KR100467681B1 - Method for manufacturing partition of plasma display device - Google Patents

Abstract

The present invention provides an electrode forming step of forming an electrode having a predetermined pattern on a substrate in which a first electrode and a second electrode are spaced apart from each other by a heating portion therebetween; A dielectric layer forming step of forming a dielectric layer on the substrate on which the first electrode and the second electrode are formed; A heating step of heating the heating unit having heating means capable of transferring heat; Forming a barrier layer stack by applying and drying a paste of barrier material on a substrate on which the dielectric layer is formed; Applying and drying a photoresist material on the partition stack; Exposing the photoresist material with an exposure mask formed in a pattern having a predetermined shape corresponding to the partition wall; Sandblasting the photoresist; Removing the photoresist; And firing the barrier material paste to form a barrier rib. Here, the method may further include removing the partition wall of the heating unit, and the heating unit may be a laser.

Description

Method for manufacturing partition of plasma display device

The present invention relates to a method of manufacturing a partition wall of a plasma display device, and more particularly, to a method of manufacturing a partition wall of a plasma display device that is dividedly driven.

Plasma display elements are used to display images using gas discharge phenomena. They are excellent in various display capacities such as display capacitance, brightness, contrast, afterimage, viewing angle, and the like. In the plasma display device, a discharge is generated in a gas between the electrodes by a direct current or an alternating voltage applied to the electrode, and the phosphor emits light by exciting the phosphor by radiation of ultraviolet rays.

FIG. 1A is an exploded perspective view of a structure of an AC plasma display device which is divided and driven in the related art, and FIG. 1B is a cross-sectional view of the back substrate according to I-I of FIG. 1A.

Referring to FIG. 1A, a common electrode 13X and a scan electrode 13Y are formed in a strip shape on the rear side of a transparent front substrate 11 such as glass, and the rear substrate 12 is formed. An address electrode 13A is formed separately from the center on the front side of the. When the front substrate 11 and the rear substrate 12 are assembled to each other, they cross at right angles to each other. The dielectric layer 14 and the protective layer 15 are sequentially stacked on the inner surface of the front substrate 11. On the other hand, the rear substrate 12 is formed with a partition wall 17 on the upper surface of the dielectric layer 14 ', the cell 19 is formed by the partition wall 17. The cell 19 is filled with an inert gas as a discharge gas. In addition, the phosphor 18 is applied to a predetermined portion inside the partition wall 17 forming each cell 19. Each cell 19 is coated with phosphors 18 corresponding to the pixels of red (R), green (G), and blue (B). Although not shown, bus electrodes may be formed on the common electrode and the scan electrodes 13X and 13Y.

Referring to the operation of the plasma display device having the above configuration, first, when a trigger voltage is applied to cause a discharge, positive ions are accumulated in the dielectric layer 14, and when the threshold voltage is exceeded, A stable discharge state is maintained between the adjacent common electrode 13X and the scan electrode 13Y. In the stable discharge state, light in the ultraviolet region excites the phosphor 18 to emit light, thereby forming an image for display by each pixel formed by each cell 19.

As described above, the partition wall of the plasma display element provides a place where a fluorescent film is applied and a discharge space. Such a partition is sand blasting method, for example, a paste of partition material is applied on a back substrate such as glass to a certain thickness and dried, and a protective film in the shape of a desired partition is formed thereon, It can be formed by the method of removing the unnecessary part by spraying the sand under high pressure.

2A and 2B illustrate a process of forming a partition wall by using a sand blasting method on the II-II cross-sectional substrate of FIG. 1, and FIG. 2C shows that static electricity is generated in the sand blasting process to accumulate charge at the end of the electrode. Is shown on the III-III cross-sectional substrate of FIG.

Referring to FIG. 2A, an electrode 22 having a predetermined pattern and a dielectric layer 23 covering the electrode 22 are formed on the substrate 21. The dielectric layer 23 is formed in a baked state by applying and drying a dielectric material. In order to form the partition wall, the stack 24 of the partition material paste is formed on the dielectric layer 23 and the mask 25 is covered. The mask 25 is provided with a shield 26 and a through hole 27. The shield 26 shields the abrasive particles 28 sprayed at a high speed against the stack 24 of the partition paste. The abrasive particles 28 sprayed through the through hole 27 wear the partition paste laminate 24 in a predetermined form.

Referring to FIG. 2B, it can be seen that a partition wall 24a having a predetermined shape is formed on the dielectric layer 23. After the partition wall 24a is formed, it is subjected to the firing process again.

Referring to FIG. 2C, static electricity is generated when the abrasive particles 28 wear the stacked portion 17 of the partition material paste during the sandblasting process. The formation of the electric field by the static electricity interferes with the abrasion action of the abrasive particles 28, and causes the barrier formation failure. In particular, large plasma display devices are driven by dividing the address electrodes into upper and lower parts in order to improve luminance by shortening the addressing period and increasing the sustain discharge period. As shown in the figure, they move along the surface of the dielectric in the direction of the arrow and accumulate at the ends 23 and 24 of the electrodes 13A and 13A 'which are conductors. Thus, a potential difference occurs between the electrodes 13A and 13A ', and the interaction damages the dielectric between or around the ends 23 and 24. That is, the dielectric constant of the dielectric is reduced, and further, cracks in the dielectric are generated. Furthermore, the formation of barrier ribs at the central portion is particularly hindered by the charge accumulated at the ends 23 and 24 of the electrodes 13A and 13A ', so that the failure of barrier rib formation is large.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a partition of a plasma display device that prevents a poor formation of partition walls and damage of a dielectric layer due to the generation of static electricity.

1 is an exploded perspective view of a conventional plasma display device.

2A and 2B illustrate cross-sectional views of a method of fabricating a partition of a plasma display device according to the related art, and FIG. 2C illustrates a state in which charge is accumulated at an end of an electrode due to static electricity generated in a sandblasting process.

3 to 11 are cross-sectional views illustrating a method of manufacturing a partition wall of the plasma display device according to the present invention.

12 is a perspective view illustrating a substrate including a partition wall manufactured by the method according to the present invention.

<Brief Description of Major Codes in Drawings>

112. Substrate

123a. First electrode 123b. Second electrode

130. Dielectric layer

140. Bulkhead laminate part 140a. septum

150. Photoresist layer 160. Abrasive particles

170. Exposure Mask

In order to achieve the above object, a method of manufacturing a partition wall of a plasma display device according to an aspect of the present invention includes forming electrodes on a substrate having a predetermined pattern in which the first electrode and the second electrode are spaced a predetermined distance apart from each other with a heating portion interposed therebetween. Electrode forming step; A dielectric layer forming step of forming a dielectric layer on the substrate on which the first electrode and the second electrode are formed; A heating step of heating the heating unit having heating means capable of transferring heat; Forming a barrier layer stack by applying and drying a paste of barrier material on a substrate on which the dielectric layer is formed; Applying and drying a photoresist material on the partition stack; Exposing the photoresist material with an exposure mask formed in a pattern having a predetermined shape corresponding to the partition wall; Sandblasting the photoresist; Removing the photoresist; And baking the barrier material paste to form a barrier.

Furthermore, the method of manufacturing a partition wall of the plasma display device may further include removing the partition wall of the heating unit. The partition may not be formed in the heating unit. In addition, the heating means may heat the heating unit during sandblasting. Here, the heating means may be using a laser.

Hereinafter, a method of manufacturing a partition wall of a plasma display device according to the present invention will be described in detail with reference to the accompanying drawings.

3 to 12 illustrate a barrier rib manufacturing process of a plasma display device according to an exemplary embodiment of the present invention.

3 is a perspective view showing an electrode formed on a substrate as an embodiment according to the present invention.

As illustrated, an address electrode 123 is formed on the substrate 112, and the address electrode 123 is separated from the center at an upper portion and a lower portion by a predetermined distance from the first electrode 123a and the second electrode ( 123b). The first electrode 123a and the second electrode 123b are disposed to face each other, and the heating part 112a is provided by a spaced distance therebetween. Here, the heating part 112a means a part for heating in order to disperse or remove charges accumulated in the sandblasting process described later.

The electrode 123a and 123b patterns may be formed using a printing method, a photolithography method, a lift off method, an etching method, and the like. As an example, the photolithography method will be described below. Same as After dispersing a predetermined functional material in the photoresist, a binder, a dispersant, a surfactant, a photoresist, and the like are added to make a photosensitive paste. The photoresist is then coated and dried on a substrate, and then the electrodes 123a and 123b are removed. A desired electrode pattern film is formed on the substrate 112 by exposure and development through an exposure photo mask formed in a pattern.

FIG. 4A shows a dielectric layer formed on the cross-sectional substrate of FIG. 3 I-I, and FIG. 4B shows a dielectric layer formed on the cross-sectional substrate of II-II of FIG.

Referring to the drawings, the entire surface of the dielectric material is printed once or twice on the substrate 112 on which the electrodes 123a and 123b are formed by screen printing, dried for a predetermined time, and then subjected to the firing process again. A dielectric layer is formed. Here, the said baking process can also be carried out together in the partition baking process mentioned later. In addition, the present invention is not limited thereto, and the partition wall may be immediately formed by omitting the process of forming the dielectric layer on the substrate 112 and the electrodes 123a and 123b.

5 to 8A and 9 illustrate a partition formed on the cross-sectional substrate of I-I of FIG. 3, and FIG. 8B illustrates a partition formed on the cross-sectional substrate of IV-IV of FIG.

As shown in FIG. 5, the stacked portion 140 of the barrier material paste is formed on the substrate 112 on which the electrodes are formed. The paste of the partition material may be conventionally used in the art, and is laminated on the front surface to a predetermined thickness through a coating and drying process.

As shown in Fig. 6, a photoresist 150 is applied on top of the stack 140 of partition material paste. Next, exposure is performed in a state where the exposure mask 170 is covered with the photoresist 150. Light transmitting part 170a and light blocking part 170b are formed in the mask 170. Here, the transmissive portion 170a of the mask 170 is disposed at a position corresponding to the position where the partition wall is to be formed in a subsequent process. When the exposure is performed, the portion of the photoresist 150 that receives the light is cured while the other portion is not cured. Among the materials which can be used as the photoresist, it is preferable to use a dry film resist (DFR).

7 shows a state where the exposure of the photoresist is completed. Referring to the drawing, the photoresist 150 on the barrier material paste 140 includes a cured photoresist pattern 150a and an uncured photoresist pattern 150b.

As shown in FIG. 8A, when the sand blasting process is performed, the abrasive particles 160 are shielded by not passing through the cured photoresist pattern 150a, but wear while colliding with the uncured photoresist pattern 150b. . However, in the sand blasting process, the static electricity is generated due to the friction of the abrasive particles 160 or the partition paste, and the charges are accumulated at the ends 125 and 126 of the separated electrodes 123a and 123b (see FIG. 4B).

As shown in FIG. 8B, in order to prevent this, the outer surface of the substrate 112 is heated in the arrow direction A during the sandblasting process with a heating means. And the heating means is to heat the substrate 112 to a predetermined temperature in order to disperse or remove the charge accumulated during sandblasting, the heating temperature, heating cycle or heating time is different depending on the physical properties of the material such as the substrate Can be.

Such heating means may be used without limitation as long as it can be commonly used in the art, it may be provided with a laser generating unit 180 as an example. The laser generating unit 180 is not limited as long as it can be used for heating, and can be heated while moving in the direction of the arrow using a guide rail and a ball screw (not shown). Here, the arrow direction is a portion in which charges are accumulated between the ends 125 and 126 of the electrodes 123a and 123b (see FIGS. 3 and 4b), and IV-IV of FIG. 3 is shown on the opposite side of the substrate on which the electrodes 123a and 123b are formed. The direction to move along. That is, the direction moves along the heating part 112a (refer FIG. 3) of the board | substrate 112a. As the heating means, heat may be transferred using a heating wire such as a heater coil (not shown) to disperse the charge accumulated between the first electrode 123a and the second electrode 123b.

9A illustrates a partition wall formed by a sandblasting process. Referring to the drawings, the partition wall 140a is formed by a sandblasting process, and the photocured photoresist pattern 150a remains on the partition wall 140a. Here, FIG. 9B shows a partition wall formed by a sandblasting process on the III-III cross-sectional substrate of FIG. 3A.

FIG. 10 shows a state in which the photoresist is removed in FIG. 9B. There may be various methods of removing the photoresist 150a, but as an example, the method of removing the photoresist including the DFR may be based on a peeling process. That is, when the basic stripping solution is passed through the acidic DFR using the stripping equipment, it can be removed by the acid group neutralization reaction, it can be removed. And after the firing process, it becomes a stripe-type partition wall.

In the stripe-type partition wall 140a formed through the firing process, the portion “B” may not be removed, but in this case, the vacuum conductivity of the discharge space is increased due to the influence of the partition wall 140a in the manufacturing process. It is relatively low, the discharge of discharge space is not smoothed, and impurities remaining in the "B" region reduce the purity of the plasma forming gas and degrade the image quality of the plasma display panel, thereby removing the "B" portion. As shown in the drawing, a method of removing the "B" portion may be used without limitation as long as it can be used in the art, and as an example, the blade method, that is, the fine "B" portion and the third electrode 121 may be used. It can be removed and removed.

In addition, in the applying of the photoresist 150, the light blocking portion 170b of the mask 170 may be disposed on the “B” portion of the barrier material paste, so that the barrier rib may not be formed on the “B” portion. .

FIG. 11 is a view illustrating a state in which a portion “B” is removed from FIG. 10, and FIG. 12 is a perspective view showing a state in which a plasma display partition wall is completed on a substrate as an embodiment of the present invention.

Referring to the drawing, the stripe-type partition wall 140a in the Y direction is separated from the central portion (C).

As such, after the barrier rib 135a is completed, a phosphor layer (not shown) is coated on the barrier rib and the dielectric layer 130 to fabricate a back substrate, and the front substrate on which the common electrode, the scan electrode, the dielectric layer, and the protective layer are formed is formed on the back surface. A plasma display device (see FIG. 1) is manufactured by assembling with a substrate. In addition, the panel having the electrode structure divided in the Y direction is operated in a split driving method.

According to the method of manufacturing a partition wall of the plasma display device according to the present invention, it is possible to prevent the dielectric layer from being damaged by static electricity during sand blasting, and to accumulate charges between the electrodes divided during sand blasting. Defects of the partition wall formed by the blasting process can be prevented.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, it is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible. Could be. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (6)

An electrode forming step of forming an electrode having a predetermined pattern on the substrate such that the first electrode and the second electrode are spaced apart from each other by a heating portion; A dielectric layer forming step of forming a dielectric layer on the substrate on which the first electrode and the second electrode are formed; A heating step of heating the heating unit having heating means capable of transferring heat; Forming a barrier layer stack by applying and drying a paste of barrier material on a substrate on which the dielectric layer is formed; Applying and drying a photoresist material on the partition stack; Exposing the photoresist material with an exposure mask formed in a pattern having a predetermined shape corresponding to the partition wall; Sandblasting the photoresist; Removing the photoresist; And Calcining the barrier material paste to form a barrier rib; and a barrier rib manufacturing method of a plasma display device. delete The method of claim 1, Removing the partition wall of the heating unit; The partition wall manufacturing method of the plasma display device further comprising. The method of claim 1, A partition wall manufacturing method of a plasma display device, characterized in that no partition wall is formed in the heating unit. The method of claim 1, And the heating means heats the heating part during sandblasting. The method of claim 1, The heating means is a partition wall manufacturing method of the plasma display element, characterized in that the laser.