KR100401115B1 - Dressing apparatus of pads in double side polisher and method using thereof - Google Patents

Abstract

The present invention includes a lower plate with a first pad, an upper plate with a second pad, an inner circumference gear formed at an upper center of the lower plate, an outer circumference gear formed on an edge portion of the first pad, and an inner circumference gear of the upper plate. A dressing apparatus and method for dressing said first and second pads of a double-side polisher comprising grooves formed in a corresponding portion thereof, wherein said high pressure deionized water is sprayed to separate solids adhered to said first and second pads. And a pressurizing means for supplying a water pressure of the deionized water to the water supply pipe to increase the water pressure of the deionized water, and reciprocating between the inner gear and the outer gear to sweep and remove the separated solids on the first and second pads. The brush block and the brush block to move up and down in contact with the first pad as well as the reciprocating motion between the inner gear and the outer gear. The key includes a dresser arm, comprising: installing a brush block in contact with the first pad; lowering the top plate such that the second pad is in contact with the brush block; and the first and second pads. High pressure injection of deionized water through a water supply pipe to separate the solid matter adhered to the first and second pads, and the brush block reciprocates between the inner and outer gears to reciprocate the first and second pads. Sweeping off the solids separated from the

Description

Dressing apparatus of pads for double side polisher and method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pad dressing apparatus and method for a double-side polisher capable of simultaneously polishing both sides of a semiconductor wafer, and in particular, reacts with wafers and polishing liquids remaining in respective pads attached to the upper and lower plates in the polishing process. The present invention relates to a pad dressing apparatus and method for a double-side polisher capable of removing solids produced by the same.

Double-sided polishing is a method of simultaneously polishing the surface and backside of a semiconductor wafer for the purpose of improving the flatness of the processed wafer and preventing the backside from transferring contaminants to the frontside. In the above-mentioned double-sided polishing is less than the single-side polishing process stress is excellent flatness.

1 is a side view of a double-side polisher having a pad dressing apparatus according to the prior art.

The double-sided polishing machine according to the prior art is provided with a lower top plate 13 on the turntable 11, and an upper top plate 19 is installed to correspond to the lower top plate 13.

An inner circumferential gear 15 is installed at the upper center of the lower surface plate 13. Then, the first pad 14 is attached to the remaining portion except the center where the inner gear 15 is formed on the lower plate 13, and the outer gear 17 is installed on the edge of the first pad 14. do.

The upper plate 19 corresponds to the lower plate 13 by the support 23 and is driven up and down by the driving device 25. The groove 21 into which the inner peripheral gear 15 is inserted is formed in the center of the surface facing the lower surface 13 of the upper surface 19. In the above, the side surface of the groove 21 is uneven to be engaged with the outer surface of the inner circumferential gear 15. Then, the second pad 20 is attached to the remaining portion except the center where the groove 21 of the surface facing the lower plate 13 of the upper plate 19 is formed.

The operation of the double-side polishing machine of the above-described configuration will be described.

A plurality of disc shaped carriers (not shown) are mounted on the first pad 14 of the lower plate 11 with a plurality of wafers (not shown) to be processed. In the above, the carrier penetrates a portion to which the wafer is inserted so that the surface and the back of the wafer are exposed, and the inner and outer sides of the carrier are concave and convex to engage the inner and outer gears 15 and 17. Then, the upper peripheral plate 19 is inserted into the groove 21 by the drive device 25 so that the second pad 20 is brought into contact with the carrier. Therefore, each of the front and back surfaces of the wafer is pressed in contact with the first and second pads 14 and 20 attached to the lower plate 13 and the upper plate 19. In the above, the drive device 25 is composed of a cylinder to raise and lower the upper plate 19.

The lower plate 13 and the inner and outer gears 15 and 17 are rotated by respective driving devices (not shown). At this time, the plurality of carriers in which the plurality of wafers are inserted are rotated by the inner gear 15 and the outer gear 17 while driving along the lower plate 13. In addition, since the inner circumferential gear 15 is inserted into the groove 21 and engaged, the upper plate 19 rotates.

Then, a polishing liquid composed of an abrasive and a corrosion solution is injected. At this time, the corrosive component corrodes the rough portions of the surface and back side of the wafer to be processed and the abrasive promotes abrasion when the corroded portion is rubbed with the first and second pads 14 and 20. Therefore, the wafer to be processed is mirror polished simultaneously on the rough surfaces of the surface and the back.

In the above processing of the wafer, the solids hardened by the reaction of the wafer and the corrosion solution adhere to the surfaces of the first and second pads 14 and 20. Solids stuck to the surfaces of the first and second pads 14 and 20 may cause scratches on the surface and back of the wafer being processed in subsequent polishing processes. Therefore, a dressing step is needed to remove solids stuck to the surface of the first and second pads 14 and 20 after wafer polishing.

The carrier is removed to remove solids that have adhered to the surfaces of the first and second pads 14, 20. As shown in FIG. 1, a brush block 27 is provided on the first pad 14. Brush block 27 is made of a disc (PVC) such as polyvinyl chloride (PVC) is formed in the upper and lower soles. In addition, the brush block 27 is installed by hand, so that the inner and outer sides of the inner and outer circumference, such as a carrier, are engaged with the inner and outer gears 15 and 17.

Then, the upper platen 19 is lowered by the drive device 25. Therefore, the upper and lower soles of the brush block 27 are pressed against the first and second pads 14 and 20 attached to the lower plate 13 and the upper plate 19.

Then, the lower platen 13 and the inner and outer gears 15 and 17 are rotated by respective driving devices (not shown) in the same manner as in the polishing process. At this time, the brush block 27 is rotated by the inner gear 15 and the outer gear 17 while driving along the lower platen 13. Therefore, the solids stuck to the first and second pads 14 and 20 are removed by the upper and lower brushes of the brush block 27 being rotated.

However, in the above-described prior art, the brush block is worn by the friction with the inner and outer gears in the dressing step, so that fine particles are generated. Therefore, even if the solids fixed on the surface of the first and second pads by the dressing are removed, the fine particles generated in the brush block in the dressing step are not removed, thereby reducing the dressing effect.

In addition, since the brush block has to be manually installed and removed on the lower plate, there is a problem that takes a lot of time.

Accordingly, an object of the present invention is to provide a pad dressing apparatus of a double-side polishing machine that automatically installs a brush block when dressing and can prevent generation of fine particles due to wear of the brush block.

Another object of the present invention is to provide a pad dressing method of a double-sided polishing machine that can prevent the generation of fine particles due to wear of the brush block when dressing.

The present invention for achieving the above object, the lower plate with the first pad, the upper plate with the second pad, the inner peripheral gear formed in the upper center of the lower plate, the outer peripheral gear formed on the edge portion of the first pad A dressing apparatus for dressing the first and second pads of a double-sided polishing machine, the dressing device comprising: pressurizing means for increasing and supplying water pressure of deionized water, one end connected to the pressurizing means, and the other end of the first and second pads; A water supply pipe extending to be disposed between the pads, injecting deionized water supplied from the pressurizing means to separate the solids fixed to the first and second pads, and simultaneously contacting the first and second pads. And a brush block for sweeping and removing the separated solids on the first and second pads, and the brush block is connected to one end thereof so that the brush block is in the inner circumference. And a dresser arm that enables reciprocating motion between the fish and the outer gear, and which is installed in close contact with a part of the water supply pipe so that deionized water can be injected close to the brush block. According to the present invention, a lower plate with a first pad, an upper plate with a second pad, an inner circumference gear formed at an upper center of the lower plate, an outer circumference gear formed on an edge portion of the first pad, the inner circumference of the upper plate Generated by the reaction of the wafer and the polishing liquid during polishing in a double-side polishing machine for simultaneously polishing the surface and the backside of the wafer with the first and second pads while supplying the polishing liquid including grooves formed in the portion corresponding to the gear. In the dressing method for removing the solids adhered to the surface of the first and second pads, the dressing method is in contact with the first pad Installing a brush block, lowering the upper plate such that the second pad is in contact with the brush block, and spraying deionized water with a high pressure on the first and second pads through a water supply pipe. Separating the solids fixed to the two pads, and sweeping the solids separated from the first and second pads by reciprocating the brush block between the inner and outer gears.

Preferably, the pressurizing means consists of a high pressure pump.

Preferably, the brush block is formed in a rod shape of polyvinyl chloride (PVC), and a brush is formed on and in contact with the first and second pads.

Preferably, the dresser arm drives the brush block so that no mechanical interference occurs by contacting the inner and outer gears.

Preferably, the dresser arm is installed to be movable up and down of the brush block by its own shangdong, so that the brush block can contact the first pad and the second pad.

1 is a side view of a double-side polishing machine having a pad dressing apparatus according to the prior art.

2 is a side view of a double-sided polishing machine having a pad dressing apparatus according to the present invention.

3 is a plan view showing a pad dressing method according to the present invention. 31... Turntable 33... 1 pad 35 ...................... main gear 37 ............. outer gear 39 .......... 2nd pad 41 .......... groove 43 ......... support 45 .......... drive mechanism 47 ......... brush Block 51 .......... Water Supply 53 .........

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a side view of a double-side polishing machine having a dressing apparatus according to the present invention, Figure 3 is a plan view showing a pad dressing method according to the present invention.

The lower surface plate 33 is provided on the turntable 31 according to the present invention, and the upper surface plate 39 is installed to correspond to the lower surface plate 33.

The inner circumference gear 35 is installed in the upper center of the lower plate 33. The first pad 34 is attached to the remaining portion except the center where the inner gear 35 is formed on the lower plate 33, and the outer gear 37 is installed on the edge of the first pad 34. do.

The upper plate 39 corresponds to the lower plate 33 by the support 43 and is driven up and down by the driving device 45. The groove 41 in which the inner circumference gear 35 is inserted is formed in the center of the surface facing the lower surface plate 33 of the upper surface plate 39. In the above, the side surface of the groove 41 is uneven to be engaged with the outer surface of the inner circumferential gear 35. Then, the second pad 40 is attached to the remaining portion except the center where the groove 41 of the surface facing the lower surface plate 33 of the upper surface plate 39 is formed.

The above-described configuration is a configuration of a polishing machine for performing a polishing process, and the present invention adds a dressing apparatus to this configuration.

The dressing device is composed of a pressurizing means 49, a water supply pipe 51, a dresser arm 53 and a brush block 47.

The pressurizing means 49 is made of a high pressure pump to increase the water pressure to enable high pressure injection of deionized water used when dressing the first and second pads 34 and 40. The water supply pipe 51 injects the deionized water pressurized by the pressurizing means 49 to the first and second pads 34 and 40.

In addition, the dresser arm 53 has one side fixed to the support 43 and the other side is provided with a brush block 47. The brush block 47 is formed in a rod shape made of polyvinyl chloride (PVC) or the like, and a brush is formed in contact with the first and second pads 34 and 40 at the upper and lower portions thereof. The dresser arm 53 allows the brush block 47 to reciprocate between the inner gear 35 and the outer gear 37 as well as the up and down motion such that the brush block 47 is in contact with the first pad 34 on the lower plate 33. In the above, the dresser arm 53 should be in contact with the inner and outer gears 35 and 37 when driving the brush block 47 up and down and reciprocating so that no mechanical interference occurs.

2 and 3, one end of the water supply pipe 51 of the present embodiment is connected to the pressurizing means 49, and a part of the water supply pipe 51 extends to be in close contact with the inside of the dresser arm to be sprayed around the brush block 47. Consists of. Alternatively, a portion of the water supply pipe 51 is installed to be embedded in the dresser arm to spray compressed deionized water at a position close to the brush block.

The polishing process of the double-sided polishing machine shown in FIG. 2 is the same as the conventional double-sided polishing machine shown in FIG. At this time, the solid produced in the reaction between the wafer and the corrosion liquid of the polishing liquid is cured and fixed to the surfaces of the first and second pads 35 and 37.

Therefore, after removing the carrier used for the polishing process, the dress arm 53 is lowered to bring the brush block 47 into contact with the first pad 34. Then, the upper plate 39 is lowered by the drive device 45 to bring the second pad 40 into contact with the brush block 47. Thus, the soles of the upper and lower portions of the brush block 47 are pressed in contact with the first and second pads 34 and 40 attached to the lower plate 33 and the upper plate 39.

Then, the dresser arm 53 is driven left and right while rotating the lower plate 33 and the upper plate 39 so that the brush block 47 reciprocates between the inner gear 35 and the outer gear 37. . Then, the deionized water is increased by the pressurizing means 49 and injected at high pressure to the first and second pads 34 and 40 through the water supply pipe 51. At this time, the deionized water sprayed at a high pressure separates the solids from the surfaces of the first and second pads 34 and 40, and the brush block 47 sweeps the solids separated by the upper and lower brushes. And from second pads 34 and 40.

The brush block 47 is rotated because the lower plate 34 and the upper plate 40 are rotated and the dresser arm 53 reciprocates the brush block 47 between the inner gear 35 and the outer gear 37. Silver dresses the entire surface of the first and second pads 34 and 40 to remove stuck solids. In addition, since the brush block 47 reciprocates without friction with the inner and outer gears 35 and 37 by the dresser arm 53, fine particles due to wear are not generated. Therefore, when the solid matter stuck to the surface of the first and second pads 34 and 40 by dressing is not generated, fine particles due to the wear of the brush block 47 are not generated, thereby preventing the dressing effect from being reduced.

After the dressing of the first and second pads 34 and 40 is completed, the upper plate 39 is driven upward and the dresser arm 53 is driven upward and left or right to drive the brush block 47 during the polishing process. The driving of the upper platen 39 is not prevented.

As described above, according to the present invention, the solids fixed on the surface of the first and second pads are separated by deionized water sprayed at high pressure, and then driven up and down by a dresser arm and reciprocally driven between the inner gear and the outer gear. Sweep away by block

Therefore, the present invention enables the drive of the dresser arm to be driven automatically by moving up and down without the need to install the brush block on the lower plate. The first pad and the second pad are dressing at the same time, but at high pressure. Since the solids are separated by the compressed deionized water, it is possible to prevent the wear of the brush block and to prevent the generation of fine particles due to the wear of the brush block.

Claims (10)

The first and second polishing machines including a lower plate having a first pad attached thereto, an upper plate having a second pad attached thereto, an inner circumferential gear formed at an upper center of the lower plate and an outer circumferential gear formed on an edge portion of the first pad. In a dressing apparatus for dressing a second pad, A pressurizing means for increasing and supplying water pressure of deionized water, One end is connected to the pressing means, and the other end is extended so as to be placed between the first and second pads, and the solid matter fixed to the first and second pads by spraying the deionized water supplied from the pressing means Separated water pipe, A brush block in contact with the first and second pads at the same time to sweep off the separated solids on the first and second pads; The brush block is connected to one end to enable the brush block to reciprocate between the inner and outer gears, and is installed in close contact with a part of the water supply pipe so that deionized water can be injected in close proximity to the brush block. Pad dressing apparatus for a double-sided polishing machine comprising a dresser arm. The pad dressing apparatus of claim 1, wherein the pressurizing means comprises a high pressure pump. The pad dressing apparatus of claim 1, wherein the brush block is formed of polyvinyl chloride (PVC). The method of claim 1, wherein the dresser arm is installed to be moved up and down the brush block by its own shangdong, so that the brush block is in contact with the first pad and the second pad, characterized in that Pad dressing device of double side grinding machine. The pad dressing apparatus of claim 1, wherein the brush block has a brush formed on top and bottom thereof in contact with the first and second pads. The pad dressing apparatus of claim 1, wherein the dresser arm drives the brush block such that mechanical interference due to contact with the inner gear and the outer gear does not occur. A lower plate with a first pad, an upper plate with a second pad, an inner gear formed at an upper center of the lower plate, and an outer gear formed on an edge portion of the first pad, A dressing that removes solids formed by the reaction of the wafer and the polishing liquid during the polishing in the double-side polisher which simultaneously polishes the surface and the backside of the wafer with the first and second pads and adhered to the first and second pad surfaces. In the method, Installing a brush block in contact with the first pad; Lowering the upper plate such that the second pad is in contact with the brush block; Separating deionized water adhered to the first and second pads by high pressure injection of deionized water into the first and second pads through a water supply pipe; And sweeping the brush block back and forth between the inner gear and the outer gear to sweep off the solids separated from the first and second pads. The method according to claim 7, wherein the dresser arm is installed to be able to move the vertical position of the brush block by its own shangdong, so that the brush block can be in contact with the first pad and the second pad. Pad dressing method of double side grinding machine. delete The method of claim 8, wherein the dresser arm drives the brush block to prevent mechanical interference caused by contact with the inner gear and the outer gear.