KR100353006B1 - Structure For Fixing The Cavacity Block Of Mold - Google Patents

Abstract

The present invention relates to a cavity block fixing structure of a mold, and in particular, a cavity block having a cavity formed on an upper surface thereof is divided into a plurality of parts to form a key and hole through a central part, and are positioned using a plurality of square fixing keys. Since the crystal block, the first and the second cavity block and the runner block are connected to each other and fixed, the thickness of the semiconductor device to be formed becomes thick, and the assembly and workability can be improved by assembling smoothly even if there are many parts to be assembled. Rather, it relates to very useful and effective inventions that allow precise assembly.

Description

Structure For Fixing The Cavacity Block Of Mold}

The present invention relates to a mold structure for connecting and fixing other parts of a block of a mold. In particular, a cavity block having a cavity formed on an upper surface thereof is divided into a plurality of parts to form a key hole and a plurality of parts. The positioning block, the first and the second cavity block, and the runner block are fixed to each other by using the square fixing key, so that the thickness of the semiconductor device to be formed becomes thick and the assembly can be performed smoothly even if there are many parts to be assembled. And it relates to a cavity block fixing structure of the mold to improve workability as well as precise assembly.

In general, the semiconductor package device is a thermosetting material for the effective dissipation of heat generated in the semiconductor while protecting the electrical chip due to various causes such as corrosion caused by external factors of the semiconductor chip after the wire bonding and promoting mechanical stability It is the apparatus comprised by sealing using the epoxy molding compound which is resin.

As described above, the process of sealing the semiconductor chip is roughly described. After manufacturing the lead frame, the semiconductor chip having various circuits is bonded to the central portion of the lead frame. Then, the wire bonding process that connects the terminal part of the bonded semiconductor chip and the lead of the lead frame is followed, and in order to protect the wire bonded state, it is finally formed into an epoxy molding compound to complete a semiconductor device having a certain shape. do.

The package molding process requires not only an ultra-precision of 0.004 mm or less, but also maintains a high density between the upper and lower chases and the center block and the lower chase during the package forming operation.

In particular, when a high temperature heat is received between the center block and the lower chase, a minute gap is generated due to the difference in stress, and the resin paper moving through the passage leaks, thereby causing a defect in molding of the semiconductor package device.

Meanwhile, a method of assembling a mold device for molding a lead frame of a semiconductor device includes a method of fastening different parts (blocks) using screws, and giving a step to different parts so that one part (block) A method of structurally holding another part (block) was used.

1 is a view showing a planar state of a mold structure according to a conventional embodiment, Figure 2 is a view showing a cross section of Figure 1, Figure 3 is a cross-sectional view showing a mold structure according to another conventional embodiment.

1 and 2, the configuration of the invention according to the prior art, the lower chase (1) having a recess forming a lower structure of the mold, and on one side of the lower chase (1) A mold case 11 for fixing the lower chase 1 by a mold coupling screw 21 fastened to the formed screw hole, and is placed in the center of the lower chase 1, the mold is moved to the upper A passage 5 is formed and a runner block 3 fixed to the bottom by a runner fixing screw 19 and a cavity block fixing screw 17 to the lower chase 1 adjacent to both sides of the runner block 3. Cavity block 7 is fixed by the (C) and the cavity 9 is formed on the upper surface and the blocks (3) (7) placed on one side of the cavity block 7 is fixed And a positioning block 13 having a positioning pin 15 protruding upward.

As shown in FIG. 3, the runner block 31, the first cavity block 27, and the same as those of the above embodiment are disposed in the lower chase 26. In the second cavity block 33 to be inserted into the stepped portion to form a mutually fixed parts (blocks) of each other.

Of course, it is preferable to use the runner fixing screw 35, the cavity block fixing screw 37, and the like, rather than purely using the stepped portion.

However, in recent years, in order to increase the productivity of a semiconductor device having a small package, many lines have been arranged in one lead frame. In this case, in the mold maker's position, the assembly of the parts (blocks) for forming the part becomes a problem, and the thickness of the semiconductor device to be molded becomes thin, and the number of parts to be assembled increases. There is a problem that becomes impossible.

The present invention has been made in view of this point, and divided into a plurality of parts of the cavity block with a cavity formed on the upper surface to form a key and hole through the central portion, and using a plurality of rectangular fixing keys Since the first and second cavity blocks and the runner block are connected to each other to fix them, the thickness of the semiconductor device to be molded becomes thick, and even if there are many parts to be assembled, the assembly can be performed smoothly, thereby improving the assemblability and workability as well as precise assembly. The purpose is to make it happen.

