KR100340094B1 - Pressure sensitive adhesive for electrical insulating tape - Google Patents
Pressure sensitive adhesive for electrical insulating tape Download PDFInfo
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- KR100340094B1 KR100340094B1 KR1020000003505A KR20000003505A KR100340094B1 KR 100340094 B1 KR100340094 B1 KR 100340094B1 KR 1020000003505 A KR1020000003505 A KR 1020000003505A KR 20000003505 A KR20000003505 A KR 20000003505A KR 100340094 B1 KR100340094 B1 KR 100340094B1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/06—Copolymers with styrene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L7/00—Compositions of natural rubber
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
- C09J125/02—Homopolymers or copolymers of hydrocarbons
- C09J125/04—Homopolymers or copolymers of styrene
- C09J125/08—Copolymers of styrene
- C09J125/10—Copolymers of styrene with conjugated dienes
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- Medicinal Chemistry (AREA)
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- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
본 발명은 전기 절연 테이프용 점착제에 관한 것으로서, 더욱 상세하게는 스티렌-부타디엔 고무를 주폴리머로 하고, 여기에 수지성분, 점착부여제 및 통상의 첨가제가 함유되어 있는 전기 절연 테이프용 점착제 조성물에 있어, 상기 점착제 조성물 중에 스티렌-부타디엔 고무, 천연고무, 및 스티렌-부타디엔-스티렌 블록 공중합체 또는 스티렌-이소프렌-스티렌 블록 공중합체의 세 종류의 고무성분을 주폴리머로 하여 반응성 페놀수지와 소량의 액상고무를 함유시킴으로써, 점착부여제를 사용하지 않고도 점착성을 부여하고 점착제의 흐름성을 억제하여 우수한 점착물성과 점착제의 이행성 방지를 동시에 얻을 수 있는 전기 절연 테이프용 점착제에 관한 것이다.The present invention relates to a pressure-sensitive adhesive for electrical insulating tape, and more particularly, to a pressure-sensitive adhesive composition for electrical insulating tape containing styrene-butadiene rubber as a main polymer and containing a resin component, a tackifier, and a common additive. In the pressure-sensitive adhesive composition, a reactive phenolic resin and a small amount of liquid rubber are prepared by using three kinds of rubber components as styrene-butadiene rubber, natural rubber, and styrene-butadiene-styrene block copolymer or styrene-isoprene-styrene block copolymer as main polymers. The present invention relates to a pressure-sensitive adhesive for electrical insulation tape which can provide tackiness without inhibiting the use of a tackifier and suppress the flowability of the pressure-sensitive adhesive to simultaneously obtain excellent pressure-sensitive adhesiveness and prevention of migration of the pressure-sensitive adhesive.
Description
본 발명은 전기 절연 테이프용 점착제에 관한 것으로서, 더욱 상세하게는 고무성분, 수지성분, 점착부여제 및 통상의 첨가제가 함유되어 있는 전기 절연 테이프용 점착제 조성물에 있어, 상기 점착제 조성물 중에 스티렌-부타디엔 고무, 천연고무, 및 스티렌-부타디엔-스티렌 블록 공중합체 또는 스티렌-이소프렌-스티렌 블록 공중합체의 세 종류의 고무성분을 주폴리머로 하여 반응성 페놀수지와 소량의 액상고무를 함유시킴으로써, 점착부여제를 사용하지 않고도 점착성을 부여하고 점착제의 흐름성을 억제하여 우수한 점착물성과 점착제의 이행성 방지를 동시에 얻을 수 있는 전기 절연 테이프용 점착제에 관한 것이다.The present invention relates to a pressure-sensitive adhesive for electrical insulation tape, and more particularly, to a pressure-sensitive adhesive composition for electrical insulation tape containing a rubber component, a resin component, a tackifier and a common additive, wherein the styrene-butadiene rubber in the pressure-sensitive adhesive composition A tackifier is used by containing a reactive phenol resin and a small amount of liquid rubber using three kinds of rubber components, which are natural rubber, styrene-butadiene-styrene block copolymer or styrene-isoprene-styrene block copolymer as main polymers. The present invention relates to a pressure-sensitive adhesive for electrical insulating tape which can provide adhesiveness and suppress the flowability of the pressure-sensitive adhesive to simultaneously obtain excellent pressure-sensitive adhesiveness and prevention of migration of the pressure-sensitive adhesive.
