KR100341791B1 - A Manufacturing method using diecasting of antenna bracket for a wireless celluar phone - Google Patents

A Manufacturing method using diecasting of antenna bracket for a wireless celluar phone Download PDF

Info

Publication number
KR100341791B1
KR100341791B1 KR1019990031000A KR19990031000A KR100341791B1 KR 100341791 B1 KR100341791 B1 KR 100341791B1 KR 1019990031000 A KR1019990031000 A KR 1019990031000A KR 19990031000 A KR19990031000 A KR 19990031000A KR 100341791 B1 KR100341791 B1 KR 100341791B1
Authority
KR
South Korea
Prior art keywords
thickness
plating
antenna bracket
manufacturing
tapping
Prior art date
Application number
KR1019990031000A
Other languages
Korean (ko)
Other versions
KR20010011571A (en
Inventor
남광희
Original Assignee
남광희
주식회사 케이에이치바텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 남광희, 주식회사 케이에이치바텍 filed Critical 남광희
Priority to KR1019990031000A priority Critical patent/KR100341791B1/en
Publication of KR20010011571A publication Critical patent/KR20010011571A/en
Application granted granted Critical
Publication of KR100341791B1 publication Critical patent/KR100341791B1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D21/00Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
    • B22D21/02Casting exceedingly oxidisable non-ferrous metals, e.g. in inert atmosphere
    • B22D21/027Casting heavy metals with low melting point, i.e. less than 1000 degrees C, e.g. Zn 419 degrees C, Pb 327 degrees C, Sn 232 degrees C
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23GTHREAD CUTTING; WORKING OF SCREWS, BOLT HEADS, OR NUTS, IN CONJUNCTION THEREWITH
    • B23G1/00Thread cutting; Automatic machines specially designed therefor
    • B23G1/16Thread cutting; Automatic machines specially designed therefor in holes of workpieces by taps
    • B23G1/18Machines with one working spindle
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Waveguide Aerials (AREA)
  • Chemically Coating (AREA)
  • Support Of Aerials (AREA)

Abstract

본 발명은 아연합금을 다이캐스팅으로 성형하여 태핑으로 중앙 나사공을 천공한후 화학연마액 처리로서 노출된 제품표면과 중앙 나사공의 내주연을 도금층의 두께에 해당되는 10 - 12 미크론 두께로 일정하게 부식시키고 Cu 하지도금과 함께필요에 의해 Ni 도금이나 또는 Ni + Au 도금을 실시하여 화학연마액으로서 부식된 두께정도의 도금층을 적층시켜서 된 무선전화기용 안테나 브래킷의 다이캐스팅에 의한 제조방법.According to the present invention, zinc alloy is formed by die casting to punch the central threaded hole by tapping, and then the exposed surface of the product and the inner circumferential edge of the central threaded hole as chemical polishing solution are uniformly set to a thickness of 10-12 microns corresponding to the thickness of the plating layer. A method of manufacturing by die-casting an antenna bracket for a radiotelephone in which a plating layer having a thickness of corroded thickness as a chemical polishing liquid is formed by performing corrosion by Ni plating or Ni + Au plating as necessary with Cu plating.

Description

무선전화기용 안테나 브래킷의 다이캐스팅에 의한 제조방법 { A Manufacturing method using diecasting of antenna bracket for a wireless celluar phone }A manufacturing method using diecasting of antenna bracket for a wireless celluar phone}

본 발명은 무선전화기의 안테나를 내부에서 메탈(Metal)과 함께 고정시키면서 송,수신회로와 접속되는 안테나 브래킷을 다이캐스팅으로 성형하여 태핑(Tapping)한후 화학연마액으로 처리하여 도금하는 무선전화기용 안테나 브래킷의 다이캐스팅에 의한 제조방법에 관한 것이다.The present invention is fixed to the antenna of the radiotelephone with a metal (metal) inside the antenna bracket for radiotelephones to be plated by chemical polishing liquid after tapping (tapping) by forming the antenna bracket connected to the transmission and reception circuit by die casting It relates to a manufacturing method by die casting.

