KR100342577B1 - Process for producing silicone composition cured at ordinary temperature - Google Patents

Process for producing silicone composition cured at ordinary temperature Download PDF

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KR100342577B1
KR100342577B1 KR1019950002214A KR19950002214A KR100342577B1 KR 100342577 B1 KR100342577 B1 KR 100342577B1 KR 1019950002214 A KR1019950002214 A KR 1019950002214A KR 19950002214 A KR19950002214 A KR 19950002214A KR 100342577 B1 KR100342577 B1 KR 100342577B1
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silane
methylethylketoxymo
silicone composition
weight
formula
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KR960031543A (en
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최근묵
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고려화학 주식회사
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
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    • C08K5/15—Heterocyclic compounds having oxygen in the ring
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C08L27/06—Homopolymers or copolymers of vinyl chloride
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof

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Abstract

PURPOSE: Provided is a silicon composition cured at ordinary temperature, which is excellent in tensile stress, elongation, hardness, and heat storage ability and keeps the initial curing rate. CONSTITUTION: The silicon composition is produced by a process comprising the steps of: mixing 50-65pts.wt. of a polysiloxane(formula 1), of which the both sides are modified by hydroxy, having a molecular weight of 75,000-140,000 and 25-35pts.wt. of a non-reactive polysiloxane(formula 3) having a molecular weight of 1,200-7,000 and then adding 3.4-6.0pts.wt. of a crosslinking agent(formula 2) under nitrogen, wherein the crosslinking agent(formula 2) is at least three selected from methyl tris(methyl ethyl ketoxymo)silane, ethyl tris(methyl ethyl ketoxymo)silane, vinyl tris(methyl ethyl ketoxymo)silane, methyl methoxy bis(methyl ethyl ketoxymo)silane, and tetrakis(methyl ethyl ketoxymo)silane; mixing the resultant and 0.1-1.9pts.wt. of a coupling agent, and 0.01-0.1pts.wt. of a catalyst under nitrogen and stirring for 10-30min and then mixing and dispersing 5-10pts.wt. of a filler by 3-4 times; vacuum-stirring the mixture at ordinary temperature to remove bubbles. In the formula (1), n is an integer of 1,000-2,000. In the formula (2), R1 is -CH3, -CH5, -C6H5, or -CH=CH2, R2 is -H, -CH3, -OCH3, -OC2H5, or -OC3H7, n is an integer of 0-3, m is 0 or 1, R' is H, CH3, C2H5, C3H7, or C6H5, R'' is CH3, C2H5, C3H7, or C6H5. In the formula (3), n is an integer of 10-100.

Description

상온 경화형 실리콘 조성물의 제조방법Method for producing a room temperature curable silicone composition

본 발명은 상온에서 경화되는 실리콘 조성물에 관한 것으로서, 보다 상세하게는 베이스폴리머, 가소제, 3종 이상의 가교제 및 커플링제로 조성되며, 초기 경화 속도를 유지시키면서도 인장응력, 신율, 경도 및 열저장성이 우수한 상온 경화형 실리콘 조성물의 제조방법에 관한 것이다.The present invention relates to a silicone composition that is cured at room temperature, and more particularly, is composed of a base polymer, a plasticizer, three or more crosslinking agents, and a coupling agent, and has excellent tensile stress, elongation, hardness, and heat storage while maintaining an initial curing rate. It relates to a method for producing a room temperature-curable silicone composition.

일반적인 실리콘 조성물은 베이스폴리머, 가소재, 가교제, 커플링제, 충전제 및 촉매를 사용하여 제조되는 것으로, 제조시 쓰여지는 가교제의 종류에 따라 탈옥심형, 탈초산형 또는 탈알코올형 등으로 구분된다.A general silicone composition is prepared using a base polymer, a plastic material, a crosslinking agent, a coupling agent, a filler, and a catalyst, and is divided into a oxime type, a deacetic acid type, or a dealcohol type according to the type of the crosslinking agent used in the manufacture.

