KR100307736B1 - Ground device for electronic equipment - Google Patents
Ground device for electronic equipment Download PDFInfo
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- KR100307736B1 KR100307736B1 KR1019990027070A KR19990027070A KR100307736B1 KR 100307736 B1 KR100307736 B1 KR 100307736B1 KR 1019990027070 A KR1019990027070 A KR 1019990027070A KR 19990027070 A KR19990027070 A KR 19990027070A KR 100307736 B1 KR100307736 B1 KR 100307736B1
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- South Korea
- Prior art keywords
- circuit board
- ground
- case
- auxiliary case
- ground pattern
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- 230000008878 coupling Effects 0.000 claims abstract description 16
- 238000010168 coupling process Methods 0.000 claims abstract description 16
- 238000005859 coupling reaction Methods 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 abstract description 8
- 230000001070 adhesive effect Effects 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 7
- 230000005611 electricity Effects 0.000 description 7
- 230000003068 static effect Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/15—Devices for taking samples of blood
- A61B5/150007—Details
- A61B5/150374—Details of piercing elements or protective means for preventing accidental injuries by such piercing elements
- A61B5/150381—Design of piercing elements
- A61B5/150412—Pointed piercing elements, e.g. needles, lancets for piercing the skin
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/15—Devices for taking samples of blood
- A61B5/151—Devices specially adapted for taking samples of capillary blood, e.g. by lancets, needles or blades
- A61B5/15101—Details
- A61B5/15103—Piercing procedure
- A61B5/15107—Piercing being assisted by a triggering mechanism
- A61B5/15113—Manually triggered, i.e. the triggering requires a deliberate action by the user such as pressing a drive button
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/15—Devices for taking samples of blood
- A61B5/151—Devices specially adapted for taking samples of capillary blood, e.g. by lancets, needles or blades
- A61B5/15101—Details
- A61B5/15115—Driving means for propelling the piercing element to pierce the skin, e.g. comprising mechanisms based on shape memory alloys, magnetism, solenoids, piezoelectric effect, biased elements, resilient elements, vacuum or compressed fluids
- A61B5/15117—Driving means for propelling the piercing element to pierce the skin, e.g. comprising mechanisms based on shape memory alloys, magnetism, solenoids, piezoelectric effect, biased elements, resilient elements, vacuum or compressed fluids comprising biased elements, resilient elements or a spring, e.g. a helical spring, leaf spring, or elastic strap
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2560/00—Constructional details of operational features of apparatus; Accessories for medical measuring apparatus
- A61B2560/04—Constructional details of apparatus
- A61B2560/0406—Constructional details of apparatus specially shaped apparatus housings
- A61B2560/0418—Pen-shaped housings
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2560/00—Constructional details of operational features of apparatus; Accessories for medical measuring apparatus
- A61B2560/04—Constructional details of apparatus
- A61B2560/0431—Portable apparatus, e.g. comprising a handle or case
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Heart & Thoracic Surgery (AREA)
- Surgery (AREA)
- Biophysics (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Hematology (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Physics & Mathematics (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Dermatology (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
본 발명은 전자제품의 접지장치를 개시한다.The present invention discloses a grounding device for an electronic product.
본 발명은, 결합 패널과; 결합 패널의 상면에 위치되며 양측면에 복수의 그라운드용 패드가 마련되고, 상면에는 소정의 그라운드 패턴이 형성된 회로기판과; 회로기판상에 설치되며, 하면에는 회로기판의 그라운드 패턴과 연결되는 그라운드용 패드가 마련되고, 내측면에는 그라운드용 패드와 접속되는 그라운드 패턴이 형성된 보조 케이스와; 회로기판의 상면으로부터 이를 감싸는 형태로 설치되어 내부에 소정의 공간부를 형성하며, 보조 케이스와 고정되는 메인 케이스와; 회로기판의 그라운드용 패드를 외부로 접지시키도록 결합패널상에 마련되는 접촉봉;을 포함하여 된 것으로서, 메인 케이스와 보조 케이스가 스폿 용접을 통해 직접 고정되는 것이어서, 균일한 강도를 유지할 수 있는 이점이 있으며, 별도로 접착제의 도포나 납땜등이 불필요하여 전체 높이가 커지는 것을 방지할 수 있다. 따라서 제품의 콤팩트화를 도모한 이점이 있다.The present invention, the bonding panel; A circuit board positioned on an upper surface of the coupling panel and provided with a plurality of ground pads on both sides thereof, and having a predetermined ground pattern formed on the upper surface thereof; An auxiliary case provided on a circuit board, the lower surface of which has a ground pad connected to a ground pattern of the circuit board, and an inner surface of which has a ground pattern connected to the ground pad; A main case installed in a form surrounding the upper surface of the circuit board to form a predetermined space therein, and fixed to the auxiliary case; A contact rod provided on the coupling panel to ground the ground pad of the circuit board to the outside; the main case and the auxiliary case are directly fixed by spot welding, thereby maintaining a uniform strength. In addition, it is possible to prevent the application of adhesives, soldering, or the like, to increase the overall height. Therefore, there is an advantage that the product is compact.
Description
본 발명은 전자제품에 관한 것으로서, 특히 전자제품의 동작과정에서 발생되는 전자파 또는 정전기를 외부로 어스(earth)시키기 위한 접지장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic products, and more particularly, to a grounding device for earthing electromagnetic waves or static electricity generated during the operation of electronic products.
일반적으로 전자제품의 작동과정에서는 각 부품마다 어느정도의 차이는 있지만, 미세하나마 전자파의 형성과 정전기가 발생되게 되며, 이러한 전자파나 정전기는 부품의 수명저하와 인접된 다른 부품등의 성능을 떨어뜨리는 것이기 때문에 이를 외부로 어스시켜야 한다.In general, there are some differences in each part of the operation of electronic products, but the formation of electromagnetic waves and static electricity are generated, but such electromagnetic waves or static electricity reduce the life of parts and the performance of other adjacent parts. So you have to earth it out.
도 1에는 일반적인 전자제품의 접지장치를 나타내 보였다.1 shows a grounding apparatus of a general electronic product.
이는 크게 결합 패널(panel;1)과 회로기판(2) 및 보조 케이스(sub case;3)와 메인 케이스(main case;4)로 대별된다.This is roughly divided into a coupling panel 1, a circuit board 2, a sub case 3, and a main case 4.
결합패널(1)은 회로기판(2)이 안착되는 것으로서, 편평한 판상의 형태를 갖는다.The coupling panel 1 is to which the circuit board 2 is seated, and has a flat plate shape.
회로기판(2)은 각종 회로부품이 설치되는 것으로서, 상면에는 소정의 그라운드 패턴(2a)이 형성되어 있어 각 회로부품상에 발생되는 전자파 또는 정전기를 흡수하도록 되어 있으며, 양측면에는 결합패널(1)상에 안착될 때 외부로 접촉봉(5)을 통해 외부로 어스될 수 있도록 그라운드용 패드(pad;2b)가 마련된다.The circuit board 2 is provided with various circuit components. A predetermined ground pattern 2a is formed on the upper surface to absorb electromagnetic waves or static electricity generated on each circuit component, and the coupling panel 1 is provided on both sides. A ground pad 2b is provided so that when it is seated on the ground, it can be earthed outwardly through the contact rod 5.
보조 케이스(3)는 부품을 외부의 충격등으로부터 보호하거나 또는 전자파의 차폐를 도모하기 위하여 마련되는 것으로서, 하면에는 회로기판(2)상의 그라운드 패턴(2a)가 연결되는 그라운드용 패드(3a)가 형성된다.The auxiliary case 3 is provided to protect the component from external impact or the like, and to shield the electromagnetic wave. The ground pad 3a to which the ground pattern 2a on the circuit board 2 is connected is provided on the lower surface of the auxiliary case 3. Is formed.
메인 케이스(4)는 회로기판(2)의 상면에 이를 감싸는 형태로 결합되는 것으로서, 회로기판(2)과의 결합에 의해 형성되는 공간부상에 보조 케이스(3)를 내장하게 되며, 특히 보조 케이스(3)와 고정된다.The main case 4 is coupled to the upper surface of the circuit board 2 so as to surround it, and the auxiliary case 3 is embedded in the space formed by the coupling with the circuit board 2, in particular, the auxiliary case. It is fixed with (3).
메인 케이스(4)와 보조 케이스(3)의 고정은 주로 접착제나 납땜등을 통해 이루어진다.The main case 4 and the auxiliary case 3 are fixed by adhesive or soldering.
이와같은 구성을 갖는 전자제품의 접지장치는, 회로기판(2) 및 보조 케이스(3)등에 마련된 그라운드용 패드(2b,3a) 및 그라운드 패턴(2a)등을 통해 회로부품으로부터 발생된 전자파 또는 정전기를 접촉봉(5)을 통해 외부로 즉, 결합 패널(1)상으로 용이하게 어스시킬 수 있게된다.The grounding device for an electronic product having such a configuration includes electromagnetic waves or static electricity generated from circuit components through the ground pads 2b and 3a and the ground pattern 2a provided on the circuit board 2, the auxiliary case 3, and the like. It is possible to easily earth out through the contact rods 5, ie onto the coupling panel (1).
그러나 이러한 전자제품의 접지장치에 있어서는, 메인 케이스(4)와 보조 케이스(3)의 고정이 접착제 또는 납땜을 통해 이루어지는 것이기 때문에 작업이 매우 번거롭고 또한 균일한 접착 또는 납땜이 어려워 전체적으로 균일한 강도를 유지할 수 없는 문제점이 내재되어 있다.However, in the grounding device of such an electronic product, since the fixing of the main case 4 and the auxiliary case 3 is performed by adhesive or soldering, the work is very cumbersome and the uniform bonding or soldering is difficult, thus maintaining the overall uniform strength. There are inherent problems.
이러한 문제점외에도 접착제의 개재 및 납땜시에는 소정의 접착제 및 납이 소정의 두께를 갖고 있는 것이기 때문에 제품의 높이가 상대적으로 높아야 하는 문제점이 발생된다.In addition to these problems, when the adhesive is interposed and soldered, since the predetermined adhesive and lead have a predetermined thickness, a problem arises in that the height of the product should be relatively high.
본 발명은 이와같은 종래의 문제점을 해결하기 위하여 창출된 것으로서, 전체적으로 균일한 강도를 유지할 수 있으며, 케이스간의 조립이 매우 용이하고 특히 제품의 높이가 높아지는 것을 미연에 방지할 수 있는 전자제품의 접지장치를 제공함에 그 목적이 있다.The present invention was created in order to solve such a conventional problem, it is possible to maintain a uniform strength as a whole, the grounding device of an electronic product that can easily prevent the assembly between the cases, and in particular to increase the height of the product in advance. The purpose is to provide.
도 1은 종래 전자제품의 접지장치를 나타낸 단면도,1 is a cross-sectional view showing a grounding device of a conventional electronic product,
도 2는 본 발명에 따른 전자제품의 접지장치를 나타낸 단면도.2 is a cross-sectional view showing a grounding device for an electronic product according to the present invention.
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
10 : 결합 패널 20 : 회로기판10: bonding panel 20: circuit board
21 : 그라운드 패턴 22 : 그라운드용 패드21: ground pattern 22: ground pad
30 : 보조 케이스 31 : 그라운드용 패드30: auxiliary case 31: ground pad
32 : 그라운드 패턴 40 : 메인 케이스32: ground pattern 40: main case
50 : 접촉봉 60 : 용접공구50: contact rod 60: welding tool
이와같은 목적을 달성하기 위하여 본 발명에 따른 전자제품의 접지장치는, 결합 패널과; 상기 결합 패널의 상면에 위치되며 양측면에 복수의 그라운드용 패드가 마련되고, 상면에는 소정의 그라운드 패턴이 형성된 회로기판과; 상기 회로기판상에 설치되며, 하면에는 회로기판의 그라운드 패턴과 연결되는 그라운드용 패드가 마련되고, 상부 내측면에는 그라운드용 패드와 접속되는 그라운드 패턴이 형성된보조 케이스와; 상기 회로기판의 상면으로부터 이를 감싸는 형태로 설치되어 내부에 소정의 공간부를 형성하며, 상기 보조 케이스와 고정되는 메인 케이스와; 상기 회로기판의 그라운드용 패드를 외부로 접지시키도록 결합패널상에 마련되는 접촉봉;을 포함하여 된 것을 그 특징으로 한다.In order to achieve the above object, a grounding apparatus for an electronic product according to the present invention includes: a coupling panel; A circuit board positioned on an upper surface of the coupling panel and provided with a plurality of ground pads on both sides thereof, and having a predetermined ground pattern formed on an upper surface thereof; An auxiliary case provided on the circuit board, and having a ground pad connected to a ground pattern of a circuit board at a lower surface thereof, and a ground pattern connected to a ground pad at an upper inner surface thereof; A main case installed in a form surrounding the upper surface of the circuit board to form a predetermined space therein, and fixed to the auxiliary case; And a contact rod provided on the coupling panel to ground the pad for ground of the circuit board to the outside.
본 발명의 바람직한 한 특징은, 상기 보조 케이스와 메인 케이스는 상호 스폿 용접 고정되는 것에 있다.One preferred feature of the present invention is that the auxiliary case and the main case are spot welded to each other.
이하 본 발명에 따른 전자제품의 접지장치의 바람직한 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, a preferred embodiment of a grounding device for an electronic product according to the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명에 따른 전자제품의 접지장치를 나타낸 단면도이다.2 is a cross-sectional view showing a grounding device for an electronic product according to the present invention.
이에 나타내 보인 바와 같이 본 발명에 따른 전자제품의 접지장치는, 이는 크게 결합 패널(panel;10)과 회로기판(20) 및 보조 케이스(sub case;30)와 메인 케이스(main case;40)로 대별된다.As shown therein, the grounding device for an electronic product according to the present invention is largely divided into a coupling panel 10, a circuit board 20, a sub case 30, and a main case 40. It is rough.
결합패널(10)은 회로기판(20)이 안착되는 것으로서, 편평한 판상의 형태를 갖는다.The coupling panel 10 is a circuit board 20 is seated, it has a flat plate shape.
회로기판(20)은 각종 회로부품이 설치되는 것으로서, 상면에는 소정의 그라운드 패턴(21)이 형성되어 있어 각 회로부품상에 발생되는 전자파 또는 정전기를 흡수하도록 되어 있으며, 양측면에는 결합패널(10)상에 안착될 때 외부로 접촉봉(50)을 통해 외부로 어스될 수 있도록 그라운드용 패드(pad;22)가 마련된다.The circuit board 20 is provided with various circuit components, and a predetermined ground pattern 21 is formed on the upper surface to absorb electromagnetic waves or static electricity generated on each circuit component, and the coupling panel 10 on both sides thereof. Ground pads (22) are provided so that they can be earthed outwardly through contact rods (50) when they are seated on them.
보조 케이스(30)는 부품을 외부의 충격등으로부터 보호하거나 또는 전자파의 차폐를 도모하기 위하여 마련되는 것으로서, 하면에는 회로기판(20)상의 그라운드패턴(21)과 연결되는 그라운드용 패드(31)가 형성된다.The auxiliary case 30 is provided to protect the component from an external shock or the like, and to shield the electromagnetic waves. The auxiliary case 30 has a ground pad 31 connected to the ground pattern 21 on the circuit board 20. Is formed.
보조 케이스(30)의 상부 내측면에는 그라운드용 패드(31)로 부터는 연장되는 소정의 그라운드 패턴(32)이 형성된다.A predetermined ground pattern 32 extending from the ground pad 31 is formed on the upper inner surface of the auxiliary case 30.
메인 케이스(40)는 회로기판(20)의 상부에서 이를 감싸는 형태로 결합되며, 특히 보조 케이스(30)를 내장하는 형태로 이에 고정 설치된다.The main case 40 is coupled in a form surrounding the circuit board 20 at the top thereof, and in particular, the main case 40 is fixedly installed in the form of embedding the auxiliary case 30.
메인 케이스(40)와 보조 케이스(30)간의 고정은 접착제나 납땜의 형태로 이루어지지 않고 도 2에 나타내 보인 바와 같이 용접공구(60)를 통해 스폿 용접함으로써 직접 고정된다.The fixing between the main case 40 and the auxiliary case 30 is not made in the form of adhesive or soldering but is directly fixed by spot welding through the welding tool 60 as shown in FIG. 2.
이와같이 메인 케이스(40)와 보조 케이스(30) 상호간의 스폿 용접 가능한 것은, 보조 케이스(30)의 상부 내측면이 금속성분을 갖고 있는 그라운드 패턴(32)이 형성되어 있기 때문에 가능하다.Thus, spot welding between the main case 40 and the auxiliary case 30 can be performed because the ground pattern 32 in which the upper inner surface of the auxiliary case 30 has a metal component is formed.
이러한 구성을 갖는 본 발명은, 회로기판(20) 및 보조 케이스(30)등에 마련된 그라운드용 패드(22,31) 및 그라운드 패턴(21,32)등을 통해 회로부품으로부터 발생된 전자파 또는 정전기를 접촉봉(50)을 통해 외부로 즉, 결합 패널(10)상으로 용이하게 어스시킬 수 있게된다.The present invention having such a configuration contacts electromagnetic waves or static electricity generated from circuit components through ground pads 22 and 31 and ground patterns 21 and 32 provided on the circuit board 20 and the auxiliary case 30. It is possible to easily earth out through the rod 50, ie onto the coupling panel 10.
또한 메인 케이스(40)와 보조 케이스(30)가 스폿 용접을 통해 직접 고정되는 것이기 때문에 별도의 접착제 도포나 납땜이 불필요하여 전체 높이의 상승이 방지되며, 균일한 강도를 유지할 수 있게된다.In addition, since the main case 40 and the auxiliary case 30 are directly fixed through spot welding, a separate adhesive application or soldering is unnecessary, and thus an increase in the overall height is prevented and uniform strength can be maintained.
상술한 바와 같이 본 발명에 따른 전자제품의 접지장치에 의하면, 메인 케이스와 보조 케이스가 스폿 용접을 통해 직접 고정되는 것이어서, 균일한 강도를 유지할 수 있는 이점이 있으며, 별도로 접착제의 도포나 납땜등이 불필요하여 전체 높이가 커지는 것을 방지할 수 있다. 따라서 제품의 콤팩트화를 도모한 이점이 있다.As described above, according to the grounding apparatus of the electronic product according to the present invention, the main case and the auxiliary case are directly fixed by spot welding, and thus, there is an advantage of maintaining uniform strength, and application of an adhesive or soldering It is unnecessary, and it can prevent that an overall height becomes large. Therefore, there is an advantage that the product is compact.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990027070A KR100307736B1 (en) | 1999-07-06 | 1999-07-06 | Ground device for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990027070A KR100307736B1 (en) | 1999-07-06 | 1999-07-06 | Ground device for electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20010008964A KR20010008964A (en) | 2001-02-05 |
| KR100307736B1 true KR100307736B1 (en) | 2001-11-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019990027070A KR100307736B1 (en) | 1999-07-06 | 1999-07-06 | Ground device for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100307736B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100577429B1 (en) * | 2004-09-03 | 2006-05-08 | 삼성전자주식회사 | Display apparatus |
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1999
- 1999-07-06 KR KR1019990027070A patent/KR100307736B1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR20010008964A (en) | 2001-02-05 |
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