KR100468160B1 - monolithic bubble-ink jet print head and fabrication method therefor - Google Patents

Abstract

The monolithic bubble-ink jet print head of the present invention has a first supply hole portion having at least one hole connected to the ink cartridge, and a second supply having a first supply hole portion and a plurality of holes in communication with each of the restrictors. The board | substrate which provided the ink supply opening provided with a hole part is included. The manufacturing method of the present invention comprises the steps of providing a substrate having a resistor and a protective layer for heating the ink on the upper surface, removing the protective layer formed on the portion of the upper surface of the substrate to be formed of the second supply hole portion including a plurality of holes Forming a chamber plate on the portion of the substrate from which the protective layer has been removed; forming a second supply hole by etching the upper surface of the substrate using the chamber plate and the protective layer as an etching mask; and a second supply hole. Etching a lower surface of the substrate on which the portion is formed to form a first supply hole portion communicating with the second supply hole portion and including at least one hole. According to the present invention, the ink supplied from the hole of the first supply hole connected with the ink cartridge is divided into holes through the holes of the second supply hole to distribute the ink uniformly to the respective ink chambers. to provide.

Description

Monolithic bubble-ink jet print head and fabrication method therefor}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a print head of an ink jet printer and a manufacturing method thereof, and more particularly to a monolithic bubble-ink jet print head and a manufacturing method thereof.

In general, inkjet printers have a low noise, high resolution, and can realize color at a low cost, and thus consumer demand is rapidly increasing.

In addition, with the development of semiconductor technology, the manufacturing technology of the print head, which is a key component of the inkjet printer, has also developed remarkably over the past decade. As a result, a print head having about 300 ejection nozzles and capable of providing a resolution of 1200 dpi is now mounted and used in an ink cartridge of a disposable form.

Referring to Fig. 1, a conventional print head 10 for an inkjet printer is schematically illustrated.

Typically, ink is supplied from the lower surface of the substrate 1 of the print head 10 to the upper surface of the substrate 1 through the ink supply passage 2.

Ink supplied through the ink supply path 2 reaches the ink chamber 4 along the restrictor 3 formed by the chamber plate 8 and the nozzle plate 9. Ink temporarily stagnant in the ink chamber 4 is heated instantaneously by the heat generated from the heater 6 under the protective layer 5.

At this time, the ink generates an explosive bubble, whereby some of the ink in the ink chamber 4 is discharged out of the print head 10 through the ink nozzle 7 formed on the ink chamber 4 by the generated bubble. .

In this print head 10, the chamber plate 8 and the nozzle plate 9 are important factors influencing the flow of ink, the spraying shape of the ink, and the spraying frequency characteristics. Therefore, many studies on the material, shape, manufacturing method, and the like of the chamber plate 8 and the nozzle plate 9 have been conducted.

At present, the manufacturing method of the print head related to the chamber plate and the nozzle plate is manufactured by separately manufacturing the substrate and the nozzle plate, and then aligning them and attaching them to the polymer thin film having photosensitive properties. Monolithic methods to form are widely used.

In addition, the joining method is a method in which the nozzle plate is manufactured separately, and then aligned on a substrate with a chamber plate made of polymer, and then attached with an adhesive, and the nozzle plate and chamber plate are manufactured together, and then aligned with a substrate, and then attached with an adhesive. Can be divided into

In general, the manufacturing method of the print head according to the monolithic method has the following advantages over the bonding method.

First, the monolithic method eliminates the need for adhesives that must meet demanding conditions, aligns the nozzle plate with the substrate, and then glues the equipment to perform them.

Secondly, the monolithic manner can align the substrate, chamber plate and nozzle plates more precisely than the bonding method. Therefore, the manufacturing process can be reduced, thereby reducing the manufacturing cost and improving the productivity, and is suitable for manufacturing a high resolution print head that requires precise alignment.

An example of the manufacturing process of the conventional print head 10 '(FIG. 2E) according to the monolithic method will be described below.

First, as shown in FIG. 2A, a preliminary ink supply path for forming an ink supply path 2 constituting an ink supply port on the back surface of the silicon substrate 1 on which the heater 6 and the protective layer 5 are formed. (2 ') is formed. At this time, the substrate 1 is not completely penetrated in the preliminary ink supply path 2 ', and a certain thickness is left.

Then, a positive photoresist is formed over the protective layer 5 of the substrate 1, and the positive photoresist is patterned by a photolithography process using a photo mask (not shown), and as a result, As shown in 2b, a positive photoresist mold 3 ', which is a sacrificial layer, is formed on the protective layer 5. The positive photoresist mold 3 'is later removed by etching to provide a flow path structure of the restrictor 3, the ink chamber 4, or the like. The thickness of the positive photoresist mold 3 'is about 30 to 40 mu m, which is the height of the restrictor 3 and the ink chamber 4 to be formed later.

After the positive photoresist mold 3 'is formed on the protective layer 5, a photosensitive epoxy resin layer is formed on the entire surface of the substrate 1 as a negative photoresist by coating.

The photosensitive epoxy resin layer is then exposed by a photomask (not shown) in which a pattern of nozzles is formed and then patterned by a micro-punching or lithography process, as shown in FIG. 2C, A chamber / nozzle plate 9 'formed with a nozzle 7' is formed.

After the chamber / nozzle plate 9 'is formed, the portion of the substrate forming the preliminary ink supply passage 2' at the back side of the substrate 1 is removed isotropically by silicon etching, and as a result, the ink supply passage (2) is formed.

Thereafter, when the photoresist mold 3 'is dissolved and removed by a solvent, the ink chamber 4 and the restrictor 3 are formed, and the manufacture of the print head 10' is completed.

However, the manufacturing method of the print head 10 'according to the conventional monolithic method has the advantage that the nozzle plate and the chamber plate can be formed integrally without being formed separately, but the photoresist mold 3' is used as a solvent. When removed, the residue of the photoresist mold 3 'is not completely removed and remains in the ink chamber 4 and the restrictor 3, or depending on the shape of the photoresist mold 3' formed, the ink chamber 4 And there was a problem that the shape of the restrictor 3 is changed to make the ink supply uneven during printing.

In addition, since the photosensitive epoxy resin layer forming the chamber / nozzle plate 9 'should be coated on the entire photoresist mold 3', the thickness of the photosensitive epoxy resin layer should be thicker. As a result, the chamber / nozzle plate 9 'finally formed by the photosensitive epoxy resin layer is subjected to residual stress by a thickened thickness, and thus with the substrate 1, i.e., the protective layer 5 The adhesion will be poor. In this case, a swelling phenomenon occurs in which ink penetrates between the protective layer 5 and the chamber / nozzle plate 9 'and the chamber / nozzle plate 9' is peeled off. In order to prevent this swelling phenomenon, an additional adhesion promoter should be added to the protective layer 5 and the photosensitive epoxy resin layer.

In addition, since the distance between the ink supply passages 2 is generally large, at least 150-200 µm or more, the portion of the nozzle plate 9 'forming the ink chamber 4 above the ink chamber 4 is struck or cracked. There was a problem that occurred. In particular, in the operation of wiping the print head 10 ', there is a possibility that the nozzle plate 9' may not only cause cracks but also breakage problems.

As another example of the manufacturing method of the monolithic print head to prevent such problems, a manufacturing method of the monolithic print head 10 " (FIG. 3D) using a dry film resist (DFR) has been proposed and used. .

Referring to the manufacturing process of the monolithic print head 10 "using DFR, first, as shown in FIG. 3A, the heater 6 'and the protective layer 5' are formed on the silicon substrate 1 '. do.

At this time, the heater 6 'is formed by depositing polysilicon doped with impurities on the entire surface of the silicon substrate 1' and then patterning it.

In addition, the protective layer 5 'is formed by depositing a silicon nitride film by LPCVD to a thickness of approximately 0.5 mu m as a protective film of the heater 6'.

Then, a preliminary ink supply path 2 "'for forming an ink supply path 2" constituting the ink supply port is formed on the lower surface of the silicon substrate 1'. At this time, the substrate 1 'is not completely penetrated in the preliminary ink supply passage 2 "' and the thickness of about 20 mu m is left.

Next, a negative photoresist is formed above the protective layer 5 'of the substrate 1', and the negative photoresist is a photo-pattern formed with a channel structure pattern such as an ink chamber 4 ', a restrictor 3 ", and the like. It is patterned through a photolithography process that involves UV exposure and development using a mask (not shown).

As a result, as shown in FIG. 3B, the chamber plate 8 is formed on the protective layer 1 '. The chamber plate 8 provides flow path structures of the ink chamber 4 ', the restrictor 3 ", etc. later. The thickness of the chamber plate 8 is the restrictor 3" and the ink chamber 4 to be formed later. Is the height of ').

After the chamber plate 8 is formed on the protective layer 5 ', in order to form the ink supply path 2 ", as shown in FIG. 3C, the preliminary ink supply path 2 is formed on the lower surface of the substrate 1'. The portion of the substrate having a thickness of about 20 占 퐉 that is not completely penetrated in "') is isotropically etched and removed by the wet etching method.

Thereafter, the DFR is laminated on the chamber plate 8 at a high temperature and high pressure, and the DFR is patterned by a photolithography process in which the UV exposure and development are performed using a photomask (not shown) in which a pattern of the nozzle 7 "is formed. do.

As a result, as shown in FIG. 3D, the nozzle plate 9 "having the nozzle 7" is formed, and the manufacture of the print head 10 "is completed.

However, the manufacturing method of the monolithic print head 10 "using this DFR has solved the problem of deformation or swelling of the ink chamber and ink supply caused by using the photoresist mold, but the ink supply (2" Part of the nozzle plate 9 "forming the ink chamber 4 'above the ink chamber 4', since the spacing of the < RTI ID = 0.0 > 1 < / RTI > The problem of being hit and cracked or broken still remains unresolved.

In addition, due to the wide spacing of the ink supply passages 2 ", the nozzle plate 9" during the baking process for strengthening the durability of the chamber plate 8 and the nozzle plate 9 "and closely adhering to the substrate 1 ) May cause thermal deformation.

In addition, since the ink supply path 2 "is formed in the center of the substrate 1 'by an isotropic wet etching method having high etching selectivity and inferior processing accuracy, the chip area is increased and the interval between nozzle rows is widened. have.

The present invention has been made to solve the above conventional problems, the main object of the present invention is to subdivide the ink supplied from one hole of the first supply hole portion connected to the ink cartridge through a plurality of holes of the second supply hole portion It is to provide a monolithic bubble inkjet print head and a method of manufacturing the same by uniformly distributing the ink to each ink chamber.

Another object of the present invention is to increase the contact area between the chamber plate and the nozzle plate through the partition wall of the chamber plate to increase resistance to sagging and cracking of the nozzle plate during the wiping operation or to deformation during pressing / heating during the manufacturing process. A monolithic bubble inkjet print head and a method of manufacturing the same are provided.

Another object of the present invention is to supply ink to the ink chamber through the second supply hole having a plurality of holes, thereby dispersing and reducing the edge area of the ink supply passage where the residual stress is concentrated, thereby reducing the chamber plate, the substrate, and the chamber plate. The present invention provides a monolithic bubble inkjet print head and a method of manufacturing the same, which prevent peeling of the chamber plate and the nozzle plate due to ink penetration between the nozzle plate and the nozzle plate.

It is still another object of the present invention to form the first and second supply holes by anisotropic dry etching, thereby increasing the reliability of the process and increasing the number of nozzle rows in the ink supply holes according to the number of holes in the second supply holes. The present invention provides a monolithic bubble inkjet print head and a method of manufacturing the same.

1 is a cross-sectional view of a typical print head.

2A, 2B, 2C, 2D, and 2E are process diagrams illustrating a manufacturing method of a conventional monolithic bubble ink jet print head.

3A, 3B, 3C, and 3D are process diagrams illustrating another conventional monolithic bubble inkjet printhead manufacturing method.

4A, 4B, 4C, 4D, 4E, and 4F are process diagrams illustrating a method of manufacturing a monolithic bubble inkjet print head according to one embodiment of the present invention.

5 is a plan view of the monolithic bubble inkjet print head of 4e.

* Description of the symbols for the main parts of the drawings *

1, 101: substrate 2, 2 ", 102: ink supply path

3, 3 ", 103: Restrictor 3 ': photoresist mold

4, 4 ', 104: ink chamber 5, 5', 105: protective layer

6, 6 ', 106: Heater 7, 7', 7 ", 107: Furnace

8, 108: chamber plate 9, 9 ", 109: nozzle plate

9 ': Chamber / nozzle plate 10, 10', 10 ", 100: Print head

102a: first supply hole portion 102b: second supply hole portion

According to one embodiment for achieving the object of the present invention as described above, the present invention comprises a substrate having a plurality of resistors for heating the ink and the ink supply port for supplying ink from the ink cartridge; A chamber plate formed on the substrate to form a flow path structure such as a plurality of restrictors connected with the ink supply port, a plurality of ink chambers connected with the restrictor, and the like; And a nozzle plate formed on the chamber plate to form a plurality of nozzles, the monolithic bubble ink jet print head comprising: a first supply hole portion having at least one hole connected to an ink cartridge, and a first supply hole portion; And a second supply hole portion having a plurality of holes in communication with each of the restrictors.

In a preferred embodiment, the chamber plate is provided on the portion of the substrate partitioning the holes of the second supply hole to increase the contact area with the substrate and the nozzle plate while preventing the holes of the second supply hole from communicating with each other. And a partition wall formed.

The hole of the second supply hole is preferably formed to have an area of at least twice the area of the ink chamber and a depth of 20 µm or more from the upper surface of the substrate on which the ink chamber is formed.

In addition, the first supply hole portion and the second supply hole portion are preferably formed by an anisotropic dry etching method.

According to another embodiment of the present invention, the present invention comprises the steps of providing a substrate on which a resistor and a protective layer for heating the ink on the upper surface, a portion of the upper surface of the substrate on which the second supply hole portion including a plurality of holes is to be formed Removing the protective layer formed on the substrate; forming a second supply hole by etching the upper surface of the substrate using the protective layer as an etch mask; and etching a lower surface of the substrate on which the second supply hole is formed; And forming a first supply hole portion in communication with and including at least one hole.

In a preferred embodiment, the method of manufacturing a monolithic bubble inkjet printhead of the present invention further comprises forming a chamber plate over the substrate after removing the protective layer. Forming the chamber plate includes forming a first photoresist on the substrate from which the protective layer has been removed, patterning the first photoresist by a photolithography process using a photomask on which a chamber plate pattern is formed, and a patterned substrate. It consists of a hard baking step. Forming the first photoresist consists of forming the negative photoresist in a thickness range of 30-40 μm. At this time, the negative photoresist is preferably formed of one of the photosensitive epoxy resin and the polyimide resin. Further, the chamber plate pattern preferably includes a partition wall formed on a portion of the substrate that partitions the hole of the second supply hole portion.

The forming of the second supply hole may be performed by etching the upper surface of the substrate to a depth of about 20 μm or more using an anisotropic dry etching method.

The forming of the first supply hole includes forming a first supply hole mask pattern on a lower surface of the substrate, and etching the lower surface of the substrate using an anisotropic dry etching method.

Forming the first supply hole mask pattern includes forming a second photoresist on a bottom surface of the substrate, exposing the second photoresist using a photo mask on which the first supply hole pattern is formed, and the exposed second photoresist. It consists of developing a photoresist with a developing solution.

In some embodiments, the forming of the first supply hole pattern may include depositing a metal layer using a mask on which the first supply hole pattern is formed.

Etching the lower surface of the substrate includes cooling the upper surface of the substrate by He gas cooling to reduce the etch rate when the first supply hole portion communicates with the second supply hole portion.

In addition, the manufacturing method of the monolithic bubble inkjet print head of the present invention further includes forming a nozzle plate on the chamber plate after forming the first supply hole.

Forming the nozzle plate consists of laminating the DFR at high temperature and high pressure on the chamber plate, and patterning the DFR in a photolithography process using a photomask in which the pattern of the nozzle is formed. At this time, DFR is comprised by the negative photosensitive DFR of polyacrylate resin.

Hereinafter, the monolithic bubble inkjet print head according to the present invention will be described in detail with reference to the accompanying drawings.

4F and 5, a monolithic bubble inkjet print head 100 is illustrated in accordance with one preferred embodiment of the present invention.

The monolithic bubble inkjet print head 100 of this embodiment has an ink supply path 102 constituting an ink supply port for supplying ink from a plurality of heaters 106 for heating ink and an ink cartridge (not shown). A formed substrate 101; A chamber plate 108 formed on the substrate 101 to form a flow path structure such as a plurality of restrictors 103 connected to the ink supply path 102, a plurality of ink chambers 104 connected to the restrictor 103, and the like; And a nozzle plate 109 formed over the chamber plate 109 to form a plurality of nozzles 107.

The heater 106 is made of a resistance heating element having an annular or square shape.

The protective layer 105 is formed on the heater 106. The protective layer 105 is a passivation layer (not shown) composed of a silicon nitride film, a silicon carbon film, or the like, and a cavitation deposited on a passivation layer by a metal film such as Ta, TaN, TiN, or the like. It is composed of an anti-caviation layer (not shown).

The ink supply path 102 is formed on the lower surface side of the substrate 101 so as to be connected with the ink cartridge, and includes a first supply hole portion 102a formed of one long rectangular hole disposed between the vertical rows of the nozzles 107, and The second supply hole portion 102b includes a plurality of rectangular holes formed on the upper surface side of the substrate 101 so as to communicate with the first supply hole portion 102a and each of the restrictors 103.

The rectangular hole of the first supply hole portion 102a formed on the lower surface side of the substrate 101 has a width of at least 150-200 μm or more, similar to the ink supply paths 2 and 2 ″ of the conventional print heads 10 ′ and 10 ″. It is formed by etching the lower surface of the substrate 101 by an anisotropic dry etching method to have a, so that the side wall of the rectangular hole has a rectangular shape.

As shown in detail in FIG. 5, the holes of the second supply hole portion 102b formed on the upper surface side of the substrate 101 to communicate with the longitudinal holes of the first supply hole portion 102a are two times the area of the ink chamber 104. It has an area of twice or more, and is formed to have a depth of 20 µm or more from the upper surface of the substrate 101 on which the ink chamber 104 is formed.

The holes of the second supply hole 102b are also formed by etching the upper surface of the substrate 101 by an anisotropic dry etching method to have sidewalls having a right angle.

The holes of the second supply hole part 102b are connected to the respective restrictors 103 so as to subdivide the ink supplied from the rectangular holes of the first supply hole part 102a to distribute the ink evenly to the respective ink chambers 104. It acts as an ink supply manifold.

Thus, the ink can be supplied to the ink chamber 104 more uniformly than the ink supply paths 2, 2 "of the conventional print heads 10 ', 10".

The chamber plate 108 is formed of a negative photosensitive photoresist, for example, a photosensitive epoxy resin or a polyimide resin.

The chamber plate 108 prevents the holes of the second supply hole part 102b from communicating with each other and increases the contact area with the substrate 101 and the nozzle plate 109, so as to increase the contact area of the second supply hole part 102b. Barrier ribs 108a formed on the portion 101a of the substrate 102 that partitions them.

The partition wall 108a supplies ink to the ink chamber 104 through the second supply hole portion 102b formed of a plurality of holes, thereby dispersing and reducing the edge area of the ink supply passage 102 where the residual stress is concentrated. Prevent delamination of the chamber plate 108 and the nozzle plate 109 due to ink penetration between the plate 108 and the substrate 101 and between the chamber plate 108 and the nozzle plate 109, The area of the plate 108 in contact with the substrate 101 and the nozzle plate 109 is increased to increase the resistance to sagging and cracking of the nozzle plate 109 during the wiping operation or to deformation during pressing / heating during the manufacturing process. Let's do it.

The nozzle plate 109 is preferably formed of DFR, for example, negative photosensitive DFR of polyacrylate resin.

A method of manufacturing the monolithic bubble inkjet print head 100 according to the present invention configured as described above will be described in detail with reference to FIGS. 4A to 4F.

First, as shown in FIG. 4A, a silicon substrate 101 on which a device isolation film (not shown), an interlayer insulating film (not shown), a heater 106, a protective layer 105, and the like are sequentially formed is prepared. .

In this case, the heater 106 may selectively etch a metal having a low resistance in a metal thin film in which a metal having a high specific resistance and a low metal are stacked, or may be formed of polysilicon doped with impurities on the entire surface of the upper surface of the silicon substrate 101. It can be formed by depositing and then patterning it.

In addition to the heater 106, a switching element such as a transistor, a wiring connected to the switching element, a pad connected to the lead end of the wiring and an external circuit part, etc. are formed on the substrate 101 in addition to the heater 106.

The protective layer 105 formed on the heater 106 is deposited with a passivation layer made of silicon nitride, silicon carbide, or the like, and a metal film such as Ta, TaN, TiN, or the like on the passivation layer. Anti-caviation layer (not shown).

After the substrate 101 is prepared, as shown in FIG. 4B, the passivation layer 105 formed on the portion 101a ′ of the substrate 101 on which the second supply hole portion 102b composed of a plurality of rectangular holes is to be formed, and In order to remove the cavitation prevention layer, a photoresist (not shown) is applied on the cavitation prevention layer, an etch mask (not shown) is formed by exposure and development using a photomask for the second supply hole, and then an etch mask is used. Thereby patterning the cavitation prevention layer and the passivation layer 105 in sequence. As a result, the portion 101a 'where the second supply hole portion 102b is to be formed is exposed.

Subsequently, a negative photoresist (not shown) for forming the chamber plate 108 is formed above the first protective layer 105 of the substrate 101.

The negative photoresist is formed of photosensitive epoxy resin or polyimide resin. At this time, the thickness of the negative photoresist is determined in accordance with the amount of droplets in one ejection that affects the resolution. The droplet amount is influenced by the flow path structure of various dimensions for each product such as the height of the ink chamber 104, the size of the restrictor 103, the diameter of the nozzle 107, the size of the heater 106, and the like. Therefore, in order to satisfy the flow path structure of various dimensions, it is preferable to form the thickness of the negative photoresist in the range of 30-40 micrometers.

Thereafter, the negative photoresist is UV-protected using a photomask in which a chamber plate pattern including a flow path structure such as the restrictor 103, the ink chamber 104, and the pattern of the partition 108a is formed, as shown in FIG. 4C. Patterned by a photolithography process that is exposed and developed, as a result, the chamber plate 108 is formed.

After the chamber plate 108 is formed, a hard baking process for more tightly bonding the chamber plate 108 to the substrate 101, i.e., the cavitation prevention layer, may be performed, for example, from several tens to hundreds of degrees to several minutes to several hours. 101).

After the hard baking process, the portion 101a of the substrate 101 is removed to a certain depth by etching by anisotropic dry etching using the chamber plate 108 and the anti-cavitation layer as an etching mask, thereby forming a plurality of rectangular grooves. The preliminary second supply hole portion 102b ′ is formed. At this time, the depth at which the portion 101a 'of the substrate 101 is removed, that is, the depth of each groove of the preliminary second supply hole portion 102b is preferably about 20 µm or more.

Subsequently, a photoresist (not shown) is formed on the bottom surface of the substrate 101 on which the preliminary second supply hole portion 102b 'is formed, and the photoresist is exposed and developed using a photo mask on which the first supply hole portion pattern is formed. An etching mask pattern (not shown) for the first supply hole is formed by patterning the photoresist in a photolithography process.

In this case, optionally, the etching mask pattern for the first supply hole part may be formed by depositing a metal layer using a mask on which the first supply hole part pattern is formed on the bottom surface of the substrate 101.

After the etching mask pattern for the first supply hole is formed, as shown in FIG. 4E, the lower surface of the substrate 101 is etched by the anisotropic dry etching method using the etching mask pattern for the first supply hole as an etching mask. As a result, a first supply hole portion 102a consisting of an elongated rectangular hole communicating with the grooves of the preliminary second supply hole portion 102b 'is formed, and the grooves of the preliminary second supply hole portion 102b' are formed in the first supply hole portion 102a. In communication with the elongate rectangular hole of is formed as a complete second supply hole (102b).

At this time, when the lower surface of the substrate 101 is overetched, the portion 101a of the substrate constituting the groove of the preliminary second supply hole portion 102b 'may be removed so that the second supply hole portion 102b may not be formed. Therefore, in order to easily control the etching stop position or etching time by reducing the etching rate when the first supply hole 102a communicates with the preliminary second supply hole 102b 'by the etching of the lower surface of the substrate 101. The upper surface of the substrate 101 is cooled by the He gas cooling method.

In more detail, when the rectangular hole of the first supply hole portion 102a communicates with the groove of the preliminary second supply hole portion 102b 'by etching the lower surface of the substrate 101, the He gas is formed on the substrate 101. Since the partial pressure of the etching gas flows from the upper surface, the etching rate of the substrate 101 is reduced. Therefore, as the number of the grooves of the preliminary second supply hole portion 102b 'communicating with the rectangular hole of the first supply hole portion 102a increases, the etch rate of the substrate 101 decreases in proportion, and thus the etch stop The position or etching time can be easily controlled. At this time, the process margin between the etching stop position and the depth of the second supply hole 102b can be set to 10 µm or more. This is because the depth of the second supply hole 102b does not significantly affect the frequency performance of the print head.

As such, after the first supply hole 102a is formed, the DFR is laminated on the chamber plate 8 with high heat and high pressure, and the DFR is exposed using a photomask (not shown) in which the pattern of the nozzle 107 is formed. And patterned by developing photolithography process. At this time, the negative photosensitive DFR of polyacrylate type resin is used for DFR.

As a result, as shown in FIG. 4F, the nozzle plate 109 on which the nozzle 107 is formed is formed, and the manufacture of the print head 100 is finished.

As described above, the monolithic bubble inkjet printhead of the present invention and a method of manufacturing the same may further divide the ink supplied from one rectangular hole of the first supply hole portion connected to the ink cartridge through a plurality of rectangular holes of the second supply hole portion. By uniformly distributing to each ink chamber, the performance of the print head can be made uniform.

In addition, the print head of the present invention and the method of manufacturing the same increase the contact area between the chamber plate and the nozzle plate through the partition wall of the chamber plate, so that the deflection and cracking of the nozzle plate during the wiping operation, or deformation during pressurization / heating during the manufacturing process. It provides the effect of increasing resistance to.

In addition, the print head of the present invention and the method of manufacturing the same by supplying the ink to each ink chamber through the second supply hole having a plurality of holes by dispersing and reducing the edge area of the ink supply path in which residual stress is concentrated It provides an effect of preventing peeling of the chamber plate and the nozzle freund due to ink penetration between the chamber plate and the substrate and the chamber plate and the nozzle plate.

In addition, the printhead of the present invention and the method of manufacturing the same can not only increase the reliability of the process by forming the first and second supply holes by the anisotropic dry etching method, but also in the ink supply holes according to the number of holes in the second supply holes. The number of nozzle rows can be increased.

Claims (19)

A substrate having a plurality of resistors for heating the ink and an ink supply port for supplying ink from the ink cartridge; A chamber plate formed on the substrate to form a flow path structure such as a plurality of restrictors connected to the ink supply port and a plurality of ink chambers connected to the restrictor; And a nozzle plate formed on the chamber plate to form a plurality of nozzles, the monolithic bubble ink jet print head comprising: The ink supply port has a first supply hole portion having at least one hole connected to the ink cartridge, and an area in communication with the first supply hole portion and each of the restrictors, each of which is at least twice the area of each of the ink chambers. And a second supply hole portion having a plurality of holes having a plurality of holes. delete The monolithic bubble inkjet printhead of claim 1, wherein the hole of the second supply hole has a depth of 20 µm or more from an upper surface of the substrate on which the ink chamber is formed. The substrate of claim 1, wherein the chamber plate partitions the hole of the second supply hole to increase the contact area with the substrate while preventing the holes from communicating with the second supply hole. And a barrier rib formed on a portion of the monolithic bubble ink jet print head. The monolithic bubble inkjet printhead of claim 1, wherein the first supply hole portion and the second supply hole portion are formed by an anisotropic dry etching method. Providing a substrate on which a resistor and a protective layer are formed to heat ink; Removing the protective layer formed on a portion of the upper surface of the substrate on which a second supply hole portion including a plurality of holes each having an area of at least two times the area of the ink chamber is formed; Forming a second supply hole including the plurality of holes by etching the upper surface of the substrate using the protective layer as an etching mask; And And etching a lower surface of the substrate on which the second supply hole part is formed to form a first supply hole part communicating with the second supply hole part and including at least one hole. Method of manufacturing the head. 7. The method of claim 6, further comprising forming a chamber plate on the substrate after the step of removing the protective layer. The method of claim 7, wherein the step of forming the chamber plate, Forming a first photoresist on the substrate from which the protective layer is removed; Patterning the first photoresist in a photolithography process using a photomask having a chamber plate pattern formed thereon; And And hard-baking said patterned substrate. 10. The method of claim 8, wherein the step of forming the first photoresist comprises forming a negative photoresist in a thickness range of 30-40 μm. 10. The method of claim 9, wherein the negative photoresist is formed of one of a photosensitive epoxy resin and a polyimide resin. 10. The method of claim 8, wherein the chamber plate pattern includes a pattern of partition walls formed on the portion of the substrate that partitions the hole of the second supply hole portion. . The monolithic bubble ink jet of claim 6, wherein the forming of the second supply hole comprises etching the upper surface of the substrate to a depth of about 20 μm or more using an anisotropic dry etching method. Method of manufacturing a print head. The method of claim 6, wherein the forming of the first supply hole comprises: Forming a first supply hole mask pattern on the lower surface of the substrate; And And etching the bottom surface of the substrate using an anisotropic dry etching method. The method of claim 13, wherein the forming of the first supply hole mask pattern comprises: Forming a second photoresist on the bottom surface of the substrate; Exposing the second photoresist with a photomask having a first supply hole pattern; And And developing the exposed second photoresist with a developing solution. The method of claim 13, wherein the forming of the first supply hole pattern comprises: depositing a metal layer using a mask on which the first supply hole pattern is formed. . The method of claim 13, wherein the etching of the lower surface of the substrate comprises cooling the upper surface of the substrate by He gas cooling to reduce an etch rate when the first supply hole is in communication with the second supply hole. Method of producing a monolithic bubble inkjet print head comprising a. 8. The method of claim 7, further comprising forming a nozzle plate on the chamber plate after the step of forming the first supply hole. The method of claim 17, wherein forming the nozzle plate comprises: Laminating dry film resist on the chamber plate at high temperature and high pressure; And And patterning the dry film resist in a photolithography process using a photomask having a pattern of nozzles formed thereon. 19. The method of claim 18, wherein the dry film resist comprises a negative photosensitive dry film resist of a polyacrylate-based resin.