이중에 탈옥심형 실리콘 조성물은 제조시 사용되는 옥심형가교제의 조성 및 양에 따라 물성이 좌우되며, 이러한 물성 즉 초기 경화속도, 가교빌밀도에 의한 인장웅력, 경도 등은 실리콘 조성물을 피착재에 도포할 때 작업성에 영향을 주고 또한 완전 경화후 피착재의 상품성 등에 영향을 줄 수 있다.Of these, the oxime-type silicone composition depends on the composition and amount of the oxime crosslinking agent used in the manufacture, and such physical properties, that is, initial curing rate, tensile strength due to crosslinking bill density, hardness, etc. are applied to the adherend. This can affect the workability and also affect the commerciality of the adherend after complete curing.

이러한 종래의 옥심형 실리콘 조성물은 미국특허 제3,471,434호 및 제3,962,160호에 개시된 바 있는데, 이는 메톡시트리아세톡시모실란, 아세토논옥실실란, 아세톡시에틸트리스(메틸에틸케톡시모)실란등의 옥심형 가교제 1종을 사용하여 제조하였 던 바, 이 방법에 의해 제조된 실리콘 조성물은 피착재에 도포시 초기 경화속도의 조절이 어렵고, 가교밀도 등에도 나쁜 영향을 주는 문제점이 있다.Such conventional oxime silicone compositions have been disclosed in US Pat. Nos. 3,471,434 and 3,962,160, which are oximes such as methoxytriacetoxymosilane, acetononeoxysilane, and acetoxyethyltris (methylethylketoxymo) silane. As prepared using one type of crosslinking agent, the silicone composition prepared by this method has a problem that it is difficult to control the initial curing rate when applied to the adherend, and also adversely affects the crosslinking density.

따라서, 본 발명은 상기 종래기술의 문제점을 해결하기 위한 것으로, 그 목적은 가교제를 3종 이상 혼합하여 적정한 초기 경화속도를 유지하면서 인장응력, 신율, 경도 및 열저장성이 우수한 상온 경화형 실리콘 조성물의 제조방법을 제공하는데 있다.Accordingly, the present invention is to solve the problems of the prior art, the purpose is to prepare a room temperature curable silicone composition excellent in tensile stress, elongation, hardness and heat storage while maintaining a proper initial curing rate by mixing three or more crosslinking agents To provide a method.

상기 본 발명의 목적을 달성하기 위한 상온 경화형 실리콘 조성물의 제조방법은, 분자량이 75,000∼140,000인 일반식(1)로 표시되는 양말단 하이드록실변성 폴리실록산 50∼65중량부와 분자량이 1,200∼7,000인 일반식(3)으로 표시되는 비반응성 폴리실록산 25∼35중량부를 혼합 교반하면서 일반석(2)로 표시되는 가교제 3.4~6.0중량부를 질소분위기하에서 첨가 반응시키는 1단계와; 상기 반응물을 질소분위기하에서 커플링제 0.1∼1.9중량부 및 촉매 0.01∼0.1중량부흘 혼합하여 10∼30분간 교반한 후, 충전제 5∼10중량부를 3∼4회 나누어 혼합 분산시키는 2단계와: 충전제가 분산된 상기 혼합물을 상온에서 감압교반시켜 기포를 제거시키는 3단계를 포함하는 데에 그 특징이 있다.The method for producing a room temperature-curable silicone composition for achieving the object of the present invention, 50 to 65 parts by weight of the sock end hydroxyl-modified polysiloxane represented by the general formula (1) having a molecular weight of 75,000 to 140,000 and a molecular weight of 1,200 to 7,000 1 step of adding and reacting 3.4 to 6.0 parts by weight of the crosslinking agent represented by the general stone (2) under a nitrogen atmosphere while mixing and stirring 25 to 35 parts by weight of the non-reactive polysiloxane represented by the general formula (3); Step 2 is a mixture of 0.1 to 1.9 parts by weight of the coupling agent and 0.01 to 0.1 parts by weight of the catalyst and stirred for 10 to 30 minutes under a nitrogen atmosphere, followed by mixing and dispersing 5 to 10 parts by weight of the filler 3 to 4 times. The mixture is characterized in that it comprises three steps of removing the bubbles by stirring under reduced pressure at room temperature.