지금까지의 안테나 브래킷의 제조방법은 황동을 선반 및 밀링으로 절삭가공하여 중앙을 태핑으로 나사공을 천공한 후 전압 정재파비(V S W R)와 임피이던스(Impedance) 확보를 위해 안테나 브래킷에 Ni, Au 의 전기도금을 하는데 이때 전기도금으로 인한 도금층의 두께로 태핑한 나사공의 내경이 좁아져서 안테나와 상호 결합시 나사결합이 안되므로 도금후 필히 2차 태핑으로 내주연 도금층의 일부를 밀어내는 방법으로 내경을 확대하여야 되므로 절삭 가공방법으로 생산량이 한정되고 복잡한 작업공정으로 인해 제조원가가 상승되었고 특히 안테나를 고정하여 송,수신회로와 접속되는 안테나 브래킷의 중앙 나사공에 도금된 수개의 도금층이 2차 태핑으로 일부가 훼손됨에 따라서 도금층으로 인한 소기의 전도목적을 달성할수 없는 폐단이 발생하였다.Until now, the manufacturing method of the antenna bracket has been cutting brass by lathe and milling, drilling the screw hole by tapping the center, and then applying Ni, Au to the antenna bracket to secure voltage standing wave ratio (VSWR) and impedance. At this time, the inner diameter of the screw hole tapping with the thickness of the plating layer due to electroplating becomes narrow, and screwing is not possible when mutually coupling with the antenna. Therefore, after plating, the inner diameter is enlarged by pushing a part of the inner peripheral plating layer by secondary tapping. The production process was limited due to the cutting process, and the manufacturing cost was increased due to the complicated work process.In particular, several plating layers plated in the center screw hole of the antenna bracket connected to the transmitting and receiving circuit by fixing the antenna were partially removed by secondary tapping. As it is damaged, a closed end cannot be achieved due to the plating layer to achieve the desired conductive purpose.

본 발명에서는 이와 같은 문제점을 개선하기 위하여 안테나 브래킷의 재료를 황동보다 내충격성이 1.7배 강한 아연합금(ZnDC2)을 재료로 하여 다이캐스팅으로 성형(a)하여 대량 생산이 가능토록 하고 태핑으로 중앙 나사공을 천공한후 화학연마액으로서 노출된 제품표면과 중앙 나사공의 내주연을 도금층의 두께에 해당되는 10 - 12 미크론 두께로 일정하게 부식(b)시키고 Cu 하지도금과 함께 필요에 의해 Ni 도금이나 또는 Ni + Au 도금을 실시하여 화학연마액으로서 부식된 두께정도의 도금층을 적층시키므로서 다이캐스팅으로 성형한 안테나 브래킷의 규격 그대로에 중앙 나사공도 태핑한 내경 치수 거의 그대로 적층되므로 2차 태핑작업이 필요없을뿐만 아니라 필요에 의해 도금한 수개의 도금층이 그대로 유지되므로서 임피이던스와 전압 정재피비를 만족시킬수가 있는 것으로 이를 제조공정에 의거 상세히 설명하면 다음과 같다.In the present invention, in order to improve such a problem, the material of the antenna bracket is formed by die casting using a zinc alloy (ZnDC2), which is 1.7 times stronger than brass, so that mass production is possible and tapping is performed by tapping the center screw hole. After drilling, the exposed surface of the product and the inner circumference of the central threaded hole as a chemical polishing liquid are constantly corroded (b) to a thickness of 10-12 microns corresponding to the thickness of the plating layer. Alternatively, by applying Ni + Au plating, the plating layer of the corroded thickness is laminated as a chemical polishing liquid, and the inner diameter of the center screw hole tapping is almost as it is. In addition, several plating layers plated as needed are maintained as it is, satisfying impedance and voltage standing ratio. If it can be described in detail based on the manufacturing process as follows.

