KR100368086B1 - A silicon pouring device of resin encapsulation using semiconductor production - Google Patents

Abstract

The present invention relates to a silicon injection device for controlling to supply a fixed amount of silicon injected through a needle coupled to a resin applicator for semiconductor manufacturing.

The silicon injection device of the resin applicator for semiconductor manufacturing according to the present invention for controlling the motor for driving two scoops at a high speed by using a personal computer and a dual port memory so that silicon is quantitatively supplied to the semiconductor device is coated with a resin for semiconductor manufacturing. A personal computer that provides a control command to operate the silicon injection at a high speed, a microcontroller that receives a silicon injection control command from the personal computer to control the pump to be driven, and receives a pump drive control signal from the microcontroller to drive the motor. A silicon semiconductor device by means of a pump driver for outputting a signal and a solenoid drive signal, a first and a second motor for driving a rotating screw by a motor drive signal output from the pump driver, and a solenoid drive signal output from the pump driver. To first to inject And a pump consisting of a fourth solenoid.

Description

Silicon injection device for resin applicator for semiconductor manufacturing {A SILICON POURING DEVICE OF RESIN ENCAPSULATION USING SEMICONDUCTOR PRODUCTION}

The present invention relates to a silicon injector of a resin applicator for semiconductor manufacturing, and more particularly, to a silicon injector for controlling supply of silicon injected through a needle coupled to a resin applicator for semiconductor manufacturing.

In general, the automation system used in the micro ball grid array package (CSP manufacturing process in the form of a ball grid array) is a ball side front surface of a tape product attached to a carrier frame. Cover film attaching process that attaches cover file over the film, and encapsulate process that injects and applies the resin around the chip with resin to protect the semiconductor device from the external environment. After making it possible, move to the next step to complete.

In such a resin applicator, the conventional silicon injector controls a motor for driving a rotating screw (SCREW) according to an external load by a current control method, so that rotation speed is unstable, and speed variable control is impossible at high speed using a personal computer. Therefore, precise control of the silicon coating is not possible, thereby causing a fatal defect in the manufactured semiconductor device or increasing a defective rate.

Accordingly, an object of the present invention is to provide a silicon injection device for finely controlling the supply of silicon to the semiconductor device in order to solve the problem that the fatal defect or defect rate of the semiconductor device is increased.

In the silicone injection device of the resin applicator for semiconductor production of the present invention for achieving the above object, a personal computer for providing a control command to operate the silicon injection of the resin applicator for semiconductor production at a high speed, and silicon injection control from the personal computer. A microcontroller for controlling the pump to be driven by a command, a pump driver for receiving a pump drive control signal of the microcontroller and outputting a motor drive signal and a solenoid drive signal, and a rotation screw by a motor drive signal output from the pump driver And first and fourth solenoid pumps for injecting silicon into the semiconductor device by the solenoid driving signal output from the pump driver.

1 is a block diagram of a silicon injection device of a resin applicator for semiconductor manufacturing according to an embodiment of the present invention

2 to 5 are detailed circuit diagrams of the microcontroller 200 according to an embodiment of the present invention.

6 to 9 are detailed circuit diagrams of the pump driving unit 300 of FIG. 1 according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100: personal computer 200: microcontroller

300: pump driving unit 400: pump

500: rectifier

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

1 is a block diagram of a silicon injection device of a resin applicator for manufacturing a semiconductor according to an embodiment of the present invention.

The personal computer 100 controls the silicon injection of the resin applicator for semiconductor manufacturing to operate at high speed. The microcontroller 200 receives the silicon injection control command from the personal computer 100 and controls the pump 400 to be driven. The pump driving unit 300 receives the pump driving control signal of the microcontroller 200 and outputs a motor driving signal and a solenoid driving signal. The pump 400 may include first and second motors 401 and 402 for driving the rotating screw SCREW by the motor driving signal output from the pump driving unit 300, and the solenoid output from the pump driving unit 300. The first to fourth solenoids 403, 404, 405, and 406 for injecting silicon into the semiconductor device by the driving signal are formed. The rectifier 500 rectifies AC power supplied from the pump driver 300 to DC power to monitor the speeds of the first and second motors 401 and 402, and thus the first and second motors 401 and 402. To supply.

2 to 5 are detailed circuit diagrams of the microcontroller 200 according to an embodiment of the present invention.

The CPU 10 may be composed of Intel Corporation's 80C196KC, a 16-bit one-chip microprocessor, and controlled to inject silicon by controlling a motor for driving the screw at high speed by RS232C communication with the personal computer 100. do. ROM 202 contains a program for metering silicon in accordance with the present invention. The RAM 203 temporarily stores data generated while executing a program for injecting silicon. The first buffer 204 separates the address and data under the control of the CPU 201. The first decoder 205 is composed of a programmable logic array (PLA), and a signal for accessing the ROM 202, the RAM 203, and the dual port memory 207 under the control of the CPU 201, and an internal device. Outputs input / output (I / O) selection signal and chip select signal (/ CS) for communication or external communication. The second decoder 206 is composed of a PLA (Programmable Logic Arrary), and the memory chip select signal (/ MCS) and the interrupt request signal for accessing the dual port memory 207 under the control of the personal computer 100 ( INT1, INT2) and the bus busy input signal BUY are output. The dual port memory 207 writes the data transmitted from the personal computer 100 by the write signal / WR output from the CPU 201, and the read signal / RD output from the CPU 201. The data recorded by the readout is read out to enable high speed communication between the personal computer 100 and the microcontroller 200. The second to fourth buffers 208, 209, and 210 store data, an address, and an input / output chip select signal (/ ICS) for controlling various control boards managed by the microcontroller 100 through a bus. Buffered by the enable signal EN of 205 and output. The first connector 211 is embedded in the microcontroller 201 and connected to the personal computer 100. The second connector 212 is built in the microcontroller 201 and connected to the pump driver 300. Field Programmable Gate Array (FPGA) 213 is a program gate array for driving the first and second motors 401, 402 and the first to fourth solenoids 403, 404, 405, 406 for implanting silicon. to be. The selector switch 214 selects RS232C communication and RS488 communication. The RS232C communication driver 215 is connected to the third connector 218 to interface with RS232C under the control of the CPU 201. The RS488 communication driver 216 is connected to the third connector 218 to interface with RS422 communication or RS485 communication under the control of the CPU 201. The third connector 218 is embedded in the micro controller 201 and connected to the pump driver 300. The fourth connector 217 is built in the pump driver 300 and connected to the pump 400. The first to third line drivers 219, 220, and 221 divide the signal input through the bus into a positive signal and a negative signal and output the divided signals.

6 to 9 are detailed circuit diagrams of the pump driving unit 300 of FIG. 1 according to an embodiment of the present invention.

The fifth connector 222 is built in the microcontroller 200 and connected to the pump driving unit 300. The sixth connector 223 is embedded in the pump driver 300 and connected to the second connector 212 embedded in the microcontroller 200. The third decoder 224 is a chip of the first and second digital-to-analog converters 225 and 226 for motor driving under the control of the CPU 201 of the microcontroller 200 through the fifth connector 222. A select signal / CS and an enable signal for enabling the input buffer 231 and the output buffer 232 are output. The first and second digital-to-analog converters 225 and 226 receive the motor driving signal input through the fifth connector 222 and the analog signal by the chip select signal / CS of the third decoder 224. Convert to and print it out. The first and second motor speed monitoring level adjusting units 223 and 230 adjust and output motor speed monitoring signals detected from the first and second motors 401 and 402 to predetermined levels. The first and second motor on / off signal detectors 227 and 228 are composed of two operational amplifiers OP1 and OP2, and output signals from the first and second digital / analog converters 225 and 226. The motor driving on / off signal is detected and output by comparing the motor speed monitoring signals leveled from the first and second motor speed monitoring level adjusting units 223 and 230. The input buffer 231 receives the position monitoring signal of the motor and the speed monitoring signal of the motor and buffers the output signal by the enable signal output from the third decoder 224. The output buffer 232 receives the solenoid driving signal input through the fifth connector 223 and buffers the output signal by the enable signal output from the third decoder 224. The driver 233 outputs the solenoid drive control signal output from the output buffer 232. The first to fourth photocouplers 241, 242, 243, and 244 output the solenoid driving control signals CSL1-CSL4 output from the fifth decoder 264 to the first to fourth output drivers 245, 246, 247, and the like. 248), separate the power so as not to affect the drive signal. The first to fourth output drivers 245, 246, 247, and 248 are first to fourth solenoids by the solenoid driving control signals output from the first to fourth photocouplers 241, 242, 243, and 244. 403, 404, 405, and 406 are driven. The first to fourth line filters 249, 250, 251, and 252 remove noises of signals corresponding to rotational speeds and positions input from encoders of the first to second motors 401 and 402, and output the noises. The first line filter 249 is composed of resistors R59 and R67 and a capacitor C15. The second line filter 250 is composed of resistors R61 and R71 and a capacitor C16. The third line filter 251 is composed of resistors R63 and R75 and a capacitor C17. The fourth line filter 252 is composed of resistors R64 and R79 and capacitor C18. The first to fourth data determination units 253, 254, 255, and 256 determine whether a pulse corresponding to the motor speed from which noise is removed from the first to fourth line filters 249, 250, 251, and 252 is noise. Determine if it is data and output it. The first to fourth timers 257, 258, 259, and 260 are timers for determining time for driving the motor in the forward and reverse directions, respectively. The seventh connector 261 is embedded in the pump driver 300 and connected to the fifth connector 222 of the microcontroller 200. The eighth connector 262 is embedded in the pump driver 300 and connected to the fourth connector 217 of the microcontroller 200. The fourth decoder 263 converts the pulse discrimination data corresponding to the motor revolutions output from the first to fourth data discriminating units 253, 254, 255, and 256 into a programmed logic gate signal, and then the FPGA 213. Will output The fifth decoder 264 is a signal CP1.0-CP1.5 output from the CPU 201 and forward and reverse time determination signals output from the first to fourth timers 257, 258, 259, and 260. To output the pre-programmed motor drive control signal PCM1-PCM4 and cylinder drive control signal CSL1-CSL4. The ninth connector 265 is embedded in the pump driver 300 to be connected to the first and second motors 401 and 402 and the first to fourth solenoids 403, 404, 405 and 406. The fifth to tenth photocouplers 241, 242, 243, and 244 may output the motor driving control signals PCM1-PCM2, NCM1-NCM2, and PERM1-PERM2 output from the fifth decoder 264 to the first to second motors. When transferring to the drivers 276 and 277, disconnect the power so as not to affect the motor drive signal. The first to second motor drivers 276 and 277 may use the first to second motors by the motor driving control signals output from the fifth to tenth photocouplers 270, 271, 272, 273, 274 and 275. 401 and 402 are driven.

1 to 9, the operation of the preferred embodiment of the present invention will be described. First, the personal computer 100 transmits a control command to allow the silicon injection of the resin applicator for semiconductor manufacturing to operate at a high speed. The command is stored in dual port memory 207. Then, the CPU 201 of the microcontroller 20 reads the dual port memory 207 and operates according to the firmware programmed in the ROM 202 when a control command for silicon injection is recognized, and the first decoder 205. Control to designate a start address, and accordingly read an instruction stored in the ROM 202 corresponding to the start address to start the operation for injecting silicon. The CPU 201 stores the data generated during the operation in the RAM 203 by controlling the first decoder 205 to generate an address when performing an operation of implanting silicon.

Here, the first decoder 205 is composed of a PLA (Programmable Logic Arrary), and a signal for accessing the ROM 12, the RAM 14, and the dual port memory 207 under the control of the CPU 10. Outputs input / output (I / O) selection signal and chip select signal (/ CS) for internal or external communication. The second decoder 206 includes a programmable logic array (PLA), and a memory chip select signal (/ MCS) and an interrupt request signal for accessing the dual port memory 207 under the control of the personal computer 100. Outputs (INT1, INT2) and the bus busy input signal BUY. The dual port memory 207 writes the data transmitted from the personal computer 100 by the write signal / WR output from the CPU 201, and the read signal / RD output from the CPU 201. The data recorded by the readout is read out to enable high speed communication between the personal computer 100 and the microcontroller 200. The second to fourth buffers 208, 209, and 210 store data, an address, and an input / output chip select signal (/ ICS) for controlling various control boards managed by the microcontroller 100 through a bus. Buffered by the enable signal EN of 205 and output. The output data is applied to the first and second digital-to-analog converters 225 and 226 through the sixth connector 223. The first and second digital-to-analog converters 225 and 226 receive the motor driving signal input through the fifth connector 222 and the analog signal by the chip select signal / CS of the third decoder 224. Convert to and print it out. The first and second motor speed monitoring level adjusting units 229 and 230 adjust and output motor speed monitoring signals detected from the first and second motors 401 and 402 to predetermined levels. The first and second motor on / off signal detectors 227 and 228 are composed of two operational amplifiers OP1 and OP2 and output signals from the first and second digital / analog converters 225 and 226. The motor speed on / off signal is detected by comparing the motor speed monitoring signals leveled from the first and second motor speed monitoring level controllers 223 and 230 and output to the fifth decoder 264. At this time, the speed detection signals input from encoders (not shown) of the first and second motors 401 and 402 are applied to the first to fourth line filters 249, 250, 251, and 252 to remove noise. The first to fourth data discriminating units 253, 254, 255, and 256 are applied. The first to fourth line filters 249, 250, 251, and 252 determine whether the pulse corresponding to the motor speed from which the noise is removed is noise or data and output the noise. The data FEAM1, FEBM1, FEAM2, and FEBM2 output from the first to fourth data determination units 253, 254, 255, and 256 output a gate signal programmed to the fourth decoder 263 to provide the FPGA 213. Is applied. The field programmable gate array (FPGA) 213 is a gate pulse for driving the first and second motors 401 and 402 and the first to fourth solenoids 403, 404, 405 and 406 for implanting silicon. Outputs The fifth decoder 264 is a signal CP1.0-CP1.5 output from the CPU 201 and forward and reverse time determination signals output from the first to fourth timers 257, 258, 259, and 260. To output the pre-programmed motor drive control signal PCM1-PCM4 and cylinder drive control signal CSL1-CSL4. The fifth to tenth photocouplers 241, 242, 243, and 244 may output the motor driving control signals PCM1-PCM2, NCM1-NCM2, and PERM1-PERM2 output from the fifth decoder 264 to the first to second motors. When transferring to the drivers 276 and 277, disconnect the power so as not to affect the motor drive signal. The first to second motor drivers 276 and 277 may use the first to second motors by the motor driving control signals output from the fifth to tenth photocouplers 270, 271, 272, 273, 274 and 275. 401 and 402 are driven. The first to fourth photocouplers 241, 242, 243, and 244 output the solenoid driving control signals CSL1-CSL4 output from the fifth decoder 264 to the first to fourth output drivers 245, 246, and 247. , 248), disconnect the power so as not to affect the drive signal. The first to fourth output drivers 245, 246, 247, and 248 receive the solenoid driving control signals output from the first to fourth photocouplers 241, 242, 243, and 244 to connect the ninth connector 265. The solenoid driving signals PSL1-P knee 4 are output to drive the first to fourth solenoids 403, 404, 405, and 406.

In addition, the first to third line drivers 219, 220, and 221 divide the signal input through the bus into a positive signal and a negative signal and output the signal to the outside through the fifth connector 222.

Meanwhile, in order to perform RS232C communication or RS488 communication with the outside, the operator selects RS232C communication or RS488 communication using the selection switch 214. When the operator selects RS232C communication, the CPU 201 controls the RS232C communication driver 215 to allow RS232C communication with an external bus. However, when the operator selects RS488 communication, the CPU 201 controls the RS488 communication driver 216 to allow RS422 communication or RS485 communication with an external bus.

As described above, the present invention, by precisely operating the motor for driving the screw for injecting silicon through the needle coupled to the resin spreader to precisely supply the silicon to the semiconductor device, thereby minimizing the defect rate of the semiconductor device There is an advantage that can

Claims (8)

In the silicone injection device of a resin applicator for semiconductor manufacturing, A personal computer for providing control commands for the silicon injection of the resin applicator for semiconductor manufacturing to operate at high speed; A microcontroller for controlling a pump to be driven by receiving a silicon injection control command from the personal computer; A pump driving unit which receives a pump driving control signal of the micro controller and outputs a motor driving signal and a solenoid driving signal; First and second motors for driving the rotary screw by the motor driving signal output from the pump driving unit, and first to fourth solenoids for injecting silicon into the semiconductor device by the solenoid driving signal output from the pump driving unit. The silicone injection device of the resin applicator for semiconductor manufactures provided with the pump comprised. The method of claim 1, Resin applicator for semiconductor manufacturing characterized in that it further comprises a rectifier for rectifying the AC power supplied from the pump driver to DC power to supply the first and second motor to monitor the speed of the first and second motor. Of silicone injection device. The method of claim 1, wherein the microcontroller, A CPU for controlling silicon to be injected at high speed by RS232C communication with the personal computer; ROM which embeds program for metering silicon, RAM for temporarily storing data generated during the program for implanting the silicon; A first buffer which separates an address and data under control of the CPU; A first decoder for outputting a signal for accessing the ROM, RAM, and dual port memory, an input / output (I / O) selection signal, and a chip select signal (/ CS) for internal or external communication under control of the CPU; , A second decoder for outputting memory chip select signals (/ MCS) and interrupt request signals (INT1, INT2) and bus busy input signal (BUY) for accessing the dual port memory under control of the personal computer; A buffer unit for buffering and outputting data, an address, and an input / output chip select signal (/ ICS) for controlling various control boards managed by the CPU by an enable signal (EN) of the second decoder through a bus; A first connector embedded in the microcontroller and connected to the personal computer; A second connector embedded in the micro controller and connected to the pump driver; FPGAs for outputting first and second motors for implanting silicon and program gate signals for driving the first to fourth solenoids; The data transmitted from the personal computer is recorded by the write enable signal / WR output from the CPU, and the data recorded by the read enable signal / RD output from the CPU is read out. A silicon injector for a resin applicator for semiconductor manufacturing, comprising a dual-port memory for high speed communication between a personal computer and a microcontroller. The method according to claim 1 or 3, A selector switch for selecting RS232C communication and RS488 communication; An RS232C communication driver connected to a third connector and interfaced to allow RS232C communication under control of the CPU; An RS488 communication driver connected to the third connector to interface with the CPU for RS422 communication or RS485 communication; A third connector embedded in the micro controller and connected to the pump driving unit; The silicon injection device of the resin applicator for manufacturing a semiconductor, characterized in that it further comprises a fourth connector embedded in the pump driving unit connected to the pump. The method of claim 4, wherein And a first to third line drivers for separating and outputting a signal input through a bus into a positive signal and a negative signal. The method of claim 3, wherein the pump driving unit, A fifth connector embedded in the micro controller and connected to the pump driving unit; A sixth connector embedded in the pump driver and connected to the second connector embedded in the microcontroller; A third chip for outputting a chip select signal (/ CS) of a digital / analog converter for driving a motor and an enable signal for enabling an input buffer and an output buffer by controlling the CPU of the microcontroller through the fifth connector; With a decoder, First and second digital / analog converters which receive the motor driving signal input through the fifth connector and convert the analog driving signal into an analog signal by the chip select signal (/ CS) of the third decoder; First and second motor speed monitoring level controllers for adjusting and outputting the motor speed monitoring signals detected from the first and second motors to a predetermined level; A first motor that detects and outputs a motor driving on / off signal by comparing a signal output from the first and second digital / analog converters with a motor speed monitoring signal leveled by the first and second motor speed monitoring level controllers; And a second motor on / off signal detector; An input buffer receiving the position monitoring signal and the speed monitoring signal of the first and second motors and buffering the output signal by an enable signal output from the third decoder; An output buffer receiving the solenoid driving signal input through the fifth connector and buffering the output signal by the enable signal output from the third decoder; First to fourth photocouplers for separating power so as not to affect the drive signal when the solenoid driving control signals CSL1 to CSL4 output from the fifth decoder are transmitted to the first to fourth output drivers; First to fourth output drivers configured to drive the first to fourth solenoids by solenoid driving control signals output from the first to fourth photocouplers; First to fourth data discriminating units which determine whether the pulse corresponding to the motor speed from which the noise is removed from the first to fourth line filters is noise or data and output the noise; First to fourth timers for determining time for driving the first and second motors in the forward and reverse directions, respectively; A fourth decoder for converting the pulse discrimination data corresponding to the motor revolutions output from the first to fourth data discriminating units into a programmed logic gate signal and outputting the logic gate signal to the FPGA; Pre-programmed motor drive control signals PCM1-PCM4 and cylinder drive by inputting the signals CP1.0-CP1.5 output from the CPU and the forward and reverse time determination signals output from the first to fourth timers. A fifth decoder for outputting control signals CSL1-CSL4; Motor drive control signals PCM1-PCM2, NCM1-NCM2, and PERM1-PERM2 output from the fifth decoder 264 do not affect the motor drive signal when transferred to the first to second motor drivers 276 and 277. A fifth to tenth photocoupler for separating a power supply, Silicon injection device of the resin applicator for semiconductor manufacturing, characterized in that the first to second motor driver configured to drive the first to second motor by the motor drive control signal output from the fifth to tenth photocoupler . The method of claim 6, And a first to fourth line filters for removing and outputting noise of a pulse number corresponding to the number of rotations input from the encoders of the first to second motors. The method of claim 7, wherein A seventh connector embedded in the pump driver and connected to the fifth connector of the microcontroller; And an eighth connector embedded in the pump driving part and connected to the fourth connector of the microcontroller.