여기서 n은 1,000∼2,000 사이의 정수이다.Where n is an integer between 1,000 and 2,000.

여기서, R1은 -CH3, -CH5, -C6H5또는 -CH=CH2,Wherein R 1 is —CH 3 , —CH 5 , —C 6 H 5 or —CH═CH 2 ,

R2는 -H, -CH3, -OCH3, -OC2H5또는 -OC3H7,R 2 is —H, —CH 3 , —OCH 3 , —OC 2 H 5 or —OC 3 H 7 ,

n은 0∼3사이의 정수,n is an integer between 0 and 3,

m은 0 또는 1,m is 0 or 1,

R'은 H, CH3, C2H5, C3H7 또는 C6H5이고,R 'is H, CH 3 , C 2 H 5 , C3H7 or C 6 H 5 ,

R"는 CH3, C2H5, C3H7또는 C6H5이다.R ″ is CH 3 , C 2 H 5 , C 3 H 7 or C 6 H 5 .

여기서 n은 10∼100 사이의 정수이다.Where n is an integer between 10 and 100.

본 발명에서, 상기 일반식(1)의 양말단하이드록실변성폴리실록산 분자량이 75,000 미만인 것을 사용하면 가교밀도가 높아 수득제품의 경화시 도막이 크랙이 발생할 우려가 있고, 140,0000을 초과하는 것을 사용하면 경화 후에 인장응력 및 경도가 낮아지게 된다.In the present invention, when the molecular weight of the sock- short hydroxyl-modified polysiloxane of the general formula (1) is less than 75,000, the crosslinking density is high, and there is a fear that the coating film cracks when the obtained product is cured. After curing, the tensile stress and hardness are lowered.

가소제인 비반웅성 폴리실록산의 경우에는 분자량이 1,200 미만인 것을 사용하면 실란트조성물을 피착재에 도포시 비반응성 폴리실록산이 용출될 수 있으며,7,000을 초과하는 것을 사용하면 조성물 제조시 조성물의 점도가 상승하여 교반에 어려움이 뒤따르게 된다.In the case of the non-banung polysiloxane, which is a plasticizer, when the molecular weight is less than 1,200, the non-reactive polysiloxane may be eluted when the sealant composition is applied to the adherend.If the amount exceeds 7,000, the viscosity of the composition increases when the composition is prepared. Difficulties follow.

가교제로는 메틸트리스(메틸에틸케톡시모)실란, 에틸트리스(메틸에틸케톡시모)실란, 비닐트리스(메틸에틸케톡시모)실란, 메틸메톡시비스(메틸에틸케톡시모)실란 및 테트라키스(메틸에틸케독시모)실란등을 3종 이상 혼합 사용하며, 메틸트리스(메틸에틸케톡시모)실란, 에틸트리스(메틸에틸케톡시모)실란, 비닐트리스(메틸에틸케톡시모)실란중 1종과 메틸메톡시비스(메틸에틸케톡시모)실란 및 테트라키스(메틸에틸케톡시모)실란을 혼합 사용하는 것이 바람직하다.Examples of the crosslinking agent include methyl tris (methylethyl methoxymo) silane, ethyl tris (methylethyl methoxymo) silane, vinyl tris (methylethyl methoxymo) silane, methylmethoxybis (methylethyl methoxymo) silane, and tetrakis (methylethyl 3 or more types of catedoxy) silanes are mixed and used, and one of methyltris (methylethylketoxymo) silane, ethyltris (methylethylketoxymo) silane, vinyltris (methylethylketoxymo) silane and methylmethoxybis It is preferable to mix and use (methyl ethyl methoxymo) silane and tetrakis (methyl ethyl methoxymo) silane.

