KR100408161B1 - Apparatus for manufacturing Multi-Layered Thin Film for mass-production - Google Patents
Apparatus for manufacturing Multi-Layered Thin Film for mass-production Download PDFInfo
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- KR100408161B1 KR100408161B1 KR10-2001-0012214A KR20010012214A KR100408161B1 KR 100408161 B1 KR100408161 B1 KR 100408161B1 KR 20010012214 A KR20010012214 A KR 20010012214A KR 100408161 B1 KR100408161 B1 KR 100408161B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
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Abstract
본 발명은 양산용 다층 박막의 제작장치에 관한 것으로서, 특히, 유기물이나 금속재료를 열적 증발시켜 기판에 증착하여 다층의 박막을 형성하는 장비에 관한 것으로, 한쪽면에 다수개의 개구부(110)가 형성되고, 펌프포트(120)가 설치되는 기판이송챔버(100)와; 상기 기판이송챔버(100) 내부에 설치되어, 상기 다수개의 개구부(110)에서 해당 공정과정을 끝낸 기판들을 상기 기판이송챔버(100) 내에서 한꺼번에 다음의 개구부(110)로 이동시키는 기판이송수단(200)과; 상기 기판이송챔버(100)의 개구부(110)에 부착되는 다수개의 챔버(300)로 구성되어, 기판이송챔버 내에서 기판들을 한꺼번에 이송하고, 여러 챔버에서 한꺼번에 기판크리닝, 마스크 얼라인 및 증착 등의 해당 공정을 수행할 수 있는 것이다.The present invention relates to an apparatus for manufacturing a multilayer thin film for mass production, and more particularly, to an apparatus for forming a multilayer thin film by thermally evaporating an organic material or a metal material onto a substrate, and having a plurality of openings 110 formed on one side thereof. A substrate transfer chamber 100 in which the pump port 120 is installed; Substrate transfer means is installed in the substrate transfer chamber 100, the substrate transfer means for moving the substrates that have completed the process in the plurality of openings 110 to the next opening 110 at a time in the substrate transfer chamber (100) 200); Consists of a plurality of chambers 300 attached to the opening 110 of the substrate transfer chamber 100, transfer the substrates at once in the substrate transfer chamber, substrate cleaning, mask alignment and deposition at the same time in several chambers The process can be performed.
Description
본 발명은 양산용 다층 박막의 제작장치에 관한 것으로서, 특히, 유기물이나 금속재료를 열적 증발시켜 기판에 증착하여 다층의 박막을 형성하는 장비에 관한것으로, 기판이송 챔버(chamber) 내에서 기판 또는 기판과 마스크가 일체가된 어셈블리들을 한꺼번에 이송하고, 여러 공정챔버에서 한꺼번에 로딩, 기판 크리닝, 마스크 주입 및 얼라인, 증착 그리고 언로딩 등의 공정을 수행할 수 있도록 하는 양산용 다층 박막의 제작장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a multilayer thin film for mass production, and more particularly, to an apparatus for forming a multilayer thin film by thermally evaporating an organic material or a metal material onto a substrate, wherein the substrate or substrate is provided in a substrate transfer chamber. And an apparatus for manufacturing multi-layered thin film for mass production, which transfers the integrated assemblies and masks at once, and performs processes such as loading, substrate cleaning, mask injection and alignment, deposition, and unloading, in several process chambers at once. will be.
종래에는 기판을 이송하기 위하여 마그네틱 바(Magnetic Bar)를 진공 챔버에 설치하거나 로봇 암(Robot Arm)을 사용하였다.In the related art, a magnetic bar was installed in a vacuum chamber or a robot arm was used to transfer a substrate.
상기 마그네틱 바를 사용하면 바의 길이가 한정되어 있고, 두 개의 챔버 사이의 이송만 가능하여 여러 진공 챔버들을 통하여 연속 공정을 행하기가 어렵다.Using the magnetic bar is limited in the length of the bar, it is only possible to transfer between the two chambers, it is difficult to perform a continuous process through several vacuum chambers.