종래 연질 PVC 필름을 기재로 하는 전기 절연용 점착 테이프에 사용되는 점착제는 천연고무나 합성고무를 주원료로 하고 50 ∼ 150 phr 정도의 점착부여 수지, 연화제 등의 첨가제를 혼합하여 제조되고 있다. 이러한 점착제는 저온에서의 점착력이 우수하고 피착표면의 상태에 구애받지 않고 잘 부착되는 특징이 있지만, 주원료인 고무의 유동성이 크고 여기에 다량의 점착부여제 및 연화제가 첨가됨으로써 고온에서 또는 시간이 흐를수록 점착제의 흐름성이 증가하여 저장 또는 사용 중에 점착제가 테이프의 측면으로 이행되거나 점착 테이프의 텔레스코프 현상이 일어나는 등의 문제가 있다.The pressure-sensitive adhesives conventionally used for adhesive tapes for electrical insulation based on soft PVC films are manufactured by mixing additives such as tackifying resins and softeners of about 50 to 150 phr, using natural rubber or synthetic rubber as a main raw material. These adhesives are characterized by excellent adhesion at low temperatures and adhesion well regardless of the surface of the adhered surface.However, the rubber, which is the main raw material, has high fluidity, and a large amount of tackifiers and softeners are added thereto, so that the adhesive can be used at high temperatures or over time. Increasingly, the flowability of the pressure-sensitive adhesive increases, such that the pressure-sensitive adhesive is transferred to the side of the tape during storage or use, or a telescope phenomenon of the adhesive tape occurs.
상기와 같은 문제점을 해결하기 위해, SBS(styrene-butadiene-styrene)와 같이 흐름성이 적은 블록 공중합체를 주원료로 사용하거나 반응성 페놀 수지 등을 사용하여 경화시키는 방법, 또는 폴리메틸메타크릴레이트(PMMA)와 같은 아크릴 중합체를 혼합하거나 그라프트 중합하여 흐름성을 저하시키는 방법 등이 행해져 왔다. 그러나, 상기 방법과 같이 폴리머의 흐름성을 낮출 경우 점착력이 저하되는 경향이 있어 점착력을 확보하기 위해서는 다량의 점착부여제나 연화제를 사용해야 하고, 이로 인해 테이프와 점착제의 이행성이 발생되며, 이러한 문제점을 아직까지는 효과적으로 해결하지 못하고 있는 실정이다.In order to solve the above problems, a method of curing a block copolymer having a low flow rate, such as styrene-butadiene-styrene (SBS) as a main raw material or using a reactive phenol resin, or polymethyl methacrylate (PMMA) A method of mixing or graft-polymerizing an acrylic polymer such as) to lower flowability and the like has been performed. However, when the flowability of the polymer is lowered as in the above method, the adhesive force tends to be lowered. Therefore, in order to secure the adhesive force, a large amount of tackifier or softener must be used, which results in the transferability of the tape and the adhesive. It is not yet solved effectively.
이에, 본 발명자들은 종래 상기와 같은 문제점을 해결하기 위해 연구 노력한 결과, 점착제 조성물 중에 스티렌-부타디엔 고무, 천연고무, 및 스티렌-부타디엔-스티렌 블록 공중합체 또는 스티렌-이소프렌-스티렌 블록 공중합체의 세 종류의 고무성분을 주폴리머로 하여 반응성 페놀수지와 소량의 액상고무를 함유시킴으로써, 적절한 혼련으로 점착성을 부여하여 점착부여제를 사용하지 않고도 전기 절연 테이프용 점착제로 우수한 점착력을 나타내면서 점착제의 흐름성을 억제하여 측면 이행성이나 텔레스코프 현상을 억제 할 수 있는 전기 절연 테이프용 점착제를 제공하는데 그 목적이 있다.Accordingly, the inventors of the present invention have made efforts to solve the above problems, and as a result, three types of styrene-butadiene rubber, natural rubber, and styrene-butadiene-styrene block copolymer or styrene-isoprene-styrene block copolymer in the pressure-sensitive adhesive composition It contains the reactive phenolic resin and a small amount of liquid rubber as the main polymer, and it provides adhesiveness by proper kneading, and shows excellent adhesive force as an adhesive for electric insulating tape without using a tackifier, thereby suppressing the flowability of the adhesive. The purpose of the present invention is to provide a pressure-sensitive adhesive for electrical insulating tape that can suppress side transition or telescope phenomenon.
본 발명은 스티렌-부타디엔 고무를 주폴리머로 하고, 여기에 수지성분, 점착부여제 및 통상의 첨가제가 함유되어 있는 전기 절연 테이프용 점착제에 있어서,The present invention relates to a pressure-sensitive adhesive for electrical insulating tape comprising styrene-butadiene rubber as a main polymer and containing a resin component, a tackifier, and a conventional additive,
상기 주폴리머로는 스티렌-부타디엔 고무 50 ∼ 80 중량%, 천연고무 15 ∼ 30 중량%, 그리고 스티렌 함량이 30 중량% 미만인 스티렌-부타디엔-스티렌 블록 공중합체 또는 스티렌-이소프렌-스티렌 블록 공중합체 5 ∼ 20 중량%로 이루어져 있으며, 상기 주폴리머 100 중량부에 대하여 반응성 페놀수지 5 ∼ 30 중량부, 가교촉진제로서 레진화아연 5 ∼ 20 중량부 및 액상고무 5 ∼ 20 중량부가 함유되어 있는 전기 절연 테이프용 점착제를 그 특징으로 한다.The main polymer may be 50 to 80% by weight of styrene-butadiene rubber, 15 to 30% by weight of natural rubber, and styrene-butadiene-styrene block copolymer or styrene-isoprene-styrene block copolymer having a styrene content of less than 30% by weight. 20 wt%, based on 100 wt% of the main polymer, 5-30 wt% of reactive phenolic resin, 5-20 wt% of zinc resin as a crosslinking accelerator, and 5-20 wt% of liquid rubber. It is characterized by an adhesive.
