KR100489917B1 - 플라즈마생성용코일을지지하는스탠드오프및코일지지방법 - Google Patents

플라즈마생성용코일을지지하는스탠드오프및코일지지방법 Download PDF

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Publication number
KR100489917B1
KR100489917B1 KR10-1998-0700103A KR19980700103A KR100489917B1 KR 100489917 B1 KR100489917 B1 KR 100489917B1 KR 19980700103 A KR19980700103 A KR 19980700103A KR 100489917 B1 KR100489917 B1 KR 100489917B1
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KR
South Korea
Prior art keywords
base member
cover member
standoff
cover
wall
Prior art date
Application number
KR10-1998-0700103A
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English (en)
Korean (ko)
Other versions
KR19990028803A (ko
Inventor
아난싸 서브레메니
존 포스터
브레들리 오. 스팀슨
서지오 에들스테인
하워드 그룬스
애비 테프맨
쳉 수
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR19990028803A publication Critical patent/KR19990028803A/ko
Application granted granted Critical
Publication of KR100489917B1 publication Critical patent/KR100489917B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32504—Means for preventing sputtering of the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Electron Sources, Ion Sources (AREA)
KR10-1998-0700103A 1996-05-09 1997-05-08 플라즈마생성용코일을지지하는스탠드오프및코일지지방법 KR100489917B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US64718296A 1996-05-09 1996-05-09
US8/647182 1996-05-09
US08/647182 1996-05-09

Publications (2)

Publication Number Publication Date
KR19990028803A KR19990028803A (ko) 1999-04-15
KR100489917B1 true KR100489917B1 (ko) 2005-08-05

Family

ID=24596001

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1998-0700103A KR100489917B1 (ko) 1996-05-09 1997-05-08 플라즈마생성용코일을지지하는스탠드오프및코일지지방법

Country Status (5)

Country Link
EP (1) EP0845151A1 (fr)
JP (1) JP3175835B2 (fr)
KR (1) KR100489917B1 (fr)
TW (1) TW324831B (fr)
WO (1) WO1997042648A1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0908921A1 (fr) * 1997-10-10 1999-04-14 European Community Chambre de traitement pour dépÔt chimique en phase vapeur renforcé par plasma et dispositif utilisant cette chambre de traitment
US6146508A (en) * 1998-04-22 2000-11-14 Applied Materials, Inc. Sputtering method and apparatus with small diameter RF coil
US6139679A (en) * 1998-10-15 2000-10-31 Applied Materials, Inc. Coil and coil feedthrough
KR100649278B1 (ko) * 1998-10-15 2006-11-24 어플라이드 머티어리얼스, 인코포레이티드 플라즈마 챔버용 수냉 코일
US6221221B1 (en) * 1998-11-16 2001-04-24 Applied Materials, Inc. Apparatus for providing RF return current path control in a semiconductor wafer processing system
US6284110B1 (en) * 1999-04-14 2001-09-04 Tokyo Electron Limited Method and apparatus for radio frequency isolation of liquid heat transfer medium supply and discharge lines
US6192829B1 (en) * 1999-05-05 2001-02-27 Applied Materials, Inc. Antenna coil assemblies for substrate processing chambers
US6277253B1 (en) 1999-10-06 2001-08-21 Applied Materials, Inc. External coating of tungsten or tantalum or other refractory metal on IMP coils
US6139696A (en) * 1999-10-25 2000-10-31 Motorola, Inc. Method and apparatus for forming a layer on a substrate
EP1273027B1 (fr) * 2000-04-12 2007-02-07 Aixtron AG Chambre de reaction dotee d'au moins une ouverture pour ligne h.f.
US6652713B2 (en) 2001-08-09 2003-11-25 Applied Materials, Inc. Pedestal with integral shield
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
US7942969B2 (en) 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
CN102437003B (zh) * 2011-12-07 2015-01-21 宁波江丰电子材料股份有限公司 聚焦环组合、imp溅射设备
US10342114B2 (en) * 2017-09-15 2019-07-02 Axcelis Technologies, Inc. RF resonator for ion beam acceleration
KR102378722B1 (ko) * 2020-08-06 2022-03-28 (주)아이작리서치 플라즈마 처리 장치 및 이의 rf 전원 공급 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0618606A1 (fr) * 1993-04-02 1994-10-05 Applied Materials, Inc. Appareil pour dépôt en phase vapeur à plasma réactif d'un matériau électriquement isolant utilisant une anode secondaire protégée

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1263582A (en) * 1969-09-19 1972-02-09 Barr & Stroud Ltd Improvements in or relating to thin film deposition
JPH0562936A (ja) * 1991-09-03 1993-03-12 Mitsubishi Electric Corp プラズマ処理装置およびプラズマクリーニング方法
DE4235064A1 (de) * 1992-10-17 1994-04-21 Leybold Ag Vorrichtung zum Erzeugen eines Plasmas mittels Kathodenzerstäubung
EP0625792B1 (fr) * 1993-05-19 1997-05-28 Applied Materials, Inc. Dispositif et procédé pour augmenter l'uniformité des taux de pulvérisation dans un appareil de pulvérisation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0618606A1 (fr) * 1993-04-02 1994-10-05 Applied Materials, Inc. Appareil pour dépôt en phase vapeur à plasma réactif d'un matériau électriquement isolant utilisant une anode secondaire protégée

Also Published As

Publication number Publication date
JP3175835B2 (ja) 2001-06-11
JPH10510676A (ja) 1998-10-13
WO1997042648A1 (fr) 1997-11-13
TW324831B (en) 1998-01-11
KR19990028803A (ko) 1999-04-15
EP0845151A1 (fr) 1998-06-03

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