로봇 암은 주로 소형 기판으로 공정할 때 사용하는 것으로, 대형의 다층 박막 기판의 제작용 기판 이송 장비가 필요하다.The robot arm is mainly used when processing a small substrate, and a substrate transfer equipment for manufacturing a large multilayer thin film substrate is required.
한 챔버에 여러 증착셀을 설치하여 다층 박막 공정을 하면 박막 사이에 오염의 가능성이 있으므로 이를 방지하기 위한 장치가 필요하다. 예를 들어 유기 박막의 경우가 그렇다.If a plurality of deposition cells are installed in one chamber to perform a multilayer thin film process, there is a possibility of contamination between the thin films, and thus an apparatus for preventing the same is required. For example, for organic thin films.
또한, 증착 공정시 증착원이 고갈되면, 공정을 중지하고 진공상태를 상압으로 만든 후에 새 증착원으로 공급을 해주어야 하는데, 이러한 경우 박막의 제작시간이 매우 오래 걸리게 되는 단점이 있었다.In addition, when the deposition source is exhausted during the deposition process, the process must be stopped and the vacuum state is made at atmospheric pressure and then supplied to a new deposition source. In this case, the manufacturing time of the thin film was very long.
본 발명은 상기의 결점을 해소하기 위한 것으로, 기판 위에 다층박막들을 형성하는데 있어서 제작시간이 적게 들며, 상호 오염되지 않은 상태에서 박막들을 기판에 효과적으로 생장시키는 양산장비를 제공하고자 한다.The present invention is to solve the above-mentioned drawbacks, the manufacturing time is low in forming a multi-layer thin film on the substrate, and to provide a mass production equipment for effectively growing the thin film on the substrate in a non-contaminated state.
본 발명의 다른 목적으로서, 본 발명의 양산용 다층 박막 제작장치에서 증착챔버의 진공을 깨지 않고 증착셀을 교환할 수 있는 회전식 증착셀 교환장치를 제공하고자 한다.Another object of the present invention is to provide a rotary deposition cell exchange apparatus capable of exchanging deposition cells without breaking the vacuum of the deposition chamber in the mass production multilayer thin film production apparatus of the present invention.
본 발명은 다수개의 개구부가 형성되고, 펌프포트가 설치되는 기판이송챔버와; 상기 기판이송챔버 내부에 설치되어, 상기 각각의 다수개의 개구부에서 해당 공정과정을 끝낸 기판들을 상기 기판이송챔버 내에서 한꺼번에 다음의 개구부로 이동시키는 기판이송수단과; 상기 기판이송챔버의 개구부에 부착되는 다수개의 챔버를 구성함으로써 달성된다.The present invention is a substrate transfer chamber is formed with a plurality of openings, the pump port is installed; A substrate transfer means installed in the substrate transfer chamber to move the substrates which have completed the process in each of the plurality of openings to the next opening at once in the substrate transfer chamber; It is achieved by configuring a plurality of chambers attached to the opening of the substrate transfer chamber.
도 1은 본 발명의 양산용 다층 박막 제작장치의 일실시예를 나타내는Figure 1 shows an embodiment of the multi-layer thin film manufacturing apparatus for mass production of the present invention
분해사시도,Exploded View,
도 2는 본 발명의 양산용 다층 박막 제작장치의 일실시예를 나타내는Figure 2 shows an embodiment of the multi-layer thin film manufacturing apparatus for mass production of the present invention
정단면도,Cross Section,
도 3은 본 발명의 양산용 다층 박막 제작장치의 일실시예를 나타내는Figure 3 shows an embodiment of the multi-layer thin film manufacturing apparatus for mass production of the present invention
측단면도,Cross Section,
도 4는 본 발명의 양산용 다층 박막 제작장치를 구성하는 단일구조를Figure 4 is a unitary structure constituting the multi-layer thin film manufacturing apparatus for mass production of the present invention
나타내는 사시도,Indicating perspective,
도 5는 도 4의 단일구조가 연결된 상태를 나타내는 단면도,5 is a cross-sectional view showing a state in which the unitary structure of FIG. 4 is connected;
도 6은 본 발명의 양산용 다층 박막 제작장치의 다른 실시예를 나타내는Figure 6 shows another embodiment of the multi-layer thin film production apparatus of the present invention
분해사시도,Exploded View,
도 7은 본 발명의 양산용 다층 박막 제작장치의 다른 실시예를 나타내는Figure 7 shows another embodiment of the mass production thin film manufacturing apparatus of the present invention
저면도,Bottom View,
도 8은 본 발명의 양산용 다층 박막 제작장치의 다른 실시예를 나타내는Figure 8 shows another embodiment of the multi-layer thin film manufacturing apparatus for mass production of the present invention
단면도,Cross-section,
도 9는 본 발명의 양산용 다층 박막 제작장치에서 다수개의 증착셀을 사용9 is using a plurality of deposition cells in the multi-layer thin film manufacturing apparatus for mass production of the present invention
할 수 있는 회전식 증착셀 교환장치를 나타내는 단면도,Cross-sectional view showing a rotary deposition cell exchange device,
도 10은 본 발명의 회전식 증착셀 교환장치의 내면을 나타내는 사시도.10 is a perspective view showing the inner surface of the rotary deposition cell exchanger of the present invention.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
100 : 기판이송챔버 110 : 개구부100: substrate transfer chamber 110: opening
200 : 기판이송수단 210 : 체인200: substrate transfer means 210: chain
230 : 기판 홀더 240 : 덮개밸브230: substrate holder 240: cover valve
300 : 챔버 310 : 로딩챔버300: chamber 310: loading chamber
320 : 언로딩챔버 330 : 공정챔버320: unloading chamber 330: process chamber
400 : 회전식 증착셀 교환장치 410 : 상측챔버400: rotary deposition cell exchange device 410: upper chamber
420 : 하측챔버420: lower chamber
본 발명의 실시예를 첨부 도면을 참고하여 상세히 설명하면 다음과 같다.An embodiment of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명의 양산용 다층 박막 제작장치의 일실시예를 나타내는 분해사시도이고, 도 2는 본 발명의 양산용 다층 박막 제작장치의 일실시예를 나타내는 정단면도이며, 도 3은 본 발명의 양산용 다층 박막 제작장치의 일실시예를 나타내는 측단면도로서, 본 발명은 공정용 챔버 설치를 위한 다수개의 개구부(110)가 형성되고, 펌프포트(120)가 설치되는 기판이송챔버(100)와; 상기 기판이송챔버(100) 내부에 설치되어, 상기 각각의 다수개의 개구부(110)에서 해당 공정과정을 끝낸 기판들을 상기 기판이송챔버(100) 내에서 한꺼번에 다음의 개구부(110)로 이동시키는 기판이송수단(200)과; 상기 기판이송챔버(100)의 개구부(110)에 부착되는 다수개의챔버(300)로 구성되는 것을 그 기술상의 특징으로 한다.1 is an exploded perspective view showing an embodiment of a mass production multilayer thin film manufacturing apparatus of the present invention, Figure 2 is a front sectional view showing an embodiment of the mass production multilayer thin film manufacturing apparatus of the present invention, Figure 3 is As a side cross-sectional view showing an embodiment of a multi-layer thin film manufacturing apparatus for mass production, the present invention is a substrate transfer chamber 100 is formed with a plurality of openings 110 for the installation of the process chamber, the pump port 120 and ; The substrate transfer is installed in the substrate transfer chamber 100 to move the substrates that have completed the process in each of the plurality of openings 110 to the next opening 110 at once in the substrate transfer chamber 100. Means (200); Technical features of the present invention include a plurality of chambers 300 attached to the opening 110 of the substrate transfer chamber 100.
상기 기판이송챔버(100)는 긴 통모양으로 형성되고, 기판 크리닝, 마스크 주입 및 얼라인, 증착, 로딩, 언로딩 등의 과정을 수행하기 위한 챔버들이 설치될 수 있도록 다수개의 개구부(110)가 형성되고, 상기 기판이송수단(200)의 장착의 편의를 위하여 별도의 덮개(130)가 구성될 수도 있다.The substrate transfer chamber 100 is formed in a long cylindrical shape, and a plurality of openings 110 are provided so that chambers for performing substrate cleaning, mask injection and alignment, deposition, loading, and unloading may be installed. Is formed, a separate cover 130 may be configured for the convenience of mounting the substrate transfer means 200.
상기 다수개의 챔버(300)는 로딩챔버(310), 증착 및 기타 공정을 위한 공정챔버(330) 및 언로딩챔버(320)로 일반적으로 구성되며, 상기 로딩챔버(310)는 기판이송챔버(100)의 일측단에 형성된 개구부(111)에 설치되며, 펌프 포트(311)와 도어(312)를 가진다.The plurality of chambers 300 is generally composed of a loading chamber 310, a process chamber 330 and an unloading chamber 320 for deposition and other processes, the loading chamber 310 is a substrate transfer chamber 100 It is installed in the opening 111 formed at one end of the), and has a pump port 311 and the door 312.
상기 언로딩챔버(320)는 상기 기판이송챔버(100)의 타측단 개구부(112)에 설치되며, 펌프 포트(321)와 도어(322)를 가진다. 이 두 챔버 사이에는 다수개의 공정챔버(330)들이 기판이송챔버(100)의 개구부(110)에 설치되며, 각각 펌프 포트(331)와 증착셀 포트(332)를 가진다.The unloading chamber 320 is installed at the other end opening 112 of the substrate transfer chamber 100 and has a pump port 321 and a door 322. Between the two chambers, a plurality of process chambers 330 are installed in the opening 110 of the substrate transfer chamber 100, and each has a pump port 331 and a deposition cell port 332.
상기 공정챔버(330)는 기판 크리닝, 마스크 주입 및 얼라인, 증착 등의 공정을 할 수 있도록 상기 기판이송챔버(100)의 개구부(111)에 설치되며, 그 역할에 따라, 펌프 포트와 도어를 가지는 기판 크리닝챔버와, 상기 기판이송챔버의 개구부에 설치되며, 펌프 포트와 도어를 가지는 마스크 얼라인 챔버와, 상기 기판이송챔버의 개구부에 설치되며, 각각 펌프 포트와 증착셀 포트를 가지는 다수개의 증착챔버로 구성된다.The process chamber 330 is installed in the opening 111 of the substrate transfer chamber 100 to perform substrate cleaning, mask injection and alignment, deposition, and the like. A plurality of depositions having a substrate cleaning chamber, a mask alignment chamber having a pump port and a door, and an opening of the substrate transfer chamber, each having a pump port and a deposition cell port. It consists of a chamber.
기판에 여러 공정을 할 수 있도록 상부에 입구(330a)가 형성되어 있으며,하부에는 기판크리닝 장치, 마스크얼라인 장치, 그리고 증착공정의 경우 증착셀을 설치하도록 증착셀 포트(332)가 형성되어 있고, 후단에는 진공 펌프가 설치되는 펌프 포트(331)가 설치된다.An inlet 330a is formed at the upper part to perform various processes on the substrate, and a deposition cell port 332 is formed at the bottom of the substrate cleaning device, a mask aligning device, and a deposition cell in the deposition process. The rear end is provided with a pump port 331 in which a vacuum pump is installed.
상기 기판이송챔버(100)에 형성되는 개구부(110)와 공정챔버(330)의 수는 해당 제작되는 소자에 따라 많아지거나 적어질 수도 있으나, 유기 전계 발광소자의 경우를 예로 들면 대략 20개 정도에 이르게 된다. 그리하여 상기와 같이 그 수가 많아지는 경우에는 상기 기판이송챔버(100)의 길이가 길어지기 때문에, 그 모양을 일자형 뿐 만 아니라 도넛 모양이나, 유(U)자 모양으로 하는 것이 공간 이용에 편리할 수 있다.The number of the openings 110 and the process chambers 330 formed in the substrate transfer chamber 100 may be increased or decreased depending on the fabricated device, but the organic electroluminescent device may be, for example, about 20 units. This leads to. Therefore, when the number increases as described above, since the length of the substrate transfer chamber 100 becomes long, it may be convenient to use not only the straight shape but also the donut shape or the U shape to make the space useful. have.
또한, 상기 기판이송수단(200)은 레일(210)과; 상기 레일(210) 상에서 일방향으로 이동하는 이동체(220)와; 상기 이동체(220)에 부착되어 기판을 고정시키는 기판홀더(230)로 구성되어, 상기 이송체(220)에 기판 또는 기판 및 마스크가 일체로 되어 이송되면서 공정이 수행된다.경우에 따라서는 컨베이어 벨트 방식의 이동수단에 기판이 부착되어 이송되도록 할 수도 있다.In addition, the substrate transfer means 200 and the rail (210); A moving body 220 moving in one direction on the rail 210; It is composed of a substrate holder 230 attached to the moving body 220 to fix the substrate, the process is performed while the substrate or the substrate and the mask is integrally transferred to the transfer body 220. In some cases, the conveyor belt The substrate may be attached to and transferred to the moving means.
상기 이동체(220)는 다수개를 사용하여 상기 각 공정챔버(330) 위를 각 공정이 끝나면 연속적으로 이동할 수 있도록 하며, 모든 증착 과정이 끝난 기판을 부착한 이동체(220)는 일측에 차례로 쌓이게 하거나 회수할 수 있도록 할 수도 있다(도시되지 않음).The movable body 220 is used to move continuously on each process chamber 330 after each process using a plurality of, the movable body 220 attached to the substrate after all the deposition process is stacked on one side in turn or It may also be possible to recover (not shown).
또한 경우에 따라서는 상기 기판이송챔버(100)의 개구부(110)를 밀폐할 수 있도록 하는 덮개밸브(240)를 추가 구성하여, 기판 홀더(230)가 각 공정챔버(330)까지 내려가면 상기 기판이송챔버(100)의 하부에 있는 개구부(110)를 밀폐수단(10)을 통하여 밀폐시키도록 한다.In addition, in some cases, the cover valve 240 may be further configured to seal the opening 110 of the substrate transfer chamber 100, and the substrate holder 230 may be lowered to each process chamber 330. The opening 110 in the lower portion of the transfer chamber 100 is sealed through the sealing means 10.
상기 밀폐수단(10)으로서는 일반적으로 사용하는 오링(O-ring)을 사용하는 것이 바람직하다.As the sealing means 10, it is preferable to use an O-ring generally used.
상기와 같이, 증착시 기판이송챔버(100)와 공정챔버(330)들을 분리함으로써, 공정챔버(330)에서 증발되는 가스에 의한 오염을 방지할 수 있고, 높은 진공도를 유지할 수 있다.As described above, by separating the substrate transfer chamber 100 and the process chamber 330 during deposition, it is possible to prevent contamination by the gas evaporated in the process chamber 330, it is possible to maintain a high degree of vacuum.
상기 기판이송수단(200)의 다른 예로서는 한 쌍의 체인과, 이 체인에 일정한 간격으로 다수개의 상기 기판홀더를 부착하여 구성함으로써도 동일한 작용효과를 얻을 수 있다(도시되지 않음).As another example of the substrate transfer means 200, the same operation effect can be obtained by attaching a pair of chains and a plurality of the substrate holders at regular intervals to the chains (not shown).
상기 기판이송챔버(100)와 다수개의 챔버(300)는 상기한 바와 같이, 기판이송챔버(100)에 다수개의 챔버(300)를 부착하여 상기와 같은 구조를 이룰 수도 있으나, 도 4 및 도 5에서 도시하는 바와 같이, 하나의 챔버와 기판이송챔버가 일체로 된 단일구조(150)를 반복하여 접합시킴으로써도 전체적으로 상기 도 2에서 도시하는 구조를 이룰 수 있다.As described above, the substrate transfer chamber 100 and the plurality of chambers 300 may be formed by attaching the plurality of chambers 300 to the substrate transfer chamber 100, but may have the same structure as described above with reference to FIGS. 4 and 5. As shown in FIG. 2, the structure illustrated in FIG. 2 may be formed as a whole by repeatedly joining a single structure 150 in which one chamber and a substrate transfer chamber are integrated.
즉, 상기 하나의 챔버와 기판이송챔버의 일부분이 각각 상측부(151)와 하측부(152)로서 일체로 형성된 단일구조(150)를 서로 이웃하여 반복하여 접합시킨 후에, 서로 인접한 단일구조(150)의 상측부(151)는 개구된 연결부(151a)로 연결이 되어 상기 기판이송수단(200)이 위치할 수 있도록 기판이송챔버(100)가 형성되고, 서로 인접한 단일구조(150)의 하측부(152)는 서로 벽으로 구분되어 연결되어 형성됨으로써, 증착과 로딩 및 언로딩의 역할을 수행하는 각 챔버(300)를 이루게 된다.That is, after the one chamber and a portion of the substrate transfer chamber are repeatedly bonded to each other by repeatedly joining the single structure 150 formed integrally as the upper portion 151 and the lower portion 152, respectively, the adjacent single structure 150 is adjacent to each other. The upper portion 151 of the) is connected to the open connection portion 151a so that the substrate transfer chamber 100 is formed so that the substrate transfer means 200 is located, and the lower portion of the single structure 150 adjacent to each other. 152 is formed by being separated from each other by a wall to form a chamber 300 to perform the role of deposition, loading and unloading.
도 6은 본 발명의 양산용 다층 박막 제작장치의 다른 실시예를 나타내는 분해사시도이고, 도 7은 본 발명의 양산용 다층 박막 제작장치의 다른 실시예를 나타내는 저면도이며, 도 8은 본 발명의 양산용 다층 박막 제작장치의 다른 실시예를 나타내는 단면도로서, 본 실시예에서는 상기 기판이송챔버(100)의 일측에 펌프 포트가 설치되고, 원통형 혹은 다각형 통모양으로 형성되어, 하측면에 다수개의 개구부(110)가 통의 중심에서 같은 거리에 형성되도록 하는 것을 그 기술상의 특징으로 한다.Figure 6 is an exploded perspective view showing another embodiment of the mass production multilayer thin film manufacturing apparatus of the present invention, Figure 7 is a bottom view showing another embodiment of the mass production multilayer thin film manufacturing apparatus of the present invention, Figure 8 is Cross-sectional view showing another embodiment of the multi-layer thin film manufacturing apparatus for mass production, in this embodiment, the pump port is provided on one side of the substrate transfer chamber 100, formed in a cylindrical or polygonal cylindrical shape, a plurality of openings on the lower side The technical feature is that the 110 is formed at the same distance from the center of the barrel.
또한 본 실시예에서 상기 기판이송수단(200)은 상기 원통형 혹은 다각형 통모양의 기판이송챔버(100)의 중심에 설치되는 중심축(250)과; 상기 중심축(250)에서 로드(260)로 분기되어 설치되는 기판 홀더(230)로 구성됨으로써, 상기 중심축(250)에 따라 회전함으로써 기판을 이송시키도록 하는 것이 바람직하다.In addition, in the present embodiment, the substrate transfer means 200 includes a central axis 250 installed at the center of the cylindrical or polygonal cylindrical substrate transfer chamber 100; The substrate holder 230 is branched from the central axis 250 to the rod 260. The substrate holder 230 is preferably rotated along the central axis 250 to transfer the substrate.
이때에도 기판이송챔버(100)에 덮개(140)를 형성할 수 있으며, 이때에는 상기 중심축(250)이 위치할 수 있도록 축덮개부(141)를 형성하는 것이 바람직하다.In this case, the cover 140 may be formed in the substrate transfer chamber 100. In this case, it is preferable to form the shaft cover part 141 so that the central axis 250 is located.
그리하여 해당 증착과정이 끝나면 회전장치(도시되지 않음)를 이용하여 상기 중심축(250)을 적당한 각도로 회전하도록 하여, 그 다음의 공정챔버(330)에서 기판에 증착과정이 일어나도록 할 수 있는 것이다.Thus, when the deposition process is completed, the central axis 250 may be rotated at an appropriate angle by using a rotating device (not shown), so that the deposition process may occur on the substrate in the next process chamber 330. .
다층 박막의 기판을 양산할 때 증착셀의 증착원이 고갈되어 이를 교체하여야 할 때가 생긴다. 도 9와 도 10은 본 발명의 양산용 다층 박막 제작장치에서 공정챔버(330)의 진공을 깨지 않고 증착셀(A)을 연속으로 주입할 수 있는 회전식 증착셀교환장치(400)를 도시하고 있다.When mass-producing a substrate of a multi-layer thin film, the deposition source of the deposition cell is depleted and there is a time to replace it. 9 and 10 illustrate a rotary deposition cell exchange apparatus 400 capable of continuously injecting the deposition cell A without breaking the vacuum of the process chamber 330 in the mass production multilayer thin film manufacturing apparatus of the present invention. .
이러한 회전식 증착셀 교환장치(400)는 상기 공정챔버(330)의 증착셀 포트(332)에 연결되는 연결포트(411)와 펌프포트(412)를 가지는 상측챔버(410)와; 상기 상측챔버(410)에 회전 가능하게 결합되고 다수의 증착셀(A)이 놓여지는 하측챔버(420)와; 상기 하측챔버(420)를 회전시키는 회전수단(도시되지 않음)으로 구성되도록 함으로써, 각 증착작업 중에 증착원이 고갈되었을 경우에 각 챔버(300)의 진공을 깨지 않고도 효율적으로 증착셀(A)을 교환할 수 있도록 할 수 있다.The rotary deposition cell exchange apparatus 400 includes an upper chamber 410 having a connection port 411 and a pump port 412 connected to the deposition cell port 332 of the process chamber 330; A lower chamber 420 rotatably coupled to the upper chamber 410 and having a plurality of deposition cells A disposed thereon; The lower chamber 420 is rotated to rotate the lower chamber 420 (not shown), so that when the deposition source is exhausted during each deposition operation, the deposition cell A can be efficiently removed without breaking the vacuum of each chamber 300. Can be exchanged.
도 10에 도시된 바와 같이, 상기 하측챔버(420) 위에는 다수개의 증착셀(A)이 상기 하측챔버(420)의 원주를 따라 배치되게 되어, 모든 증착셀(A)이 모두 소모되기 전까지는 중지되지 않고 공정을 진행시킬 수가 있다.As shown in FIG. 10, a plurality of deposition cells A are disposed along the circumference of the lower chamber 420 on the lower chamber 420, and thus stop until all the deposition cells A are exhausted. The process can be carried out without.
이하, 상기 도 1 내지 도 10을 참조하여 본 발명의 작용 및 효과를 상세히 설명하면 다음과 같다.Hereinafter, the operation and effects of the present invention will be described in detail with reference to FIGS. 1 to 10.
상기 로딩챔버(310)에서는 박막 공정될 기판이 기판 홀더(230)에 부착된다. 상기 기판 홀더(230)에 부착된 기판은 다음의 공정챔버(330)로 이송되어 기판크리닝, 마스크얼라인 공정후 기판과 마스크가 일체가 된 어셈블리가 함께 이동하여 해당 챔버(300)에서 여러 증착 공정에 의한 박막이 형성되며, 동시에 로딩챔버(310)에서는 박막 공정될 다음 기판이 기판 홀더(230)에 부착된다.In the loading chamber 310, a substrate to be a thin film process is attached to the substrate holder 230. The substrate attached to the substrate holder 230 is transferred to the next process chamber 330, and after the substrate cleaning and mask aligning process, the assembly in which the substrate and the mask are integrated together moves together to form various deposition processes in the chamber 300. A thin film is formed, and at the same time, the next substrate to be thin film processed in the loading chamber 310 is attached to the substrate holder 230.
이때 로딩챔버(310)는 덮개밸브(240) 혹은 추가적으로 설치되는 밸브에 의해 진공인 기판이송챔버(100)와 분리되도록 하여, 기판이송챔버(100)의 진공을 깨지 않고 로딩챔버 만을 대기중에 노출할 수 있게 한다.At this time, the loading chamber 310 is separated from the substrate transfer chamber 100 which is a vacuum by the cover valve 240 or an additional valve to expose only the loading chamber to the atmosphere without breaking the vacuum of the substrate transfer chamber 100. To be able.
언로딩챔버(320)도 같은 방식으로 기판이송챔버(100)와 밸브로 차단한 다음, 증착 공정이 모두 끝난 기판을 상기 기판이송챔버(100)와 공정챔버(330)의 진공을 깨지 않고 언로딩챔버(320)에서 꺼낼 수 있다.The unloading chamber 320 is also blocked by the substrate transfer chamber 100 and the valve in the same manner, and then the unloaded substrate is unloaded without breaking the vacuum of the substrate transfer chamber 100 and the process chamber 330. May be taken out of chamber 320.
이러한 방법으로 로딩과 언로딩 및 다수의 증착 공정을 동시에 실행하므로 다층 박막의 기판을 대량생산 할 수 있고 제작 시간을 단축시킬 수 있다.In this way, loading, unloading and multiple deposition processes can be performed simultaneously, enabling mass production of multilayer thin film substrates and shortening manufacturing times.
상기 도 6 내지 도 8에서 도시하는 실시예에서 로딩챔버(310)와 언로딩챔버(320) 및 공정챔버(330)들의 기본 기능은 상기의 실시예에서와 동일하며 공정챔버(330)의 수는 조절이 가능하다.6 to 8, the basic functions of the loading chamber 310, the unloading chamber 320, and the process chamber 330 are the same as in the above embodiment, and the number of process chambers 330 is Adjustable
이 실시예에서는 특히, 박막 제작장치의 형태가 간단하고, 펌프 포트가 장비의 안쪽인 공정챔버(330)의 후단부에 부착되어 있으므로 설치 공간을 줄일 수 있다.In this embodiment, in particular, the shape of the thin film manufacturing apparatus is simple, and the pump port is attached to the rear end of the process chamber 330, which is the inside of the equipment, it is possible to reduce the installation space.
상기 회전식 증착셀 교환장치(400)는 다수개의 증착셀(A)이 놓인 하측챔버(420)를 이용하여 해당 증착셀로 증착 공정을 실행하다가, 증착원이 고갈되면 상기 하측챔버(420)를 일정각도 회전한다.The rotary deposition cell exchange apparatus 400 executes a deposition process to a corresponding deposition cell using a lower chamber 420 on which a plurality of deposition cells A are placed, and when the deposition source is exhausted, the lower chamber 420 is fixed. Rotate the angle.
그러면 상기 연결포트(411)쪽에는 새로운 증착셀(A)이 위치하게 되고, 이 새로운 증착셀(A)을 사용하여 증착 공정을 계속할 수 있게 된다.Then, a new deposition cell A is positioned at the connection port 411, and the deposition process can be continued using the new deposition cell A. FIG.
이때, 상기 상측챔버(410)와 하측챔버(420)는 상기한 바와 같이, 서로 회동 가능하나, 그 사이에는 오링(O-ring)으로 밀폐가 되어 있다. 즉, 공정챔버(330)의 진공과 증착 공정에 아무런 영향을 주지 않고 증착셀을 교환할 수 있게 되는 것이다.At this time, the upper chamber 410 and the lower chamber 420, as described above, can be rotated with each other, between them is sealed with an O-ring (O-ring). That is, it is possible to exchange the deposition cells without affecting the vacuum and the deposition process of the process chamber 330.
이상과 같은 본 발명은 진공 내에서 기판들을 연속적으로 각 공정챔버에 이송할 수 있고, 로딩, 기판크리닝, 마스크 주입 및 얼라인, 언로딩 및 다수의 증착 공정을 동시에 실행하여 다층 박막의 기판을 양산하는 효과가 있다.As described above, the present invention can continuously transfer substrates to respective process chambers in a vacuum, and simultaneously execute loading, substrate cleaning, mask injection and alignment, unloading, and multiple deposition processes to mass-produce substrates of multilayer thin films. It is effective.
각 증착챔버에는 다른 종류의 증착원이 들어 있는 증착셀이 설치되어 증착 공정을 수행하므로 상호 오염되지 않은 다층 박막의 기판을 제작할 수 있다.Each deposition chamber is provided with a deposition cell containing a different type of deposition source to perform a deposition process, thereby manufacturing a substrate of a multilayer thin film that is not contaminated with each other.
상기의 회전식 증착셀 교환장치를 사용함으로써, 증착챔버의 진공을 깨지 않고 증착셀을 교환할 수 있어 제작 시간을 단축하는 효과가 있다.By using the rotary deposition cell exchange device described above, deposition cells can be exchanged without breaking the vacuum of the deposition chamber, thereby reducing the production time.
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