도 1은 본 발명의 사용상태를 보인 부분확대 종단면도1 is a partially enlarged longitudinal sectional view showing a state of use of the present invention;

도 2는 본 발명에서 안테나 브래킷을 성형하여 화학연마액으로 부식시킨Figure 2 is molded in the antenna bracket in the present invention to corrode with chemical polishing liquid

상태를 보인 확대 종단면도Enlarged longitudinal cross-sectional view showing the state

제 1공정1st process

아연합금(ZnDC2)을 복수 구동 다이캐스팅으로 1분당 80 - 120개 정도로 대량 생산하여 그 중앙을 태핑으로 필요규격의 나사공으로 천공시킨다.Zinc alloy (ZnDC2) is mass-produced with 80-120 pieces per minute by plural drive die casting, and the center is punched to the required size by tapping the center.

제 2공정2nd process

중앙에 나사공이 천공된 안테나 브래킷을 다이글림(Dygleam) 80의 화학연마액으로 32℃ 온도에서 30 - 40초간 처리하여 10 - 12미크론 정도 두께로 노출된 표면과 중앙 나사공의 내주연을 일정하게 부식시킨다The antenna bracket with a screw hole in the center is treated with Dygleam 80's chemical polishing solution at 32 ℃ for 30-40 seconds to uniformly expose the inner circumference of the exposed surface and the center screw hole with a thickness of about 10 to 12 microns. Corrode

제 3공정3rd process

이렇게 안테나 브래킷의 노출된 표면과 중앙 나사공의 내주연이 부식되면 도금층의 밀착성이 좋아져서 도금효과가 개선되므로 이러한 상태의 안테나 브래킷을 처음에는 Cu 하지도금을 한후 전압 정재파비(V S W R)를 위해 Ni 도금을 하면 표면과 중앙 나사공에 10 - 12 미크론 두께의 도금층이 형성되고 그 위에 다시 임피이던스 (Impedance)를 위해 Au 도금을 하면 10.3 - 12.5 미크론 두께의 도금층이 형성된다.When the exposed surface of the antenna bracket and the inner circumference of the center screw hole are corroded, the adhesion of the plating layer is improved and the plating effect is improved. Therefore, the antenna bracket in this state is initially plated with Cu, and then Ni is applied for the voltage standing wave ratio (VSWR). When plating, a 10-12 micron thick plated layer is formed on the surface and the central threaded hole, and Au plating is formed on the surface again for impedance to form a 10.3-12.5 micron thick plated layer.

이와 같은 공정으로 제조된 본 발명은 황동보다 내충격성이 1.7배 강한 아연합금을 다이캐스팅으로 성형하므로서 대량 생산이 가능하고 태핑으로 중앙 나사공을 가공하여 화학연마액으로서 안테나 브래킷의 노출된 표면과 중앙 나사공을 도금층 두께에 해당하는 두께로 부식시키므로서 도금층의 밀착성을 강화시킬뿐만 아니라 필요로 하는 도금으로 수개의 도금층을 적층시키면 안테나 브래킷의 외형크기는 물론이고 중앙 나사공의 내경크기가 표준규격과 거의 일치되므로서 종래처럼 2차태핑의 가공이 필요가 없이 수개의 도금층이 그대로 유지가 되므로 내충격성과 전압 정재파비 그리고 임피이던스를 만족시킬수가 있는 것이다.The present invention manufactured by such a process can be mass-produced by molding die-cast zinc alloy 1.7 times stronger than brass, and the center screw hole is processed by tapping to expose the exposed surface and the center of the antenna bracket as chemical polishing liquid. By not only strengthening the adhesion of the plating layer by corroding the pores to the thickness corresponding to the thickness of the plating layer, but also by stacking several plating layers with the required plating, the internal diameter of the center screw hole as well as the outer diameter of the antenna bracket are almost equal to the standard specification. As a result, several plating layers are maintained without the need for the processing of secondary tapping as in the prior art, thereby satisfying the impact resistance, the voltage standing wave ratio, and the impedance.

