KR100288524B1 - 도전성 실리콘 고무 조성물 - Google Patents
도전성 실리콘 고무 조성물 Download PDFInfo
- Publication number
- KR100288524B1 KR100288524B1 KR1019940007582A KR19940007582A KR100288524B1 KR 100288524 B1 KR100288524 B1 KR 100288524B1 KR 1019940007582 A KR1019940007582 A KR 1019940007582A KR 19940007582 A KR19940007582 A KR 19940007582A KR 100288524 B1 KR100288524 B1 KR 100288524B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- silicone rubber
- conductive silicone
- conductive
- rubber composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP93-109864 | 1993-04-13 | ||
| JP5109864A JP2713093B2 (ja) | 1993-04-13 | 1993-04-13 | 導電性シリコーンゴム組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR100288524B1 true KR100288524B1 (ko) | 2001-05-02 |
Family
ID=14521138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940007582A Expired - Fee Related KR100288524B1 (ko) | 1993-04-13 | 1994-04-12 | 도전성 실리콘 고무 조성물 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5447661A (enExample) |
| EP (1) | EP0620248B1 (enExample) |
| JP (1) | JP2713093B2 (enExample) |
| KR (1) | KR100288524B1 (enExample) |
| DE (1) | DE69413588T2 (enExample) |
| TW (1) | TW287189B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2129073C (en) * | 1993-09-10 | 2007-06-05 | John P. Kalinoski | Form-in-place emi gaskets |
| DE59505670D1 (de) * | 1994-10-19 | 1999-05-20 | Bosch Gmbh Robert | Keramischer elektrischer widerstand und dessen verwendung |
| DE19631120A1 (de) * | 1996-08-01 | 1998-02-05 | Wacker Chemie Gmbh | Additionsvernetzte Siliconelastomere mit verringertem Druckverformungsrest |
| JP3436464B2 (ja) * | 1996-10-31 | 2003-08-11 | 東レ・ダウコーニング・シリコーン株式会社 | 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法 |
| JP4568472B2 (ja) * | 2002-11-29 | 2010-10-27 | 東レ・ダウコーニング株式会社 | 銀粉末の製造方法および硬化性シリコーン組成物 |
| US8191433B2 (en) * | 2008-05-19 | 2012-06-05 | The Hong Kong Polytechnic University | Method for manufacturing fabric strain sensors |
| EP3533839B1 (en) * | 2016-10-26 | 2021-07-21 | Shin-Etsu Chemical Co., Ltd. | Thermally-conductive silicone composition |
| US20230090821A1 (en) * | 2020-02-25 | 2023-03-23 | Cabot Corporation | Silicone-based compositions containing carbon nanostructures for conductive and emi shielding applications |
| CN116802226A (zh) * | 2020-12-30 | 2023-09-22 | 埃肯有机硅(上海)有限公司 | 可固化导电有机聚硅氧烷组合物及其制备方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1270942A (en) * | 1968-06-28 | 1972-04-19 | Midland Silicones Ltd | Organopolysiloxane elastomers |
| US3714204A (en) * | 1970-05-22 | 1973-01-30 | Dow Corning | Pelletized silicone rubber |
| US3776885A (en) * | 1971-10-28 | 1973-12-04 | Pennwalt Corp | Method of curing polymers with azo compounds |
| JPS5124302B2 (enExample) * | 1972-10-26 | 1976-07-23 | ||
| JPS55120656A (en) * | 1979-03-09 | 1980-09-17 | Toray Silicone Co Ltd | Curable liquid organopolysiloxane composition |
| JPS6198763A (ja) * | 1984-10-22 | 1986-05-17 | Toshiba Silicone Co Ltd | シリコ−ンゴム組成物 |
| US5073583A (en) * | 1988-06-06 | 1991-12-17 | Dow Corning Corporation | Organosiloxane elastomers exhibiting improved physical properties |
| GB2222171B (en) * | 1988-06-17 | 1992-01-29 | Shinetsu Polymer Co | Method for the preparation of an integral rubber article having electrically insulating and conductive parts |
| DE3825676A1 (de) * | 1988-07-28 | 1990-02-15 | Wacker Chemie Gmbh | Verwendung von zu elastomeren haertbaren organopolysiloxanmassen als klebstoffe |
| US4980384A (en) * | 1988-09-05 | 1990-12-25 | Shin-Etsu Chemical Co., Ltd. | Foamable silicone rubber composition and method for curing the same |
| JPH02102263A (ja) * | 1988-10-11 | 1990-04-13 | Shin Etsu Chem Co Ltd | 導電性シリコーンゴム組成物 |
| TW221837B (enExample) * | 1990-12-28 | 1994-03-21 | Shinetsu Chem Ind Co | |
| US5214074A (en) * | 1991-01-29 | 1993-05-25 | Shin-Etsu Chemical Co., Ltd. | Foamable silicone rubber composition and silicone rubber sponge |
| JP2570526B2 (ja) * | 1991-09-04 | 1997-01-08 | 信越化学工業株式会社 | シリコーンゴム組成物及び低硬度シリコーンゴム |
| JP2699787B2 (ja) * | 1992-11-24 | 1998-01-19 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物及び導電性シリコーンゴム |
-
1993
- 1993-04-13 JP JP5109864A patent/JP2713093B2/ja not_active Expired - Fee Related
- 1993-10-07 TW TW082108312A patent/TW287189B/zh active
-
1994
- 1994-04-12 KR KR1019940007582A patent/KR100288524B1/ko not_active Expired - Fee Related
- 1994-04-12 US US08/229,506 patent/US5447661A/en not_active Expired - Fee Related
- 1994-04-13 DE DE69413588T patent/DE69413588T2/de not_active Expired - Fee Related
- 1994-04-13 EP EP94302613A patent/EP0620248B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69413588T2 (de) | 1999-04-08 |
| DE69413588D1 (de) | 1998-11-05 |
| JP2713093B2 (ja) | 1998-02-16 |
| JPH06299074A (ja) | 1994-10-25 |
| EP0620248B1 (en) | 1998-09-30 |
| TW287189B (enExample) | 1996-10-01 |
| US5447661A (en) | 1995-09-05 |
| EP0620248A1 (en) | 1994-10-19 |
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| Publication | Publication Date | Title |
|---|---|---|
| US4273697A (en) | Electrically conductive curable liquid organopolysiloxane compositions | |
| EP0435554B1 (en) | Rubber compositions and preparation thereof | |
| JPH02102263A (ja) | 導電性シリコーンゴム組成物 | |
| JP2725507B2 (ja) | 常圧熱気加硫用導電性シリコーンゴム組成物及び導電性シリコーンゴムの製造方法 | |
| KR100288524B1 (ko) | 도전성 실리콘 고무 조성물 | |
| JP2907000B2 (ja) | 導電性シリコーンゴム発泡組成物及び導電性スポンジロール | |
| EP0434396B1 (en) | Rubber compositions, cured rubbers, and preparation thereof | |
| KR100197043B1 (ko) | 도전성 실리콘 고무 조성물 및 도전성 실리콘 고무 | |
| JP2643747B2 (ja) | 導電性シリコーンゴム組成物の製造方法 | |
| JPH08120176A (ja) | 半導電性シリコーンゴム組成物 | |
| JPH0693186A (ja) | オイルブリード性シリコーンゴム組成物及びその硬化物 | |
| JP3112627B2 (ja) | 導電性シリコーンゴム組成物 | |
| JP3384861B2 (ja) | 導電性シリコーンゴム組成物およびその製造方法 | |
| JP2699787B2 (ja) | 導電性シリコーンゴム組成物及び導電性シリコーンゴム | |
| JPS63260954A (ja) | 導電性シリコ−ンゴム組成物 | |
| JPH0553185B2 (enExample) | ||
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| JPH0688028A (ja) | 導電性シリコーンゴム組成物及びその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
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| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
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| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
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| FPAY | Annual fee payment |
Payment date: 20040120 Year of fee payment: 4 |
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| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
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| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20050208 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
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| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20050208 |
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| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |