KR100356398B1 - Refrigerated system with thermo electric module and heat pipe - Google Patents
Refrigerated system with thermo electric module and heat pipe Download PDFInfo
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- KR100356398B1 KR100356398B1 KR1020000030741A KR20000030741A KR100356398B1 KR 100356398 B1 KR100356398 B1 KR 100356398B1 KR 1020000030741 A KR1020000030741 A KR 1020000030741A KR 20000030741 A KR20000030741 A KR 20000030741A KR 100356398 B1 KR100356398 B1 KR 100356398B1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/124—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and being formed of pins
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/12—Sound
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
본 발명은 열전소자와 히트파이프를 이용한 냉각시스템에 관한 것으로, 특히 열전소자(10)의 발열부(16)에서 발생한 열을 공냉식 또는 수냉식 방열수단을 이용하여 방열함에 있어서, 상기 열전소자(10)의 발열부(16)에는 방열블럭(22b)(22c)이 접하고, 상기 방열블럭(22b)(22c)의 소정개소에는 밀페된 관의 형상으로 내부에 일정량의 냉매(52)가 일정압력으로 충진된 다수개의 히트파이프(50)의 일측단이 내설되고, 상기 히트파이프(50)의 타측으로는 냉매(52)의 액화열을 방출할 수 있는 공랭식 또는 수냉식 방열수단을 가지는 냉각시스템을 구성하여, 발열부(16)에서 발생한 열을 히트파이프(50)로서 보다 신속하게 방열수단 전체로 전도하여 방열함으로서 냉각시스템 전체의 효율을 향상킬수 있는 열전소자와 히트파이프를 이용한 냉각시스템에 관한 것이다.The present invention relates to a cooling system using a thermoelectric element and a heat pipe, in particular in the heat dissipation of heat generated in the heat generating portion 16 of the thermoelectric element 10 using air-cooled or water-cooled heat radiation means, the thermoelectric element 10 The heat dissipation blocks 22b and 22c are in contact with the heat generating unit 16, and a predetermined amount of the refrigerant 52 is filled at a predetermined pressure in a predetermined shape of the heat dissipation blocks 22b and 22c in a sealed tube. One end of the plurality of heat pipes 50 is provided, and the other side of the heat pipe 50 constitutes a cooling system having an air-cooled or water-cooled heat dissipation means capable of dissipating liquefied heat of the refrigerant 52. It relates to a cooling system using a thermoelectric element and a heat pipe that can improve the efficiency of the entire cooling system by conducting heat to the heat radiating means more quickly as a heat pipe 50 to the entire heat radiating means.
Description
본 발명은 열전소자와 히트파이프를 이용한 냉각시스템에 관한 것으로, 특히 열전소자의 발열부에서 발생한 열을 공냉식 또는 수냉식 방열수단을 이용하여 방열함에 있어서, 열전소자의 발열부와 방열수단 사이를 히트파이프로 연결구성하여 발열부에서 발생한 열을 보다 신속하게 방열수단 전체로 전도하여 방열함으로서 냉각시스템 전체의 효율을 향상킬수 있는 열전소자와 히트파이프를 이용한 냉각시스템에 관한 것이다.The present invention relates to a cooling system using a thermoelectric element and a heat pipe, in particular in heat dissipation of heat generated in the heat generating portion of the thermoelectric element using air-cooled or water-cooled heat radiating means, between the heat pipe and the heat radiating means of the thermoelectric element The present invention relates to a cooling system using a thermoelectric element and a heat pipe that can improve the efficiency of the entire cooling system by conducting heat radiation from the heat generating unit to the heat radiating means more quickly.
열전소자를 이용한 냉각시스템은 현재 의학, 광학, 반도체 생산 및 초급랭 초저온 냉동설비등 그 이용분야가 나날이 증대되고 있는 추세이며, 그에 따른 유닛의 기술개발 역시 그 필요성이 절실히 요구되고 있다.The cooling system using thermoelectric elements is currently increasing in the fields of use, such as medical, optical, semiconductor production and supercooling cryogenic refrigeration equipment, and the development of the technology of the unit is also urgently required.
