KR100476673B1 - The process and equipment for manufacturing package housing and its components for the optical communication electronic device - Google Patents

Abstract

The present invention relates to a method for manufacturing a metal case and a case part for an optical communication electronic device package, and in particular, to minimize the loss of metal raw materials by using a warm and hot processing method, the metal case of various shapes by automation of the hot working process And it relates to a manufacturing method that can be economically mass-produced parts for the case. According to the present invention, there is provided a case for an optical communication electronic device package and a method of manufacturing the same, comprising: cutting a metal material into a rod shape so as to be 5-10% larger than the volume of the case and the case part for the optical component package having a specific shape; Conveying the metal material to a first heating furnace; Continuously heating the metal material at a forming temperature in the first heating furnace; Conveying the metal material into a molding die; Hot forming the metal material in the mold; Detaching the molded metal material from the mold; Conveying the metal material to a second heating furnace; Heat-treating the molded metal material in the second furnace in a vacuum or inert atmosphere to relieve work stress; And removing the oxide film generated during the heat treatment process and finishing machining the formed metal material to meet the final product standard. The above process may be performed by an automated process, It enables mass production in an economical way with minimal loss.

Description

TECHNICAL PROCESS AND EQUIPMENT FOR MANUFACTURING PACKAGE HOUSING AND ITS COMPONENTS FOR THE OPTICAL COMMUNICATION ELECTRONIC DEVICE}

The present invention relates to a method for manufacturing a metal case and a case part for an optical communication electronic device package, and in particular, to minimize the loss of metal raw materials by using a warm and hot processing method, the metal case of various shapes by automation of the hot working process And it relates to a manufacturing method that can be economically mass-produced parts for the case.

Recently, with the rapid development of the information and communication field, the demand for optical communication electronic devices having low cost and high reliability has been greatly increased. The case for the optical communication electronic device package smoothly dissipates heat generated from the optical communication electronic device to the outside and protects the optical communication electronic device therein by blocking the optical communication electronic device from moisture, heat, vibration, electromagnetic waves, and impact. Do this.

The material of the metal case for the package varies according to the type of optical communication electronic device. Currently, optical communication electronic devices are classified into passive devices such as optical connectors, optical couplers, optical filters, optical isolators, and WDM, and active devices such as laser diodes, photo diodes, optical amplifiers, and optical switches.

In addition, depending on the type of optical communication electronic device, the shape of the package metal case and its components are also variously differentiated.

In the case of the active element, since the amount of heat generated varies depending on the type, the material of the metal case for the package also varies. In the case of the passive element, since the amount of heat generated during operation is little, duralumin, stainless steel, coba alloy, plastic, etc. are mainly used, and the metal case is manufactured by a method such as machining or cold pressing.

A material and a form of a conventional metal case for a package and its components will be described by taking the laser diode package metal case and its components shown in FIG. 1 as an example.

As shown in FIG. 1, heat sink materials 110 such as W-Cu are mainly used to smoothly discharge a large amount of heat generated during operation of the laser diode to the outside. There is a need for a lead frame 120 that controls the signal of light generated from the laser diode and interconnects it with an external high speed electrical signal. There is a need for a multilayer alumina substrate 130 having a wiring diagram interconnecting the lead frame 120 and the laser diode. To secure the space where the laser diode and other components are installed, a square COVA alloy case 140 is required, and a COVA round tube having a hermitic seal with a sapphire window for connecting the laser diode with an external optical fiber ( 150 is required, and the rectangular coba alloy ring 160 is required to fix the multilayer alumina substrate 130 to the rectangular coba alloy case 140. The above components are mutually joined by a brazing process, and after the laser diode is mounted, the COVA cover 170 is sealed thereon by laser welding in a vacuum or inert atmosphere. As described above, it can be seen that the metal case for the laser diode package requires COB parts having various shapes.

Among the components shown in FIG. 1, the rectangular cobar cover 170 is manufactured by photo etching using mainly a 0.2 mm thick KOBA plate, and the rectangular COVA ring 160 mainly uses a 1 mm thick COVA plate. It is manufactured by the normal temperature press method using. However, a rectangular coba alloy case 140, which forms a space in which an optical communication electronic device and other components can be installed, is manufactured by machining using a coba plate material having a thickness of about 10-15 mm. Conventional photo-etching or machining methods are economical than other manufacturing methods in the case of small quantities, but have a disadvantage in that processing costs are high in mass production.

