KR100430193B1 - Polybutylene Terephthalate Resin Composition - Google Patents

Polybutylene Terephthalate Resin Composition Download PDF

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KR100430193B1
KR100430193B1 KR10-1998-0062770A KR19980062770A KR100430193B1 KR 100430193 B1 KR100430193 B1 KR 100430193B1 KR 19980062770 A KR19980062770 A KR 19980062770A KR 100430193 B1 KR100430193 B1 KR 100430193B1
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epoxy
weight
compound
epoxy compound
terephthalate resin
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KR10-1998-0062770A
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KR20000046094A (en
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진 모 연
경 훈 서
태 욱 김
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제일모직주식회사
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/181Acids containing aromatic rings
    • C08G63/183Terephthalic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K3/2279Oxides; Hydroxides of metals of antimony
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings

Abstract

본 발명은 (A)폴리부틸렌테레프탈레이트 수지 40 내지 90중량%, (B)에폭시기가 1개인 에폭시화합물 0.1 내지 10중량%, (C)에폭시기가 2개 이상인 에폭시 화합물 0.1 내지 10중량%, (D)촉매 0.01 내지 5중량%, (E)충격보강재 1 내지 40중량%, (F) 난연제 0 내지 30중량%, (G) 난연조제 0 내지 10중량%, 및 (H) 전체 조성물에 대하여 0 내지 50중량%의 무기충진재로 이루어진 폴리부틸렌테레프탈레이트 수지 조성물에 관한 것으로, 폴리부타디엔테레프탈레이트 수지에 에폭시기를 1개 또는 2개이상 함유하는 에폭시 화합물과 에폭시와 PBT 카르복실말단기 반응을 촉진시키는 촉매를 사용함으로써 폴리부타디엔테레프탈레이트의 열에 의한 분해나 수분에 의한 가수분해를 방지하면서 두께가 얇은 성형품에 사출성형할 수 있도록 유동성의 개량 및 충격강도가 향상되는 효과를 갖는다.The present invention is (A) 40 to 90% by weight polybutylene terephthalate resin, (B) 0.1 to 10% by weight epoxy compound having one epoxy group, (C) 0.1 to 10% by weight epoxy compound having two or more epoxy groups, ( D) 0.01 to 5% by weight of catalyst, (E) 1 to 40% by weight of impact modifier, (F) 0 to 30% by weight of flame retardant, (G) 0 to 10% by weight of flame retardant, and (H) 0 to the total composition The present invention relates to a polybutylene terephthalate resin composition comprising an inorganic filler of about 50% by weight, wherein the epoxy compound containing one or two or more epoxy groups in a polybutadiene terephthalate resin promotes a reaction between an epoxy and a PBT carboxyl terminal group. By using the catalyst, it has the effect of improving the fluidity and impact strength so that injection molding can be performed on a thin molded article while preventing thermal decomposition or hydrolysis of polybutadiene terephthalate by heat. .

Description

폴리부틸렌테레프탈레이트 수지 조성물Polybutylene Terephthalate Resin Composition

본 발명은 폴리부틸렌테레프탈레이트 수지 조성물에 관한 것으로, 더욱 상세하게는 폴리부틸렌테레프탈레이트 수지에 2종 이상의 에폭시화합물과 촉매를 추가하여 사용함으로써 수지의 장기내열성, 내습열성을 향상시키고, 유동성 및 충격강도가 우수한 폴리부틸렌테레프탈레이트 수지 조성물에 관한 것이다.The present invention relates to a polybutylene terephthalate resin composition, and more particularly, by using two or more epoxy compounds and a catalyst in addition to the polybutylene terephthalate resin to improve the long-term heat resistance, heat and moisture resistance of the resin, It relates to a polybutylene terephthalate resin composition excellent in impact strength.

일반적으로 폴리부틸렌테레프탈레이트 수지(이하, PBT 수지라 합니다)결정화 속도가 빠르고 기계적 유동성이 높으며, 내후성, 전기 절연성 및 내마모성이 우수하여 전기, 전자, 자동차, 기계부품에 널리 사용되고 있다.Generally, polybutylene terephthalate resin (hereinafter referred to as PBT resin) has a high crystallization rate, high mechanical fluidity, and is widely used in electric, electronic, automotive, and mechanical parts because of excellent weather resistance, electrical insulation, and abrasion resistance.

특히 유리섬유를 강화하는 경우에는 인장강도, 충격강도 등의 기계적 성질과 내열성 등의 기초적인 제물성이 향상되는 효과가 있으며, 유리섬유 강화 나일론 수지에 비하여 흡습성에 의한 물성변화가 적고, 신속한 결정화 속도로 조핵제가 필요하지 않으며 100℃ 이하의 낮은 금형온도에서도 충분한 결정화 거동을 보이는 등 성형가공에 유리한 특성을 보인다.Particularly, when reinforcing glass fibers, mechanical properties such as tensile strength and impact strength and basic physical properties such as heat resistance are improved, and physical property change due to hygroscopicity is less than that of glass fiber reinforced nylon resin, and rapid crystallization rate is achieved. It does not require a nucleating agent and shows favorable crystallization behavior even at low mold temperature below 100 ℃.

그러나, PBT수지는 두께가 얇은 성형품으로 제조되는 경우 잘 깨지는 단점이 있을 뿐만 아니라 고온에서 사용하면 소량의 수분에 의해서도 에스테르가 가수분해되어 분자량 감소로인한 기계적 성질이 급격하게 감소되는 문제점을 가지고 있다. 이때, 말단의 카르복실(carboxyl)기에 의해 가수분해가 매우 빠르게 촉진되며 이를 방지하기 위하여 PBT에 특수한 첨가제를 사용함으로써 말단기를 감소시킬 수 있다.However, PBT resins have a disadvantage in that they are not easily broken when they are made of a thin molded article, and when used at a high temperature, esters are hydrolyzed even by a small amount of water, and thus, mechanical properties due to molecular weight decrease are rapidly reduced. At this time, the hydrolysis is promoted very quickly by the terminal carboxyl group, and the terminal group can be reduced by using a special additive to the PBT to prevent this.

일본 특개소 51-91958호, 51-5865호, 55-82148호등에서는 1∼2개의 에폭시기를 갖는 에폭시 화합물을 사용하는 것이 제시되어 있고, 국내특허 91-6257호에는 옥사졸린 화합물을 사용하여 장기 내열성 및 흡습성을 향상시키는 방법을 제안하고 있으나, 에폭시 화합물 및 옥사졸린 화합물의 우수한 화학반응성으로 인하여 베이스 수지인 PBT와 랜덤하게 반응하게 되고 수지의 겔화를 촉진하여 성형성이 떨어지는 문제점이 있다.Japanese Patent Application Laid-Open Nos. 51-91958, 51-5865, 55-82148 and the like have been proposed to use epoxy compounds having 1 to 2 epoxy groups, and in Korean Patent No. 91-6257, an oxazoline compound is used to Although a method of improving heat resistance and hygroscopicity has been proposed, due to the excellent chemical reactivity of the epoxy compound and the oxazoline compound, there is a problem of randomly reacting with PBT, which is a base resin, and promoting the gelation of the resin, thereby degrading moldability.

본 발명의 목적은 상기와 같은 문제점들을 해결하고 기계적 성질이 우수한 PBT수지 조성물을 제공하는 것으로, 분자내 1개의 에폭시기를 갖는 에폭시화합물과 분자내 2개 이상의 에폭시기를 갖는 에폭시 화합물을 혼합 사용하고, 에폭시 수지와 PBT수지의 카르복실 말단기와의 반응성을 향상시켜 주기 위하여 가공 성형시 반응을 촉진시켜 줄 수 있는 촉매를 사용함으로써 수지의 장기 내열성, 내습열성 및 충격강도가 우수한 폴리부틸렌테레프탈레이트 수지 조성물을 제공하는 것이다.An object of the present invention is to solve the above problems and to provide a PBT resin composition excellent in mechanical properties, by using an epoxy compound having one epoxy group in the molecule and an epoxy compound having two or more epoxy groups in the molecule, epoxy In order to improve the reactivity of the resin with the carboxyl end groups of the PBT resin, a polybutylene terephthalate resin composition having excellent long-term heat resistance, moist heat resistance and impact strength of the resin is used by using a catalyst which can accelerate the reaction during processing and molding. To provide.

본 발명을 좀 더 구체적으로 나타내면, (A)폴리부틸렌테레프탈레이트 수지 40 내지 90중량%, (B)에폭시기가 1개인 에폭시화합물 0.1 내지 10중량%, (C)에폭시기가 2개 이상인 에폭시 화합물 0.1 내지 10중량%, (D)촉매 0.01 내지 5중량%, (E)충격보강재 1 내지 40중량%, (F) 난연제 0 내지 30중량%, (G) 난연조제 0 내지 10중량%, 및 (H) 전체조성물에 대하여 0 내지 50중량%의 무기충진재로 이루어진 폴리부틸렌테레프탈레이트 수지 조성물에 관한 것이다.More specifically, the present invention more specifically, (A) 40 to 90% by weight polybutylene terephthalate resin, (B) 0.1 to 10% by weight epoxy compound having one epoxy group, (C) 0.1 epoxy compound having two or more epoxy groups To 10% by weight, (D) 0.01 to 5% by weight of catalyst, (E) 1 to 40% by weight of impact modifier, (F) 0 to 30% by weight of flame retardant, (G) 0 to 10% by weight of flame retardant, and (H It relates to a polybutylene terephthalate resin composition consisting of 0 to 50% by weight of an inorganic filler based on the total composition.

이하, 본 발명의 각 성분에 대하여 구체적으로 설명하면 다음과 같다.Hereinafter, each component of the present invention will be described in detail.

본 발명에 베이스 수지로 사용되는 폴리부틸렌테레프탈레이트 수지(A)는 디카르본산과 디올의 중합으로부터 얻어지는 것으로, 디카르본산의 예로는 테레프탈산, 이소프탈산, 나프탈렌디카르본산, 디페닐에테르디카르복실산, 디페닐디카르복실산, 디페닐설폰디카르복실산 등을 들 수 있으며, 디올 성분으로는 폴리에틸렌,α,ω-디올 즉, 에틸렌글리콜, 트리메틸렌글리콜, 테트라메틸렌글리콜, 헥사메틸렌글리콜, 네오펜틸글리콜, 시클로헥산디메틸올, 2,2 비스(4-β하이드록시 페닐-페닐)-프로판, 4,4-비스-(β-하이드록시 에폭시)-디페닐 설폰, 디에틸렌글리콜 등을 들 수 있다.The polybutylene terephthalate resin (A) used as the base resin in the present invention is obtained from polymerization of dicarboxylic acid and diol. Examples of dicarboxylic acid include terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid and diphenyl ether dicar. Acids, diphenyldicarboxylic acid, diphenylsulfondicarboxylic acid, and the like. Examples of the diol components include polyethylene, α , ω -diol, that is, ethylene glycol, trimethylene glycol, tetramethylene glycol, and hexamethylene glycol. Neopentyl glycol, cyclohexanedimethylol, 2,2 bis (4- β hydroxyphenyl-phenyl) -propane, 4,4-bis- ( β -hydroxy epoxy) -diphenyl sulfone, diethylene glycol, and the like. Can be mentioned.

본 발명에서 첨가되는 에폭시기가 1개인 에폭시 화합물은 다음 화학식 1로 나타낼 수 있는 글리시딜에테르계 화합물로 첨가량은 0.1 내지 10중량%이고, 더욱 바람직하게는 0.1 내지 2중량%이다.Epoxy compound having one epoxy group added in the present invention is a glycidyl ether compound represented by the following formula (1), the addition amount is 0.1 to 10% by weight, more preferably 0.1 to 2% by weight.

[화학식 1][Formula 1]

여기서, R1은 지방족 또는 방향족 화합물 또는 이 두가지가 결합된 형태의 화합물이다.Wherein R 1 is an aliphatic or aromatic compound or a compound of the two combined forms.

이와 같은 글리시딜에테르 화합물로는 라우릴글리시딜에테르, 부틸페닐글리시딜에테르, 알릴글리시딜에테르, 스테아릴글리시딜에테르, 메틸글리시딜에테르, 이소부틸글리시딜에테르, 페닐글리시딜에테르, 파라클로로글리시딜에테르, 나프틸글리시딜에테르, 데실글리시딜에테르, 글리시딜벤조에이트, 글리시딜부틸레이트, 페놀글리시딜에테르등이다.Such glycidyl ether compounds include lauryl glycidyl ether, butylphenyl glycidyl ether, allyl glycidyl ether, stearyl glycidyl ether, methyl glycidyl ether, isobutyl glycidyl ether, and phenyl Glycidyl ether, parachloroglycidyl ether, naphthylglycidyl ether, decylglycidyl ether, glycidyl benzoate, glycidyl butyrate, phenol glycidyl ether and the like.

일반적인 2관능기 이상의 에폭시 수지는 성형가공시 그 화학구조상 수지내 카르복실 말단기와 반응하여 겔화를 촉진하는 것에 반하여 한 개의 반응 관능기를 갖는 에폭시수지는 겔화를 촉진하지 않으면서 수지내 카르복실 말단기와 반응하여 말단기 함량을 저하시키는 특징을 갖는다. 따라서, 0.1중량% 미만에서는 이와 같은 성능이 발현되지 않으며, 10중량%를 초과하는 경우에는 과도한 함량으로 인하여 수지의 제물성이 저하되는 단점이 있으므로 본 발명에서 제시하는 범위내로 첨가하는 것이 가장 바람직하다.In general, epoxy resins having two or more functional groups react with the carboxyl end groups in the resin during the molding process to promote gelation, whereas epoxy resins having one reactive functional group do not promote gelation and do not promote gelation. Reacts to reduce the end group content. Therefore, such a performance is not expressed at less than 0.1% by weight, and when the content is more than 10% by weight, there is a disadvantage in that the physical properties of the resin are deteriorated due to the excessive content, so it is most preferable to add it within the range suggested by the present invention. .

본 발명에서 사용되는 에폭시기가 2개 이상인 에폭시 화합물(C)에 해당하는 폴리글리시딜에테르 화합물로는 폴리글리시딜아민 화합물, 비스페놀A형 에폭시 화합물, 비스페놀F형 에폭시 화합물, 레조르시놀형태 에폭시 화합물, 테트라히드록시 비스페놀F형 에폭시 화합물, 크레졸 노블락형 에폭시 화합물, 페놀노블락형 에폭시 화합물, 사이클로알리파틱에폭시 화합물로부터 선택될 수 있으며, 첨가량은 0.1 내지 10중량%이고, 바람직하게는 0.1 내지 5중량%이다.Examples of the polyglycidyl ether compound corresponding to the epoxy compound (C) having two or more epoxy groups used in the present invention include a polyglycidylamine compound, a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, and a resorcinol type epoxy. Compound, tetrahydroxy bisphenol F type epoxy compound, cresol noble type epoxy compound, phenol no block type epoxy compound, cycloaliphatic epoxy compound can be selected, the addition amount is 0.1 to 10% by weight, preferably 0.1 to 5% by weight %to be.

에폭시기가 2개 이상인 에폭시 화합물(C)도 (B)와 마찬가지로 PBT수지의 카르복실기 말단기와 반응하여 말단카르복실기의 함량을 감소시켜 PBT수지의 장기 내열성 및 내습열성을 향상시키고 분해억제 능력으로 내충격성을 향상시키는 역할을 한다. 그러나, PBT 수지의 겔화를 촉진하는 단점이 있으나, 본 발명에서와 같이 성분(B)와 혼합사용함으로써 그와 같은 문제점을 해결할 수 있으며 적절한 유동성을 유지할 수 있게된다.The epoxy compound (C) having two or more epoxy groups, like (B), reacts with the carboxyl terminal group of the PBT resin to reduce the content of the terminal carboxyl group, thereby improving the long-term heat resistance and moist heat resistance of the PBT resin, and the impact resistance by the decomposition inhibiting ability. To improve. However, there is a disadvantage in facilitating the gelation of the PBT resin, but by using in combination with the component (B) as in the present invention can solve such problems and can maintain the proper fluidity.

본 발명에서 사용하는 촉매(D)는 성분 (B), (C)의 에폭시와 PBT수지의 카르복실말단기와의 반응을 촉진하는 촉매로서 바람직하게는 인산, 아인산, 포스핀산, 포스폰산 등의 저급 알킬에스테르, 포스포늄화합물, 이미다졸 화합물, 3가아민, 4가암모늄염등이 사용될 수 있고 사용량은 0.001 내지 5중량%이다.The catalyst (D) used in the present invention is a catalyst for promoting the reaction between the epoxy of the components (B) and (C) and the carboxyl terminal group of the PBT resin, and is preferably lower grades such as phosphoric acid, phosphorous acid, phosphinic acid and phosphonic acid. Alkyl esters, phosphonium compounds, imidazole compounds, trivalent amines, tetravalent ammonium salts and the like can be used, and the amount is 0.001 to 5% by weight.

상기와 같이 본 발명에서 제시하는 범위내의 촉매를 사용함으로써 에폭시의 반응성을 높일 뿐만 아니라 PBT수지 내에서의 카르복실 말단기와 선택적 반응을 진행하게되어 에폭시의 효율을 극대화할 수 있는 특징이 있으며, 압출등 1차가공 과정에서 대부분의 에폭시가 반응을 진행하므로 사출성형등 2차 가공과정에서 수지겔화를 촉진하지 않게되는 장점이 있다.By using the catalyst within the range proposed in the present invention as described above, not only enhances the reactivity of the epoxy but also undergoes a selective reaction with the carboxyl end groups in the PBT resin, thereby maximizing the efficiency of the epoxy, and extruding Since most of the epoxy proceeds with the reaction in the primary processing process, such as injection molding has the advantage that does not promote the resin gelation in the secondary processing process.

본 발명에서 사용하는 충격보강재(E)로는 올레핀계 고무 중합체, 스티렌계 고무 중합체 및 폴리에스터엘라스토머계 충격보강재등으로 장기내열성 및 내가수분해성을 향상시킬 수 있게 된다.As the impact reinforcing material (E) used in the present invention, it is possible to improve long-term heat resistance and hydrolysis resistance with an olefinic rubber polymer, a styrene rubber polymer and a polyester elastomeric impact reinforcing material.

올레핀계 고무 중합체 충격보강재로는 에틸렌프로필렌 공중합체(EPM), 에틸렌프로필렌디엔 공중합체(EPDM)등이 있으며, 스티렌-에틸렌-부타디엔-스티렌계 충격보강재도 바람직하다. 또한, 폴리에스터 엘라스토머계 충격보강재는 폴리부틸렌테레프탈레이트를 하드 세그먼트로하고, 폴리테트라메틸렌옥사이드글리콜을 소프트세그먼트로 하여 구성된 것으로, 폴리테트라메틸렌옥사이드글리콜의 성분이 총무게 중량비로 10 내지 70중량%이다.The olefinic rubber polymer impact modifiers include ethylene propylene copolymer (EPM), ethylene propylene diene copolymer (EPDM), and the like, and styrene-ethylene-butadiene-styrene impact modifiers are also preferable. The polyester elastomeric impact modifier is composed of a polybutylene terephthalate as a hard segment and a polytetramethylene oxide glycol as a soft segment, and the components of the polytetramethylene oxide glycol are 10 to 70% by weight in a total weight ratio. to be.

본 발명에서 사용하는 난연제(F)로는 브롬화 에폭시계 난연제 또는 브롬화 폴리카보네이트계 난연제이다. 특히 브롬화에폭시계 난연제는 에폭시 자체의 우수한 전기 절연성 및 열안정성으로 성분(B),(C),(D),(E)성분에 동시에 사용하면 장기내열성 및 내습열성이 대폭 향상되는 등 본 발명에 부합되는 특성을 나타내며 보다 우수한 조성물을 수득할 수 있게된다.Flame retardants (F) used in the present invention are brominated epoxy flame retardants or brominated polycarbonate flame retardants. In particular, brominated epoxy flame retardants have excellent electrical insulation and thermal stability of epoxy itself, and when used simultaneously with components (B), (C), (D), and (E), the long-term heat resistance and heat and moisture resistance are greatly improved. It exhibits consistent properties and makes it possible to obtain better compositions.

본 발명에서 사용된 브롬화 에폭시 수지 난연제는 다음과 같은 화학식 2를 갖는 화합물로 그 사용량은 1 내지 30중량%이고, 더욱 바람직하게는 5 내지 20중량%이다.The brominated epoxy resin flame retardant used in the present invention is a compound having the following formula (2) is used in an amount of 1 to 30% by weight, more preferably 5 to 20% by weight.

[화학식 2][Formula 2]

본 발명에서 사용되는 난연조제(G)로는 일반적으로 에폭시 수지 조성물에 난연조제로 사용되는 삼산화안티몬 및 오산화안티몬이 바람직하고 사용량은 1 내지 10중량%이다.As the flame retardant aid (G) used in the present invention, antimony trioxide and antimony pentoxide, which are generally used as a flame retardant aid in an epoxy resin composition, are preferable and the amount of use is 1 to 10% by weight.

본 발명에서 무기충진재(H)로 사용된 유리섬유는 통상의 쵸프트 스트랜드가사용될 수 있으며, 수지와의 접착력을 높이기 위하여 커플링제를 사용하는 것도 가능하다. 기타 유기충진재로는 탄소섬유, 붕소섬유, 티탄산칼륨섬류, 아스베스토스, 탄산칼슘, 규산염, 알루미나, 수산화알루미늄, 활석, 점토, 운모, 유리분말, 유리비드, 황산바륨, 휘스커등이 사용될 수 있다.In the present invention, the glass fiber used as the inorganic filler (H) may be used a common chopped strand, it is also possible to use a coupling agent in order to increase the adhesion with the resin. Other organic fillers may include carbon fiber, boron fiber, potassium titanate, asbestos, calcium carbonate, silicate, alumina, aluminum hydroxide, talc, clay, mica, glass powder, glass beads, barium sulfate, whiskers, and the like.

이외에도 안정제나 산화방지제, 이형제, 적하방지제(anti-dripping agent), 안료, 무기첨가제등이 첨가될 수 있고 이때 함량은 전체 조성물에 대하여 0.1 내지 2중량%가 바람직하다.In addition, stabilizers, antioxidants, mold release agents, anti-dripping agents, pigments, inorganic additives and the like may be added, the content is preferably 0.1 to 2% by weight based on the total composition.

이하, 본 발명을 실시예를 들어 더욱 상세히 설명하고자 하나 본 발명이 하기 실시예에 의하여 제한되는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited by the following Examples.

실시예 1∼4 및 비교예 1∼5Examples 1-4 and Comparative Examples 1-5

본 발명의 실시예 및 비교예에 사용된 각 성분은 하기 표 1과 같이 정량한 뒤 헨셀믹서에서 3 내지 10분간 균일하게 혼합하고, 이축압출기에 투입하였다. 무기충진재로 사용되는 유리섬유는 측면 공급기(side feeder)를 이용하여 압출기 중간에 투입하였으며, 압출온도 240℃, 250rpm으로 압출하여 펠렛을 제조하였다.Each component used in Examples and Comparative Examples of the present invention was quantified as shown in Table 1 below, and then uniformly mixed in a Henschel mixer for 3 to 10 minutes, and then introduced into a twin screw extruder. The glass fiber used as the inorganic filler was put in the middle of the extruder using a side feeder, and the pellet was manufactured by extruding at an extrusion temperature of 240 ° C. and 250 rpm.

제조된 펠렛은 10 Oz사출기에서 사출온도 240℃, 금형온도 80℃하여 물성시편을 제조한 뒤 23℃, 상대습도 50%에서 40시간 방치한 후 ASTM 방법에 따라 물성을 측정하여 표 1에 나타내었다.The prepared pellets were prepared at 10 Oz injection machine at injection temperature of 240 ° C. and mold temperature of 80 ° C. to prepare the physical specimens, and were then left at 23 ° C. and 50% relative humidity for 40 hours. .

물성측정방법Property measurement method

PBT 카르복실 말단기 함량 : 용제로서 벤질알콜, 클로로포름, 클로로포름-메탄올 등을 사용하여 PBT를 용해시킨 후 수산화나트륨으로 적정하였다.PBT carboxyl end group content: PBT was dissolved using benzyl alcohol, chloroform, chloroform-methanol as a solvent, and then titrated with sodium hydroxide.

가수분해 : 인장강도 측정시편을 120℃, 2atm에서 100시간 동안 압력 쿠킹 테스트(pressure cooking test)를 실시한 후 인장강도 변화를 측정하여 비교하였다.Hydrolysis: The tensile strength test specimens were subjected to a pressure cooking test at 120 ° C. and 2 atm for 100 hours, and then the tensile strength change was measured and compared.

장기내열성 : 인장강도 시편을 180℃에서 200hr 경과후 강도저하를 측정하였다.Long-term heat resistance: Tensile strength specimens were measured for 200hr at 180 ° C and the strength decrease was measured.

[표 1]TABLE 1

이상에서 살펴본 바와 같이 폴리부타디엔테레프탈레이트 수지에 에폭시기를 1개 또는 2개이상 함유하는 에폭시 화합물과 촉매를 사용함으로써 폴리부타디엔테레프탈레이트가 주변 환경의 열에 의하여 분해되거나 수분에 의해 가수분해가 일어나 기계적 성질이 저하되는 단점을 방지하면서 두께가 얇은 성형품에 사출성형할 수 있도록 유동성의 개량 및 충격강도를 향상되는 효과를 갖는다.As described above, by using an epoxy compound and a catalyst containing one or two or more epoxy groups in the polybutadiene terephthalate resin, the polybutadiene terephthalate is decomposed by heat in the surrounding environment or hydrolyzed by moisture, resulting in mechanical properties. It has the effect of improving fluidity and improving impact strength so that injection molding can be performed on a thin molded article while preventing a disadvantage of deterioration.

Claims (4)

(A)폴리부타디엔테프탈레이트 수지 40 내지 90중량%,(A) 40-90 weight% of polybutadienetephthalate resins, (B)에폭시기가 1개인 에폭시 화합물 0.1 내지 10중량%,(B) 0.1 to 10% by weight of an epoxy compound having one epoxy group, (C)에폭시기가 2개 이상인 에폭시 화합물 0.1 내지 10중량%,(C) 0.1 to 10% by weight of an epoxy compound having two or more epoxy groups, (D)에폭시와 PBT 카르복실 말단기 반응촉매 0.01 내지 5중량%,(D) 0.01 to 5% by weight of an epoxy and PBT carboxyl end group reaction catalyst, (E)올레핀계, 스티렌계 고무 중합체 및 폴리에스터엘라스토머계 충격보강재 1 내지 40중량%,(E) 1 to 40% by weight of the olefin-based, styrene-based rubber polymer and polyester elastomer-based impact modifier, (F)브롬화에폭시 또는 브롬화 폴리카보네이트 올리고머 0 내지 30중량%,(F) 0 to 30% by weight of brominated epoxy or brominated polycarbonate oligomer, (G)난연조제로 삼산화안티몬 0 내지 10중량%, 및(G) 0 to 10% by weight of antimony trioxide as a flame retardant, and (H) 상기 (A)(B)(C)(D)(E)(F)(G)전체에 대하여 3 내지 50중량%의 무기충진재를 포함하는 폴리부틸렌테레프탈레이트 수지 조성물.(H) A polybutylene terephthalate resin composition comprising 3 to 50% by weight of an inorganic filler based on the entirety of (A) (B) (C) (D) (E) (F) (G). 제 1항에 있어서, 상기 에폭시기가 1개인 에폭시 화합물은 하기 화학식 1로 나타낼 수 있는 글리시딜에테르 화합물인 것을 특징으로 하는 폴리부틸렌테레프탈레이트 수지 조성물.The polybutylene terephthalate resin composition according to claim 1, wherein the epoxy compound having one epoxy group is a glycidyl ether compound represented by the following Chemical Formula 1. 화학식 1Formula 1 R1은 지방족 또는 방향족 화합물 또는 이들의 결합형이다.R 1 is an aliphatic or aromatic compound or a combination thereof. 제 1항에 있어서, 에폭시기가 2개 이상인 에폭시 화합물은 폴리글리시딜에테르 화합물, 폴리글리시딜아민에폭시화합물, 비스페놀A형 에폭시화합물, 비스페놀 F형 에폭시화합물, 레졸시놀형 에폭시 화합물, 테트라히드록시비스페놀F형 에폭시화합물, 크레졸 노볼락형 에폭시화합물, 페놀노볼락형 에폭시화합물, 사이클로알리파틱 에폭시화합물로 이루어지는 군으로부터 선택되는 것을 특징으로 하는 폴리부틸렌테레프탈레이트 수지 조성물.The epoxy compound according to claim 1, wherein the epoxy compound having two or more epoxy groups is a polyglycidyl ether compound, a polyglycidylamine epoxy compound, a bisphenol A epoxy compound, a bisphenol F epoxy compound, a resorcinol epoxy compound, or tetrahydroxy. A polybutylene terephthalate resin composition selected from the group consisting of bisphenol F type epoxy compounds, cresol novolac type epoxy compounds, phenol novolac type epoxy compounds, and cycloaliphatic epoxy compounds. 제 1항에 있어서, 상기 에폭시기가 1개인 에폭시화합물과 에폭시기가 2개 이상인 에폭시화합물의 혼합비율은 0.001 내지 99.99중량%인 것을 특징으로 하는 폴리부틸렌테레프탈레이트 수지 조성물.The polybutylene terephthalate resin composition according to claim 1, wherein the mixing ratio of the epoxy compound having one epoxy group and the epoxy compound having two or more epoxy groups is 0.001 to 99.99% by weight.
KR10-1998-0062770A 1998-12-31 1998-12-31 Polybutylene Terephthalate Resin Composition KR100430193B1 (en)

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JPH04175366A (en) * 1990-08-07 1992-06-23 Toray Ind Inc Polybutylene terephthalate resin composition
JPH0987495A (en) * 1995-09-26 1997-03-31 Kuraray Co Ltd Molding material and electric parts
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