KR100359744B1 - Device for controlling the radiant heat area of heat sink - Google Patents
Device for controlling the radiant heat area of heat sink Download PDFInfo
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- KR100359744B1 KR100359744B1 KR1020000016013A KR20000016013A KR100359744B1 KR 100359744 B1 KR100359744 B1 KR 100359744B1 KR 1020000016013 A KR1020000016013 A KR 1020000016013A KR 20000016013 A KR20000016013 A KR 20000016013A KR 100359744 B1 KR100359744 B1 KR 100359744B1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/035—Cooling of active equipments, e.g. air ducts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
본 발명은 통신전자장비내에 실장되는 각종 전장품을 냉각하는 데에 사용되는 방열판에 관한 것으로, 통신전자장비의 내부공간에 장착되는 플레이트형상의 지지베이스(110)와, 지지베이스(110)의 상부면에 일체화되어 방열면적을 증대하여주는 냉각격판(120)들로 이루어진 통상적인 방열판(100)에 있어서, 지지베이스(110)의 내부공간에 소정 크기의 공간부(30)가 형성되며, 공간부(30)에 매개체인 히트파이프(11)와 불활성가스가 충진된 저장부(12)가 상호 연결되어 한 몸체를 이루는 면적제어기(10)가 장착되어, 여름철과 같은 고온환경과 겨울철과 같은 저온환경에서도 냉각효율이 일정하게 유지되어 방열판의 가동효율이 증대됨은 물론 저온환경에서 히터를 가동하기 위한 별도의 부대비용이 절감되게 한 것이다.The present invention relates to a heat sink used to cool various electrical appliances mounted in communication electronic equipment, and includes a plate-shaped support base 110 and an upper surface of the support base 110 mounted in an internal space of the communication electronic equipment. In the conventional heat sink 100 consisting of cooling plate 120 to increase the heat dissipation area is integrated in the space, the space portion 30 of a predetermined size is formed in the internal space of the support base 110, the space portion ( 30, the heat pipe 11 and the inert gas-filled storage unit 12 are connected to each other, and the area controller 10 forming one body is mounted, so that even in a high temperature environment such as summer and a low temperature environment such as winter, The cooling efficiency is kept constant so that the operating efficiency of the heat sink is increased as well as the additional cost for operating the heater in a low temperature environment.
Description
본 발명은 통신전자장비내에 실장되는 각종 전장품을 냉각하는 데에 사용되는 방열판에 관한 것으로, 특히 방열판의 방열면적이 가변되도록 하여 외기온도와는 관계 없이 냉각효율을 일정하게 유지시킬 수 있도록 된 통신전자장비용 방열판의 방열면적제어 장치에 관한 것이다.The present invention relates to a heat dissipation plate used to cool various electrical appliances mounted in communication electronic equipment. In particular, the heat dissipation area of the heat dissipation plate is varied so that the cooling efficiency can be kept constant regardless of the outside temperature. A heat dissipation area control device of a heat sink.
일반적으로, 통신전자장비 예컨대, 통신기지단말기, 휴대통신단말기, 이동통신단말기 등에 실장되어 있는 각종 전장품들은 시스템이 작동되는 과정에서 다량의 열을 발생시키게 되므로, 이들의 수용공간에는 전장품을 냉각하기 위한 다수개의 방열장치가 실장되어 있다.In general, various electronic devices mounted in communication electronic equipment, for example, a communication base terminal, a mobile communication terminal, a mobile communication terminal, and the like generate a large amount of heat during the operation of the system. Many heat sinks are mounted.
따라서, 통신전자장비내에 실장되는 각종 전장품을 냉각하기 위한 수단으로서, 전장품에서부터 발생되는 폐열의 방열 면적을 크게 하여 주는 방열판과, 방열판에서 발생된 폐열을 강제대류방식으로 외부로 배출시켜주는 열교환기 등을 장착하게 된다.Therefore, as a means for cooling the various electrical appliances mounted in the communication electronic equipment, a heat sink for increasing the heat dissipation area of the waste heat generated from the electrical equipment, a heat exchanger for discharging the waste heat generated from the heat sink to the outside by forced convection Will be fitted.
즉, 통신전자장비의 방열판(100)은 도 1에 도시된 바와 같이, 통신전자장비의 전장품에 부착된 지지베이스(110)에 전장품으로부터 발산되는 폐열의 방열면적을 크게 하여 즉, 접촉면적을 크게 하여 냉각효율을 극대화시키기 위한 다수개의 냉각격판(120)이 일체로 형성되어 있다.That is, as shown in Figure 1, the heat sink 100 of the communication electronic equipment to increase the heat dissipation area of the waste heat emitted from the electrical equipment to the support base 110 attached to the electrical equipment of the communication electronic equipment, that is, to increase the contact area In order to maximize the cooling efficiency, a plurality of cooling plates 120 are integrally formed.
따라서. 통신전자장비의 시스템이 가동되는 과정에서 전장품으로부터 발생되는 폐열이 방열판(100)의 냉각격판(120)을 통해서 또는 열교환기에 의해 강제로 압송된 상태로 예컨대, 강제대류방식에 의해 배출구로 상향되어 외부로 배출되는 것이다.therefore. The waste heat generated from the electrical equipment in the process of operating the system of the communication electronic equipment is forced up through the cooling plate 120 of the heat sink 100 or by a heat exchanger, and is upwardly discharged to the outlet by, for example, forced convection. To be discharged.
그런데, 방열판(100)은 고온환경 즉, 발열부품의 고온환경을 기준으로 하여 설계된 상태로서, 겨울철과 같은 저온환경에서는 방열판(100)에 의해 과도하게 외부로 열이 방출되어 시스템의 내부온도가 적정수준 이하로 강하되는 악영향을 끼치게 되는 문제점이 있었다.However, the heat sink 100 is designed based on a high temperature environment, that is, a high temperature environment of the heat generating parts. In a low temperature environment such as winter, heat is excessively released to the outside by the heat sink 100 so that the internal temperature of the system is appropriate. There was a problem that adversely affects falling below the level.
또한, 겨울철과 같은 저온환경의 경우를 대비하여 통신전자장비내에 히터를 장착하는 방법이 이용되고 있지만, 히터를 설치하기 위한 별도의 공간이 요구되어 통신장비의 부피 및 중량이 증대됨은 물론 히터를 작동하기 위한 추가비용이 부담되는 문제점이 있었다.In addition, a method of mounting a heater in communication electronic equipment is used in case of a low temperature environment such as winter, but a separate space for installing a heater is required, thereby increasing the volume and weight of the communication equipment as well as operating the heater. There was a problem that the additional cost to do.
이에, 본 발명은 상기한 바와 같은 문제점을 해결하기 위하여 안출된 것으로서, 방열판의 방열면적이 주위온도에 따라 가변되도록하여 통신전자장비의 냉각효율을 일정하게 유지시킬 수 있도록 된 통신전자장비용 방열판의 방열면적 제어 장치를 제공하는 데에 그 목적이 있다.Accordingly, the present invention has been made to solve the problems described above, the heat dissipation area of the heat dissipation plate for communication electronic equipment to maintain a constant cooling efficiency of communication electronic equipment by varying the heat dissipation area of the heat sink according to the ambient temperature The object is to provide an area control apparatus.
도 1은 종래 기술에 따른 통신전자장비의 방열판을 도시한 전체도,1 is an overall view showing a heat sink of communication electronic equipment according to the prior art,
도 2는 본 발명에 따른 방열판의 방열면적 제어장치를 도시한 전체도,Figure 2 is an overall view showing a heat radiation area control device of the heat sink according to the present invention,
도 3a 및 도 3b는 본 발명에 따른 방열판의 방열면적 제어장치의 작동전후 과정을 도시한 작동상태도이다.3a and 3b is an operating state diagram showing the process before and after the operation of the heat dissipation area control device of the heat sink according to the present invention.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
10 : 면적제어기 11 : 히트파이프10: area controller 11: heat pipe
12 : 저장부 13 : 히터12: storage unit 13: the heater
20 : 단열차단막 30 ; 공간부20: thermal insulation barrier 30; Space
이하, 본 발명에 따른 실시예를 첨부된 예시도면을 참고로 하여 상세하게 설명하면 다음과 같다.Hereinafter, an embodiment according to the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명에 따른 방열판의 방열면적 제어장치를 도시한 전체도면이며,도 3a 및 도 3b는 본 발명에 따른 방열판의 방열면적 제어장치의 작동전후과정을 도시한 작동상태도로서, 통신전자장비의 내부공간에 장착되는 플레이트형상의 지지베이스(110)와, 지지베이스(110)의 상부면에 일체화되어 방열면적을 증대하여 주는 냉각격판(120)들로 이루어진 통상적인 방열판(100)에 있어서, 지지베이스(110)의 내부공간에 소정크기의 공간부(30)가 형성되며, 공간부(30)에 열전달 매개체인 히트파이프(11)와 단열 유체인 불활성가스가 충진된 저장부(12)가 상호 결합되어 한 몸체를 이루는 면적제어기(10)가 장착되어 있다.Figure 2 is an overall view showing a heat dissipation area control device of the heat sink according to the present invention, Figures 3a and 3b is an operating state diagram showing the operation before and after the operation of the heat dissipation area control device of the heat sink according to the present invention, communication electronic equipment In the typical heat sink 100 consisting of a plate-shaped support base 110 mounted in the inner space of the cooling plate 120 is integrated with the upper surface of the support base 110 to increase the heat dissipation area, A space portion 30 having a predetermined size is formed in the internal space of the support base 110, and the storage portion 12 filled with the heat pipe 11, which is a heat transfer medium, and an inert gas, which is a heat insulating fluid, is formed in the space portion 30. The area controller 10 is coupled to each other to form a body.
먼저, 본 발명의 구성요소 중 지지베이스(110)와 냉각격판(120)은 종래기술의 구성요소와 동일한 기능을 수행하므로 자세한 설명은 생략하기로 하고, 다만 지지베이스(110)의 내부공간에 소정 크기의 공간부(30)가 형성된 것에만 그 차이점이 있음을 첨언한다.First, since the support base 110 and the cooling plate 120 of the components of the present invention performs the same function as the components of the prior art, a detailed description will be omitted, but predetermined in the internal space of the support base 110 It is noted that there is a difference only in that the space portion 30 of the size is formed.
그리고, 면적제어기(10)는, 지지베이스(110)의 공간부(30)에 삽입 설치되어진 길이방향으로 중공부를 형성하는 관부재로서, 열전달매개체인 히트파이프(11)와 불활성가스가 충진되어 있는 저장부(12)로 구분되어 있으며, 히트파이프(11)는 중공인 내부공간의 소정위치에 격벽이 형성되어, 이 격벽을 중심으로 도 3a 및 도 3b에 도시된 것처럼 열원 측 즉, 도면상 좌측에는 열전달유체가, 그 반대쪽 즉, 도면상 우측에는 불활성가스가 충진된다.The area controller 10 is a pipe member that forms a hollow portion in a longitudinal direction inserted into the space portion 30 of the support base 110, and is filled with a heat pipe 11, which is a heat transfer medium, and an inert gas. The heat pipe 11 is divided into a storage unit 12, and a partition wall is formed at a predetermined position of a hollow inner space, and the partition is formed on the heat source side, that is, the left side of the drawing, as shown in FIGS. 3A and 3B. Is filled with a heat transfer fluid, on the opposite side, i.e., the right side of the drawing, with an inert gas.
또한, 저장부(12)의 몸체 일측에 소형의 히터(13)가 장착되어, 저장부(12) 내에 충진된 불활성가스를 가열하여 팽창/수축시키므로써, 면적제어기(10)내의 격벽을 왕복이동시키는 기능을 수행한다.In addition, a small heater 13 is mounted on one side of the body of the storage unit 12 to heat and expand / contract the inert gas filled in the storage unit 12, thereby reciprocating the partition wall in the area controller 10. To perform the function.
물론, 히터(13)에는 온도센서를 장착하여, 규정치 이하의 온도가 되면 '온'되게 하고, 규정치 이상의 온도로 되면 '오프'되게 함은 물론 히터의 작동시간을 적절하게 조절시킴이 바람직하다.Of course, the heater 13 is equipped with a temperature sensor, it is desirable to be 'on' when the temperature is below the prescribed value, 'off' when the temperature is above the prescribed value, as well as to properly adjust the operating time of the heater.
그리고, 단열차단막(20)은, 공간부(30)의 내부공간을 도 2에 도시된 바와 같이 열적으로 분할하고 있는 판부재로서, 열원(HS)으로부터 전달된 폐열이 히트파이프(11)를 통해서만 공간부(30)의 반대쪽 공간으로 전달될 수 있도록 한다. 이 때, 히터(13) 온오프에 따라 팽창/수축을 반복하는 불활성가스에 의해 히트파이프(11)내부의 격벽을 좌우로 이동시킴으로써 열전달유체가 차지하는 파이프(11) 내부 공간의 체적에 의해 결정되는 히트파이프(11)의 전열 가능면적(A)을 조절한다.In addition, the heat insulating barrier film 20 is a plate member that thermally divides the internal space of the space part 30 as shown in FIG. 2, and the waste heat transferred from the heat source HS is transmitted only through the heat pipe 11. It can be delivered to the space opposite the space portion 30. At this time, it is determined by the volume of the inner space of the pipe 11 occupied by the heat transfer fluid by moving the partition wall inside the heat pipe 11 from side to side by an inert gas that repeats expansion / contraction according to the heater 13 on / off. The heat transfer possible area A of the heat pipe 11 is adjusted.
이하, 본 발명에 따른 작용을 첨부된 예시도면을 참고로 하여 상세하게 설명하면 다음과 같다.Hereinafter, described in detail with reference to the accompanying drawings illustrating the operation according to the present invention.
먼저, 도 3a에 도시된 상태에서, 겨울철과 같이 저온환경이 지속되어 방열판(100)의 냉각효율을 감소시키고자 하는 경우에, 면적제어기(10)에 구비되어 있던 센서가 온도를 감지하여 히터(13)를 자동으로 '온'시키고, 이 히터(13)의 가열작용에 의해 저장부(12)에 충진되어 있던 불활성가스가 팽창된다.First, in the state illustrated in FIG. 3A, when a low temperature environment is maintained such as in winter to reduce the cooling efficiency of the heat sink 100, a sensor provided in the area controller 10 senses a temperature to generate a heater ( 13) is automatically turned on, and the inert gas that has been filled in the reservoir 12 is expanded by the heating action of the heater 13.
이로 인해, 면적제어기(10)에 내장되어 있던 격벽이 도 3b에 도시된 것처럼 불활성가스의 팽창과정에서 도면상 좌측방향으로 이동되므로, 격벽의 이동량에 해당하는 만큼 히트파이프(11) 내부에서 열전달유체가 차지하는 공간이 축소된다.As a result, the partition wall built in the area controller 10 is moved to the left side in the drawing during the expansion process of the inert gas, as shown in FIG. 3B, so that the heat transfer fluid inside the heat pipe 11 corresponds to the movement amount of the partition wall. The space occupied is reduced.
이와 같이, 히트파이프(11) 내에서 열전달유체가 차지하는 공간이 축소되는 만큼 히트파이프(11)의 전열 가능면적(A')이 감소하므로 결과적으로 면적제어기(10)에 의한 전열 가능면적(A')이 축소되어, 냉각격판(120)의 효율이 감소되는 것이다.As such, the heat transferable area A 'of the heat pipe 11 decreases as the space occupied by the heat transfer fluid in the heat pipe 11 decreases, and consequently, the heat transferable area A' by the area controller 10 is reduced. ) Is reduced, the efficiency of the cooling plate 120 is reduced.
한편, 여름철과 같이 고온환경이 지속되어 방열판(100)의 냉각효율을 증대시키고자 하는 경우에, 면적제어기(10)에 구비되어 있던 센서가 온도를 감지하여 히터(13)를 자동으로 '오프'시키게 되고, 히터(13)의 작동이 중지되어 저장부(12)에 충진되어 있던 불활성가스가 수축된다.On the other hand, when the high temperature environment is maintained, such as in summer, to increase the cooling efficiency of the heat sink 100, the sensor provided in the area controller 10 senses the temperature and automatically turns off the heater 13. The operation of the heater 13 is stopped, and the inert gas that has been filled in the reservoir 12 is contracted.