이와 같은 본 발명을 더욱 상세하게 설명하면 다음과 같다.The present invention will be described in more detail as follows.
본 발명은 합성고무를 비롯한 세 종류의 폴리머를 혼합하고 반응성 페놀수지 및 액상 고무 등의 첨가제를 함유시켜 적절한 가교가 되도록 일정하게 혼련하고 용제에 용해시킴으로써, 우수한 점착물성과 이행성 방지 효과가 있는 전기 절연 테이프용 점착제에 관한 것이다.The present invention mixes three kinds of polymers, including synthetic rubber, contains additives such as reactive phenolic resins and liquid rubbers, and constantly kneads them for proper crosslinking and dissolves them in a solvent. It relates to an adhesive for insulating tape.
본 발명에서는 점착제 조성물에 사용되는 주폴리머로서 스티렌-부타디엔 고무, 천연고무, 및 스티렌-부타디엔-스티렌 블록 공중합체 또는 스티렌-이소프렌-스티렌 블록 공중합체의 세 종류의 고무 성분을 혼합하여 사용하는 특징이 있다.In the present invention, the main polymer used in the pressure-sensitive adhesive composition is characterized by mixing three kinds of rubber components such as styrene-butadiene rubber, natural rubber, and styrene-butadiene-styrene block copolymer or styrene-isoprene-styrene block copolymer. have.
즉, 본 발명의 주 원료고무로는 전체 조성물에 대하여 스티렌-부타디엔 고무를 50 ∼ 80 중량%로 사용하며, 여기에 천연고무 15 ∼ 30 중량%, 그리고 스티렌 함량이 30 중량% 미만인 스티렌-부타디엔-스티렌 블록 공중합체 또는 스티렌-이소프렌-스티렌 블록 공중합체 5 ∼ 20 중량%가 혼합된 블렌드물을 사용한다. 이때, 상기 스티렌-부타디엔 고무의 사용함량이 50 중량% 미만이면 점착력이 저하되는 문제가 있고, 80 중량%를 초과하게 되면 응집력이 저하되고 방사성이 증가되는 문제가 있다. 또한, 천연고무의 사용함량이 15 중량% 미만이면 점착력이 크게 저하되며, 30 중량%를 초과하면 원료 폴리머간의 상용성이 저하되고 점착제의 흐름성이 증가되는 문제가 있다. 또한, 스티렌-부타디엔-스티렌 블록 공중합체 또는 스티렌-이소프렌-스티렌 블록 공중합체의 스티렌 함량이 30 중량%를 초과하게 되면 점착력을 저하시키는 문제가 있으며, 이러한 블록 공중합체의 사용량이 5 중량% 미만이면 점착제의 흐름성이 증가되고, 20 중량%를 초과하면 점착력이 저하되어 점착제로서의 성능을 나타내기가 어렵게 된다.That is, the main raw material rubber of the present invention uses 50 to 80% by weight of styrene-butadiene rubber, based on the total composition, 15 to 30% by weight of natural rubber, and styrene-butadiene- with styrene content of less than 30% by weight Blends containing 5 to 20% by weight of styrene block copolymers or styrene-isoprene-styrene block copolymers are used. At this time, when the content of the styrene-butadiene rubber is less than 50% by weight, there is a problem that the adhesive force is lowered, and when it exceeds 80% by weight, the cohesive force is lowered and the radioactivity is increased. In addition, when the content of natural rubber is less than 15% by weight, the adhesive strength is greatly reduced. When the content of the natural rubber exceeds 30% by weight, the compatibility between the raw material polymers is lowered and the flowability of the pressure-sensitive adhesive is increased. In addition, when the styrene content of the styrene-butadiene-styrene block copolymer or the styrene-isoprene-styrene block copolymer exceeds 30 wt%, there is a problem of lowering the adhesive force, and if the amount of the block copolymer is less than 5 wt% When the flowability of the pressure-sensitive adhesive is increased and exceeds 20% by weight, the adhesive force is lowered, making it difficult to exhibit the performance as the pressure-sensitive adhesive.