1 is a view showing a plan state of a mold structure according to a conventional embodiment,

2 is a view showing a cross section of FIG.

3 is a cross-sectional view showing a mold structure according to another conventional embodiment;

Figure 4a is a view showing a plan state of the mold structure according to the present invention,

4B is a view showing a cross-sectional view taken along the line A-A of FIG. 4A,

Figure 4c is a view showing a side state of the mold structure according to the present invention,

FIG. 4D is an enlarged view of “B” of FIG. 4B;

5A and 5B are views showing the configuration of the first cavity block according to the present invention;

6a and 6b are views showing the configuration of a positioning block according to the present invention;

7a and 7b are views showing the configuration of the first cavity block according to the present invention,

8 is a view showing a square fixing key according to the present invention,

9 is a view showing a center fixing key according to the present invention.

Explanation of symbols on the main parts of the drawing

50: mold case 52: lower chase

52b: positioning block 54: positioning block

56: first cavity block 58: second cavity block

60: runner block 62: mold coupling screw

64: runner fixing pin 70: square fixing key

72: center fixing key

This object is a lower chase having a recess forming a lower structure of a mold, a mold case for fixing the lower chase by a mold coupling screw fastened to a screw hole formed on one side of the lower chase, and the lower chase In the mold structure of the semiconductor device, which is placed in the center of the upper part, a passage through which the mold is moved, and fixed by a runner block fixed to the bottom by a runner fixing screw, has a lower chase adjacent to both sides of the runner block. A plurality of first cavity blocks enclosed in and forming a plurality of key insertion holes so as to penetrate the side portions, and having a thin thickness forming a center groove in a bottom surface of the central portion; A position contacted to the outside of the first cavity block to form a key insertion hole that matches the key insertion hole, a center groove corresponding to the center groove, and fixed to the bottom by a positioning block screw with a screw hole A crystal block; A second cavity block forming a jaw portion fixed between the first cavity block and a runner step of the runner block and forming a key insertion hole and a center groove corresponding to the key insertion hole and the center groove; A plurality of square fixing keys which are inserted into the key insertion holes of the first and second cavity blocks and the positioning blocks to fix the positions; The center block key of the first and second cavity block and the positioning block and the center fixing key is inserted into the chase groove formed in the bottom surface of the center of the lower chase fixed to the center position provides a cavity block fixing structure of the mold Is achieved.

EMBODIMENT OF THE INVENTION Hereinafter, the structure of this invention is demonstrated in detail based on an accompanying drawing.

Figure 4a is a view showing a planar state of the mold structure according to the present invention, Figure 4b is a view showing a cross-sectional state AA line of Figure 4a, Figure 4c is a view showing a side state of the mold structure according to the invention, Figure 4D is an enlarged view of “B” of FIG. 4B, and FIGS. 5A and 5B are views showing the configuration of the first cavity block according to the present invention, and FIGS. 6A and 6B illustrate the configuration of the positioning block according to the present invention. 7A and 7B are views showing the configuration of the first cavity block according to the present invention, FIG. 8 is a view showing a square fixing key according to the present invention, and FIG. 9 is a center fixing key according to the present invention. The figure shown.

Looking at the configuration of the present invention, the lower chase (52) having a recess forming a lower structure of the mold, and by the coupling screw 62 is fastened to the screw hole formed on one side of the lower chase 52 A mold case 50 for fixing the lower chase 1, and a passage through which the mold is moved is formed in the center of the lower chase 52, and the upper part is formed by a runner fixing screw 64. In the mold structure of the semiconductor device fixed by the runner block 60 to be fixed, a plurality of key insertion holes 56a are disposed in the lower chase 52 adjacent to both sides of the runner block 60 and penetrate the side portions thereof. A plurality of first cavity blocks 56 having a thin thickness forming a center groove 56c on the bottom surface of the center portion; A key insertion hole 54a which is in contact with the outside of the first cavity block 56 and coincides with the key insertion hole 56a is formed, and a center groove 54c which is coincident with the center groove 56c is formed. A positioning block 54 fixed to the bottom by a positioning block screw 55 with a screw hole 54b; A jaw portion 58c is formed between the first cavity block 56 and the runner step 61 of the runner block 60, and the key coincides with the key insertion hole 56a and the center groove 56c. A second cavity block 58 forming an insertion hole 58b and a center groove 58c; A plurality of square fixing keys 70 inserted into the key insertion holes 54a, 56a and 58a of the first and second cavity blocks 56 and 58 and the positioning block 54 to fix the positions; ; Chase grooves 52a formed in the center holes 54c, 56c and 58c of the first and second cavity blocks 56 and 58 and the positioning block 54 and at the bottom of the center of the lower chase 52. It is composed of a center fixing key 72 is inserted into the to fix the center position.

As shown in FIGS. 4B and 4D, upper edge portions of the first and second cavity blocks 56 and 58 are formed to be inclined with each other to be in close contact with each other.

As shown in FIG. 4D, the key insertion hole 56a of the first cavity block 56 has a slight big gap formed upward with respect to the square fixing key 70, and the position Since the key insertion hole 54a of the crystal block 54 and the key insertion hole 58a of the second cavity block 58 are configured such that a large gap is formed on the lower side with respect to the square fixing key 70, the square fixing is performed. The key 70 is a key insertion hole 54a of the positioning block 54, a key insertion hole 56a of the first cavity block 56 and a key insertion hole 58a of the second cavity block 58. ) Is fixed while applying the pushing force up and down to each other, so that the positioning block 54, the first cavity block 56, and the second cavity block 58 are firmly fixed.

The key insertion hole 54a, 56a, 58a is shown as an example that four are formed, but can be formed by adjusting the number if necessary.

The center grooves 54c, 56c, 58c of the positioning block 54, the first cavity block 56, and the second cavity block 58 are the first, second cavity blocks 56, 58, and The center groove of the positioning block 54 is formed so that half of the height of the center fixing key 72 is accurately inserted into the bottom surface of the center block, and the center groove into which the center fixing key 72 is fitted also on the bottom of the runner block 60. 68 is formed.

As shown in Figure 4c, the lower side chase 52 has a known position fixing block 52b for fixing the position when it is combined with the upper chase not shown, is fixed by a fastening screw, Although the first cavity block 56 shows ten detachable parts in contact with each other in such a manner that the inclined surfaces of the upper part thereof overlap with each other, the first cavity block 56 is in contact with each other. It is possible to add or subtract the number.

Hereinafter, the operation and effects of the present invention will be described based on the accompanying drawings.

As shown in Figure 4b, when looking at the assembled state of the present invention, the first cavity block is divided into a plurality of parts (10 illustrated in the figure) in the groove portion formed in the upper portion of the lower chase 52 Assemble (56) in contact with each other.

As shown in FIG. 4D, the positioning block 54 is in contact with the positioning block 54 and the second cavity block 58 on both sides of the first cavity block 56 of the plurality of parts. The quadrature fixing key 70 is sequentially inserted into each of the key insertion holes 54a, 56a, and 58a formed through the sides of the first cavity block 56 and the second cavity block 58 of the plurality of parts. The positioning block 54, the plurality of parts of the first cavity block 56 and the second cavity blocks 58 are assembled by the square fixing key 70 by inserting all the dogs, and the positioning block 54 ) And the second cavity block 58 has a downward gap, and the first cavity block 56 has an upward gap, so that the quadrature fixing key 70 has the positioning block 54 and the second cavity. It is in intimate contact with the upper surface of the key insertion holes 54a and 58a of the block 58, and the key insertion hole 56 with respect to the first cavity block 56 is provided. While being in close contact with the lower side of a) it is to be tightly and firmly fixed by the pressing force pressed in the vertical direction with respect to the entry direction of the square fixing key (70).

Since the first cavity block 56 and the second cavity block 58 of the plurality of parts are formed to be inclined with each other and the upper surfaces thereof are inclined with each other, the first cavity block 56 and the second cavity block 58 are assembled to have a step. The positioning block 54 and the second cavity block 58 have a lower gap, and the first cavity block 56 is fixed to the quadrature fixing key 70 with the upper gap.

In addition, the positioning block 54 assembled with each other by the rectangular fixing key 70, the first cavity block 56 and the second cavity block 58 having a plurality of parts, and the like, The runner step 61 of the runner block 60 is installed by placing the runner block 60 in a space between the two symmetrical second cavity blocks 58 by placing the groove in a symmetrical manner. The jaw portion 58d of the second cavity block 58 is caught so that the position of the two can be mutually fixed. The runner block 60 has a plurality of runner fixing screws 64 from the bottom of the lower chase 52. Fasten the runner block 60 to the lower chase 52 by fastening.

Then, the positioning block screw 55 is fastened to the screw hole 54b of the positioning block 54 through the through hole of the lower chase 52 from the bottom of the positioning block 54 to position the positioning block. In addition to being fixed by the square fixing key 70, the 54 is fixed to the lower chase 52 in a double manner.