이로인해, 면적제어기(10)에 내장되어있던 격벽이 불활성가스의 수축과정에서 도면상 우측방향으로 이동되므로, 격벽의 이동량에 해당하는 만큼 히트파이프(11)의 전열 가능면적(A)이 확대된다.As a result, the partition wall built in the area controller 10 is moved in the right direction in the drawing during the shrinkage of the inert gas, so that the heat transfer possible area A of the heat pipe 11 is increased by the amount corresponding to the movement amount of the partition wall. .
즉, 히트파이프(11)의 전열 가능면적(A)이 도 3a에 도시된 바와 같이 증대되므로 냉각격판(120)에 의한 냉각 효율이 증대되는 것이다.That is, since the heat transfer possible area A of the heat pipe 11 is increased as shown in FIG. 3A, the cooling efficiency by the cooling plate 120 is increased.
이상에서 설명한 바와 같이 본 발명에 따른 통신전자장비용 방열판의 방열면적 제어장치에 의하면, 통신전자장비용 방열판의 방열면적이 외기온도의 변화량에 따라 가변되므로써, 여름철과 같은 고온환경과 겨울철과 같은 저온환경에서도 냉각효율이 일정하게 유지되어 방열판의 가동효율이 증대됨은 물론 저온환경에서 히터를 가동하기 위한 별도의 부대비용이 절감되는 효과가 있는 것이다.As described above, according to the heat dissipation area control apparatus of the heat dissipation plate for communication electronic equipment according to the present invention, the heat dissipation area of the heat dissipation plate for communication electronic equipment is varied according to the change in the outside temperature, so that even in a high temperature environment such as summer and low temperature environment such as winter The cooling efficiency is kept constant so that the operating efficiency of the heat sink is increased, as well as the additional cost for operating the heater in a low temperature environment is reduced.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000016013A KR100359744B1 (en) | 2000-03-29 | 2000-03-29 | Device for controlling the radiant heat area of heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000016013A KR100359744B1 (en) | 2000-03-29 | 2000-03-29 | Device for controlling the radiant heat area of heat sink |
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| Publication Number | Publication Date |
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| KR20010093418A KR20010093418A (en) | 2001-10-29 |
| KR100359744B1 true KR100359744B1 (en) | 2002-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020000016013A KR100359744B1 (en) | 2000-03-29 | 2000-03-29 | Device for controlling the radiant heat area of heat sink |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01204498A (en) * | 1988-02-09 | 1989-08-17 | Fujitsu Ltd | Heat sink for forced cooling |
| JPH0645776A (en) * | 1992-07-24 | 1994-02-18 | Fujitsu Ltd | Heat dissipating plate unit of circuit package |
| JPH0766334A (en) * | 1993-06-30 | 1995-03-10 | Nec Corp | Heat sink |
| JPH08255858A (en) * | 1995-03-17 | 1996-10-01 | Fujitsu Ltd | Cooling system of electronic package |
| KR970025330A (en) * | 1995-10-27 | 1997-05-30 | 김광호 | Heatsink device |
| JPH09210581A (en) * | 1996-01-31 | 1997-08-12 | Showa Aircraft Ind Co Ltd | Radiator |
| JP2000200866A (en) * | 1999-01-07 | 2000-07-18 | Hitachi Ltd | Semiconductor cooling device for vehicle controller |
-
2000
- 2000-03-29 KR KR1020000016013A patent/KR100359744B1/en not_active IP Right Cessation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01204498A (en) * | 1988-02-09 | 1989-08-17 | Fujitsu Ltd | Heat sink for forced cooling |
| JPH0645776A (en) * | 1992-07-24 | 1994-02-18 | Fujitsu Ltd | Heat dissipating plate unit of circuit package |
| JPH0766334A (en) * | 1993-06-30 | 1995-03-10 | Nec Corp | Heat sink |
| JPH08255858A (en) * | 1995-03-17 | 1996-10-01 | Fujitsu Ltd | Cooling system of electronic package |
| KR970025330A (en) * | 1995-10-27 | 1997-05-30 | 김광호 | Heatsink device |
| JPH09210581A (en) * | 1996-01-31 | 1997-08-12 | Showa Aircraft Ind Co Ltd | Radiator |
| JP2000200866A (en) * | 1999-01-07 | 2000-07-18 | Hitachi Ltd | Semiconductor cooling device for vehicle controller |
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| Publication number | Publication date |
|---|---|
| KR20010093418A (en) | 2001-10-29 |
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