또한, 본 발명에서 점착제 조성물에 사용되는 반응성 페놀수지로는 브롬화 알킬페놀-포름알데하이드 수지로서 연화점이 70 ∼ 100 ℃의 범위인 수지를 사용하는 것이 바람직하다. 반응성 페놀수지의 사용량은 상기 주폴리머 100 중량부에 대하여 5 ∼ 30 중량부로 사용하며, 이때 반응성 페놀수지의 사용량이 5 중량부 미만일 경우 가교가 불충분 하여 점착제의 유동성이 증가하게 되고, 30 중량부를 초과시 필요 이상으로 가교되어 용해가 어렵고 점착력이 저하되는 문제가 발생한다.In addition, it is preferable to use resin whose softening point is the range of 70-100 degreeC as brominated alkylphenol-formaldehyde resin as a reactive phenol resin used for an adhesive composition in this invention. The amount of the reactive phenol resin is used in an amount of 5 to 30 parts by weight based on 100 parts by weight of the main polymer. At this time, when the amount of the reactive phenol resin is less than 5 parts by weight, crosslinking is insufficient to increase the fluidity of the pressure-sensitive adhesive. It crosslinks more than necessary and it becomes difficult to melt | dissolve and the problem that adhesive force falls is produced.
본 발명에서 점착제 조성물에 상기 반응성 페놀수지와 함께 함유시키는 가교촉진제로서 레진화아연을 사용하는데, 이는 주폴리머 100 중량부에 대하여 5 ∼ 20 중량부로 사용한다. 이때, 상기 가교촉진제의 사용함량이 5 중량부 미만으로 사용할 경우 가교가 충분치 않으며, 20 중량부를 초과하게 되면 과가교되는 경향이 심해지므로 바람직하지 않다.In the present invention, zinc resin is used as a crosslinking accelerator to be included in the pressure-sensitive adhesive composition together with the reactive phenolic resin, which is used in an amount of 5 to 20 parts by weight based on 100 parts by weight of the main polymer. In this case, when the content of the crosslinking accelerator is used in an amount less than 5 parts by weight, crosslinking is not sufficient, and when it exceeds 20 parts by weight, the crosslinking tends to be severe, which is not preferable.
본 발명에서 점착성 보강을 위한 연화제로는 액상고무를 사용하며, 주폴리머 100 중량부에 대하여 5 ∼ 20 중량부로 사용한다. 이러한 액상고무로는 액상 이소프렌 고무, 액상 이소프렌-부타디엔 고무, 액상 부타디엔 고무 및 상기 액상고무의 변성체 중에서 선택하여 사용한다. 여기서, 상기 액상고무를 5 중량부 미만으로 사용할 경우 폴리머의 유동성이 저하되어 점착력이 떨어지고, 반면 20 중량부가 초과되면 흐름성이 커져 점착제가 이행되는 현상이 심해진다.In the present invention, as a softener for reinforcing the adhesive, liquid rubber is used, and 5 to 20 parts by weight based on 100 parts by weight of the main polymer. The liquid rubber may be selected from among liquid isoprene rubber, liquid isoprene-butadiene rubber, liquid butadiene rubber, and a modified body of the liquid rubber. Here, when the liquid rubber is used in less than 5 parts by weight, the fluidity of the polymer is lowered, the adhesive force is lowered, whereas when 20 parts by weight is exceeded, the phenomenon that the pressure-sensitive adhesive is transferred to increase the flowability.
또한, 본 발명에서는 점착제 조성물에 미립자 실리카를 5 중량부 이하로 함유시킴으로써, 점착력을 크게 저하시키지 않으면서도 점착제의 유동성을 저하시키는 효과를 얻을 수 있다. 상기 미립자 실리카의 입자 크기는 0.05 ㎛ 이하인 것이 바람직하다.Moreover, in this invention, by containing 5 weight part or less of fine particle silica in an adhesive composition, the effect of reducing the fluidity | liquidity of an adhesive can be acquired, without reducing the adhesive force significantly. The particle size of the particulate silica is preferably 0.05 μm or less.
본 발명에서 사용되는 가교조제로는 부틸 지메이트를 사용하며, 주폴리머에 대하여 0 ∼ 2 중량부로 사용할 수 있다. 또한, 안정제로서 2,6-다이-t-부틸-4-메틸 페놀(이하 'BHT'라 한다)를 0.5 ∼ 2 중량부로 사용하며, 점착제 조성물의 혼련을 용이하게 하기 위해 나프테닉오일 등의 가공조제를 20 중량부 미만으로 첨가할 수 있다.Butyl zimate is used as the crosslinking aid used in the present invention, and may be used in an amount of 0 to 2 parts by weight based on the main polymer. In addition, 0.5 to 2 parts by weight of 2,6-di-t-butyl-4-methyl phenol (hereinafter referred to as 'BHT') is used as a stabilizer, and processing of naphthenic oil or the like is made to facilitate kneading of the pressure-sensitive adhesive composition. The assistant may be added in less than 20 parts by weight.