Recently, metal case parts have been manufactured by metal injection molding in powder metallurgy. That is, the coba alloy powder (average particle diameter 5-50 µm) mixed with the binder is molded into a specific shape part by injection molding, and then sintered under a non-oxidizing atmosphere to produce a sintered body having a relative density of about 94% or more. In the case of powder injection molding, a rectangular coba alloy case 140 for securing a space in which an optical communication electronic device and other components can be installed, and a coba circular tube 150 for connecting the optical communication electronic device with an external optical fiber are integrated. It can be produced at the same time, and also has the advantage that almost no process for subsequent processing. However, expensive COVA alloy powders, injection equipment and sintering furnaces have to be used, and complicated long time sintering processes have to be performed. In addition, since the density of the product is difficult and defects such as pores exist inside, there is a disadvantage in that the reliability of the product is lower than in the case of machining.

An object of the present invention is to mass-produce various kinds of optical communication electronic device package case and parts thereof at low cost, to reduce the loss of the raw material of the metal case for the package as much as possible, The present invention provides an optical communication package package and a method and apparatus for manufacturing the same.

The present invention has the biggest feature in that mass production is possible by introducing and automating a hot working method which minimizes the loss of raw materials in the optical communication electronic device package case and its manufacturing process. The gist of the present invention constructed on the basis of these features is as follows.

2 is a schematic diagram of a manufacturing process of a metal case for an optical communication electronic device package and its components by a hot working method according to the present invention.

In order to achieve the above object, the present invention includes a step (210) of cutting a metal material into a rod shape so as to be 5-10% larger than the volume of the case and the case component for the optical component package of a specific shape; Conveying the metal material to a first heating furnace (220); Continuously heating the metal material at a forming temperature in the first heating furnace (230); Transferring the metal material into a molding die (240); Hot forming (250) the metal material in the mold; Demounting the molded metal material from the mold (260); Transferring the metal material to a second heating furnace (270); Heat treating the molded metal material in the second furnace in a vacuum or inert atmosphere to relieve work stress; It provides a method for manufacturing an optical communication electronic device case and case component comprising the step (290) of removing the oxide film generated during the heat treatment process and the final machining of the molded metal material to meet the final product specifications. do.

The metal material is preferably cut to be 5-10% larger than the volume of the case for the optical component package and the case component of a particular shape. If less than 5% of the volume of the case and case parts for the optical component package of a particular shape, an extra layer is available to remove the oxide film produced during the heat treatment process and finish machining the metal material formed to the final product specification. Thickness cannot be secured. On the other hand, if the metal material exceeds 10% of the volume of the case and case parts for the optical component package of a particular shape, the extra thickness for finishing machining can be secured enough, but the extra thickness to be removed by the machining process The thickness of is so large that the extra thickness to be removed by the machining process is too large, which increases the machining cost and increases the loss of raw materials.

The method of heating the metal material to a molding temperature may be a heating method using a cantal heater or a high frequency induction heating method. In the case of a heating method using a canal heater, a large number of identical parts can be heated simultaneously to the molding temperature. However, in the case of the high frequency induction heating method, the heating time is relatively short, and components of various shapes can be uniformly heated.

The metal material may be any one of a coba alloy, a stainless steel, or a copper alloy, in which case, a heating temperature in the first heating furnace is 300-1200 ° C., and a second heating furnace for removing the processing stress. It is preferable that the heat processing process temperature in is 300-1200 degreeC. Since the first heating furnace is difficult to cold-form the coba alloy, stainless steel, or copper alloy at room temperature, the first heating furnace is for heating to a constant temperature in order to favor the molding of these metal materials. It is desirable to maintain the temperature range of about 300-1200 ℃. The second heating furnace is for removing the processing stress of each hot-formed material, it is necessary to maintain the heating temperature in the temperature range of about 300-1200 ℃ considering the high-temperature mechanical properties of the material.

However, as described above, since the material of the metal case for the package also varies according to the type of the optical communication electronic device, the metal case for the optical communication electronic device package according to the present invention and the manufacturing method of the parts thereof are within the range of the metal material to be worked. There is no special limitation.

The manufacturing method of the optical communication electronic device case and the case parts is performed in an automated process using the manufacturing apparatus shown in FIG. 2, thereby enabling mass production.