열전소자를 이용한 냉각시스템은 전류가 공급되면 양측면이 냉각부와 발열부로 형성되는 열전소자의 특징을 이용한 것으로, 상기 열전소자에 전류가 공급될때 발열부와 냉각부의 최대 온도차 ΔT는 이론상 65~73℃ 이며, 냉각부의 온도를 소정의 온도로 효율적으로 냉각하기 위해서는 ΔT를 감안한 발열부의 온도를 어떻게 제어 하느냐에 따라 냉각부의 효율에 상당한 영향을 미친다. 즉, 상기 열전소자를 이용한 냉각 시스템에서 냉각효율은 열전소자의 발열부를 냉각하는 방열수단의 성능이 중요한 영향을 미친다.The cooling system using the thermoelectric element utilizes the characteristics of the thermoelectric element formed on both sides of the cooling unit and the heating unit when a current is supplied. When the current is supplied to the thermoelectric element, the maximum temperature difference ΔT of the heating unit and the cooling unit is theoretically 65 to 73 ° C. In order to efficiently cool the temperature of the cooling unit to a predetermined temperature, the efficiency of the cooling unit has a significant effect depending on how the temperature of the heat generating unit in consideration of ΔT is controlled. That is, the cooling efficiency in the cooling system using the thermoelectric element has an important effect on the performance of the heat radiation means for cooling the heat generating portion of the thermoelectric element.
종래 열전소자를 이용한 냉각시스템의 방열수단으로는 크게 공랭식과 수냉식이 있으며, 그 실시 예를 하기에서 도1 및 도2를 참조하여 보다 상세하게살펴본다.The heat dissipation means of the conventional cooling system using a thermoelectric element is largely air-cooled and water-cooled, the embodiment will be described in more detail with reference to Figures 1 and 2 below.
도 1은 종래 공랭식 방열수단을 가지는 열전소자 냉각시스템의 단면도이고, 도 2는 종래 수냉식 방열수단을 가지는 열전소자 냉각시스템의 사시도이다.1 is a cross-sectional view of a thermoelectric element cooling system having a conventional air-cooled heat radiating means, Figure 2 is a perspective view of a thermoelectric element cooling system having a conventional water-cooled radiating means.
우선, 도 1을 참조하여 종래 공랭식 방열수단을 가지는 열전소자 냉각시스템의 구조를 살펴보면, 열전소자(10)의 냉각부(12)측으로 냉각기(14)가 형성되고 발열부(16)측으로는 방열기(20)가 형성된다. 상기 방열기(20)는 열전소자(10)의 발열부(16)와 일측면이 접하는 방열블럭(22a)과, 상기 방열블럭(22a)의 타측으로 형성된 수개의 방열핀(28)과, 방열핀(28)의 종단측으로 형성된 냉각팬(30)으로 구성되고, 방열블럭(22a) 및 방열핀(28)은 비교적 열전도성이 우수한 알루미늄이나 구리를 사용한다.First, referring to FIG. 1, a structure of a thermoelectric element cooling system having a conventional air-cooled heat dissipation means is provided. A cooler 14 is formed on the cooling unit 12 side of the thermoelectric element 10, and a radiator (radiator) is disposed on the heat generating unit 16 side. 20) is formed. The radiator 20 includes a heat dissipation block 22a in which one side of the heat dissipating portion 16 of the thermoelectric element 10 is in contact, several heat dissipation fins 28 formed on the other side of the heat dissipation block 22a, and a heat dissipation fin 28. The heat dissipation block 22a and the heat dissipation fin 28 are made of aluminum or copper, which are relatively excellent in thermal conductivity.