커플링제로는 아미노알킬그룹의 실란, 즉 (아미노에틸아미노프로필) 트리메톡시실란, (아미노에틸아미노프로필) 트리에톡시실란, (아미노에틸아미노프로필) 트리부톡시실란 등을 사용할 수 있다.As the coupling agent, a silane of an aminoalkyl group, that is, (aminoethylaminopropyl) trimethoxysilane, (aminoethylaminopropyl) triethoxysilane, (aminoethylaminopropyl) tributoxysilane, and the like can be used.

촉매로는 틴(TIN)계 촉매인 틴카르복시레이트, 디부틸틴디아세테이트, 디부틸틴디라우레이트 등을 사용할 수 있으며, 이는 조성물 제조시 베이스폴리머, 가교제 그리고 커플링제와의 반응속도 결정을 위해 사용하는 것이다.As the catalyst, tin (TIN) -based catalysts such as tin carboxylate, dibutyl tin diacetate, dibutyl tin dilaurate, and the like can be used, which are used to determine the reaction rate with the base polymer, the crosslinking agent, and the coupling agent when preparing the composition. will be.

충전제로는 실리콘디옥사이드(흄드실리카), 석영분말(쿼츠라우더), 알루미늄실리케이트, 폴리비닐클로라이드 등을 사용하는데, 이는 5중량부 미만으로 사용하면 조성물의 강도가 저하되고, 10중량부를 초과 사용하면 유동성이 현저히 저하되는 단점이 있다.As the filler, silicon dioxide (fumed silica), quartz powder (quartz router), aluminum silicate, polyvinyl chloride, etc. are used, which is less than 5 parts by weight, and the strength of the composition is lowered. There is a disadvantage that the fluidity is significantly reduced.

이하, 본 발명의 바람직한 실시예를 상세히 설명하고자 한다.Hereinafter, preferred embodiments of the present invention will be described in detail.

여기에서 본 발명과 종래 방법에 의해 각각 실리콘 조성물을 제조하고, 시험을 통해 제조 실리콘 조성물의 물성을 알아보기로 한다.Herein, the silicone composition is prepared by the present invention and the conventional method, and the physical properties of the manufactured silicone composition will be examined through a test.

실시예1Example 1

양말단 하이드록실변성폴리실록산[일반식(1)에서 n이 18,000인 것] 55g과 비반응성폴리실록산[일반식(2)에서 n이 14인 것] 31.96g을 질소투입계와 감압장치가 부착된 믹서에 투입한 후, 천천히 교반하면서 가교제로서 메틸트리스(메틸에틸케톡시모)실란 4.2g, 메틸메톡시비스(메틸에틸케톡시모)실란 0.4g 및 테트라키스(메틸에틸케톡시모)실란 0.4g과 촉매로서 디부틸틴라우레이트 0.04g을 질소분위기하에서 투입하고 상온에서 5분간 교반하였다. 그런다음, (아미노에틸아미노프로필)트리메톡시실란 0.3g과 흄드실리카 7.7g을 3회에 나누어 믹서기내 반응혼합물에 투입하여 분산시킨 후, 20분간 상온에서 감압, 교반하여 실리콘 조성물을 제조하였다.55 g of sock end hydroxyl-modified polysiloxane [where n is 18,000 in formula (1)] and 31.96 g of non-reactive polysiloxane [where n is 14 in formula (2)] After the addition, the mixture was stirred slowly, and as a crosslinking agent, 4.2 g of methyltris (methylethylketoxymo) silane, 0.4g of methylmethoxybis (methylethylketoxymo) silane, 0.4g of tetrakis (methylethylketoxymo) silane and a catalyst were used. 0.04 g of dibutyltin laurate was added under a nitrogen atmosphere, followed by stirring at room temperature for 5 minutes. Thereafter, 0.3 g of (aminoethylaminopropyl) trimethoxysilane and 7.7 g of fumed silica were divided into three portions, dispersed in a reaction mixture in a mixer, and then dispersed under reduced pressure and stirred at room temperature for 20 minutes to prepare a silicone composition. .

실시예2∼5Examples 2-5

아래의 표1과 같이 가교제의 조성을 달리한 것 이외에는 실시예1과 같은 조성과 방법으로 실리콘 조성물을 제조하였다.A silicone composition was manufactured according to the same composition and method as Example 1 except for changing the composition of the crosslinking agent as shown in Table 1 below.

비교예1∼2Comparative Examples 1-2

아래의 표1과 같이 가교제의 조성물 달리한 것 이외에는 실시예1과 같은 조성과 방법으로 실리콘 조성물을 제조하였다.The composition of the crosslinking agent was prepared in the same manner as in Example 1 except that the composition of the crosslinking agent was prepared as in Table 1 below.

상기 실시예 및 비교예들에서 제조된 실란트조성물의 물성검사를 실시하였으며 그 결과는 다음 표2와 같다.The physical properties of the sealant composition prepared in Examples and Comparative Examples were tested and the results are shown in Table 2 below.

상기 표2에서 알 수 있듯이, 본 발명의 실리콘 조성물을 이용하여 물성을 축정한 결과, 종래의 것과 비교하여 토출량, 지촉 건조 시간, 적절한 초기 경화속도에서는 비슷하고 인장응력, 신율, 경도 및 열저장성 등에서는 더 우수하다.As can be seen in Table 2 above, the physical properties of the silicone composition of the present invention were determined, and as compared to the conventional ones, the discharge amount, the touch drying time, and the proper initial curing rate were similar, and in terms of tensile stress, elongation, hardness, heat storage, and the like. Is better.

Claims (6)

분자량이 75,000∼140,000인 일반식(1)로 표시되는 양말단 하이드록실변성 폴리실록산 50∼65중량부와 분자량이 1,200∼7,000인 일반석(3)로 표시되는 비반응성 폴리실록산 25∼35중량부를 혼합 교반하면서 일반식(2)로 표시되는 가교제 3.4∼6.0중량부를 질소분위기하에서 첨가 반응시키는 1단계와:50-65 parts by weight of sock-end hydroxyl-modified polysiloxane represented by General Formula (1) having a molecular weight of 75,000 to 140,000 and 25 to 35 parts by weight of non-reactive polysiloxane represented by General Stone (3) having a molecular weight of 1,200 to 7,000 while mixing and stirring 1 step of adding and reacting 3.4 to 6.0 parts by weight of the crosslinking agent represented by the general formula (2) under a nitrogen atmosphere: 상기 반응물을 질소분위기하에서 커플링제 0.1∼1.9중량부 및 촉매 0.01∼0.1중량부를 혼합하여 10∼30분간 교반한 후, 충전제 5∼10중량부를 3∼4회 나누어 혼합 분산시키는 2단계와:In step 2, the reaction product is mixed with 0.1-1.9 parts by weight of coupling agent and 0.01-0.1 parts by weight of catalyst under a nitrogen atmosphere and stirred for 10-30 minutes, followed by mixing and dispersing 5-10 parts by weight of filler three to four times. 충전제가 분산된 상기 흔합물을 상온에서 감압교반시켜 기포를 제거시키는 3단계로 이루어진 상온 경화형 실리콘 조성물의 제조방법.Method for producing a room temperature-curable silicone composition consisting of three steps of removing the bubbles by stirring under reduced pressure at room temperature to the mixture dispersed filler. 여기서 n은 1,000∼2,000 사이의 정수이다.Where n is an integer between 1,000 and 2,000. 여기서, R1은 -CH3, -CH5, -C6H5또는 -CH=CH2,Wherein R 1 is —CH 3 , —CH 5 , —C 6 H 5 or —CH═CH 2 , R2는 -H, -CH3, -OCH3, -OC2H5또는 -OC3H7,R 2 is —H, —CH 3 , —OCH 3 , —OC 2 H 5 or —OC 3 H 7 , n은 0~3사이의 정수,n is an integer between 0 and 3, m은 0 또는 1,m is 0 or 1, R'은 H, CH3, C2H5, C3H7또는 C6H5이고,R 'is H, CH 3 , C 2 H 5 , C 3 H 7 or C 6 H 5 , R"는 CH3, C2H5, C3H7 또는 C6H5 이다.R ″ is CH 3, C 2 H 5, C 3 H 7 or C 6 H 5. 여기서, n은 10∼100 사이의 정수이다.Where n is an integer between 10 and 100. 제 1 항에 있어서,The method of claim 1, 가교제는 메틸트리스(메틸에틸케톡시모)실란, 에틸트리스(매틸에틸케톡시모)실란, 비닐트리스(메틸에틸케톡시모)실란, 메틸메톡시비스(메틸에틸케톡시모)실란 및 테트라키스(메틸에틸케톡시모)실란으로 구성된 일반석(2)로 표시되는 것으로 부터 선택되는 3종이상 혼합된 것임을 특징으로하는 상온 경화형 실리콘 조성물의 제조방법.The crosslinking agent is methyltris (methylethylketoxymo) silane, ethyltris (methylethylketoxymo) silane, vinyltris (methylethylketoxymo) silane, methylmethoxybis (methylethylketoxymo) silane and tetrakis (methylethylketok Simo) A method for producing a room temperature-curable silicone composition, characterized in that the mixture of three or more selected from those represented by the common stone (2) consisting of silane. 제 2 항에 있어서,The method of claim 2, 가교제는 메틸트리스(메틸에틸케톡시모)실란, 에틸트리스(메틸에틸케톡시모)실란, 비닐트리스(메틸에틸케톡시모)실란 중에 1종과 메틸메톡서비스(메틸에틸케톡시모)실란 및 테트라키스(메틸에틸케톡시모)실란을 혼합 사용하는 것을 특징으로하는 상온 경화형 실리콘 조성물의 제조방법.The crosslinking agent is one of methyltris (methylethylketoxymo) silane, ethyltris (methylethylketoxymo) silane, vinyltris (methylethylketoxymo) silane and methylmethoxy service (methylethylketoxymo) silane and tetrakis (methyl A method for producing a room temperature-curable silicone composition characterized by using a mixture of ethyl ketoxy mo) silane. 제 1 항에 있어서,The method of claim 1, 커플링제는 (아미노에틸아미노프로필) 트리메톡시실란, (아미노에틸아미노프로필) 트리에톡시실란, (아미노에틸아미노프로필) 트리부톡시실란으로 구성된 아미노알킬계 실란으로 부터 선택되는 것을 특징으로 하는 상온 경화형 실리콘 조성물의 제조방법.The coupling agent is selected from an aminoalkyl silane composed of (aminoethylaminopropyl) trimethoxysilane, (aminoethylaminopropyl) triethoxysilane, and (aminoethylaminopropyl) tributoxysilane. Method for producing a curable silicone composition. 제 1 항에 있어서,The method of claim 1, 촉매는 틴카르복시레이트, 디부틸틴디아세테이트, 디부틸틴디라우레이트로 구성된 틴(TIN)제 촉매로 부터 선택되는 것을 특징으로 하는 상온 경화형 실리콘 조성물의 제조방법.The catalyst is a method for producing a room temperature curable silicone composition, characterized in that selected from tin (TIN) catalyst consisting of tin carboxylate, dibutyl tin diacetate, dibutyl tin dilaurate. 제 1항에 있어서,The method of claim 1, 충전제는 실리콘디옥사이드(흄드실리카), 석영분말(쿼츠파우더), 알루미늄실리케이트, 폴리비닐클로라이드로 부터 선택되는 것을 특징으로 하는 상온 경화형 실리콘 조성불의 제조방법.The filler is a method for producing a room temperature-curable silicone composition fire, characterized in that selected from silicon dioxide (fumed silica), quartz powder (quartz powder), aluminum silicate, polyvinyl chloride.
KR1019950002214A 1995-02-08 1995-02-08 Process for producing silicone composition cured at ordinary temperature KR100342577B1 (en)

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