An automated optical communication electronic device metal case and its manufacturing apparatus according to the present invention, the hopper 310 for supplying a metal material cut to a size suitable for molding; A first heating furnace 340 for heating the metal material to a hot forming temperature; A mold 360 for molding the metal material heated to a hot forming temperature; A second heating furnace (390) for performing heat treatment for stress relaxation on the hot formed metal material; A collector 410 for collecting the heat treated metal material; A first conveyor belt 330 for conveying the metal material supplied from the hopper while passing through the first heating furnace; A second conveyor belt 380 for conveying the metal material detached from the mold while passing through the second heating furnace; A first pusher (350) for moving the metal material from the first conveyor belt to the mold; A second pusher (370) for moving the metal material from the mold to the second conveyor belt; It comprises a third pusher 400 for moving the metal material to the collection box from the second conveyor belt, the entire manufacturing process can be performed by an automated process.

The automated process is described as follows. The cut rod-shaped metal material 310 is placed on the first conveyor belt 330 through the first heating furnace 340 by the hopper 320 and transported to the inlet of the first heating furnace 340. The metal material 310 placed on the first conveyor belt 330 is continuously heated while passing through the first heating furnace 340, and the heated metal material 310 is disposed at an outlet of the first heating furnace 340. The metal material 310 is molded by the second pusher 370 by being transported from the first conveyor belt 330 into the molding die 360 by the installed first pusher 350. Detachable from the mold 360 and placed on the second conveyor belt 380 penetrating the second heating furnace 390 to be transported to the inlet of the second heating furnace 390 and placed on the second conveyor belt 380. The metal material 310 is heat-treated to remove stress while passing through the second heating furnace 390, The heat treated metal material 310 is conveyed from the second conveyor belt 380 to the product collection box 410 by a third pusher 400 installed at the outlet of the second heating furnace 390.

3, a preferred embodiment of the present invention will be described in detail.

Example 1

In this embodiment, a coba alloy or stainless steel metal case for packaging an optical communication electronic device and parts thereof are manufactured by an automated warm and hot forming process (extrusion or pressing) shown in FIG.

First, a mold 360 for manufacturing a metal case and a case part of a specific shape to be molded is manufactured. At this time, the mold was made about 3-5% larger than the size of the metal case and the case part for the optical communication electronic device package using the tool steel material which is superior to the cold mold steel SKD 11 class widely used as the press die material.

The bar-shaped or rectangular cobar or stainless steel metal block 310 is cut to a predetermined length and then charged into the metal block supply hopper 320. The metal block 310 charged to the hopper 320 is charged into the heating furnace 340 while being sequentially moved to the conveyor belt 630 installed in the heating furnace 640 and heated.

The heating furnace 340 is a heating furnace or a high frequency induction heating furnace using a Kanthal heater, and inert gas such as hydrogen, argon, nitrogen, or the like is mixed alone or mixed to suppress oxidation during heating of the metal block. Formed. At this time, a nitrogen curtain was installed around the inlet and the outlet of the furnace to prevent the inflow of oxygen as much as possible when entering and exiting the metal block. The heating time of the metal block 310 in the heating furnace 340 is slightly different depending on the size of the metal block, but about 3-10 minutes, the heating temperature was about 400-1200 ℃.

 The heated metal block 310 is moved to a place where the metal block should be located in the press mold 360 by the pusher 350 operated by the pneumatic cylinder, and then hot formed by the press.

The hot-formed metal parts are detached from the mold 360 by the pusher 680 which can be moved in the vertical direction from the bottom of the mold 360 by a pneumatic cylinder.

Then, the hot-formed metal parts are sequentially moved by the conveyor belt 380 into the heating furnace 390, and are heated for about 0.2 to 2.0 hours at 400 to 1200 ° C under hydrogen or an inert atmosphere. The processing stresses generated during the hot forming process are alleviated.

The heat treated metal parts are then collected in the final part collection 410 by a pusher 400 operated by a pneumatic cylinder. The hydrogen and inert gas atmosphere heat treatment furnace 390 includes a preheating unit 392, a heating unit 394, and a cooling unit 396.

As described above, the present embodiment discloses a method and apparatus for automating the entire process from the charging of the metal block to the hopper until the metal case for the final optical communication electronics package and its components are collected in the collecting box.

Finish machining was performed to improve the dimensional accuracy of the atmosphere-treated metal case and parts and to remove the oxide film that may be formed on the surface during the heat treatment process.

Example 2

In this embodiment, an aluminum alloy case for packaging an optical communication electronic device and its components were manufactured by the automated warm and hot forming processing (extrusion or pressing) shown in FIG.

First, a mold required for manufacturing an aluminum alloy case and a case part of a specific shape to be molded was manufactured, and then an aluminum alloy case and a case part for an optical communication electronic device package were manufactured in the same process as in the manufacturing process of Example 1. However, the heating temperature of the aluminum alloy was about 150 ~ 600 ℃, the atmosphere heat treatment for about 0.2 ~ 2.0 hours in the temperature range of 150 ~ 600 ℃ in the air to relieve the work stress remaining in the hot-formed aluminum alloy parts Was carried out.

Example 3

In this embodiment, a copper alloy case for packaging an optical communication electronic device and its components were manufactured by the automated warm and hot forming processing (extrusion or pressing) shown in FIG.

First, a mold for manufacturing a copper alloy case and a case part having a specific shape to be molded was manufactured, and then a copper alloy case and a case part for an optical communication electronic device package were manufactured in the same process as in the manufacturing process of Example 1. However, the heating temperature of the copper alloy was about 300 ~ 1000 ℃, the atmosphere heat treatment for about 0.2 ~ 2.0 hours in the temperature range of 300 ~ 1000 ℃ in the air to relieve the work stress remaining in the hot-formed aluminum alloy parts Was carried out.

Thus far, the technical content of the present invention has been described with reference to specific examples. However, it is apparent that various modifications and changes can be made without departing from the essential concept of the invention. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense.

According to the present invention, a metal case for an optical communication electronic device package, a method of manufacturing the same, and a device for manufacturing the same, the high speed production is possible due to the automation of the warm and hot forming processing process, and the loss of metal raw materials can be minimized. In addition, it is possible to mass-produce various types of metal cases and case components at a lower cost than conventional methods. Therefore, since the case for optical communication electronic device package and case components can be manufactured and supplied at low cost, it can greatly contribute to the expansion of the optical communication market.

Thus far, the present invention has been described with reference to specific examples. However, it is apparent that various modifications and changes can be made without departing from the general concept of the invention. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense.

1 is a perspective view of a case and parts thereof of a conventional laser diode optical communication electronic device.

2 is a process flowchart of a method for manufacturing a case and parts thereof of an optical communication electronic device using a hot working method according to the present invention.

3 is a layout view of an apparatus for manufacturing a case of an optical communication electronic device and parts thereof by automating a hot working process according to the present invention.

Claims (6)

The metal material is cut into rods so as to be 5-10% larger than the volume of the case and case parts for the optical communication electronics package of a specific shape. The cut rod-shaped metal material is placed on a first conveyor belt passing through the first furnace by a hopper and transported to the inlet of the first furnace, Continuously heating the metal material placed on the first conveyor belt to a forming temperature while passing through the first heating furnace, Continuously conveying the heated metal material from the first conveyor belt into a molding die by a first pusher installed at the outlet of the first heating furnace, Hot forming the metal material in the mold, The molded metal material is detached from the molding die by a second pusher, positioned over a second conveyor belt passing through the second furnace, and continuously transported to the inlet of the second furnace, Heat-treating the metal material placed on the second conveyor belt to remove stress while passing through the second heating furnace, Conveying the heat-treated metal material from the second conveyor belt to a product collector by a third pusher installed at the outlet of the second furnace, The manufacturing method of the optical communication electronic device case and the case component, characterized in that the providing tablet is performed in an automated process. The method of claim 1, The method of heating the metal material to a molding temperature is a method of heating using a kantal heater or a method of manufacturing an optical communication electronic device case and a case component, characterized in that the high frequency induction heating method. The method of claim 1, The metal material is any one of a coba alloy, stainless steel or copper alloy, the heating temperature in the first heating furnace is 300-1200 ℃, the heat treatment process temperature in the second heating furnace for removing the work stress Method of manufacturing an optical communication electronic device case and case parts is 300-1200 ℃. The method of claim 1, The metal material is an aluminum alloy, the heating temperature in the first heating furnace is 150-600 ℃, heat treatment process temperature in the second heating furnace for removing the work stress is characterized in that the 150-600 ℃ Method of manufacturing an optical communication electronic device case and case parts. delete An apparatus for manufacturing a metal case for an optical communication electronic device package and its parts by an automated process, A hopper for supplying a metal material cut to a size suitable for molding; A first heating furnace for heating the metal material to a hot forming temperature, A mold for molding the metal material heated to a hot forming temperature; A second heating furnace performing heat treatment for stress relaxation on the hot formed metal material; A collector for collecting the heat treated metal material, A first conveyor belt for conveying the metal material supplied from the hopper while passing through the first heating furnace; A second conveyor belt for conveying the metal material detached from the mold while passing through the second heating furnace; A first pusher for moving the metal material from the first conveyor belt to the mold; A second pusher for moving the metal material from the mold to the second conveyor belt, And a third pusher for moving the metal material from the second conveyor belt to the collecting box.