그러나, 상기의 경우 작은 방열면적을 가지는 열전소자(10) 발열부(16)의 열이 보다 넓은 방열면적을 가지는 각각의 방열핀(28)에 신속히 전도되어 대기중으로 방열 되어야하나, 방열블럭(22a) 및 방열핀(28)이 비교적 열전도성이 좋은 알루미늄이나 구리를 사용함에도 불구하고 열전도율의 한계가 있어 발열부(16)의 열이 각각의 방열핀(28)에 신속히 전도되지 못하여 냉각효율이 떨어지게 되고, 이를 보완하여 방열핀(28)의 종단측으로 냉각팬(30)을 형성하여 강제송풍을 하게되지만, 이로 인하여 냉각시스템 전체의 부피가 커지고 냉각팬(30)에 의한 소음 또한 발생하는 문제점이 있다.However, in the above case, the heat of the heat generating unit 16 having a small heat dissipation area should be quickly conducted to each of the heat dissipation fins 28 having a larger heat dissipation area and radiated to the air. And although the heat dissipation fin 28 has a relatively high thermal conductivity of aluminum or copper, there is a limit of thermal conductivity, so that the heat of the heat generating unit 16 is not quickly conducted to each of the heat dissipation fins 28, thereby decreasing cooling efficiency. Complementary to form a cooling fan 30 to the end side of the radiating fins 28 to force forced air, but this causes a problem that the volume of the entire cooling system is increased and noise by the cooling fan 30 also occurs.
그리고, 도 2를 참조하여 종래 수냉식 방열수단을 가지는 열전소자 냉각시스템의 구조를 살펴보면, 열전소자(10)의 냉각부(12)측으로 냉각기(미도시)가 형성되고, 발열부(16)측으로는 급수체구부(44)와 배수체구부(46)가 형성되고 상기 급수체구부(44)와 배수체구부(46)를 연통하는 냉각수로(42)가 내부에 형성된 수냉킷트(40)가 형성되어 열전소자(10)의 발열부(16)와 접하며, 상기 수냉킷트(40)에 공급되는 냉각수는 순환펌프(미도시)와 연결호스(69)에 의하여 순환된다.2, a cooler (not shown) is formed on the cooling unit 12 side of the thermoelectric element 10, and the heat generating unit 16 side is described with reference to FIG. A water cooling kit 40 having a water supply sphere 44 and a drainage sphere 46 formed therein and having a cooling water passage 42 communicating with the water supply sphere 44 and the drainage sphere 46 is formed. In contact with the heat generating portion 16 of 10, the cooling water supplied to the water cooling kit 40 is circulated by a circulation pump (not shown) and the connection hose (69).
그러나, 상기의 경우 역시 열전소자(10) 발열부(16)의 열이 수냉킷트(40)가 가지는 열전도율의 한계에 따라 수냉킷트(40)의 전체에 신속하게 전도되지 않아 만족할 만한 냉각시스템의 효율을 얻지 못하는 문제점이 있었다.However, in this case, too, the heat of the heat generating element 16 of the thermoelectric element 10 is not quickly conducted to the whole of the water cooling kit 40 according to the limit of the thermal conductivity of the water cooling kit 40, thereby satisfactory efficiency of the cooling system. There was a problem not getting.
상기한 바와 같은 열전소자를 이용한 냉각시스템의 문제를 해결하기 위한 본 발명의 목적은, 열전소자의 발열부와 공랭식 또는 수냉식 방열수단 사이에 히트파이프를 구성함으로서 열전소자의 발열부에서 발생한 열을 보다 신속하게 방열수단에 전달하여 대기중에 방열함으로서 냉각효율을 향상 시키고, 그에따라 공랭식 방열수단을 가지는 냉각시스템의 경우 냉각팬을 사용하지 않아 부피가 작고 소음이 없는 열전소자를 이용한 냉각시스템을 제공하는데 본 발명의 목적이 있다,An object of the present invention for solving the problem of the cooling system using a thermoelectric element as described above, by forming a heat pipe between the heat generating portion of the thermoelectric element and air-cooled or water-cooled heat dissipation means to see the heat generated in the heat generating portion of the thermoelectric element Cooling efficiency is improved by transferring heat to the heat dissipation means rapidly, and accordingly, the cooling system with air-cooled heat dissipation means provides a cooling system using a small volume and noiseless thermoelectric element without using a cooling fan. There is an object of the invention,
도 1은 종래 공랭식 방열수단을 가지는 열전소자 냉각시스템의 단면도1 is a cross-sectional view of a thermoelectric element cooling system having a conventional air-cooled heat radiating means
도 2는 종래 수냉식 방열수단을 가지는 열전소자 냉각시스템의 사시도Figure 2 is a perspective view of a thermoelectric element cooling system having a conventional water-cooled heat dissipation means
도 3은 본 발명의 실시예 따른 부분 단면도3 is a partial cross-sectional view according to an embodiment of the present invention.
