KR100311828B1 - Pre-coating apparatus of pcb pad - Google Patents
Pre-coating apparatus of pcb pad Download PDFInfo
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- KR100311828B1 KR100311828B1 KR1019990059984A KR19990059984A KR100311828B1 KR 100311828 B1 KR100311828 B1 KR 100311828B1 KR 1019990059984 A KR1019990059984 A KR 1019990059984A KR 19990059984 A KR19990059984 A KR 19990059984A KR 100311828 B1 KR100311828 B1 KR 100311828B1
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- South Korea
- Prior art keywords
- solder
- substrate
- seating
- upper side
- electrode pattern
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- 239000011248 coating agent Substances 0.000 title claims abstract description 17
- 238000000576 coating method Methods 0.000 title claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 239000007787 solid Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
본 발명은 기판에 있어서, 솔더범프가 부착되는 접합재료를 솔더를 사용할때 기판에 솔더를 코팅하는 장치에 관한 것에 관한 것으로서 그 기술적인 구성은, 안착홀이 형성되는 안착틀과 상기 안착틀에 연결되어 안착틀을 진동시키는 모터및 상기 안착틀에 적재되는 솔더볼을 용해하는 히팅코일과, 일체로 장착되는 기판 상측의 일정위치에 안착틀을 위치토록 하는 베이스로 구성되어 기판의 전극패턴 상측에 솔더를 도포하는 것을 요지로 한다.The present invention relates to a device for coating a solder on a substrate when a solder is used for soldering a bonding material to which a solder bump is attached, the technical configuration of which is connected to a seating frame in which a seating hole is formed and the seating frame. And a heating coil for dissolving a solder ball loaded on the seating frame, a motor for vibrating the seating frame, and a base for positioning the seating frame at a predetermined position on the upper side of the substrate to be integrally mounted. It is made into the summary to apply | coat.
Description
본 발명은 패키지 기판에 있어서, 플립 칩(FLIP CHIP)의 실장 형태중 C4/FCA(CONROLLED COLLAPSE CHIP CONNECION/ FLIP CHIP ATTACH)를 사용하는 방식에서 솔더범프가 부착되는 접합재료를 솔더를 사용할때 기판에 솔더를 코팅하는 장치에 관한 것이다.The present invention relates to a package substrate, in which a solder bump is attached to a substrate when solder is used in a method of using a C4 / FCA (CONROLLED COLLAPSE CHIP CONNECION / FLIP CHIP ATTACH) in a mounting form of a flip chip. It relates to a device for coating solder.
일반적으로 알려져있는 종래의 기판 플립 칩 연결구조는 도1A에서와 같이, 기판(1)의 상측에 일체로 형성되는 전극패턴(3)에 리드프레임(5)을 고정하고, 상기 기판(1)의 상측에 장착토록 되면서 플립 칩(7)과 전기적으로 연결되는 칩다이(9)에 금사선(11)을 통하여 리드프레임(5)과 전기적으로 연결토록 하고, 상기 칩다이(9)의 둘레에 에폭시가 충진되어 플립칩(7)을 기판(1)에 고정함은 물론 외부부품과 절연토록 하는 구성으로 이루어진다.In general, the conventional substrate flip chip connection structure, as shown in Fig. 1A, fixes the lead frame 5 to the electrode pattern 3 formed integrally on the upper side of the substrate 1, To be mounted on the upper side and electrically connected to the lead frame 5 through the gold wire 11 to the chip die (9) electrically connected to the flip chip (7), epoxy around the chip die (9) Is filled to secure the flip chip 7 to the substrate 1 as well as to insulate the external component.
그러나, 상기와 같은 플립칩의 연결구조는, 플립칩(7)과 기판(1)을 연결하기 위한 공정의 증가및 리드프레임(5)등의 별도의 부품을 필요로 하여 생산 원가 및 작업성이 저하되고, 장착면적이 증가하여 기판의 소형화 및 경박화에 역행하게 되는 단점이 있는 것이다.However, the connection structure of the flip chip as described above, the increase in the process for connecting the flip chip 7 and the substrate 1 and requires a separate component such as the lead frame 5, the production cost and workability There is a disadvantage in that it is lowered and the mounting area is increased to counteract miniaturization and lightening of the substrate.
또한, 도1B에서와 같이, 솔더볼에 의한 부착의 경우 기판(1)의 상측에 형성되는 전극패턴(3)에 수작업에 의해 솔더볼(15)을 부착한 상태에서 그 상측에 플립칩(7)을 접합하여 가열함으로써 기판(1)의 상측에 플립칩(7)이 연결되는 것이다.In addition, as shown in FIG. 1B, in the case of adhesion by solder balls, the flip chip 7 is placed on the upper side in the state where the solder balls 15 are manually attached to the electrode pattern 3 formed on the upper side of the substrate 1. The flip chip 7 is connected to the upper side of the board | substrate 1 by bonding and heating.
그러나, 상기와 같은 플립칩 연결구조는, 전극패턴(3)의 상측에 수작업에 의해 솔더볼(15)을 부착하여 작업자의 숙련도에 따라 전극패턴(3) 상측에 정확하게 도포되지 못하여 칩의 접합시 편차 발생으로 응력이 발생되어 전기, 기계적인 연결의 신뢰성을 저하시키고, 소형화되는 기판(1)에서의 작업시 양측의 전극패턴(3)이 연결되어 연결의 신뢰성을 저하시키게 되며, 전극패턴(3)의 상측에 수작업에의해플럭스(FLUX)를 도포할 경우 각각의 전극패턴(3)에 도포 및 건조에 따른 작업손실이 발생하게 되는 단점이 있었던 것이다.However, in the flip chip connection structure as described above, the solder ball 15 is attached to the upper side of the electrode pattern 3 by hand, so that it is not accurately applied on the upper side of the electrode pattern 3 according to the skill of the operator. When stress is generated, the reliability of the electrical and mechanical connection is reduced, and when working on the substrate 1 to be miniaturized, the electrode patterns 3 on both sides are connected to reduce the reliability of the connection. When the flux (FLUX) is applied by hand on the upper side of the electrode pattern (3) was a disadvantage in that the work loss occurs due to the application and drying.
본 발명은 상기한 바와같은 종래의 여러 문제점들을 개선하기 위한 것으로서 그 목적은, 전극패턴의 상측에 솔더를 균일하게 도포하여 플립칩의 실장시 신뢰성을 제공하며, 정확하게 전극패턴의 상측에 코팅이 이루어져 숙련도와 상관없이 정확한 작업이 가능하여 작업성이 향상되고, 솔더펌프의 크기에 상관없이 결합이 가능하며, 기판의 상측에 플립칩의 장착시간을 최소화 할수 있도록 한 기판 패드의 코팅장치를 제공하는데 있다.The present invention is to improve the various problems as described above, the object of the present invention is to uniformly apply solder on the upper side of the electrode pattern to provide reliability when mounting the flip chip, the coating is made on the upper side of the electrode pattern accurately It is to provide a coating device for substrate pads that enables accurate work regardless of skill and improves workability, can be bonded regardless of solder pump size, and minimizes flip chip mounting time on the upper side of the substrate. .
도1A,B는 종래의 플립 칩을 기판에 장착하는 구조를 도시한 개략도1A and B are schematic diagrams showing a structure for mounting a conventional flip chip on a substrate.
도2는 본 발명에 따른 기판 패드의 코팅장치를 도시한 분해도Figure 2 is an exploded view showing the coating apparatus of the substrate pad according to the present invention
도3은 본 발명에 따른 기판 패드의 코팅장치를 도시한 결합상태도Figure 3 is a bonded state showing a coating apparatus of the substrate pad according to the present invention
* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
110...솔더볼 120...히팅코일110 Solder ball 120 Heating coil
210...모터 220...회전판210 ... motor 220 ... turn plate
250...안착홀 250...안착틀250 ... seat hole 250 ... seat frame
330...지지대 350...가이드핀330 support 350 guide pin
상기 목적을 달성하기 위한 기술적인 구성으로서 본 발명은, 고열을 발생토록 다수의 히팅코일및 팬이 설치되는 솔더 용해부와,As a technical configuration for achieving the above object, the present invention provides a solder dissolving unit in which a plurality of heating coils and fans are installed to generate high heat;
모터의 상측에 회전판이 설치되어 그 일측에 돌출되는 고정축을 통하여 다수의 안착홀이 형성되는 안착틀이 연결판으로서 연결되고, 상기 안착틀의 내측에 가이드홀이 형성되는 솔더 안착부및,A solder seat having a rotary plate installed on the upper side of the motor and a seating frame having a plurality of seating holes formed thereon through a fixed shaft projecting on one side thereof as a connecting plate, and a guide hole formed inside the seating frame;
상기 안착틀의 저부에 전극패턴이 상측에 일체로 형성되는 기판이 안착토록 지지대가 형성되며, 상기 지지대의 모서리부에 지지판이 일체로 형성되는 가이드핀이 돌출 설치되는 베이스를 포함하여 구성되는 기판 패드의 코팅장치를 마련함에의한다.A substrate pad is formed at the bottom of the seating frame to include a base on which an electrode pattern is integrally formed at an upper side thereof, and a base on which a guide pin protrudes integrally to a corner of the support. By providing a coating apparatus.
이하, 첨부된 도면에 의거하여 본 발명의 실시예를 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도2는 본 발명에 따른 기판 패드의 코팅장치를 도시한 분해도이고,도3은 본 발명에 따른 기판 패드의 코팅장치를 도시한 결합상태도로서 본 발명은, 솔더용해부(100)와 솔더 안착부(200) 및 베이스(300)를 포함하는 구성으로 이루어 진다.Figure 2 is an exploded view showing the coating apparatus of the substrate pad according to the present invention, Figure 3 is a bonded state diagram showing the coating apparatus of the substrate pad according to the present invention, the present invention, the solder melting portion 100 and the solder seating portion It consists of a configuration including the 200 and the base 300.
고체상태의 솔더볼(110)을 용해토록 설치되는 솔더 용해부(100)는, 고열을 발생토록 다수의 히팅코일(120)및 열을 일방향으로 배출하는 팬(130)이 일체로 설치된다.The solder dissolving unit 100, which is installed to dissolve the solid solder ball 110, is integrally provided with a plurality of heating coils 120 and a fan 130 discharging heat in one direction to generate high heat.
상기 히팅코일(120)의 하부에 설치되는 솔더 안착부(200)는, 모터(210)의 상측에 회전판(220)이 설치되어 그 일측에 고정축(230)이 돌출되고, 상기 고정축(230)에 연결판(240)이 결합되어 솔더볼(110)이 방출되는 최소의 직영을 갖도록 다수의 안착홀(250)이 형성되는 상측이 개방되는 박스형상의 안착틀(260)에 회전가능토록 연결되며, 상기 안착틀(260)의 내측에 가이드홀(270)이 일체로 형성된다.In the solder seating portion 200 installed at the lower portion of the heating coil 120, the rotating plate 220 is installed on the upper side of the motor 210, and the fixed shaft 230 protrudes on one side thereof, and the fixed shaft 230 is fixed. Connecting plate 240 is coupled to the rotatable box-shaped seating frame 260, the upper side of which is formed a plurality of seating holes 250 are formed so that the solder ball 110 has a minimum direct release is coupled to the rotatable The guide hole 270 is integrally formed inside the seating frame 260.
상기 안착틀(260)의 저부에 설치되는 베이스(300)는, 전극패턴(310)이 상측에 일체로 형성되면서 핀고정홀(320A)이 일체로 형성되는 기판(320)이 안착토록 지지대(330)가 설치되며, 상기 지지대(330)의 모서리부에 지지판(340)이 일체로 형성되는 가이드핀(350)이 돌출 설치되는 구성으로 이루어 진다.The base 300, which is installed at the bottom of the seating frame 260, has a support 330 for mounting the substrate 320 on which the pin fixing holes 320A are integrally formed while the electrode pattern 310 is integrally formed on the upper side. ) Is installed, it is made of a configuration in which the guide pin 350, which is formed integrally with the support plate 340 is protruded to the corner portion of the support 330.
이와같은 구성으로 이루어진 본 발명의 작용을 설명하면 다음과 같다.Referring to the operation of the present invention made of such a configuration as follows.
도2 및 도3에 도시한 바와같이, 전극패턴(310)의 상측에 일정두께로 도포가능토록 그 부피를 갖는 고체상태의 솔더볼(110)이 안착틀(260)의 내측에 충진되고, 이때 상기 안착틀(260)의 내측에는 솔더볼(110)이 용이하게 배출토록 최소의 직경을 갖는 안착홀(250)에 의해 안착틀(260)의 진동시 솔더볼(110)이 안착홀(250)을 통하여 용이하게 배출토록 된다.2 and 3, the solder ball 110 of the solid state having a volume so as to be applied to a predetermined thickness on the upper side of the electrode pattern 310 is filled in the seating frame 260, wherein Inside the seating frame 260, the solder ball 110 is easy through the seating hole 250 during the vibration of the seating frame 260 by a seating hole 250 having a minimum diameter so that the solder ball 110 is easily discharged. To be discharged.
또한, 상기 안착틀(260)은, 지지대(330)에 돌출설치되는 가이드핀(350)의 상단이 삽입토록 모서리부에 가이드홀(270)이 형성되며, 상기 가이드홀(270)은, 가이드핀(350)의 직경보다 확대토록 형성되어 그 내측에서 가이드핀(350)이 모터(210)에 의한 안착틀(260)의 진동시 동시에 진동토록 된다.In addition, the seating frame 260, the guide hole 270 is formed in the corner portion so that the upper end of the guide pin 350 protrudingly installed in the support 330, the guide hole 270, the guide pin It is formed to be larger than the diameter of 350 so as to vibrate at the same time when the guide pin 350 in the vibration of the seating frame 260 by the motor 210.
이때, 상기 가이드홀(270)은, 가이드핀(350)과의 직경차에 의한 이동거리가 안착홀(250)의 직경 중심점이 전극패턴(310)의 중심점과 일치된 상태에서 전후및 좌우이동할때 전극패턴(310)의 상측면을 벗어나지 않도록 결정된다.In this case, the guide hole 270, when the movement distance due to the diameter difference with the guide pin 350 is moved back and forth and left and right in a state in which the center point of the diameter of the seating hole 250 coincides with the center point of the electrode pattern 310 It is determined not to deviate from the upper side surface of the electrode pattern 310.
또한, 상기 가이드핀(350)의 상부에는 가이드홀(270)의 직경보다 확대토록 되는 지지판(340)이 일체로 형성되어 안착틀(260)을 지지대(330)에 장착되는 기판(320)의 상측에서 일정거리 이격돤 상태에서 이동가능토록 하고, 상기 지지판(340)의 장착위치는 전극패턴(310)의 상측에 도포되는 솔더볼(110)의 도포 두께에 따라 임의로 조정하게 된다.In addition, the upper side of the substrate 320 on which the support plate 340 is integrally formed at the upper portion of the guide pin 350 so as to be larger than the diameter of the guide hole 270 to mount the seat frame 260 on the support 330. To be movable at a predetermined distance apart from the state, the mounting position of the support plate 340 is adjusted arbitrarily in accordance with the coating thickness of the solder ball 110 is applied on the upper side of the electrode pattern (310).
계속하여, 상기 안착틀(260)을 진동시키는 모터(210)는, 상측에 고정축(230)이 결합되는 회전판(220)이 설치되어 이에 연결판(240)을 통하여 연결되는 안착틀(260)을 가이드핀(350)을 중심으로 전후좌우로 진동시키게 된다.Subsequently, the motor 210 which vibrates the seating frame 260 has a rotating plate 220 to which the fixed shaft 230 is coupled to an upper side thereof, and a seating frame 260 connected to the seating plate 260 through the connecting plate 240. To vibrate back and forth and left and right around the guide pin 350.
한편, 상기 솔더볼의 도포과정은, 상기 안착틀(260)의 내측에 고체상태인 다수의 솔더볼(110)을 충진한후 히팅코일(120)과 팬(130)을 동작시켜 솔더볼(110)을 용해하면서 모터(210)의 구동에 의해 안착틀(260)을 진동시키면 안착홀(250)을 통하여 솔더볼(110)이 배출되어 안착홀(250)과 일치토록 되는 전극패턴(310)의 상측에 항상 일정형상으로 도포됨으로써 다수의 전극패턴에 한번의 동작을 통하여 일시에 플립칩을 고정하는 솔더펌프가 전극패턴에 용이하게 부착토록 하는 솔더볼의 도포가 가능토록 된다.Meanwhile, in the application process of the solder ball, the solder ball 110 is dissolved by filling the plurality of solder balls 110 in a solid state inside the seating frame 260 and operating the heating coil 120 and the fan 130. While vibrating the seating frame 260 by the driving of the motor 210, the solder ball 110 is discharged through the seating hole 250, and is always constant on the upper side of the electrode pattern 310 to coincide with the seating hole 250. By applying the shape, the solder pump for fixing the flip chip at a time through a single operation on the plurality of electrode patterns can be applied to the solder ball to easily adhere to the electrode pattern.
이때 상기 기판(340)은, 베이스(330)의 상측에 모서리부에 형성되는 핀고정홀(320A)을 통하여 고정되는 것이다.In this case, the substrate 340 is fixed through a pin fixing hole 320A formed at an edge portion of the base 330.
이상과 같이 본 발명에 따른 기판 패드의 코팅장치에 의하면, 전극패턴의 상측에 솔더를 균일하게 도포하여 플립칩의 실장시 신뢰성을 제공하며, 정확하게 전극패턴의 상측에 코팅이 이루어져 숙련도와 상관없이 정확한 작업이 가능하여 작업성이 향상되고, 솔더펌프의 크기에 상관없이 결합이 가능하며, 기판의 상측에 플립칩의 장착시간을 최소화 할수 있도록 하는 등의 우수한 효과가 있는 것이다.According to the coating apparatus of the substrate pad according to the present invention as described above, the solder is uniformly applied on the upper side of the electrode pattern to provide reliability when mounting the flip chip, the coating is formed on the upper side of the electrode pattern accurately, regardless of skill It is possible to work and improve the workability, it is possible to combine regardless of the size of the solder pump, it has an excellent effect such as to minimize the mounting time of the flip chip on the upper side of the substrate.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990059984A KR100311828B1 (en) | 1999-12-21 | 1999-12-21 | Pre-coating apparatus of pcb pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990059984A KR100311828B1 (en) | 1999-12-21 | 1999-12-21 | Pre-coating apparatus of pcb pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20010063108A KR20010063108A (en) | 2001-07-09 |
| KR100311828B1 true KR100311828B1 (en) | 2001-10-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019990059984A KR100311828B1 (en) | 1999-12-21 | 1999-12-21 | Pre-coating apparatus of pcb pad |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06268086A (en) * | 1993-03-17 | 1994-09-22 | Hitachi Ltd | Semiconductor integrated circuit device and printed board mounted with same |
| JPH10223798A (en) * | 1997-02-12 | 1998-08-21 | Oki Electric Ind Co Ltd | Ball grid array package structure and method of mounting it on printed circuit board |
| JPH11111886A (en) * | 1997-10-07 | 1999-04-23 | Sony Corp | Mounted substrate and its manufacture |
| JPH11274203A (en) * | 1998-03-25 | 1999-10-08 | Sumitomo Metal Electronics Devices Inc | Forming method of solder bumps in batch |
-
1999
- 1999-12-21 KR KR1019990059984A patent/KR100311828B1/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06268086A (en) * | 1993-03-17 | 1994-09-22 | Hitachi Ltd | Semiconductor integrated circuit device and printed board mounted with same |
| JPH10223798A (en) * | 1997-02-12 | 1998-08-21 | Oki Electric Ind Co Ltd | Ball grid array package structure and method of mounting it on printed circuit board |
| JPH11111886A (en) * | 1997-10-07 | 1999-04-23 | Sony Corp | Mounted substrate and its manufacture |
| JPH11274203A (en) * | 1998-03-25 | 1999-10-08 | Sumitomo Metal Electronics Devices Inc | Forming method of solder bumps in batch |
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| Publication number | Publication date |
|---|---|
| KR20010063108A (en) | 2001-07-09 |
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