As shown in FIG. 4B, the chase groove 52a, the first and second cavity blocks 56 and 58, and the positioning block penetrate from the side portion of the lower chase 52 to the bottom surface portion. The lower chase, the positioning block, and the second chase are again made by using the center fixing keys 72 fitted to the center grooves 54c, 56c, 58c, and 68 formed on the bottom surface of the runner block 60 and 54, respectively. The second cavity block, the first cavity block, the positioning block and the lower chase 60, which are symmetrical through the first cavity block, the second cavity block, and the runner blocks 52, 54, 56, 58, and 60. (58) (54) (52) continue to penetrate and fix the positioning blocks, the first and second cavity blocks, and the runner blocks (54, 56, 58, 60) to the lower chase (52). do.

The lower chase 52 having the positioning block, the first cavity block, the second cavity block, and the runner blocks 54, 56, 58, 60, etc. are fixed to the mold case 50. After that, it is fastened by fixing using the mold coupling screw 62.

As such, in the assembled state, the upper chase (not shown) is brought into contact with the lower chase 52 to enter the position fixing block 52b into the groove of the lower chase 52 to fix the positions of the upper and lower chases. When the mold liquid is supplied through the main passage 65 of the runner block 60, the first and second sides of the runner block 60 are spread evenly to both sides through the branch passage 67 formed by being orthogonal to the vertical direction in the main passage 65. The mold liquid is supplied to the cavities 56b and 58b of the second cavity blocks 56 and 58 to perform a mold process to manufacture a finished product of the mold of the semiconductor device. After the mold of the semiconductor device is completed by the mold liquid injected between the upper chase and the lower chase 52, the heat is cooled after a predetermined time, and the upper chase is released again by releasing the position fixing block 52b. The lower chase ( 52) to separate the molded semiconductor device having a mold from the cavities 56b and 58b of the first and second cavity blocks 56 and 58, and then proceed with the above process again to mold the semiconductor device. In this way, the mold liquid is supplied through the main passage 65 of the runner block 60 to be branched into the branch passage 67 to form the first and second cavity blocks 56. Since the configuration in which the molding is performed in the cavities 56b and 58b of 58 and the effects and effects thereof are almost the same as in the related art, detailed description thereof will be omitted.

Therefore, as described above, when the cavity block fixing structure of the mold according to the present invention is used, the cavity block in which the cavity is formed on the upper surface is divided into a plurality of parts to form a key hole and penetrate the central portion, and a plurality of quadrangles. By using fixing keys, the positioning block, the first and second cavity blocks, and the runner block are connected to each other and fixed, so that the thickness of the semiconductor device to be formed is thick and the assembly can be performed smoothly even if there are many parts to be assembled. It is a very useful and effective invention that not only improves workability but also enables precise assembly.

Claims (4)

A lower chase having a recess forming a lower structure of a mold, a mold case for fixing the lower chase by a mold coupling screw fastened to a screw hole formed on one side of the lower chase, and placed in a central portion on the lower chase; In the mold structure of the semiconductor device fixed to the runner block is formed in the upper portion, the passage for moving the mold is fixed to the bottom surface by a runner fixing screw, A plurality of first cavity blocks adjacent to both side surfaces of the runner block, the plurality of first cavity blocks being formed in the lower chase, forming a plurality of key insertion holes to penetrate the side portions, and having a thin thickness forming a center groove in the central bottom surface; A key insertion hole is formed out of the first cavity block, the key insertion hole coincides with the key insertion hole, and a center groove coincides with the center groove of the first cavity block. A positioning block which is fixed by tightening a block screw; A second cavity block forming a jaw portion fixed between the first cavity block and a runner step of the runner block and forming a key insertion hole and a center groove corresponding to the key insertion hole and the center groove; A plurality of square fixing keys which are inserted into the key insertion holes of the first and second cavity blocks and the positioning blocks to fix the positions; And a center fixing key inserted into the center hole of the first and second cavity blocks and the positioning block and the chase recess formed in the bottom surface of the center of the lower chase to fix the center position. 2. The cavity block fixing structure according to claim 1, wherein a position fixing block for fixing a position with the upper chase is coupled to all sides of the lower chase. 2. The cavity block fixing structure according to claim 1, wherein upper edge portions of the first and second cavity blocks are formed to be inclined with each other to be in close contact with each other. The key insertion hole of the first cavity block has a slightly larger cap formed upwardly with respect to the square fixing key, and the key insertion hole of the positioning block and the key insertion hole of the second cavity block. The ball is a cavity block fixing structure of the mold, characterized in that a large gap is formed in the lower side with respect to the square fixing key.