KR100452728B1 - Filter assembly for system to compensate for temperature in semiconductor test handler - Google Patents

Abstract

The present invention relates to a filter assembly for an exothermic compensator of a semiconductor device test handler, wherein the liquid liquid is liquefied in a mixed cooling fluid of liquefied nitrogen and dry air without increasing the pressure in the tube to which the cooling fluid is supplied in the exothermic compensator of the handler. By allowing nitrogen to be filtered out, liquid liquefied nitrogen does not stick to the semiconductor device while the cooling fluid is injected into the semiconductor device.

To this end, the present invention, the housing is installed on the conduit flows the mixed cooling fluid of liquefied nitrogen and dry air, and the inlet and outlet formed to penetrate the upper portion of the housing to form a passage for supplying and discharging the mixed cooling fluid; And a conical gas-liquid separating member installed inside the housing and contacting and separating liquid liquid nitrogen from the mixed cooling fluid flowing from the inlet, and liquid liquefaction formed on the lower portion of the housing and flowing along the outer circumferential surface of the gas-liquid separating member. Provided is a filter assembly for a heat compensation device of a semiconductor device test handler including a collecting part for collecting nitrogen.

Description

Filter assembly for heat compensation device of semiconductor device test handler {filter assembly for system to compensate for temperature in semiconductor test handler}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a handler for testing a semiconductor device, and more particularly, to a heat compensation device for compensating for a temperature deviation caused by self-heating of a semiconductor device during a test of the semiconductor device in a handler, wherein the mixed cooling fluid of liquid nitrogen and dry air The present invention relates to a filter assembly for a heat compensation device of a semiconductor device test handler, which filters liquid liquefied nitrogen supplied so that liquid liquefied nitrogen does not stick to the surface of the semiconductor device in the process of spraying the same on the semiconductor device.

In general, memory or non-memory semiconductor devices and modules that are appropriately structured on a single substrate are shipped after various tests after production, and handlers automatically process semiconductor devices and modules in such a test process. As a device used to test and transfer a semiconductor device or module to a loading stacker, the picker robot transfers the semiconductor device or module to be tested to a test site and performs a predetermined test. Then, the picker robot transfers the tested semiconductor devices or modules to the unloading stacker and classifies the test results in a designated tray.

Many of these handlers are typically subjected to extreme temperature conditions of high and low temperatures through electrothermal heaters and liquefied nitrogen injection systems in sealed chambers, as well as general performance testing at room temperature. It is also configured to perform high temperature test and low temperature test to test whether normal function can be performed.

However, in performing the test in the handler capable of the temperature test of the semiconductor device as described above, there is a heat generation phenomenon in which predetermined heat is generated in the semiconductor device itself during the test by electrically connecting the semiconductor device to the test socket. As a result, the test may not be performed at the exact temperature desired by the user. This phenomenon is intensifying with the recent miniaturization trend of semiconductor devices.

For example, if the user performs the test by setting the temperature inside the chamber to 80 ° C. during the high temperature test, if the semiconductor device itself does not generate heat, it is possible to test at the set test temperature of 80 ° C. However, heat is generated in the semiconductor device during the test. If the temperature deviation is about 15 ℃, the actual test will be made at 95 ℃.

Therefore, the semiconductor device is tested at a temperature higher than the set test temperature, and thus, the test is not performed within the correct temperature range, thereby lowering yield and reliability.

Recently, a research has been conducted on an exothermic compensation system that allows a semiconductor device to be tested within an accurate temperature range by directly injecting a cooling fluid mixed with liquefied nitrogen and dry air into the semiconductor device on one side of the semiconductor device being tested. It is in progress.

However, in the exothermic compensation system as described above, when liquid liquefied nitrogen having a large particle is stuck to the semiconductor element without being immediately vaporized during the injection of the mixed cooling fluid of the liquid nitrogen and the dry air to the semiconductor element. In this case, not only the semiconductor element is damaged but also the heating compensation temperature is not controlled as desired.

Accordingly, the present invention has been made in order to solve the above problems, only liquid liquid nitrogen in the mixed cooling fluid of the liquid nitrogen and dry air without increasing the pressure in the tube supplied with the cooling fluid in the heat compensation device of the handler It is an object of the present invention to provide a filter assembly for a heat compensation device of a semiconductor device test handler which prevents liquid liquefied nitrogen from adhering to the semiconductor device while the cooling fluid is injected into the semiconductor device.

1 is a configuration diagram showing a schematic configuration of a heat compensation device to which the filter assembly according to the present invention is applied;

2 is a sectional view showing the main parts of a structure of a first embodiment of a filter assembly for a heating compensation device according to the present invention;

3 is a sectional view showing the main parts of a structure of a second embodiment of a filter assembly for a heating compensation device according to the present invention;

4 is a sectional view showing the main parts of a structure of a third embodiment of a filter assembly for a heating compensation device according to the present invention;

Explanation of symbols on the main parts of the drawings

10, 20, 30: filter assembly 101, 201, 301: housing

102, 202, 302: inlet 103, 203, 303: outlet

104, 204: gas-liquid separation member 105: holding part

106, 205: collector

In order to achieve the above object, the present invention, the housing is installed on the conduit through which the mixed cooling fluid of liquefied nitrogen and dry air flows, and a passage formed through the upper portion of the housing to supply and discharge the mixed cooling fluid And a conical gas-liquid separating member which is installed inside the housing and separated from the mixed cooling fluid flowing from the inlet by contact with liquid nitrogen, and is formed in the lower portion of the housing to form an outer peripheral surface of the gas-liquid separating member. The present invention provides a filter assembly for a heat compensation device of a semiconductor device test handler including a collecting part for collecting liquid liquefied nitrogen flowing along.

According to another aspect of the present invention, it is provided on a conduit through which a mixed cooling fluid of liquefied nitrogen and dry air flows, and is connected to a cooling fluid supply pipe at one side thereof to form an inlet for supplying a cooling fluid, and cooling at the other upper end. There is provided a discharge outlet through which a fluid is discharged, and a filter assembly for a heat compensation device of a semiconductor device test handler, the housing having a shape having a cross-sectional area extending from the inlet toward the outlet.

Hereinafter, with reference to the accompanying drawings will be described in detail preferred embodiments of the filter assembly for a heat compensation device of the semiconductor device test handler according to the present invention.

1 is a configuration diagram showing the configuration of a heat compensation device according to the present invention, the heat compensation device is a dry air supply source for supplying dry air (Dry Air) (2), a liquid nitrogen supply source for supplying liquid nitrogen (LN ₂ ) (1), a mixer (3) for uniformly mixing dry air and liquid nitrogen supplied in connection with the dry air supply source (2) and the liquid nitrogen supply source (1), and on one side of a test site (not shown) of the handler It is composed of a plurality of nozzle assembly (4) which is installed to be connected to the mixer (3) via the cooling fluid supply pipe (7a, 7b) to inject the mixed cooling fluid supplied from the mixer (3) to the semiconductor element (s) On the conduit of the cooling fluid supply pipes 7a and 7b, a filter assembly 10 is installed to separate and refine the liquid liquefied nitrogen in the mixed cooling fluid supplied from the mixer 3 to the nozzle assembly 4.

As shown in FIG. 2, the filter assembly 10 has a substantially cylindrical housing 101 and a cooling fluid inlet installed to be connected to the cooling fluid supply pipes 7a and 7b on an upper surface of the housing 101. 102 and a cooling fluid outlet 103 and a conical gas-liquid separating member 104 installed inside the housing 101.

The gas-liquid separation member 104 is installed on the support portion 105 formed at the center of the bottom surface inside the housing 101, so that a space is provided between the bottom portion of the gas-liquid separation member 104 and the bottom surface of the housing 101. The space is formed to form a collecting portion 106 in which the liquid liquefied nitrogen dropped along the gas-liquid separation member 104 is collected.

The filter assembly 10 configured as described above operates as follows.

The liquefied nitrogen supplied at a predetermined pressure from the liquefied nitrogen supply source 1 is mixed with dry air in the mixer 3 and discharged to the cooling fluid supply pipe 7a, and then flows through the cooling fluid supply pipe 7a to filter assembly. It is introduced into the housing 101 through the inlet 102 of 10, the light gas and very fine liquid particles in the mixed cooling fluid of the liquid nitrogen and dry air discharged into the housing 101 through the inlet 102 Since the liquefied nitrogen of the kinetic energy is low, the liquid liquefied nitrogen is discharged to the cooling fluid supply pipe 7b through the outlet 103, which is a low pressure region, without reaching the gas-liquid separation member 104, and the liquid liquefied nitrogen having a large particle size moves. Since the energy is large, it flows down while touching the gas-liquid separating member 104.

The liquid liquefied nitrogen flowing down along the gas-liquid separation member 104 is collected in the collecting section 106 at the bottom, and then gradually vaporized and discharged to the cooling fluid supply pipe 7b through the outlet 103.

Therefore, the cooling fluid discharged through the filter assembly 10 to the cooling fluid supply pipe 7b is mostly gaseous liquid nitrogen and dry air, and the particles are very fine even though some liquid liquid nitrogen is contained in the cooling fluid. Therefore, all of them are vaporized in the process of spraying through the nozzle assembly 4 so that the liquid nitrogen does not adhere to the semiconductor device.

On the other hand, Figure 3 shows another embodiment of the filter assembly according to the present invention, the filter assembly 20 of this embodiment is the bottom portion of the conical gas-liquid separation member 204 is integrally formed on the bottom surface of the housing 201 In addition, the collecting part 205 in which liquid liquefied nitrogen collects is formed in a concave groove shape on the bottom surface of the housing 201 outside the lower end of the gas-liquid separation member 204.

Therefore, the cooling gas in the light gas state among the cooling fluids introduced into the housing 201 through the inlet 202 through the inlet 202 is discharged to the cooling fluid supply pipe 7b through the outlet 203, and is relatively The liquid liquefied nitrogen in a heavy liquid state descends on the outer surface of the gas-liquid separation member 204, accumulates in the collecting unit 205, and then vaporizes and is discharged to the discharge port 203.

Figure 4 shows another embodiment of the filter assembly according to the present invention, the filter assembly 30 of this embodiment is connected to the cooling fluid supply pipe (7a) in one side is formed with an inlet 302 through which the cooling fluid flows And a housing 301 which is connected to the cooling fluid supply pipe 7b at the other upper end and has a discharge port 303 for discharging the cooling fluid, and the housing 301 rapidly expands toward the discharge port 303 from the inlet 302 side. It takes the form of a diffuser.

Therefore, when the mixed cooling fluid of the dry air and the liquid nitrogen is discharged into the housing 301 through the inlet 302, the discharged cooling fluid is expanded while the liquid liquid nitrogen having a small particle vaporizes with the dry air. The liquid liquefied nitrogen, which is directly discharged through the discharge port 303 and the particles in the liquid nitrogen cannot be vaporized, is vaporized over the next time accumulated in the lower portion of the housing 301 and discharged to the upper discharge port 303.

According to the embodiments of the filter assembly of the present invention as described above, because the flow of the mixed cooling fluid supplied into the filter assembly (10, 20, 30) is filtered out of the liquid liquefied nitrogen without being disturbed, mixed cooling It is possible to maintain a constant pressure without increasing the pressure in the pipe to which the fluid is supplied, thereby allowing the vaporized mixed cooling fluid of a constant pressure to be discharged through the nozzle assembly 4.

As described above, according to the present invention, it is possible to filter only the liquid liquefied nitrogen in the mixed cooling fluid of the liquid nitrogen and dry air without increasing the pressure in the pipe to which the cooling fluid is supplied, and thus a constant pressure through the nozzle assembly. The vaporized mixed cooling fluid can be supplied to prevent liquid liquefied nitrogen from adhering to the semiconductor device, and the control of the exothermic compensation temperature can be easily controlled, thereby improving test reliability.

Claims (5)

A housing installed on a conduit through which the mixed cooling fluid of liquefied nitrogen and dry air flows, an inlet and an outlet formed through the upper portion of the housing to form a passage through which the mixed cooling fluid is supplied and discharged, and installed inside the housing Semiconductor consisting of a gas-liquid separating member which is contacted and separated from liquid liquefied nitrogen in the mixed cooling fluid flowing from the inlet, and a collecting part which collects liquid liquefied nitrogen flowing down along the outer circumferential surface of the gas-liquid separating member and collected at the bottom of the housing. Filter assembly for heat compensation device of device test handler. The filter assembly of claim 1, wherein the gas-liquid separating member is formed in a conical shape. The gas-liquid separating member is installed on a holding portion formed perpendicular to the bottom surface of the housing, and the collecting portion is formed in a space between the bottom surface of the gas-liquid separating member and the bottom surface of the housing. Filter assembly for heat compensation device of the semiconductor device test handler. The heat generation of the semiconductor device test handler according to claim 2, wherein the gas-liquid separating member is integrally formed on the bottom surface of the housing, and the collecting part is formed concave along the bottom surface of the housing outside the lower end of the gas-liquid separating member. Filter assembly for compensator. It is installed on the conduit through which the mixed cooling fluid of liquefied nitrogen and dry air flows, and is connected to the cooling fluid supply pipe at one side to form an inlet for supplying the cooling fluid, and an outlet for discharging the cooling fluid at the upper end of the other side. A filter assembly for a heat compensation device of a semiconductor device test handler comprising a housing having a shape in which a cross-sectional area is extended from the inlet to the outlet.