KR100280840B1 - Dispensing Head Unit for Semiconductor Packaging - Google Patents

Abstract

Disclosed are a dispensing head unit for semiconductor packaging that is improved to shorten the dispensing process time and improve the quality of a semiconductor chip. The unit includes a plurality of resin reservoirs 161 and 162 in which resin is stored, and a plurality of dispenser heads 171 and 172 which are movable together with each resin reservoir and which resin supplied from each resin reservoir is applied onto the lead frame. ). The unit includes a plurality of reservoirs and a plurality of dispensing heads to supply epoxy resins of different physical properties, so that a resin having excellent bonding strength is applied to the edge of the chip and a chemically stable resin can be applied to the center of the chip. It is advantageous to improve product quality. In addition, by discharging the same resin into each of the reservoirs so that a plurality of heads can be simultaneously processed, the dispensing process can be shortened.

Description

Dispensing Head Unit for Semiconductor Packaging

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dispensing head unit for semiconductor packaging that supplies an epoxy resin after an IC chip is mounted on a pad of a lead frame, and particularly employs a plurality of heads to selectively supply two or more kinds of epoxy resins. A semiconductor packaging dispensing head unit.

In general, the lead frame 10 includes a pad 1 on which the IC chip 5 is mounted and an inner lead 2 connected to the IC chip 5 as shown in FIGS. 1 and 2; inner lead) and outer lead (3; outer lead) connected to the outer terminal.

In the semiconductor chip assembly using the lead frame 10, a molding process of molding the resin body 4 to maintain the distance between the leads 2 and to prevent deformation of the leads 2 during the post-treatment process, and the lead frame ( A die bonding step for mounting the IC chip 5 on the pad 1 of the pad 10, a wire bonding step for electrically connecting the IC chip 5 and the inner lead 2, and the resin body 4 Dispensing process to protect the circuit elements such as IC chip 5 by filling thermoplastic epoxy resin 7 on top and IC chip 5 and inner lead 2 through dispenser head 8 Assembled via

In the dispensing process, on the other hand, an epoxy resin applied on the IC chip 5 and the inner lead 2 and an epoxy resin applied on the resin body 4 corresponding to the chip edge have different physical properties. Inclusion is preferred. For example, the resin applied to the upper portion of the resin body 4 requires a resin of a material that is excellent in bonding, and the resin applied to the IC chip 5 and the upper part of the inner lead 2 is chemically stable for stabilization of chip driving. Resin is required.

By the way, by employing only one type of resin in a conventional dispenser, at least two or more dispensing heads are required to dispense with different resins.

As a result, the productivity is lowered, which is disadvantageous in narrowing the work space and reducing the cost by employing a plurality of dispensers.

The present invention has been made to solve the above problems, and an object thereof is to provide a dispensing head unit for semiconductor packaging that can supply different resins as one dispenser.

1 is a plan view showing a conventional lead frame,

2 is a cross-sectional view of a lead frame in which an IC chip is mounted;

3 is a perspective view showing a dispensing apparatus employing the head unit of the present invention;

4 is a schematic front view of FIG. 3;

5 is a schematic plan view showing an X-Y robot mechanism employed in the present apparatus;

6 is a perspective view of the head unit of the present invention;

7 is a schematic side cross-sectional view of FIG. 6;

8 is a schematic plan view of FIG. 6;

9 is a schematic diagram showing a head unit;

10 is a schematic front view showing a dispensing apparatus;

11 is a schematic side view showing a dispensing apparatus;

12 is an enlarged view illustrating main parts of FIG. 11.

* Explanation of symbols for main parts of the drawings

10 ... Lead frame 110 ... Fixed block

120 ... main unit 131 ... X-axis screw

132 ... Y-axis screws 141 ... 1st slider

142.2nd slider 150 ... head unit

161,162 ... Resin reservoir 171,172 ... Dispensing head

171a, 172a ... needle 180 ... inclined block

The present invention to achieve the above object in the semiconductor packaging dispensing head unit for supplying resin to the lead frame mounted IC chip,

A plurality of resin storage passages through which resin is stored;

And a plurality of dispensing heads which are movable together with the respective resin reservoirs and apply the resin supplied from each resin reservoir onto the lead frame.

An inclined block is formed between the outlet side of each of the resin reservoirs and the dispensing head in an inclined shape, and has an inclined passage through which resin is supplied.

In addition, each of the dispensing head is a motor for generating power, a screw rod that rotates a predetermined step by the drive of the motor to move a predetermined amount of the resin supplied to the resin reservoir, and the resin moved in accordance with the rotation of the screw rod is discharged Needles are provided.

At this time, the amount of resin to be discharged may be adjusted by arbitrarily adjusting the rotation speed of the motor for rotating the screw rod.

According to the above feature of the present invention, the dispensing head unit of the present invention includes a plurality of resin reservoirs and a plurality of dispensing heads for storing different resins, thereby greatly shortening the dispensing process of applying resin on the lead frame.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 and 2 of the present invention, the dispensing head unit includes a die bonding step of mounting the IC chip 5 on the pad 1 of the lead frame 10, the IC chip 5 and the inner lead. After the wire bonding step of electrically connecting (2) is carried out, it is employed in a dispensing step of applying a resin so as to protect the IC chip 5 and the inner lead 2.

Dispensing apparatus employing such a dispensing head unit of the present invention, as shown in Figures 3 to 5, 11 and 12, the guide means for transporting the lead frame and the fixing block 110 for fixing the lead frame at a predetermined position Main frame 120 is provided; A sub mount 130 provided above the main mount 120; An X-axis screw 131 which is installed in the sub mount 130 in parallel with the conveying direction of the lead frame and is driven to rotate; A first slider 141 moved along the X-axis screw 31; A fixed block 141a fixed to the first slider 141; A Y-axis screw 132 installed on the fixed block 141a in a direction perpendicular to the X-axis screw 131 and driven to rotate; A second slider 142 moved along the Y-axis screw 132; It is provided with a head unit 150 installed so as to be elevated relative to the second slider 142 to apply the epoxy resin on the lead frame.

6 to 9, the head unit 150 can be elevated together with a plurality of resin reservoirs 161 and 162 and resin reservoirs 161 and 162 for storing resin, and each resin reservoir. And a plurality of dispensing heads 171 and 172 for applying the resin supplied from the (161) and the 162 on the lead frame.

And, as shown in Figure 7, the inlet side of each of the resin reservoir (161, 162) and each of the dispensing heads (171, 172) inclined to form an inclined passage 181 is supplied with resin The inclined block 180 is provided.

The dispensing heads 171 and 172 each have needles 171a and 172a through which resins supplied from the resin reservoirs 161 and 162 are discharged, and screw rods rotatably driven to discharge resins by a predetermined amount. 172b and the motors 171c and 172c which rotate-drive a screw rod.

At this time, the amount of resin discharged may be adjusted by arbitrarily adjusting the rotation speed of the motors 171c and 172c. To this end, the magnitude of the voltage applied to the motors 171c and 172c may be adjusted to a desired rotation speed through a program.

6 to 8, a screw shaft 193 is provided on a drive pulley 191 connected and driven by the drive motor 190 and the belt 192, and a slider (1) is provided on the screw shaft 193. 194 is provided to be movable up and down, and the head unit 150 is raised and lowered as the slider 194 is raised and lowered.

As illustrated in FIG. 10, the guide means includes a pair of ropes 201 in which a lead frame supplied from a loader (not shown) is seated and is driven by a motor pulley 200. The fixing block 110 is provided with a gripping plate (not shown) for fixing the lead frame seated on the rope 2-1 and a heater body (not shown) for preventing hardening of the applied resin.

As described above, the driving and dispensing method of the dispensing apparatus employing the dispensing head unit of the present invention is as follows.

First, the resin reservoirs 161 and 162 are filled with epoxy resins having different physical properties.

The lead frame on which the IC chip or the like is mounted is seated on the rope 201 that is wound and driven to move to the fixed block 110 and stopped. Subsequently, the head unit 150 is moved in the X-Y axis direction according to a predetermined program to apply resin onto the lead frame.

At this time, the dispensing head 171 first applies a kind of epoxy resin along the edge of the lead frame. Subsequently, another type of epoxy resin is applied to the inside of the resin to which the other dispensing heads 172 have already been applied.

Here, since the resin reservoirs 161 and 162 are supplied to the needles 171a and 172a along the inclined passage 181, the supply of the resin is smooth.

While the resin is applied as described above, the heater body of the fixed block 110 is heated to prevent curing of the resin.

In the above, each of the resin reservoirs 161 and 162 may be filled with the same type of resin, and the two dispensing heads 171 and 172 may be lowered together to simultaneously apply resin to the adjacent chip tops. In this case, the spacing between the two dispensing heads 171 and 172 and the spacing between adjacent chips must be the same. In this case, the dispensing process of resin can be shortened significantly.

On the other hand, the dispensing head unit of the present invention may be provided with an adjustment unit for adjusting the initial position of the needle after replacing the damaged needle (171a) (172a) during the dispensing process of applying the epoxy resin as described above. In addition, reference numeral 400 is a correction unit for sensing so that the lifting width of the needles 171a and 172a can be adjusted according to the flatness of the lead frame supplied.

Needless to say, the dispensing head unit of the present invention as described above is not limited to the above embodiment and can be implemented by adding many modifications without departing from the spirit and scope of the present application.

Dispensing head unit for semiconductor packaging of the present invention has the following advantages.

First, by providing a plurality of reservoirs and a plurality of dispensing heads to enable the supply of epoxy resins of different physical properties, a resin having excellent bonding strength is applied to the edge of the chip and a chemically stable resin can be applied to the center of the chip. It is advantageous to improve quality.

Second, by discharging the same resin in each reservoir to allow a plurality of heads to proceed at the same time, it is possible to shorten the dispensing process time.

Third, each resin reservoir and each dispensing head are provided with an inclined block that is a resin supply passage, thereby smoothly supplying resin.

Claims (4)

In the dispensing head unit for semiconductor packaging that supplies resin to the lead frame on which the IC chip is mounted, A plurality of resin storage passages through which resin is stored; A dispensing head unit for semiconductor packaging, comprising a plurality of dispensing heads which are movable together with each of the resin reservoirs and apply a resin supplied from each resin reservoir onto the lead frame. The semiconductor packaging dispensing head unit of claim 1, further comprising an inclined block connecting the outlet side of each of the resin reservoirs and the dispensing head in an inclined shape and having an inclined passage through which resin is supplied. . The dispensing head of claim 2, wherein each of the dispensing heads includes a motor for generating power, a screw rod that is rotated by a predetermined step by driving the motor, and moves a predetermined amount of resin supplied to the resin reservoir, and is moved according to the rotation of the screw rod. A dispensing head unit for semiconductor packaging, comprising needles through which resin is discharged. 4. The dispensing head unit for semiconductor packaging according to claim 3, wherein the amount of resin discharged is controlled by arbitrarily adjusting the rotation speed of the screw rod.