KR100368003B1 - Three dimensional stacked module and method corresponding the same for elecronic circuit system - Google Patents

Abstract

The present invention divides the circuit into sub-unit modules so that they can be divided into functions, and assembles the divided modules by using a terminal connecting plate, thereby minimizing the volume, size and weight of the electronic system, and assembling and inspecting functions and circuits. It relates to a three-dimensional stacked electronic circuit device and a method of manufacturing the same that can improve the performance.

The present invention provides a module module substrate which is mounted on separate electronic circuit components for each function and operating frequency and stacked at predetermined intervals; Input and output terminals disposed on both edges of the unit module substrate; The gap between the stacked upper unit module substrate and the lower unit module substrate is adjusted according to the height of the components mounted thereon, and the predetermined size is aligned so that the input and output terminals of the upper and lower unit module substrates can be aligned with each other. A terminal connecting plate having a plurality of holes; And alignment means for aligning and electrically connecting the input and output terminals of the upper and lower unit module substrates to each other through the alignment holes of the terminal connecting plate and the holes of the unit module substrate. To provide.

In addition, the present invention is a first step of mounting a variety of electronic circuit components on a unit module substrate and stacked at a predetermined interval; A second step of fixing a component mounted on the unit module substrate by performing a reflow process; A third step of molding the component on the unit module substrate using one of a fixing agent and a molding compound so that the components fixed on the unit module substrates stacked at the predetermined intervals do not change their positions due to heat applied from the outside; ; A fourth step of aligning and assembling positions between designated input / output terminals of each of the plurality of stacked unit module substrates and designated input / output terminals of the terminal connecting plate; A fifth step of performing a reflow process so as to electrically and mechanically connect the pads provided on the unit module substrate and the pads provided on the terminal connection plate; And a sixth step of completing the three-dimensional assembly by removing the alignment pin from the alignment hole after performing the fifth step.

The method of implementing such an electronic circuit is to realize the bulk weight, electrical operation characteristics and thermal characteristics of the circuit when implementing the electronic circuit having high speed, high density, low power characteristics or low cost, or when changing the function of the circuit product variably. Have the effect of improving.

Description

Three-dimensional stacked module and method for manufacturing the same {Three dimensional stacked module and method corresponding the same for elecronic circuit system}

The present invention divides the digital and analog circuits with high integration such as electronic systems, wired and wireless communication circuits, and digital circuits into functional unit modules, and then connects the functional unit modules by using a terminal connection board to form a three-dimensional stack. The present invention relates to an apparatus and a manufacturing method for implementing a miniaturized electronic system of the present invention, and in particular, a signal receiving unit, a signal transmitting unit, a signal processing unit, a power supply unit, a memory unit, and the like through a terminal connecting plate formed using an epoxy substrate and a solder ball. The present invention relates to a three-dimensional stacked electronic circuit device for an electronic packaging process capable of assembling an electrical signal of a unit module having an independent function of each other into a three-dimensional structure and implementing an electronic system, and a manufacturing method thereof.

Conventionally, in order to implement a system circuit, two-dimensional planar substrates are implemented to connect the substrates and the substrates, and to connect the components and the substrates. The method of connecting the substrate with the former is to two-dimensionally arrange the necessary components on the surface of the printed circuit board, and to mount the through-hole or surface mounting technology to form a separate unit board, and then the various unit boards are connected to the pin connector, It is a method of implementing an electronic system by connecting to each other using cable connectors, sockets, and film connectors.

The latter method of assembling the system by connecting the components and the substrate is a method of mounting the components of the circuit using surface mounting methods or through holes or sockets, and implementing the electronic system.

Such electronic system implementation methods not only have a large substrate volume or size, but also take a long time to inspect a circuit board after completion, and also have a difficult problem of checking the performance of each specific partial circuit and improving its performance to the maximum. . In addition, there is a problem in that it is inconvenient to check a partial function for each function and a difficulty in checking the characteristics of a circuit implemented for each function.

On the other hand, as a method of miniaturizing the volume and size of the electronic system, multi-chip module (MCM) technology or three-dimensional package technology, MCM-V technology, which is a vertical stacking method of modules, has been presented, The process is fine and has the disadvantage of having to use difficult wire bonding or flip chip boning. In addition, it is expensive to use a special fuse for the vertical connection, and a difficult process is difficult to implement, it is difficult to implement an electronic system of a three-dimensional stacked structure easily.

Accordingly, the present invention has been made to solve the above problems, by dividing the circuit into sub-unit modules to be divided into functional units, and by assembling the divided module using a terminal connecting plate and the volume and size of the electronic system It is an object of the present invention to provide a three-dimensional stacked electronic circuit device capable of miniaturizing weight, improving assembly and inspection functions, and circuit performance, and a manufacturing method thereof.

In addition, the present invention can be produced by separating the electronic circuit or wireless communication circuit module for each function to make the unit boards corresponding to the basic unit to a minimum size, the unit according to the height of the components mounted on the separated unit module Another object of the present invention is to provide a three-dimensional stacked electronic circuit device and a method of manufacturing the same, which can be stacked in a three-dimensional structure while controlling the distance between module substrates.

In addition, another object of the present invention is to provide a three-dimensional stacked electronic circuit device and a method of manufacturing the same, which can be easily assembled by attaching the terminal connecting plate and the common electrode between the circuit boards.

In addition, the present invention is to separate the unit by function in the process of dividing the electronic system to configure the unit module, if there is an error in any one unit module substrate by separating and inspecting only the module in question by the entire module Another object of the present invention is to provide a three-dimensional stacked electronic circuit device and a method of manufacturing the same in order to maximize individual electrical characteristics of a unit module in a design process or a manufacturing process.

1A and 1B are a cross-sectional view and a perspective view showing a surface array type stacking method of an input / output terminal which is a main part of the present invention.

2 is a plan view of a board of a receiving unit showing components mounted on a single board and input, output, and ground power terminals.

3 is an exemplary view showing a component mounting method using molding and flip chip bonding.

4 is a schematic configuration diagram of a terminal connecting plate for three-dimensional connection of a substrate.

5 is a cross-sectional view showing a connection state of a lead used in lamination of a circuit board.

Figure 6 is a cross-sectional view showing a part mounting state using a lead.

7 is a perspective view showing a three-dimensional stacked electronic circuit module according to the present invention.

8 is a block diagram of respective parts of a wireless transceiver circuit module.

9 is a frequency distribution diagram of each divided region.

* Explanation of symbols for main parts of the drawings

101: receiver 102: transmitter

103: PLL section 104: power section

105: digital unit 201: antenna

202: alignment pin 203: unit module substrate

204: via pad 205: terminal connecting plate

208: Via 301: Pin

302: public address 303: grounding

304: power supply terminal 305: input / output terminal

306: input and output terminal 307: parts

308: molding 401: alignment hole

402 IC chip

The present invention for achieving the above object is a unit module substrate mounted on each of the separate electronic circuit components for each function and operating frequency and stacked at a predetermined interval; Input and output terminals disposed on both edges of the unit module substrate; The gap between the stacked upper unit module substrate and the lower unit module substrate is adjusted according to the height of the components mounted thereon, and the predetermined size is aligned so that the input and output terminals of the upper and lower unit module substrates can be aligned with each other. A terminal connecting plate having a plurality of holes; And alignment means for aligning and electrically connecting the input and output terminals of the upper and lower unit module substrates to each other through the alignment holes of the terminal connecting plate and the holes of the unit module substrate. To provide.

In addition, the present invention is a first step of mounting a variety of electronic circuit components on a unit module substrate and stacked at a predetermined interval; A second step of fixing a component mounted on the unit module substrate by performing a reflow process; A third step of molding the component on the unit module substrate using one of a fixing agent and a molding compound so that the components fixed on the unit module substrates stacked at the predetermined intervals do not change their positions due to heat applied from the outside; ; A fourth step of aligning and assembling positions between an input / output terminal designated on each of the plurality of stacked unit module substrates and a designated input / output terminal of the terminal connecting plate; A fifth step of performing a reflow process so as to electrically and mechanically connect the pads provided on the unit module substrate and the pads provided on the terminal connection plate; And a sixth step of completing the three-dimensional assembly by removing the alignment pin from the alignment hole after performing the fifth step.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings so that those skilled in the art may easily implement the technical idea of the present invention. do.

The three-dimensional stacked electronic circuit device and a method of manufacturing the same according to the present invention are composed of unit modules in which electronic circuits are divided by functions, and are connected and assembled using a terminal connecting plate and a common circuit to realize electrical characteristics in realizing an electronic system circuit. In order to reduce the process cost while minimizing the stacking shape while improving, first, the present embodiment proposes two methods of a package method using an input / output terminal of a PAA surface array method. That is, FIG. 1A is a schematic view showing a package assembling method using pins, and FIG. 1B is a schematic view showing a package assembling method using public pay.

As shown in the drawings, the unit module boards 203 on which the unit circuit modules such as various components 307 and the electrical signal connection terminals are mounted are stacked at predetermined intervals, and the pins 301 or Pb 95% / Sn 5%, Pb 50% / Sn 50%, Pb 37% / Sn 63%, Au 80% / Sn 20%, In 52% / Sn 48%, In 51% / Sn 16.5% / A packaging process of electrically connecting and assembling is performed by using a lead (302) in an alloy form such as Bi 32.5%, Pb 43.5% / Bi 56.5%, and the like. At this time, mainly the pin or the empty row of the left serves as a mechanical support, the pin or the empty row of the right to serve as a signal and ground wire.

FIG. 2 is a diagram illustrating an upper surface of a unit module substrate 203 of a receiver, which is a lower unit module, as an embodiment configured by the division design method. As shown in the drawing, an alignment hole 401 is formed in the rectangular portion of the unit module substrate, and the input / output terminals 305 and 306 may be configured in a form arranged from one row to a plurality of rows according to the surface array method. In this figure, the input / output terminals with a constant array interval have nine input / output terminals in each column, and three columns are formed in parallel with nine input / output terminals as one column. will be.

In addition, the figure shows that the component 307, the power supply terminal 304 and the ground line 303 is formed.

FIG. 3 illustrates various aspects in which the component 307 mounted on the unit module substrate 203 is mounted using a surface mount component or a bare chip.

In this drawing, the component 307 is surface-mounted on the unit module substrate 203 by using the common solder 302, or the bare chip is mounted by using a fine wire used in wire bonding. After the component 307 is mounted on the module substrate 203, the component 307 and the unit module are connected to each other by wire bonding, or a method of mounting the component using flip chip bonding is shown. This series of connection technologies for component mounting, component molding, and module board connection provides a way to help optimize each unit module by function and performance independently.

That is, FIG. 3 shows four component mounting forms. From the left, first, the IC chip 402 is mounted and molded 308 using wire bonding (wire bonding). After mounting a semiconductor chip as a component on a substrate, a micro wire is used to electrically connect the pad of the component to the pad of the substrate. The next figure shows how the component 307 is mounted by flip chip bonding. The chip chip and the substrate pad are connected by flipping the semiconductor chip, which is a bare chip, by a plurality of bumps, and electrically and mechanically connected. The third method is to mount by surface mounting method. The DIP type or QFP type parts are electrically and physically connected to the printed circuit board through lead reflow process. The fourth method is to mount a component on a substrate by the method of a ball grid array. Molding is the process of wrapping around a component that is bonded or mounted to block the components being mounted and the external environment. Therefore, the components are interconnected by surface mounting, wire bonding, or flip chip bonding, and then the components are generally mounted by molding.

FIG. 4 is a schematic view of the terminal connecting plate 205. The upper pad 204 and the lower pad 204 'of the terminal connecting plate 205 are connected through a via 208. As described above, when connecting the input / output terminal 305 of the lower surface of the upper unit module substrate 203 and the input / output terminal 305 of the lower surface of the lower module module substrate to each other, the terminal connecting plate 205 and the upper pad 204 are not shared 302. The input and output terminals 305 of the lower surface of the upper unit module substrate 203 and the other side of the upper unit module substrate 203 are in contact with the other side of the lead 302 to connect the unit module substrates during the reflow process.

In addition, the alignment module 203 and the terminal connecting plate (alignment hole 401 and the alignment hole 401 'of the terminal control plate 205 located at the edge of the unit module substrate 205 using the alignment pin 202). The input / output terminals 305 of 205 are aligned with each other so that they can be contacted and electrically connected to each other. The above structure is for performing a three-dimensional stacking connection of the unit module substrate 203, the alignment pin is inserted into the alignment holes (401, 401 ') of the unit module substrate 203 and the terminal connecting plate 205. By specifying the position of the input and output terminals 305 of the upper and lower unit module substrate 203 and the terminal connecting plate 205 by the (202), to facilitate the connection between terminals during the reflow process The surface tension of 302 allows fine positioning of the input / output terminal 305 to be achieved.

FIG. 5 is a cross-sectional view of the surface array input / output terminals 305 used for stacking circuit boards using a common solder 302 and interconnected with the circuit board 203. The number of arrays in which the common structure 302 is arranged may be a surface array method using the whole surface from a method of using only one row in each side. In this embodiment, the common structure is arranged only in the remaining region except the area where the component is located. As a structure to achieve this, a three-column input / output terminal 305 surface array method was used.

FIG. 6 is a schematic view showing a method of mounting the component 307 on the unit module substrate 203 and then connecting the same using the common lead 302. FIG. The perspective view of the transmission / reception module of the dimensional laminated structure is shown. As shown in the figure, the two columns on the left and right sides connect the circuit boards 203 stacked at predetermined intervals using the common 302, the alignment pin 202, the via 204, and the alignment terminal 401. The component 307 and the IC chip 402 may be mounted in a three-dimensional stacked structure by separately manufacturing modules according to functions, functions, and operating frequencies.

FIG. 8 is a block diagram of a wireless communication transceiver circuitry operating at 224MHz as an example of a method of manufacturing a three-dimensional stacked electronic circuit, using a frequency of 224MHz that can be used in data communication between a base station and a mobile vehicle. Perform wireless communication transmission / reception function of digital frequency modulation system. The receiver 101 of the wireless transceiver circuit module has a reception frequency of 224 MHz, the first intermediate frequency is 21.4 MHz, and the second intermediate frequency is 450 GHz. The wireless transceiver circuit module transmitter 102 has a transmission frequency of 224 MHz and uses 21.4 MHz as the first intermediate frequency. When divided into functional division design method and frequency division design method, it is divided into receiver 101, transmitter 102, phase locked loop 103, power supply 104, and digital unit 105. can do.

As shown in FIG. 8, the wireless transceiver module is divided into a receiver unit, a transmitter unit, a phase fixing unit, a power unit, and a digital unit circuit to form a lower unit module. It can maintain and maximize the functional and operating characteristics of individual modules.

FIG. 9 graphically illustrates one embodiment illustrating the criteria by which electronic circuits are divided by function and by frequency.

In the present embodiment, the three-dimensional stacked structure of the wireless transceiver circuit module has been described as an example. However, the present invention is not limited thereto, and the present invention can be applied to all products in an electronic system implemented by all electronic circuits. As such, although the technical idea of the present invention has been described in detail according to the above-described preferred embodiment, it should be noted that the above-described embodiment is for the purpose of description and not of limitation. In addition, those skilled in the art will understand that various embodiments are possible within the scope of the technical idea of the present invention.

As described above, according to the present invention, the unit module boards on which various components or electrical connection elements are mounted are stacked at predetermined intervals, and high-speed wireless communication is realized by implementing a three-dimensional stack package by connecting a terminal array plate of a surface array method. It can be applied to a circuit, an ultra-fast RF circuit system, a large-capacity memory circuit, a microprocessor circuit, and the like, and has a high-speed, high-density, low-power characteristic, and can be manufactured at low cost. In addition, it is possible to further expand the function by dividing the radio transceiver circuit module by function and frequency according to the proposed division design criteria. As a result, the three-dimensional wireless circuit implementation method reduces the size, weight, and production cost, and improves the electrical characteristics, signal transmission characteristics, and thermal characteristics, unlike the conventional two-dimensional configuration method that was constructed using a single substrate. It has an effect that can be done.

Claims (13)

Unit module substrates each having separate electronic circuit components mounted by independent functions and operating frequencies and stacked at predetermined intervals; Input and output terminals disposed on both edges of the unit module substrate; The gap between the stacked upper unit module substrate and the lower unit module substrate is adjusted according to the height of the components mounted thereon, and the predetermined size is aligned so that the input and output terminals of the upper and lower unit module substrates can be aligned with each other. A terminal connecting plate having a plurality of holes; And Alignment means for aligning and electrically connecting the input and output terminals of the upper and lower unit module substrates to each other through the alignment holes of the terminal connecting plate and the hole of the unit module substrate Three-dimensional stacked electronic circuit device comprising a. The method of claim 1, 3D stacked electronic circuit device wherein the input and output terminals are arranged in a surface array method. The method of claim 1, And a mounting means for mounting the electronic circuit component on the unit module substrate. The method of claim 3, wherein Three-dimensional stacked electronic circuit device, the mounting means is made of air. A first step of mounting various electronic circuit components on a unit module substrate and stacking the electronic circuit components at predetermined intervals; A second step of fixing a component mounted on the unit module substrate by performing a reflow process; A third step of molding the component on the unit module substrate using one of a fixing agent and a molding compound so that the components fixed on the unit module substrates stacked at the predetermined intervals do not change their positions due to heat applied from the outside; ; A fourth step of aligning and assembling positions between designated input / output terminals of each of the plurality of stacked unit module substrates and designated input / output terminals of the terminal connecting plate; A fifth step of performing a reflow process so as to electrically and mechanically connect the pads provided on the unit module substrate and the pads provided on the terminal connection plate; And A sixth step of completing the three-dimensional assembly by removing the alignment pin from the alignment hole after performing the fifth step; 3D stacked electronic circuit manufacturing method comprising a. The method of claim 5, The first step is 3. The method of claim 3, wherein the unit module substrates on which the electronic circuit components are mounted have separate functions and operating frequencies so that the unit module substrates have separate functions and operating frequencies. The method of claim 5, The first step is The method of manufacturing a three-dimensional stacked electronic circuit in which the number of input / output terminals of each unit module substrate is the same and has the same terminal characteristics, and the terminal pad array is disposed at both edges of the substrate in a plane array manner. The method of claim 5, The first step is a method of manufacturing a three-dimensional stacked electronic circuit comprising the step of mounting the electronic circuit component on the unit module substrate by one method of soldering or flip chip bonding. The method according to any one of claims 5 to 8, The fourth step is And forming the RF characteristic impedance of each unit module substrate so that the characteristic impedance of the terminal control panel is the same. The method according to any one of claims 5 to 8, The fourth step is And processing the thickness of the terminal adjusting plate to adjust the height according to the height of the components mounted on the terminal module substrate. The process according to any one of claims 5 to 8. The fourth step is And a step of assembling each unit module substrate and the terminal connecting plate by inserting an alignment pin into the through hole formed in each unit module substrate and the alignment hole formed in the plurality of terminal connecting plates. The method according to any one of claims 5 to 8, The fourth step is Method of manufacturing a three-dimensional stacked electronic circuit comprising the step of assembling each terminal module substrate and the terminal connecting plate using a surface-mounted pneumatic. The method according to any one of claims 5 to 8, The fifth step is Solder ball is inserted between the pad provided on the unit module substrate and the pad provided on the terminal connecting plate to fix with flux, and then precisely and automatically corrected by the surface tension of the solder during the reflow process. Method of manufacturing a three-dimensional stacked electronic circuit comprising a step of finding and fixing the pad position of each other.