Claims (2)

아연합금(ZnDC2)을 복수 구동 다이캐스팅으로 성형하여 그 중앙을 태핑으로 나사공을 천공시키고 화학연마액으로 처리하여 노출된 표면과 나사공의 내주연을 도금층에 해당되는 두께로 부식시킨후 이에 도금으로 부식층 두께의 도금층을 형성시켜서 된 무선전화기용 안테나 브래킷의 다이캐스팅에 의한 제조방법Zinc alloy (ZnDC2) is formed by plural drive die casting, and the center of the screw hole is drilled by tapping the center and treated with chemical polishing liquid to corrode the exposed surface and inner circumference of the screw hole to the thickness corresponding to the plating layer, and then Manufacturing method by die casting of antenna bracket for radiotelephone which has formed plating layer of corrosion layer thickness 제 1항에 있어서 화학연마액을 다이글림(Dygleam) 80으로 하여 32℃ 온도에서 30 - 40초간 처리하여 10 - 12 미크론 두께로 부식시켜서 된 무선전화기용 안테나 브래킷의 다이캐스팅에 의한 제조방법The method according to claim 1, wherein the chemical polishing liquid is diglyme 80, treated at 32 ° C. for 30 to 40 seconds, and corroded to a thickness of 10 to 12 microns.
KR1019990031000A 1999-07-29 1999-07-29 A Manufacturing method using diecasting of antenna bracket for a wireless celluar phone KR100341791B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019990031000A KR100341791B1 (en) 1999-07-29 1999-07-29 A Manufacturing method using diecasting of antenna bracket for a wireless celluar phone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019990031000A KR100341791B1 (en) 1999-07-29 1999-07-29 A Manufacturing method using diecasting of antenna bracket for a wireless celluar phone

Publications (2)

Publication Number Publication Date
KR20010011571A KR20010011571A (en) 2001-02-15
KR100341791B1 true KR100341791B1 (en) 2002-06-26

Family

ID=19605525

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019990031000A KR100341791B1 (en) 1999-07-29 1999-07-29 A Manufacturing method using diecasting of antenna bracket for a wireless celluar phone

Country Status (1)

Country Link
KR (1) KR100341791B1 (en)

Also Published As

Publication number Publication date
KR20010011571A (en) 2001-02-15

Similar Documents

Publication Publication Date Title
US20170019510A1 (en) Cover for electronic device, antenna assembly, electronic device, and method for manfuacturing the same
JP2897981B2 (en) Helical antenna and method of manufacturing the same
WO2007094759A3 (en) Semiconductor package with plated connection
GB2318218A (en) Inductive device
WO2004077633A3 (en) Thin coaxial cable and method for its manufacture
KR100341791B1 (en) A Manufacturing method using diecasting of antenna bracket for a wireless celluar phone
KR20000051998A (en) Method of Silver-plating Microwave Band Pass Cavity Filter Products
KR100339227B1 (en) Electronic components and radio terminal unit
CN102623336A (en) Method for manufacturing gallium arsenide-based microwave monolithic integrated circuit power device
EP0903804A1 (en) Lightweight antenna assembly comprising a whip antenna and a helical antenna mounted on a top end of the whip antenna
JPH11112182A (en) Electromagnetic wave shield case and its manufacture
KR100511549B1 (en) Method of Coating Surface of RF Connector
SI1260615T1 (en) Metal coating of graphite
WO2019113740A1 (en) Radio frequency connection apparatus and manufacturing method therefor
GB2349598A (en) Moulded electrical components
CN220302497U (en) Corrosion-resistant hardware
EP1879436A3 (en) Method for manufacturing a composite of copper and resin
CN220347411U (en) Tin-coating and gold-removing tool and device for SMP (SMP) radio frequency connector
US7751583B2 (en) Shielding housing for a condenser microphone
JP5213731B2 (en) Method for manufacturing printed antenna and communication apparatus having printed antenna
JPS583349B2 (en) aluminum terminal
KR100948264B1 (en) Rf device and method of treating plating in the same
JPH07254812A (en) Antenna unit
KR20200137331A (en) Method of surface treatment of housing and cover of a product for wireless communication
KR200259422Y1 (en) Cavity Filter of Combiner for Base Station of Mobile Telecommunication

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee