric nanocomposite materials and materials produced thereby
Lee et al. Thermal stability and physical properties of epoxy composite reinforced with silane treated basalt fiber
EP3553129B1 (en) Curing resin composition, cured product of, and curing method for, curing resin composition, and semiconductor device
CN106633680A (en) Modified liquid crystal polyester resin composition, preparation method thereof and application of composition
CN111087765A (en) Low-density liquid crystal polymer and preparation method thereof
Chen et al. Miscibility and fracture behaviour of an epoxy resin-bisphenol-A polycarbonate blend
RU2488612C1 (en) Epoxide composition for making articles from polymer composite materials by vacuum infusion
US20100130646A1 (en) Method for manufacturing epoxy nanocomposite material containing vapor-grown carbon nanofibers and its products thereby
CN102311616B (en) Carbon-fiber-reinforced polyester composite material and preparation method thereof
CN114395216A (en) Bio-based hyperbranched polymer epoxy resin and preparation method thereof
CN111909645A (en) Epoxy resin composition for motor rotor encapsulation
CN109265922A (en) A kind of high tenacity self-catalysis epoxy resin and preparation method
CN114891320A (en) Epoxy resin/chopped glass fiber composite material and preparation method thereof
CN106633706A (en) Full-aromatic polyester resin compound, preparation method thereof and application
CN113308089A (en) Preparation method of high-whiteness and high-toughness epoxy resin composite material
KR100496040B1 (en) Manufacturing method of toughened epoxy resin using polyester waste chips
KR101637632B1 (en) nylon composite And Method of nylon composite
CN107353598A (en) Glass epoxy molding plastic and preparation method thereof
CN116606621A (en) Epoxy pouring sealant and preparation method and application thereof
CN114891315A (en) Epoxy glass polymer/chopped glass fiber composite material and preparation method thereof
CN113337107A (en) Method for composite modification of nylon 6 by nano-alumina
CN109680368A (en) A kind of preparation method of modified polyester fiber silk
CN110698648A (en) Preparation method of novel epoxy resin composition
JPH078898B2 (en) Thermosetting epoxy resin composition for molding
TWI851189B (en) Method for degrading ester-containing epoxy curable product and composite thereof

Legal Events

Date Code Title Description
A201 Request for examination
N231 Notification of change of applicant
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20080320

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee