KR100455120B1 - Meander slot antenna and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a meander slot antenna and a method of manufacturing the same, wherein a plurality of first high dielectric constant substrates are spaced apart from each other by a predetermined distance from an upper portion of the first high dielectric constant substrates, and are uniformly positioned in a horizontal direction on a plane at the same level. A plurality of second horizontal patterns spaced apart from the first horizontal pattern and the plurality of first horizontal patterns by a predetermined distance in a vertical direction on a plane and uniformly disposed in a horizontal direction at a position opposite to the separation section of the first horizontal pattern; And a top plate having a plurality of vertical patterns connecting side ends of the first horizontal pattern and side ends of the second horizontal pattern. A second high dielectric constant substrate in contact with a bottom surface of the first high dielectric constant substrate, a feed line positioned between the second high dielectric constant substrate and the first high dielectric constant substrate to supply a voltage, and a bottom surface of the second high dielectric constant substrate By forming each pattern of the meander slot antenna consisting of a lower plate having a ground electrode located in the electroplating method to form a meander slot antenna pattern on the high dielectric constant substrate, by adjusting the width of the vertical pattern of the antenna, By reducing the total length of the meander slot antenna and reducing its size, each metal slot pattern is formed using the electroplating method, thereby improving the uniformity of the upper and lower sides of the metal slot pattern and increasing the reproducibility of the process. It has the effect of enabling production.

Description

Mender slot antenna and its manufacturing method {MEANDER SLOT ANTENNA AND MANUFACTURING METHOD THEREOF}

The present invention relates to a meander slot antenna and a method for manufacturing the same, and in particular, a method for fabricating a meander slot antenna capable of transmitting and receiving at a frequency of 2 to 5 GHz using a semiconductor process, reducing its size, and easily adjusting a bandwidth, and a method for manufacturing the same. It is about.

Most of the antennas widely used in wireless communication and microwave communication, which are rapidly developing in recent years, are a whip / heelical combination type and have protrusions outside the terminal. Such a protrusion may cause an increase in the volume of the entire terminal and may be easily broken.

In order to solve this problem, a research on an embedded antenna is being conducted. Currently, an internal antenna is bulky, and a terminal having a high dielectric constant has a large volume and a price is increased.

To develop a lower cost, smaller antenna, an antenna that can be embedded in a terminal using a silicon or ceramic substrate is being researched. Such a wafer-level antenna can be mass-produced and can be integrated with other high frequency (RF) passive elements, which is advantageous for producing a miniature high frequency transceiver of a multi-chip module type. The antenna developed in this manner may include, for example, a microstrip antenna having a meander type slot antenna and a slot antenna having a CB-CPW (CONDUCTOR BACKED COPLANAR WAVEGUIDE) feeding structure.

However, the above-described microstrip antenna has to be manufactured with a length corresponding to half of the wavelength (λ _g ) of the transmission / reception signal for radiation, and thus has a problem in that its size is increased in the current mobile communication band. The same will be described in detail with reference to the accompanying drawings, such as the conventional meander slot antenna and its manufacturing method as follows.

FIG. 1 is a plan view of a conventional meander slot antenna, as shown in FIG. 1, on the synthetic resin substrate 1 such as TEFLON, the overall width W1 is uniform, long in the vertical direction V on the plane, and horizontal in the plane It consists of a metal slot pattern 2 having a shape bent a plurality of times in the direction (H).

The metal slot pattern 2 is formed by etching copper (Cu) thin film, the length of the vertical direction (V) is longer than the length bent in the horizontal direction (H), the length of the bent portion and the vertical direction (V ) Are uniform in length, respectively.

In addition, the vertical direction (V) pattern of the metal slot pattern 2 has the opposite direction of the current between the adjacent patterns, the radiation of the radio wave is canceled according to the direction of the current, the actual radiation of the metal slot pattern ( 2) It occurs at the long bent part in the horizontal direction (H).

Conventional meander slot antennas configured as described above have a total length of the metal slot pattern 2 equal to a wavelength λ _g of a transmission / reception signal used for wireless communication, and thus the terminal size decreases rapidly. It has a problem that is not easy to mount inside.

In the conventional method for manufacturing a meander slot antenna, a metal thin film such as copper is coated on the synthetic resin substrate 1, and then the metal thin film is selectively etched to form a metal slot pattern 2 having the above shape.

The metal slot pattern 2 formed by such an etching method may have a different degree of etching on the upper side and the lower side of the side part of the pattern, which makes it difficult to form a uniform pattern. As the shape is not uniform, there is a serious change in the characteristics of the antenna, which is not suitable for mass production.

As described above, the conventional meander slot antenna and its manufacturing method are composed of a metal pattern having the same length as the wavelength of the transmitted / received signal on the synthetic resin substrate, which has a limitation in reducing the size of the antenna, and the size and weight of the wireless communication terminal are abrupt. There was a problem that can not be used in the decreasing trend.

In addition, the manufacturing method is formed by patterning the metal thin film using the formation and etching process of the metal thin film, so that it is not easy to form a uniform pattern on the upper and lower parts, and thus the characteristics of the antenna are nonuniform, resulting in mass production. There was an adverse problem.

It is an object of the present invention in view of the above problems to provide a method for manufacturing a meander slot antenna capable of forming a uniform pattern and reducing the size of the meander slot antenna.

1 is a plan view of a conventional meander slot antenna.

Figure 2 is a top plan view of the present invention midder slot antenna.

Figures 3a to 3c is a plan view showing an embodiment of the lower plate of the present invention, respectively, the meander slot antenna.

Figure 4 is a cross-sectional view of the meander slot antenna bonded to the upper plate and the lower plate.

Figures 5a to 5c is a cross-sectional view of the top plate manufacturing process of the present invention midder slot antenna.

Figure 6a to 6c is a cross-sectional view of the lower plate manufacturing process step of the present invention midder slot antenna.

Figure 7 is a plan view of the upper plate and the lower plate bonded together.

Fig. 8 is a graph of the measurement result of the return loss of the present invention midder slot antenna.

Figure 9 is a graph of the radiation characteristics of the present invention meander slot antenna.

10A to 10C are another embodiment plan view of the present invention midder slot antenna.

Fig. 11 is a graph showing the return loss measurement results of Figs. 10A to 10C.

** Description of symbols for the main parts of the drawing **

21, 31: high dielectric constant substrate 22: metal slot pattern

32: feed line 33: ground electrode

The above object is a first high dielectric constant substrate, a plurality of first horizontal patterns spaced apart from each other by a predetermined distance from the upper portion of the first high dielectric constant substrate, and uniformly positioned in the horizontal direction on the plane at the same level, and the plurality of A plurality of second horizontal patterns spaced apart from the first horizontal pattern in a vertical direction on a plane and uniformly disposed in a horizontal direction at a position opposite to the separation section of the first horizontal pattern; and the sides of the first horizontal pattern An upper plate having a plurality of vertical patterns connecting end portions and side ends of the second horizontal patterns; A second high dielectric constant substrate in contact with a bottom surface of the first high dielectric constant substrate, a feed line positioned between the second high dielectric constant substrate and the first high dielectric constant substrate to supply a voltage, and a bottom surface of the second high dielectric constant substrate A lower plate having a ground electrode positioned in the lower plate antenna is configured to form a pattern by using an electroplating method. The present invention will be described in detail with reference to the accompanying drawings. same.

FIG. 2 is a plan view of the top plate of the present invention's meander slot antenna, which is located on the high dielectric constant substrate 21 and the high dielectric constant substrate 21 and is long and flat in the vertical direction (V) on the plane. It has a shape bent a plurality of times in the horizontal direction (H) of the image, the width of the long region in the vertical direction (V) is made of a metal slot pattern 22 narrower than the width of the region bent in the horizontal direction (H). .

When the high dielectric constant substrate 21 such as HRS (HIGH RESISTIVITY SILICON) is used as described above, when the same metal slot pattern 22 as in the prior art is used, the frequency of the transmitted / received signal is increased. The resonance frequency of the antenna is inversely proportional to the size of the metal slot pattern 22. When the high dielectric constant substrate 21 is used, the resonance frequency of the antenna when the same metal slot pattern 22 is used as the conventional wireless communication is present. It has a high resonant frequency exceeding the range used in, and the total length of the metal slot pattern 22 should be formed larger.

As the frequency increases, the frequency is different from that of the currently applied wireless communication. In order to adjust the frequency, the size of the metal slot pattern 22 needs to be increased.

However, by adjusting the width of the region having a long shape in the vertical direction, the resonance frequency can be lowered even when the metal slot patterns 22 of the same size are used.

The total length of the metal slot pattern 22 has a length of about 0.75 times the wavelength, and the total length of the metal slot pattern 22 can be greatly reduced as compared with the use of a metal pattern having the same length as a conventional wavelength. .

To this end, the width W1 of the long pattern in the vertical direction V of the metal slot pattern 22 is narrower than the width W2 of the region bent in the horizontal direction H.

3A is a perspective view showing an embodiment of a lower plate of the present invention's midder slot antenna. As shown therein, a high dielectric constant substrate 31 having a region having a step lower than a peripheral portion in a central portion of an upper surface thereof, and the high dielectric constant substrate The feed line 32 is located in a region where the step difference is low, and the ground electrode 33 is located at the bottom of the high dielectric constant substrate 31.

The top plate shown in FIG. 2 is mounted in an area where the step difference of the high dielectric constant substrate 31 is low, and a central portion of the metal slot pattern 22 in which a part of the feed line 32 is located on the top plate is placed in a horizontal direction ( To pass through H).

3B illustrates another embodiment of the lower plater of the midder slot antenna, and the feed line 32 is extended to a peripheral region of the high dielectric constant substrate 31, which is a region having a high step, as shown.

At this time, the feed line 32 is exposed to the outside even when the top plate is mounted, and the signal is easily applied.

3C is a perspective view of another embodiment of the lower plate of the meander slot antenna of the present invention, and as shown therein, the high-k dielectric substrate 31 has a flat upper and lower surface, and a feed line is formed on the upper side of the high-k dielectric substrate 31. In addition, the alignment key 34 is positioned at the periphery of the high dielectric constant substrate 31 and the top plate is bonded to the upper portion of the high dielectric constant substrate 31. The ground electrode 33 is disposed on the bottom of the high dielectric constant substrate 31. This is located.

4 is a cross-sectional view of a result of bonding the upper and lower plates of the above-described structure, and as shown therein, the feed lines 32 are positioned between the high dielectric constant substrates 21 and 31 forming the upper and lower plates. The metal slot pattern 22 positioned between the metal pattern 24 on the non-engagement surface of the substrate 21 and the ground electrode 33 positioned on the non-adhesion surface of the high dielectric constant substrate 31. It consists of.

Hereinafter, a method of manufacturing the present invention meander slot antenna configured as described above will be described in detail.

First, FIGS. 5A to 5C are cross-sectional views of a top plate manufacturing process of the present invention, and the steps of depositing the seed metal layer 23 on the upper surface of the high dielectric constant substrate 21 as shown in FIG. 5A and FIG. ; After the photoresist (PR) is applied to the upper surface of the seed metal layer 23, to form a photoresist (PR) pattern for exposing and developing the patterned metal layer 23 to be produced (Fig. 5b) )Wow; After forming a metal slot pattern 22 therebetween by growing a metal on the seed metal layer 23 by electroplating to form a metal pattern 24, the photoresist PR pattern and the lower part thereof. The top plate of the structure shown in FIG. 2 is manufactured by removing the seed metal layer 23 of FIG. 5C.

The manufacturing process is characterized in that the upper and lower widths of the metal slot pattern 22 can be uniformly formed as compared to the method of forming the metal slot pattern 22 using an etching process as in the related art. (22) is excellent in uniformity and reproducibility, and mass production is possible.

Next, FIGS. 6A to 6C are cross-sectional views of a lower plate manufacturing process of the present invention, and the photoresist PR is coated on the high dielectric constant substrate 31, exposed to light, and developed. Forming a pattern exposing a central upper portion of the electrified substrate 31 (FIG. 6A); In the etching process using the photoresist (PR) pattern as an etching mask, the exposed high-k dielectric substrate 31 is etched to a predetermined depth, a metal is deposited thereon, and then patterned to form the feed line 32. Forming step (FIG. 6B); Forming a ground electrode 33 by depositing a metal on a bottom surface of the high dielectric constant substrate 31.

As described above, the reason for etching the central upper portion of the high dielectric constant substrate 31 to a predetermined depth is to set an area where the upper plate is to be located, and as shown in the lower plate embodiment, the high dielectric constant substrate 31 is not etched. In addition, the alignment key 34 may be formed to enable accurate alignment of the top plate.

Next, FIG. 7 is a plan view of the upper plate and the lower plate bonded to each other, and as shown thereon, a high dielectric constant substrate 21 constituting an upper plate is positioned on an upper portion of the high dielectric constant substrate 31 forming a lower plate. A portion of the feed line 32 is exposed on the lower high dielectric constant substrate 31 of the substrate 21.

As the method of bonding the upper plate and the lower plate as described above, since the thermal process cannot be used by the formation of each metal pattern, an epoxy resin, a polymer thin film, and a solder are placed between the upper plate and the lower plate, and then baked. It can bond by hardening the said epoxy resin, a polymer thin film, solder, etc.

The present invention manufactured by the above-described manufacturing process, the antenna slot antenna can control the frequency characteristics by adjusting the width (W1) of the long pattern portion in the vertical direction (V) of the metal slot pattern 22 located on the top plate. Will be.

FIG. 8 is a graph illustrating a measurement result of the return loss of the present invention midder slot antenna. As shown in FIG. 8, the width W1 of the long pattern portion in the vertical direction V of the meander slot antenna is horizontally ( H) When the ratio to the width W2 of the bent portion is 0.5, 0.3, 0.2, or 0.1, respectively, the change in the frequency bandwidth can be seen.

As the width W1 decreases, the frequency band is reduced, and thus the frequency band that is increased can be adjusted using the high dielectric constant substrates 21 and 31.

This makes the meander slot antenna more compact.

9 is a graph illustrating radiation characteristics of the present invention's meander slot antenna, which has relatively even radio wave radiation characteristics in all directions.

The meander slot antenna has a structure using two high dielectric constant substrates, and by further simplifying it, a meander slot antenna can be implemented using one high dielectric constant substrate, and thus the present invention uses a high dielectric constant substrate. The structure of the antenna and the manufacturing method thereof are as follows.

FIG. 10A is another embodiment plan view of the present invention's meander slot antenna, as shown therein, and is symmetrical with respect to an imaginary vertical line passing through the high dielectric constant substrate 41 and the central portion on the plane of the high dielectric constant substrate 41, and as a whole, FIG. The first and second metal slot patterns 42 and 43 having a uniform width W2 and a long shape in the vertical direction V on the plane, and having a shape bent a plurality of times in the horizontal direction H on the plane; One of the first and second metal slot patterns 42 and 43 is connected to the end of the bent portion of an elongated shape in the horizontal direction (H) on the plane of the central portion of the high dielectric constant substrate 1, and extends vertically (V) to extend The first and second feedline slot patterns 44 and 45 are positioned to the lower ends of the electrifying substrate 1. The first and second feedline slot patterns 44 and 45 are formed as feed lines.

In this case, the first and second feedline slot patterns 44 and 45 are directly connected to the first and second metal slot patterns 42 and 43, which are the meander slot antennas, and the bottom surface of the high dielectric constant substrate 41. The ground electrode 46 is located.

The first and second metal slot patterns 42 and 43 have the same structure as the substrate 41 is exposed by removing the horizontally bent pattern corresponding to the center portion of the metal pattern in FIG. The width of the first and second feedline slot patterns 44 and 45 connected to both ends of which the pattern is removed is narrower than the width W2 of the first and second metal slot patterns 42 and 43. (W3), and are positioned in parallel to each other so that the separation distance between the first and second feedline slot patterns 44 and 45 is uniform.

Since such a structure uses a single substrate, the manufacturing process can be simplified and the manufacturing cost can be reduced as compared with the case of using a plurality of substrates.

In addition, FIG. 10B shows the width W1 of the long pattern in the vertical direction V of the first and second metal slot patterns 42 and 43 in the configuration shown in FIG. 10A. It is a shape narrower than the width | variety W2 of the said area | region, and it is possible to change a frequency band by adjusting width W1 in this way.

10C is a portion in which the first and second metal slot patterns 42 and 43 are located at the side surfaces of the first and second feedline slot patterns 44 and 45 in the configuration shown in FIG. 10B. The width of is widened to be the same width as the width W2 of the portion bent in the horizontal direction of the first and second metal slot patterns 42, and the width of the remaining area is kept at the original width W3.

It is possible to tune the frequency characteristics of the antenna by adjusting the respective widths (W1, W2), it is possible to reduce the manufacturing cost by simplifying the structure and the reduction of the substrate material.

The measurement result of the return loss of the meander slot antenna of the present invention shown in FIGS. 10A and 10C is shown in the graph of FIG. 11, and the frequency is determined according to the ratio of the width W1 to the width W2. The band will change.

That is, the width W2 of the portion bent in the horizontal direction H of the first and second metal slot patterns 42 and 43 and the width of the vertical direction H are the same as those of the pattern. As the width ratio decreases to 0.4 and 0.2, the frequency band becomes lower.

When the width W2 is 1 mm, the pattern width W1 in the vertical direction V is changed to 1, 0.4, and 0.2 mm, respectively.

By using such a tuning method, antennas of various frequency bands can be manufactured, and the feed lines between the first and second feedline slot patterns 44 and 45 and the first and second metal slot patterns 42, The structure on which 43) is located on the same substrate is referred to collectively as a slot antenna having a CB-CPW (CONDUCTOR BACKED COPLANAR WAVEGUIDE) feeding structure.

The manufacturing method of a meander slot antenna using the said board | substrate is demonstrated in detail.

The seed metal is deposited on the high dielectric constant substrate 41, the photoresist PR is coated on the top surface of the seed metal, and the photoresist pattern is disposed on an upper portion of the seed metal. Forming; Forming first and second metal slot patterns 42 and 43 and first and second feedline slot patterns 44 and 45 by plating a metal on the exposed seed metal using an electroplating method. Wow; And removing the remaining photoresist pattern and the seed metal under the photoresist pattern.

This process is more uniform than the pattern formation by etching by forming the first and second metal slot patterns 42 and 43 and the first and second feedline slot patterns 44 and 45 using an electroplating method. A pattern is formed and the reproducibility is improved.

As described above, in the present invention, the meander slot antenna and its manufacturing method form a meander slot antenna pattern on a high dielectric constant substrate, and by adjusting the width of the vertical pattern of the antenna, the total length of the meander slot antenna is reduced to reduce its size. In addition, by forming each metal pattern using the electroplating method, there is an effect to improve the uniformity of the upper and lower sides of the metal pattern and to increase the reproducibility of the process to enable mass production.

Claims (13)

A plurality of first horizontal patterns and a plurality of first horizontal patterns spaced apart from each other by a predetermined distance on an upper portion of the first high dielectric constant substrate and the first high dielectric constant substrate, and uniformly disposed in a horizontal direction on a plane at the same level; A plurality of second horizontal patterns uniformly spaced in a horizontal direction at a position opposite to the separation section of the first horizontal pattern in a vertical direction on a plane, and side ends and the second horizontal of the first horizontal pattern; An upper plate having a plurality of vertical patterns connecting side ends of the pattern; A second high dielectric constant substrate in contact with a bottom surface of the first high dielectric constant substrate, a feed line positioned between the second high dielectric constant substrate and the first high dielectric constant substrate to supply a voltage, and a bottom surface of the second high dielectric constant substrate Mender slot antenna, characterized in that consisting of a lower plate having a ground electrode positioned in the. The antenna of claim 1, wherein the widths of the first and second horizontal patterns are uniform and the width of the vertical patterns is narrower than the width of the first and second horizontal patterns. The semiconductor device of claim 1, wherein the lower plate comprises: a second high dielectric constant substrate on which a portion of the upper plate is in contact with the substrate; Located on the etching region of the second high dielectric constant substrate, one side is a region parallel to the vertical pattern located on the upper plate, a region passing through the central portion of the vertical pattern, parallel to the first and second horizontal pattern A feedline having a; Mender slot antenna, characterized in that consisting of a ground electrode located on the front surface of the bottom of the second high dielectric constant substrate. 4. The antenna of claim 3, wherein the feed line extends in an area parallel to the vertical pattern on an unetched area of the second high dielectric constant substrate. The antenna of claim 1, wherein the lower plate further comprises an alignment key on an outer side of the feedline to facilitate alignment of the upper plate. The method of claim 1, wherein the high dielectric constant substrate is a HRS (HIGH RESISTIVITY SILICON) substrate, characterized in that the Mender slot antenna. A seed metal layer is formed on the first high dielectric constant substrate, a photoresist pattern is formed on an upper portion of the seed metal layer, and a metal layer is grown on the exposed seed metal layer by electroplating to form a slot antenna pattern. A top plate forming step of removing the photoresist pattern and a seed metal layer under the photoresist pattern; After etching the upper center of one surface of the second high dielectric constant substrate, depositing a metal on the second high dielectric constant substrate, and patterning to form a feed line located on the etching region of the second high dielectric constant substrate, A lower plate forming step of forming a ground electrode by depositing a metal on a bottom surface of the second high dielectric constant substrate; The thermosetting material is applied to a part of the joint surface of the upper plate and the lower plate, and the upper plate is bonded in the etching region of the second high dielectric constant substrate, and the bonding is performed by bonding the upper plate and the lower plate by baking. Mender slot antenna manufacturing method. The method of claim 7, wherein the first and second high dielectric constant substrates are HRS (HI RESISTIVITY SILICON) substrates. The method of claim 7, wherein the thermosetting material is one selected from a thin film polymer, an epoxy, and a solder. 9. A material having a shape that is symmetrical with respect to the high dielectric constant substrate and an imaginary vertical line passing through the central portion on the plane of the high dielectric constant substrate, the overall width is uniform, long in the vertical direction on the plane, and bent in the horizontal direction on the plane a plurality of times; The first and second metal slot patterns and the first and second metal slot patterns are connected to end portions of the first and second metal slot patterns in a horizontally elongated shape in a planar direction on the side of the central portion of the high dielectric constant substrate. Mender slot antenna, characterized in that consisting of the first and second feedline slot patterns located to the lower end. The antenna of claim 10, wherein the high dielectric constant substrate is a high resistance dielectric substrate (HRS) substrate. The antenna of claim 10, wherein the first and second metal slot patterns have a narrower width in a vertical direction than a width of a horizontally bent portion. 12. The width of the bent portion of the first and second metal slot patterns, wherein the partial regions of the first and second feedline slot patterns positioned on the side portions of the first and second metal slot patterns are horizontally bent. Mender slot antenna, characterized in that having the same width as.