도 4는 본 발명의 다른 실시예에 따른 단면도4 is a cross-sectional view according to another embodiment of the present invention.
도 5는 본 발명의 다른 실시예에 따른 평면도5 is a plan view according to another embodiment of the present invention.
*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
10 : 열전소자 12 : 냉각부10: thermoelectric element 12: cooling unit
14 : 냉각기 16 : 발열부14: cooler 16: heat generating unit
20 : 방열기 22a, 22b, 22c : 방열블럭20: radiator 22a, 22b, 22c: heat dissipation block
28, 58 : 방열핀 30 : 냉각팬28, 58: heat sink fin 30: cooling fan
40, 60 : 수냉킷트 42 : 냉각수로40, 60: water cooling kit 42: cooling water
44, 64 : 급수체구부 46, 66 : 배수체구부44, 64: water supply sphere 46, 66: drainage sphere
50 : 히트파이프 52 : 냉매50: heat pipe 52: refrigerant
55 : 실린더 62 : 공간부55 cylinder 62 space part
이와 같은 목적을 달성하기 위한 본 발명의 실시 예를 하기에서 도3 내지 도5를 참조하여 보다 상세하게 살펴보되, 도1 및 도2와 동일한 부분의 부호는 설명의 중복을 피하고자 동일 부호로 나타낸다.An embodiment of the present invention for achieving the above object will be described in more detail with reference to FIGS. 3 to 5 below, the same reference numerals as in FIGS. 1 and 2 are denoted by the same reference numerals to avoid duplication of description. .
도 3은 본 발명의 실시예 따른 부분 단면도이고, 도 4는 본 발명의 다른 실시예에 따른 단면도이며, 도 5는 본 발명의 다른 실시예에 따른 평면도이다.3 is a partial cross-sectional view according to an embodiment of the present invention, FIG. 4 is a cross-sectional view according to another embodiment of the present invention, and FIG. 5 is a plan view according to another embodiment of the present invention.
본 발명의 구성을 살펴보면, 열전소자(10)의 냉각부(12)에는 냉각기(미도시)가 형성되어 접하고, 발열부(16)에는 방열블럭(22b)(22c)이 형성되어 접한다. 상기 방열블럭(22b)(22c)의 소정개소에는 밀폐된 관의 형상으로서 그 내부공간에 일정량의 냉매(52)가 소정의 압력으로 충전되어 있는 다수개의 히트파이프(50)의 일측단이 내설되고, 상기 히트파이프(50)의 타측으로는 공랭식 또는 수냉식 방열수단이 형성된다.Looking at the configuration of the present invention, a cooler (not shown) is formed in contact with the cooling unit 12 of the thermoelectric element 10, the heat dissipation unit (22b) (22c) is formed in contact with. One end of a plurality of heat pipes 50 is formed in a predetermined portion of the heat dissipation blocks 22b and 22c in the form of a sealed tube and filled with a predetermined amount of the refrigerant 52 in a predetermined pressure in an inner space thereof. On the other side of the heat pipe 50, air-cooled or water-cooled heat radiation means is formed.
상기 공랭식 또는 수냉식 방열수단 중에서 우선 도 3을 참조하여 공랭식 방열수단의 구성을 보다 상세히 살펴보면, 상기 히트파이프(50)의 외경과 접하는 내경을 가지는 실린더(55)가 형성되고 상기 실린더(55)의 외주로 다층의 방열핀(58)이 형성되어 있다.Among the air-cooled or water-cooled heat-dissipating means, first, referring to FIG. 3, the air-cooled heat-dissipating means will be described in more detail. A cylinder 55 having an inner diameter in contact with the outer diameter of the heat pipe 50 is formed and the outer periphery of the cylinder 55. The multilayer heat sink fin 58 is formed.
그리고, 도 4 및 도 5를 참조하여 수냉식 방열수단의 구성을 살펴보면, 냉각수가 순환 할 수 있는 공간부(62)가 내부에 형성된 수냉킷트(60)를 형성하고, 상기 수냉킷트(60)의 소정개소에는 급수체구부(64)와 배수체구부(66)가 공간부(62)와 연통하게 형성되어 상기 수냉킷트(60)에 냉각수를 공급하고, 상기 수냉킷트(60)의 공간부(62) 내로는 히트파이프(50)가 내삽되어 밀폐되며, 급수체구부(64)와 배수체구부(66)를 통하여 급수 및 배수가 되는 냉각수는 순환펌프(미도시) 및 연결호스(69)에 의하여 순환된다.4 and 5, the structure of the water-cooled heat dissipation means is formed. A water cooling kit 60 having a space 62 through which cooling water can be circulated is formed, and a predetermined portion of the water cooling kit 60 is formed. At a location, a water supply outlet 64 and a drain outlet 66 are formed in communication with the space 62 to supply cooling water to the water cooling kit 60 and into the space 62 of the water cooling kit 60. The heat pipe 50 is inserted and sealed, and the coolant that is supplied and drained through the water supply outlet 64 and the drain outlet 66 is circulated by a circulation pump (not shown) and a connection hose 69.
상기와 같이 구성된 본 발명의 작용효과를 하기에서 보다 상세하게 살펴보면, 열전소자(10)에 전원이 공급되고 발열부(16)의 온도가 상승하면, 상기 발열부(16)와 접한 방열블럭(22b)(22c) 또한 열교환하여 온도가 상승하게 되고, 상기 방열블럭(22b)(22c)에 일측단이 내설된 히트파이프(50) 역시 온도가 상승하게 된다. 그리고, 상기 히트파이프(50)가 소정의 온도까지 올라가면 히트파이프(50)의 내부에 충진되어 있는 냉매(52)가 순간적으로 기화하게 되고, 이 때 방열블럭(22b)(22c)으로 부터 기화열을 흡수하여 기체상태가된 냉매(52)는 히트파이프(50)의 타측 종단으로 빠르게 이동하는데, 상기 이동간에 기화된 냉매(52)가 가지는 기화열은 공랭식 방열수단의 경우 히트파이프(50)와 접한 실린더(55) 및 실린더(55)와 접한 방열핀(58)으로 방출되어 상기 냉매(52)는 다시 액화하게 되고, 상기 냉매(52)가 방출한 기화열 즉, 액화열은 방열핀(58)을 통하여 대기로 방출된다.Looking at the effect of the present invention configured as described above in more detail, when the power is supplied to the thermoelectric element 10 and the temperature of the heat generating portion 16 rises, the heat radiation block 22b in contact with the heat generating portion 16 ) 22c is also heat exchanged to increase the temperature, and the heat pipe 50 having one end built into the heat dissipation blocks 22b and 22c also increases. When the heat pipe 50 rises to a predetermined temperature, the refrigerant 52 filled in the heat pipe 50 vaporizes instantaneously, and at this time, the heat of vaporization from the heat dissipation blocks 22b and 22c. The refrigerant 52 absorbed into the gaseous state rapidly moves to the other end of the heat pipe 50. The vaporization heat of the refrigerant vaporized between the movements is a cylinder in contact with the heat pipe 50 in the case of air-cooled heat radiating means. The coolant 52 is liquefied again by being discharged to the heat dissipation fin 58 in contact with the 55 and the cylinder 55, and the vaporization heat emitted from the coolant 52 is discharged to the atmosphere through the heat dissipation fin 58. do.
수냉식 방열수단의 경우 히트파이프(50)의 외주로 순환하는 냉각수가 상기 냉매(52)의 액화열 흡수하여 냉매(52)가 다시 액화하게 되고, 냉각수가 흡수한 냉매(52)의 액화열은 냉각수의 순환에 의하여 외부로 방출된다.In the case of the water-cooled heat dissipation means, the coolant circulated to the outer circumference of the heat pipe 50 absorbs the liquefaction heat of the coolant 52 to liquefy the coolant 52 again, and the liquefied heat of the coolant 52 absorbed by the coolant is circulated in the coolant. Is emitted to the outside.
상기와 같이 히트파이프(50)의 내부에 충진된 냉매(52)는 기화와 액화를 반복하면서 열전소자(10)의 발열부(16)에서 발생한 열을 순식간에 방열핀(58)의 초종단, 또는 냉각수로 방출하여 냉각시스템의 효율을 극대화하고, 이 때 히트파이프(50) 내의 압력이 낮으면 냉매(52)의 기화점이 낮아지고 반대로 압력이 높으면 기화점은 높아지게 되며 상기 히트파이프(50)의 내부압력이나 냉매(52)의 종류는 냉각시스템이 필요로 하는 성능과 그 용도에 맞게 설정할 수 있다.As described above, the refrigerant 52 filled in the heat pipe 50 may immediately dissipate heat generated by the heat generating portion 16 of the thermoelectric element 10 while repeating vaporization and liquefaction. It is discharged into the cooling water to maximize the efficiency of the cooling system, in this case, if the pressure in the heat pipe 50 is low, the vaporization point of the refrigerant 52 is low, on the contrary, if the pressure is high, the vaporization point is high and the inside of the heat pipe 50 The type of pressure or the refrigerant 52 can be set according to the performance required by the cooling system and its use.
상기한 바와 같은 열전소자와 히트파이프를 이용한 냉각시스템을 구성함으로서, 열전소자의 발열부에서 발생한 열을 보다 신속하게 방열수단 전체로 전도하여 대기중에 방열할 수 있어 냉각시스템 전체의 냉각효율을 증대시키고, 그에따라 공랭식 방열수단을 가지는 냉각시스템에 있어서는 별도의 냉각팬이 필요치 않으므로 냉각팬에 의한 소음이 없고 부피를 최소화 할 수 있는 뛰어난 효과가 있다.By constructing the cooling system using the thermoelectric element and the heat pipe as described above, the heat generated from the heat generating portion of the thermoelectric element can be conducted more quickly through the heat dissipation means to radiate heat into the air, thereby increasing the cooling efficiency of the entire cooling system. Therefore, in the cooling system having air-cooled heat radiating means, there is no need for a separate cooling fan, so there is no noise caused by the cooling fan and there is an excellent effect of minimizing the volume.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100512041B1 (en) * | 2003-12-11 | 2005-09-05 | 최동각 | Heat exchanger for air conditioner |
| WO2007073050A1 (en) * | 2005-12-22 | 2007-06-28 | Byoung-Goan Park | Thermoelectrical work plate |
| KR101449293B1 (en) * | 2013-06-03 | 2014-10-08 | 현대자동차주식회사 | Cooling and heating cup holder |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101529024B1 (en) * | 2013-12-31 | 2015-06-17 | 갑을오토텍(주) | Heat exchanger with thermoelectric element |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121816A (en) * | 1997-10-21 | 1999-04-30 | Morikkusu Kk | Thermoelectric module unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH11121816A (en) * | 1997-10-21 | 1999-04-30 | Morikkusu Kk | Thermoelectric module unit |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100512041B1 (en) * | 2003-12-11 | 2005-09-05 | 최동각 | Heat exchanger for air conditioner |
| WO2007073050A1 (en) * | 2005-12-22 | 2007-06-28 | Byoung-Goan Park | Thermoelectrical work plate |
| KR101449293B1 (en) * | 2013-06-03 | 2014-10-08 | 현대자동차주식회사 | Cooling and heating cup holder |
| US9416994B2 (en) | 2013-06-03 | 2016-08-16 | Hyundai Motor Company | Cooling and heating cup holder |
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| KR20000054406A (en) | 2000-09-05 |
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