그 밖에 본 발명에서는 점착제의 점착물성을 저하시키지 않는 범위내에서 점착부여제를 제외한 다른 배합제를 소량 첨가할 수도 있다.In addition, in this invention, a small amount of other compounding agents except a tackifier can also be added in the range which does not reduce the adhesiveness of an adhesive.
한편, 상기 조성성분들을 이용하여 전기 절연 테이프용 점착제의 제조방법을 설명하면 다음과 같다.Meanwhile, the manufacturing method of the pressure-sensitive adhesive for electrical insulating tape using the composition components will be described below.
본 발명에서는 반응성 페놀수지와 가교촉진제로서 사용되는 레진화아연을 제외한 나머지 조성성분들을 배합하여 80 ∼ 130 ℃의 온도범위에서 오픈롤밀(open-roll-mill), 니이더(kneader) 또는 반바리 믹서(banbury mixer)를 사용하여 30분 동안 혼련시킨다. 그런 다음, 상기 반응성 페놀수지와 레진화아연을 투입하여 다시 같은 온도에서 15 ∼ 30분간 혼련시킨 후, 점착제의 고형분의 함량이 15 ∼ 75 중량%가 되도록 용제로 용해하여 점착제를 제조하게 된다. 이때, 주폴리머와 액상고무의 혼련시간이 30분 미만이 되면 충분한 점착력이 발현되지 않으며, 반응성 페놀수지 첨가 후 혼련온도가 80℃ 미만이면 가교가 충분치 않아 이행성이 심해지는 문제가 있고, 130 ℃를 초과하게 되면 과가교가 되어 점착제 조성물이 용제에 용해되지 않는 문제를 야기한다. 또한, 반응성 페놀수지를 투입한 후 혼련시간이 15분 이내가 되면 가교가 불충분하며, 30분을 초과하면 과가교가 되므로 반응성 페놀수지의 투입시기를 적절하게 조절할 필요가 있다. 본 발명에서 사용되는 용제로는 톨루엔, 자일렌, 사이클로헥산 및 에틸 아세테이트 중에서 선택된 것을 단독 또는 병용하여 사용할 수 있다.In the present invention, an open-roll-mill, kneader or short-barrier mixer is blended in the temperature range of 80 to 130 ° C. by mixing the other constituents except the zinc resin used as a reactive phenol resin and a crosslinking accelerator. knead for 30 minutes using a banbury mixer. Then, the reactive phenolic resin and zinc resin were added and kneaded again at the same temperature for 15 to 30 minutes, and then dissolved in a solvent such that the solid content of the adhesive is 15 to 75% by weight to prepare an adhesive. At this time, when the kneading time of the main polymer and the liquid rubber is less than 30 minutes, sufficient adhesive strength is not expressed. If the kneading temperature after the addition of the reactive phenolic resin is less than 80 ° C., the crosslinking is not sufficient, resulting in severe transition, and 130 ° C. Exceeding the above causes crosslinking, which causes a problem that the pressure-sensitive adhesive composition is not dissolved in the solvent. In addition, when the kneading time is less than 15 minutes after the addition of the reactive phenolic resin, the crosslinking is insufficient, and if it exceeds 30 minutes, the crosslinking is insufficient. Therefore, it is necessary to appropriately adjust the timing of adding the reactive phenolic resin. As the solvent used in the present invention, one selected from toluene, xylene, cyclohexane and ethyl acetate may be used alone or in combination.
이상과 같은 방법으로 제조된 본 발명의 점착제를 연질 PVC 필름에 도포하여 점착 테이프를 제조할 수 있으며, 이는 점착부여제를 첨가하지 않고도 점착력이 우수하면서 점착제의 이행성이 없는 특성을 지니고 있다.The pressure-sensitive adhesive tape of the present invention prepared by the above method may be applied to a soft PVC film to prepare a pressure-sensitive adhesive tape, which is excellent in adhesive force without adding a tackifier and has a property of non-transferability of the pressure-sensitive adhesive.
이하 본 발명을 실시예에 의거하여 상세히 설명하겠는바, 본 발명이 실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited by Examples.
실시예 1Example 1
스티렌-부타디엔 고무(SBR1502, 금호석유) 80 중량%, 천연고무(SMR-L, 말레이시아고무) 15 중량%, 스티렌-부타디엔-스티렌 블록 공중합체(스티렌 29.5%, KD1102, 쉘화학) 5 중량%와, 액상 이소프렌 고무(LIR-50, 일본합성고무) 10 중량부 및 나프테닉오일(N-2 오일, 미창석유공업) 10 중량부, 부틸 지메이트(동양화학) 2 중량부, BHT(2,6-t-부틸-4-메틸 페놀, 바이엘) 2 중량부를 100 ℃ 니이더에서 30 분간 잘 혼련한 후, 반응성 브롬화 알킬페놀-포름알데하이드 수지(연화점 75 ∼ 90 ℃, 타오카화학) 10 중량부, 레진화아연(아라카와) 10 중량부를 투입하여 30분간 더 혼련하였다. 제조된 원료조성물을 점착제의 고형분 함량이 25 중량%가 되도록 톨루엔에 용해하여 점착제를 제조하였다.80% by weight of styrene-butadiene rubber (SBR1502, Kumho Petroleum), 15% by weight of natural rubber (SMR-L, Malaysian rubber), 5% by weight of styrene-butadiene-styrene block copolymer (styrene 29.5%, KD1102, Shell Chemical) , 10 parts by weight of liquid isoprene rubber (LIR-50, Nippon Synthetic Rubber) and 10 parts by weight of naphthenic oil (N-2 oil, Unchang Petrochemical), 2 parts by weight of butyl zimate (Dongyang Chemical), BHT (2,6- 2 parts by weight of t-butyl-4-methyl phenol and Bayer) were kneaded well at 100 ° C. for 30 minutes, and then 10 parts by weight of a reactive brominated alkylphenol-formaldehyde resin (softening point 75 to 90 ° C., Taoka Chemical), resinization 10 parts by weight of zinc (Arakawa) was added, and further kneaded for 30 minutes. The pressure-sensitive adhesive was prepared by dissolving the prepared raw material composition in toluene so that the solid content of the pressure-sensitive adhesive was 25% by weight.
실시예 2Example 2
스티렌-부타디엔 고무 50 중량%, 천연고무 25 중량%, 스티렌-부타디엔-스티렌 블록 공중합체 15 중량%와, 액상 이소프렌 고무 10 중량부 및 나프테닉오일 10 중량부, 부틸 지메이트 2 중량부, BHT 2 중량부, 미립자 실리카(입도 0.01 ㎛, aerosil 200, 대구사) 2 중량부를 100 ℃ 니이더에서 30 분간 잘 혼련한 후 반응성 브롬화 알킬페놀-포름알데하이드 수지 15 중량부, 레진화아연 15 중량부를 투입하여 30 분간 더 혼련하였다. 제조된 원료조성물을 점착제의 고형분 함량이 25 중량%가 되도록 톨루엔에 용해하여 점착제를 제조하였다.50% by weight of styrene-butadiene rubber, 25% by weight of natural rubber, 15% by weight of styrene-butadiene-styrene block copolymer, 10 parts by weight of liquid isoprene rubber, 10 parts by weight of naphthenic oil, 2 parts by weight of butyl zimate, 2 parts by weight of BHT 2 parts by weight of fine particle silica (particle size 0.01 μm, aerosil 200, cod sand) were kneaded well at 100 ° C. for 30 minutes, and then 15 parts by weight of reactive brominated alkylphenol-formaldehyde resin and 15 parts by weight of zinc resin were added thereto. Kneaded for a further minute. The pressure-sensitive adhesive was prepared by dissolving the prepared raw material composition in toluene so that the solid content of the pressure-sensitive adhesive was 25% by weight.
실시예 3Example 3
스티렌-부타디엔 고무 70 중량%, 천연고무 20 중량%, 스티렌-이소프렌-스티렌 블록 공중합체(스티렌 16%, TR1107, 쉘화학) 10 중량%와, 액상 이소프렌 고무 15 중량부 및 나프테닉오일 10 중량부, 부틸 지메이트 2 중량부, BHT 2 중량부, 미립자 실리카 2 중량부를 100 ℃ 니이더에서 30 분간 잘 혼련한 후, 브롬화 알킬페놀-포름알데하이드 수지 10 중량부, 레진화아연 10 중량부를 투입하여 30분간 더 혼련하였다. 제조된 원료조성물을 점착제의 고형분 함량이 25 중량%가 되도록 톨루엔에 용해하여 점착제를 제조하였다.70% by weight of styrene-butadiene rubber, 20% by weight of natural rubber, 10% by weight of styrene-isoprene-styrene block copolymer (styrene 16%, TR1107, Shell Chemical), 15 parts by weight of liquid isoprene rubber and 10 parts by weight of naphthenic oil , 2 parts by weight of butyl zimate, 2 parts by weight of BHT, and 2 parts by weight of fine particle silica were kneaded well at 100 ° C. for 30 minutes, and then 10 parts by weight of brominated alkylphenol-formaldehyde resin and 10 parts by weight of zinc resin were added thereto for 30 minutes. More kneaded. The pressure-sensitive adhesive was prepared by dissolving the prepared raw material composition in toluene so that the solid content of the pressure-sensitive adhesive was 25% by weight.
비교예 1Comparative Example 1
스티렌-부타디엔 고무 100 중량부, 테르펜 수지(YS-1000, 야스하라) 40 중량부, 로진산 에스테르 수지(RM-100, 발케케미칼) 20 중량부, 산화아연 5 중량부, 파라핀오일(극동오일) 25 중량부를 톨루엔에 용해하여 점착제의 고형분 함량이 25 중량%가 되도록 점착제를 제조하였다.100 parts by weight of styrene-butadiene rubber, 40 parts by weight of terpene resin (YS-1000, Yashara), 20 parts by weight of rosin ester resin (RM-100, Val Chemical), 5 parts by weight of zinc oxide, paraffin oil (Far East Oil) The pressure-sensitive adhesive was prepared so that 25 parts by weight of the pressure-sensitive adhesive was dissolved in toluene so that the solid content of the pressure-sensitive adhesive became 25% by weight.
비교예 2Comparative Example 2
스티렌-부타디엔 고무 100 중량부, 테르펜수지 40 중량부, 로진산 에스테르수지 20 중량부, 액상 이소프렌 고무 10 중량부 및 나프테닉오일 10 중량부, 부틸 지메이트 2 중량부, BHT 2 중량부, 미립자 실리카 2 중량부를 100 ℃ 니이더에서 30 분간 잘 혼련한 후 브롬화 알킬페놀-포름알데하이드 수지 10 중량부, 레진화아연 10 중량부를 투입하여 30 분간 더 혼련하였다. 제조된 원료조성물을 점착제의 고형분 함량이 25 중량%가 되도록 톨루엔에 용해하여 점착제를 제조하였다.100 parts by weight of styrene-butadiene rubber, 40 parts by weight of terpene resin, 20 parts by weight of rosin acid ester resin, 10 parts by weight of liquid isoprene rubber and 10 parts by weight of naphthenic oil, 2 parts by weight of butyl simate, 2 parts by weight of BHT, particulate silica 2 The parts by weight were kneaded well at 100 ° C. for 30 minutes, and then 10 parts by weight of brominated alkylphenol-formaldehyde resin and 10 parts by weight of zinc resin were kneaded for 30 minutes. The pressure-sensitive adhesive was prepared by dissolving the prepared raw material composition in toluene so that the solid content of the pressure-sensitive adhesive was 25% by weight.
비교예 3Comparative Example 3
스티렌-부타디엔 고무 80 중량%, 천연고무 15 중량%, 스티렌-부타디엔-스티렌 블록 공중합체 5 중량%와, 액상 이소프렌 고무 10 중량부 및 나프테닉오일 10 중량부, 부틸 지메이트 2 중량부, BHT 2 중량부, 미립자 실리카 2 중량부를 100 ℃ 니이더에서 30 분간 잘 혼련한 후 브롬화 알킬페놀-포름알데하이드 수지 40 중량부, 레진화아연 30 중량부를 투입하여 30분간 더 혼련하였다. 제조된 원료조성물을 점착제의 고형분 함량이 25 중량%가 되도록 톨루엔에 용해하여 점착제를 제조하였다.80% by weight of styrene-butadiene rubber, 15% by weight of natural rubber, 5% by weight of styrene-butadiene-styrene block copolymer, 10 parts by weight of liquid isoprene rubber, 10 parts by weight of naphthenic oil, 2 parts by weight of butyl zimate, 2 parts by weight of BHT 2 parts by weight of fine particle silica were kneaded well at 100 ° C. for 30 minutes, and then 40 parts by weight of brominated alkylphenol-formaldehyde resin and 30 parts by weight of zinc resin were kneaded for 30 minutes. The pressure-sensitive adhesive was prepared by dissolving the prepared raw material composition in toluene so that the solid content of the pressure-sensitive adhesive was 25% by weight.
비교예 4Comparative Example 4
스티렌-부타디엔 고무 20 중량%, 천연고무 30 중량%, 스티렌-부타디엔-스티렌 블록 공중합체 50 중량%와, 액상 이소프렌 고무 30 중량부 및 나프테닉오일 20 중량부, 부틸 지메이트 2 중량부, BHT 2 중량부, 미립자 실리카 2 중량부를 100 ℃ 니이더에서 30 분간 잘 혼련한 후 브롬화 알킬페놀-포름알데하이드 수지 10 중량부, 레진화아연 10 중량부를 투입하여 30 분간 더 혼련하였다. 제조된 원료조성물을 점착제의 고형분 함량이 25 중량%가 되도록 톨루엔에 용해하여 점착제를 제조하였다.20% by weight of styrene-butadiene rubber, 30% by weight of natural rubber, 50% by weight of styrene-butadiene-styrene block copolymer, 30 parts by weight of liquid isoprene rubber, 20 parts by weight of naphthenic oil, 2 parts by weight of butyl zimate, 2 parts by weight of BHT 2 parts by weight of fine particle silica were kneaded well at 100 ° C. for 30 minutes, and then 10 parts by weight of brominated alkylphenol-formaldehyde resin and 10 parts by weight of zinc resin were kneaded for 30 minutes. The pressure-sensitive adhesive was prepared by dissolving the prepared raw material composition in toluene so that the solid content of the pressure-sensitive adhesive was 25% by weight.
비교예 5Comparative Example 5
스티렌-부타디엔 고무 80 중량%, 천연고무 15 중량%, 스티렌-부타디엔-스티렌 블록 공중합체 5 중량%, 액상 이소프렌 고무 10 중량부 및 나프테닉오일 10 중량부, 부틸 지메이트 2 중량부, BHT 2 중량부, 미립자 실리카 2 중량부를 100 ℃ 니이더에서 30 분간 잘 혼련한 후 브롬화 알킬페놀-포름알데하이드수지 15 중량부, 레진화아연 15 중량부를 투입하여 60 분간 더 혼련하였다. 제조된 원료조성물을 점착제의 고형분 함량이 25 중량%가 되도록 톨루엔에 용해하여 점착제를 제조하였다.80% by weight of styrene-butadiene rubber, 15% by weight of natural rubber, 5% by weight of styrene-butadiene-styrene block copolymer, 10 parts by weight of liquid isoprene rubber and 10 parts by weight of naphthenic oil, 2 parts by weight of butyl zimate, 2 parts by weight of BHT 2 parts by weight of fine particle silica were kneaded well at 100 ° C. for 30 minutes, and 15 parts by weight of brominated alkylphenol-formaldehyde resin and 15 parts by weight of zinc resin were further kneaded for 60 minutes. The pressure-sensitive adhesive was prepared by dissolving the prepared raw material composition in toluene so that the solid content of the pressure-sensitive adhesive was 25% by weight.
비교예 6Comparative Example 6
전기 절연용 점착 테이프로 시판되고 있는 제품을 비교예 6으로 하였다.The product marketed by the adhesive tape for electrical insulation was made into the comparative example 6.
실험예Experimental Example
상기 실시예 1 ∼ 3과 비교예 1 ∼ 6을 다음과 같은 방법에 의해 점착특성을 비교하였으며, 그 결과를 다음 표 1에 나타내었다.The adhesion characteristics of Examples 1 to 3 and Comparative Examples 1 to 6 were compared by the following methods, and the results are shown in Table 1 below.
① 점착 테이프 제조① Adhesive tape manufacturing
PVC 필름위에 점착층의 두께가 약 20 ∼ 25 ㎛(건조상태)가 되도록 점착제를 균일하게 도포한 다음, 110 ℃ 건조기에서 2분간 건조한 후 실온에서 24 시간 방치하여 점착 테이프를 제조하였다.The pressure-sensitive adhesive was uniformly applied so that the thickness of the pressure-sensitive adhesive layer was about 20 to 25 μm (dry state) on the PVC film, and then dried in a 110 ° C. dryer for 2 minutes and left at room temperature for 24 hours to prepare an adhesive tape.
② 점착력 평가② Evaluation of adhesion
제조된 점착 테이프를 스테인레스 강판에 100 mm×20 mm의 규격으로 부착한 다음, 만능인장 시험기를 사용하여 분당 300 mm의 속도로 박리하여 점착력을 측정하였다.The adhesive tape thus prepared was attached to a stainless steel sheet in a size of 100 mm × 20 mm, and then peeled at a speed of 300 mm per minute using a universal tensile tester to measure adhesive force.
③ 점착제의 이행성 평가③ Evaluation of performance of adhesive
제조된 점착 테이프를 스테인레스 강판에 부착한 후 80 ℃에서 1시간 동안 가열한 다음, 실온에서 4시간 이상 방치후 박리하여 강판의 표면에 남겨진 잔류물의 양을 전체면적에 대한 백분율(%)로 표시하였다.The adhesive tape thus prepared was attached to a stainless steel sheet, heated at 80 ° C. for 1 hour, and left at room temperature for 4 hours or more to peel off. The amount of residue remaining on the surface of the steel sheet was expressed as a percentage (%) of the total area. .
이상에서 설명한 바와 같이, 본 발명의 전기 절연 테이프용 점착제는 스티렌-부타디엔 고무를 주폴리머로 사용하면서 천연고무와 소량의 액상고무의 적절한 혼련으로 점착성을 부여하여 점착부여제를 사용하지 않고도 점착물성이 우수하고 점착제의 이행성 방지를 동시에 얻을 수 있어 연질 PVC 필름을 기재로 하는 전기 절연용 점착 테이프를 제조하기에 적합하다.As described above, the pressure-sensitive adhesive for electrical insulating tape of the present invention, by using styrene-butadiene rubber as the main polymer, imparting adhesiveness by proper kneading of natural rubber and a small amount of liquid rubber, the adhesive properties without using a tackifier It is possible to obtain excellent anti-transferability of the pressure-sensitive adhesive at the same time, and is suitable for producing an adhesive tape for electrical insulation based on a soft PVC film.
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| KR1020000003505A KR100340094B1 (en) | 2000-01-25 | 2000-01-25 | Pressure sensitive adhesive for electrical insulating tape |
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