KR100276636B1 - Substrate Processing Equipment - Google Patents

Abstract

It is an object of the present invention to provide a substrate processing apparatus in which the instantaneous maximum power consumption during power supply is reduced.

The power receiving portions of the plurality of processing units 11, 12, 13, 14 are connected to one end of the power supply switch 30 via switches 41, 42, 43, 44, respectively. The other end of the power input switch 30 is connected to the external power source E via a breaker 20.

The timer values T ₁ , T ₂ , T ₃ , and T ₄ are preset to the timers 51, 52, 53, and 54, respectively.

When the power supply input switch 30 is turned on, the timers 51 to 54 turn on the corresponding switches 41 to 44 after the elapse of the time defined by the timer values T _{1 to} T _4, respectively. 14) Power is supplied with a delay for a certain time.

Description

Substrate Processing Equipment

The present invention relates to a substrate processing apparatus having a plurality of processing units.

BACKGROUND ART A substrate processing apparatus is used to perform various processes on substrates such as semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for photomasks, and glass substrates for optical discs.

For example, in the manufacturing process of a semiconductor device, a substrate processing apparatus in which each of a series of processes is unitized and a plurality of processing units are integrated is used to increase production efficiency.

Such a substrate processing apparatus is generally connected to a power supply facility (external power source) in a factory, and a plurality of processing units are driven by electric power supplied from the power supply facility.

9 is a block diagram showing a power system in a conventional substrate processing apparatus. In FIG. 9, the substrate processing apparatus 1a is equipped with the some processing unit 11, 12, 13, 14 which respectively perform a predetermined process on a board | substrate. The power receiving units of the plurality of processing units 11 to 14 are connected to the external power source E via the power supply input switch 30 and the breaker 20. When the power supply input switch 30 is turned on, electric power from the external power supply E is supplied to the plurality of processing units 11 to 14.

In each processing unit 11 to 14, for example, a resistor such as a filament of a lamp and a nichrome wire of a heater is used. When electric power flows through such a resistor, large heat is generated, but the electrical resistance of the resistor decreases at a lower temperature. When the power is turned on, the temperature of the resistor is low, and as time passes, the temperature rises and is stabilized at a certain temperature. Therefore, a large current flows immediately after the power is turned on compared with the steady state.

FIG. 10 is a diagram illustrating a temporal change of the used power in the substrate processing apparatus 1a of FIG. 9. In the substrate processing apparatus 1a of FIG. 9, power is simultaneously supplied to the plurality of processing units 11 to 14 at the time of power supply, and according to the electrical behavior of each of the processing units 11 to 14, it is shown in FIG. As described above, between the time when the power supply is turned on and the predetermined time elapses, the power consumption of the entire substrate processing apparatus 1a is increased, and when the steady state is reached, the power consumption is lower than any constant level Wd. do.

In this case, it is necessary to set the operation level Wa of the breaker 20 to be larger than the power used immediately after the power supply, so that the power supply capability of the external power source E is larger than the operation level Wa of the breaker 20. .

However, increasing the power supply capacity of the external power source E is not desirable for safety reasons, and the equipment is also large, resulting in an increase in maintenance costs. These things are entrusted to the user of the substrate processing apparatus 1a, and become a big burden.

Moreover, in the substrate processing apparatus which has a some heating unit (hot plate) as a processing unit, the temperature control controller for adjusting the processing temperature of each heating unit is provided. The heating unit includes a substrate support plate for supporting a substrate, and a heater for heating the substrate support plate. In the temperature controller, the processing temperature of each heating unit is set as the set temperature.

When the power is turned on, the temperature controller supplies electric power from an external power source to the heater of each heating unit to heat the substrate support plate, and when the temperature of the substrate support plate of each heating unit reaches the set temperature, the temperature of the substrate support plate To control the current supplied to the heater of the heating unit to maintain the set temperature on and off.

Therefore, the power consumption of the whole substrate processing apparatus becomes high from the time of power supply to the completion of the temperature control of each heating unit, and the power consumption becomes low at the time of warming after completion of the temperature adjustment of each heating unit.

In addition, when the recipe (processing order) is changed by changing the lot of the substrate to be processed or the like, the set temperature of each heating unit set in the temperature control controller is also changed accordingly.

In this case, the temperature controller supplies electric power from an external power source to the heater of each heating unit until the temperature of the substrate supporting plate of each heating unit becomes the set temperature after the change, and after completion of temperature adjustment of each heating unit, In order to maintain the temperature of the substrate support plate of the heating unit at the set temperature, the current supplied to the heater of each heating unit is controlled on and off.

Therefore, the power consumption of the whole substrate processing apparatus becomes high at the time of temperature adjustment of each heating unit after the change of setting temperature, and the power consumption is low at the time of warming after completion of the temperature adjustment of each heating unit.

In this case, between the time of power supply and the completion of the temperature adjustment of each heating unit and the completion of the temperature adjustment of each heating unit after the change of the set temperature, the external power is used more than the operating power after the completion of temperature adjustment. At the same time, a large power supply capacity is required, and the capacity of the wire rod component of the power system is also required. As a result, it becomes difficult to achieve energy reduction and low cost.

An object of the present invention is to provide a substrate processing apparatus in which the instantaneous maximum power consumption at the time of power supply is reduced.

Another object of the present invention is to provide a substrate processing apparatus having a reduced maximum power consumption required for temperature adjustment at power-on.

Another object of the present invention is to provide a substrate processing apparatus in which the maximum power consumption required for temperature adjustment when the set temperature is changed is reduced.

1 is a block diagram showing a power system of a substrate processing apparatus according to a first embodiment of the present invention;

FIG. 2 is a diagram illustrating a temporal change in total power used in the substrate processing apparatus of FIG. 1; FIG.

3 is a block diagram showing a power system of a substrate processing apparatus according to a second embodiment of the present invention;

4 is a flowchart showing an example of CPU processing in the substrate processing apparatus of FIG. 3;

FIG. 5 is a diagram showing a temporal change of the total used power of the substrate processing apparatus in the processing of FIG. 4; FIG.

6 is a flowchart showing another example of CPU processing in the substrate processing apparatus of FIG. 5;

FIG. 7 is a view showing a temporal change of the used power of the entire substrate processing apparatus in the operation of FIG. 6;

8 is a block diagram showing a power system of a substrate processing apparatus according to a third embodiment of the present invention;

9 is a block diagram showing a power system of a conventional substrate processing apparatus;

FIG. 10 is a diagram illustrating a temporal change in total power used in the substrate processing apparatus of FIG. 9.

* Explanation of symbols for main parts of the drawings

1, 2, 3: substrate processing apparatus, 11, 12, 13, 14: processing unit,

20: breaker, 30: power input switch,

41, 42, 43, 44: switch, 51, 52, 53, 54: timer,

60: power meter, 70: switch unit,

71, 72, 73, 74: switch, 80: CPU,

90: condition setting panel, 100: memory,

101 to 10n: heating unit, 110: heater controller,

121-12n: switch, 130: on-off control part,

140: temperature controller.

The substrate processing apparatus according to the first aspect of the present invention provides a plurality of processing units that perform predetermined processing on a substrate, power supply means connected to an external power source, and power supplied from an external power source at the time of power supply by the power supply means. And it is provided with a power supply control means for sequentially supplying a plurality of processing units.

The substrate processing apparatus according to the second aspect of the invention is the configuration of the substrate processing apparatus according to the first aspect of the invention, wherein the power supply control means is provided with a plurality of switch means each connected between a power supply means and a plurality of processing portions, and a plurality of switches. And means for turning on the means after each preset time has elapsed from the time of power-on by the power-on means.

The substrate processing apparatus according to the third aspect of the invention is the configuration of the substrate processing apparatus according to the first aspect of the invention, wherein the power supply control means is provided with a plurality of switch means each connected between a power supply means and a plurality of processing parts, and a plurality of processing parts. Power measurement means for measuring the power in use at the same time, and switch control means for sequentially turning on the plurality of switch means based on the measured value of the power measurement means.

In the substrate processing apparatus according to the fourth aspect of the invention, in the configuration of the substrate processing apparatus according to the third aspect of the invention, the switch control means is configured to turn on each switch means in a preset order when the measured value of the power measuring means is lower than a preset reference level. It is.

In the substrate processing apparatus according to the fifth aspect of the invention, in the configuration of the substrate processing apparatus according to the third aspect of the invention, the switch control means selects one of the plurality of processing units based on a difference between the preset maximum allowable level and the measured value of the power measurement means. The selected processing unit is turned on.

The substrate processing apparatus according to the sixth invention is the configuration of the substrate processing apparatus according to the third invention, wherein the switch control means turns on the plurality of switch means so that the measured value of the power measuring means does not exceed a preset maximum allowable level. The timing is delayed sequentially.

A substrate processing apparatus according to a seventh aspect of the invention has a heat source, a plurality of processing units which heat-treat the substrate, power supply means connected to an external power source, and supplying power from an external power source to the heat sources of the plurality of processing units, respectively, And a power supply control means for controlling the supply of power to each processing unit by the power supply means to adjust the processing temperature of the processing unit to a predetermined temperature, respectively, wherein the power supply control means is configured to supply power from an external power source at the time of power supply. The power supply means is controlled so as to supply the plurality of processing units sequentially while displacing time.

The substrate processing apparatus according to the eighth invention has a heat source, a plurality of processing units which heat-treat the substrate, power supply means connected to an external power source, and supplying power from the external power source to the heat sources of the plurality of processing units, respectively, And a power supply control means for controlling the supply of power to each processing unit by the power supply means to adjust the processing temperature of the processing unit to the set temperature set for each processing unit, and the power supply control means is changed when the set temperature is changed. On the basis of the set temperatures of the respective processing units, the control is sequentially performed while the supply of power to each processing unit by the power supply means is shifted in time.

1 is a block diagram showing a power system of a substrate processing apparatus according to a first embodiment of the present invention.

The substrate processing apparatus 1 of FIG. 1 includes a plurality of processing units 11, 12, 13, 14. The processing units 11 to 14 are, for example, a rotary coating unit for applying a coating liquid such as a resist to a substrate, a developing unit for developing a substrate, a cleaning unit for cleaning the substrate, a heating unit for heating the substrate, and a substrate. To a cooling unit for performing a cooling treatment to the substrate, and a conveying unit for conveying a substrate.

The substrate processing unit 1 includes a breaker 20, a power supply switch 30, a plurality of switches 41, 42, 43, 44, and a plurality of timers 51, 52, 53, 54. The plurality of switches 41, 42, 43, 44 and the plurality of timers 51, 52, 53, 54 are provided corresponding to the plurality of processing units 11, 12, 13, 14, respectively.

The power receiving units of the plurality of processing units 11 to 14 are connected to one end of the power supply input switch 30 through corresponding switches 41 to 44, respectively. The plurality of timers 51 to 54 are similarly connected to one end of the power supply switch 30. The other end of the power input switch 30 is connected to the external power source E via the breaker 20.

The timer values T ₁ , T ₂ , T ₃ , and T ₄ are preset to the timers 51, 52, 53, and 54, respectively. When the power supply switch 30 is turned on, the timers 51 to 54 are operated to turn on the corresponding switches 41 to 44 after the elapse of the time defined by the timer values T _{1 to} T ₄ , respectively. For example, when the timer values T ₁ to T ₄ of the timers 51 to 54 are set such that T ₁ < T ₂ < T ₃ < T ₄ , the switch 41, when the power supply switch 30 is turned on, The switch 42, the switch 43, and the switch 44 are turned on with a predetermined time delay in this order. As a result, power is supplied to the plurality of processing units 11 to 14 at different timings.

In the present embodiment, the processing units 11 to 14 correspond to the processing unit, and the power supply switch 30 corresponds to the power supply means. The switches 41 to 44 correspond to the switch means, and the timers 51 to 54 correspond to the clock means. The switches 41 to 44 and the timers 51 to 54 constitute power supply control means.

FIG. 2 is a diagram showing a temporal change of the used electric power of the entire substrate processing apparatus 1 of FIG. 1. In the above example, when the power supply switch 30 is turned on at time t0, the switch 41 is turned on at time t1, the switch 42 is turned on at time t2, and the switch 43 is turned on at t3, The switch 44 is turned on at the time t4.

In this way, since the switches 41 to 44 corresponding to the plurality of processing units 11 to 14 are turned on at different timings immediately after the power is turned on, the timer for initial power consumption in the processing units 11 to 14 is started. Is dispersed. Thereby, the maximum value Wm of electric power used by the whole substrate processing apparatus 1 immediately after power supply is reduced.

The operating power Wb of the breaker 20 is set higher than the maximum value Wm of the used power immediately after the power supply. In this case, the operating power Wb of the breaker 20 can be significantly lower than the operating power Wa of the breaker 20 in the conventional substrate processing apparatus 1a. Therefore, the power supply capability of the external power source E can be greatly reduced.

Further, by adjusting the timer values T _{1 to} T ₄ of the timers 51 to 54, the timing of power supply can be arbitrarily set to each of the processing units 11 to 14 at the time of power supply. Therefore, on the basis of the maximum power consumption of each of the processing units 11 to 14, the power supply to each of the processing units 11 to 14 is reduced so that the maximum value Wm of the power used in the entire substrate processing apparatus 1 is lowered. The timing and order can be easily set.

The timer values T _{1 to} T ₄ of the timers 51 to 54 may be set manually by an operator, or may be automatically set by a controller such as a CPU (central processing unit).

3 is a block diagram showing a power system of a substrate processing apparatus according to a second embodiment of the present invention.

In FIG. 3, the substrate processing apparatus 2 includes a plurality of processing units 11, 12, 13, 14. The substrate processing apparatus 2 further includes a breaker 20, a power input switch 30, a power meter 60, a switch unit 70, a CPU (central processing unit), a condition setting panel 90 and a memory ( 100). The switch unit 70 includes a plurality of switches 71, 72, 73, 74 corresponding to the plurality of processing units 11, 12, 13, 14, respectively.

The power receiving units of the plurality of processing units 11 to 14 are connected to one end of the power supply input switch 30 through the corresponding switches 71 to 74 and the power meter 60 of the switch unit 70, respectively. The other end of the power supply input switch 30 is connected to the external power source E via the breaker 20.

The power meter 60 measures the used power of the entire substrate processing apparatus 2. The condition setting panel 90 is used to set the power supply order of the plurality of processing units 11 to 14, the conditions such as the maximum power consumption, the set power, the maximum allowable power, and the like of each of the processing units 11 to 14.

The condition set by the condition setting panel 90 is stored as data in the memory 100 via the CPU 80. The CPU 80 turns on the switches 71 to 74 of the switch unit 70 at predetermined timings based on the power used by the power meter 60 and various data supplied from the memory 100.

In this embodiment, the switches 71 to 74 correspond to the switch means, the power meter 60 corresponds to the power measurement means, and the CPU 80 corresponds to the switch control means. In addition, the power meter 60, the switches 71 to 74 and the CPU 80 constitute power supply control means.

Next, the operation of the substrate processing apparatus 2 of FIG. 3 will be described with reference to FIGS. 4 to 7.

4 is a flowchart showing an example of the processing of the CPU 80 in the substrate processing apparatus 2 of FIG. 3. FIG. 5 is a diagram showing a temporal change of the used electric power of the entire substrate processing apparatus 2 in the process of FIG. 4.

In this example, it is assumed that the setting power W0 and the power supply order to the processing units 11 to 14 are stored in the memory 100 in advance using the condition setting panel 90. Here, the set power W0 corresponds to the reference level.

When the power supply input switch 30 is turned on, the CPU 80 reads data D1 of the set power W0 from the memory 100. Then, the power meter 60 reads the data D2 of the current used power Wc. It is determined whether or not the current used power Wc is lower than the set power W0 (step S1).

When the current used power Wc is greater than or equal to the set power W0, the controller waits. When the current used power Wc becomes lower than the set power W0, the data of the processing unit that is next powered by the memory 100 ( D3) is read and the switch corresponding to the processing unit is turned on (step S2).

Thereafter, it is determined whether the switch corresponding to the whole processing unit is turned on (step S3). If the switch corresponding to the entire processing unit is not turned on, the power meter 60 reads the data D2 of the current used power Wc, and returns to step S1. The processing in steps S1 to S3 is repeated until the switches corresponding to the entire processing units are turned on, and the processing ends when the switches corresponding to the entire processing units are turned on.

In the example of FIG. 4, as shown in FIG. 5, when the power supply switch 30 is turned on at time t0, when the current use power Wc is higher than the set power W0, the switch is not turned on. When the used power Wc is lower than the set power W0, the next switch is turned on. As a result, the plurality of switches 71 to 74 are turned on in a predetermined order.

In this way, since the switches 71 to 74 corresponding to the plurality of processing units 11 to 14 are turned on at different timings immediately after the power is turned on, the timing of initial power consumption in the processing units 11 to 14 is the same. This is distributed. As a result, the maximum value Wm of electric power used in the entire substrate processing apparatus 2 immediately after the power supply is reduced.

The operating power Wb of the breaker 20 is set higher than the maximum value Wm of the used power immediately after the power supply. In this case, the operating power Wb of the breaker 20 can also be significantly lower than the operating power Wa of the breaker 20 in the conventional substrate processing apparatus 1a. Therefore, the power supply capability of the external power source E can be greatly reduced.

In the above example, by setting the power supply order to the set power W0 and the processing units 11 to 14 arbitrarily, the maximum value Wm of the used power immediately after the power supply can be lowered.

6 is a flowchart showing another example of the processing of the CPU 80 in the substrate processing apparatus 2 of FIG. 3. FIG. 7 is a diagram showing a temporal change of the used electric power of the entire substrate processing apparatus 2 in the process of FIG. 6.

In this example, it is assumed that the setting power W0, the maximum allowable power Wx, and the maximum power consumption of each processing unit 11 to 14 are stored in the memory 100 using the condition setting panel 90 in advance. Here, the set power W0 corresponds to the reference level, and the maximum allowable power Wx corresponds to the maximum allowable level.

When the power supply input switch 30 is turned on, the CPU 80 stores the data D11 of the set power W0, the data D12 of the maximum allowable power Wx, and the respective processing units 11 to 11 in the memory 100. The data D13 of the maximum power consumption of 14) is read. Then, the power meter 60 reads the data D14 of the current used power Wc, and determines whether or not the current used power Wc is lower than the set power W0 (step S11).

When the current used power Wc is higher than or equal to the set power W0, the device waits. When the current used power Wc becomes lower than the set power W0, it is determined whether there is a processing unit capable of supplying power (step 12). ). In this case, the difference between the maximum allowable power Wx and the current used power Wc is calculated, and the maximum lower than the difference calculated based on the data D13 of the maximum power consumption of each processing unit 11 to 14. It is determined whether or not there is a processing unit having power consumption.

If there is no processing unit capable of supplying power, the power meter 60 reads the data D14 of the current used power Wc and returns to step S11. If there is a processing unit capable of supplying power, one of those processing units is selected according to a preset priority (step S13), and the switch corresponding to the selected processing unit is turned on (step S14).

Thereafter, it is determined whether the switch corresponding to the whole processing unit is turned on (step S15). The processing in steps S11 to 15 is repeated until the switches corresponding to the entire processing units are turned on, and the processing ends when the switches corresponding to the entire processing units are turned on.

In the example of FIG. 6, as shown in FIG. 7, when the power supply switch 30 is turned on at time t0, when the current used power Wc is lower than the set power W0, the maximum allowable power Wx and present Select a processing unit with a maximum power consumption lower than the difference from the use power (Wc), and supply power to the processing unit. Thereby, the maximum value Wm of the electric power used by the whole substrate processing apparatus 2 immediately after power supply can be made into the maximum allowable electric power Wx or less.

The operating power of the breaker 20 is set equal to or higher than the maximum allowable power Wx. In this case, the operating power of the breaker 20 can be significantly lower than the operating power Wb of the breaker 20 in the conventional substrate processing apparatus 1a. Therefore, the power supply capability of the external power source E can be greatly reduced.

In the above example, by setting the set power W0 and the maximum allowable power Wx, the processing unit 11 so that the maximum value Wm of the entire used power of the substrate processing apparatus 2 becomes equal to or less than the maximum allowable power Wx. The power supply order and timing to ˜14) are automatically set.

8 is a block diagram showing a power system of a substrate processing apparatus according to a third embodiment of the present invention.

The substrate processing apparatus 3 of FIG. 8 includes a plurality of heating units (hot plates) 101, 102,: 10n, a heater controller 110, and a temperature control controller 140. The heater controller 110 includes a plurality of switches 121, 122,:, 12n and an on / off control unit 130. The plurality of switches 121 to 12n are provided corresponding to the plurality of heating units 101 to 10n, respectively.

Each heating unit 101-10n has the board | substrate support plate which supports a board | substrate, and the heater as a heat source for heating this board | substrate support plate.

The power receiving unit connected to the heaters of the heating units 101 to 10n is connected to the on / off control unit 130 through the corresponding switches 121 to 12n, respectively, and the on / off control unit 130 is connected to the external power source E. Connected. The on-off control unit 130 controls the on-off operation of the plurality of switches 121 to 12n, respectively. As a result, a current is continuously or intermittently supplied to the heaters of the heating units 101 to 10n to heat the substrate support plate.

The temperature sensor is provided in the board | substrate support plates of several heating unit 101-10n. The output signals SE1 to SEn of the temperature sensors of the heating units 101 to 10n are provided to the temperature control controller 140. In the temperature control controller 140, the processing temperature of each heating unit 101-10n is set as set temperature.

The temperature control controller 140 provides the on-off control unit 130 with a control signal for commanding the on / off of the plurality of switches 121 to 12n based on the set temperatures of the heating units 101 to 10n. The on-off control unit 130 turns on and off the respective switches 121 to 12n in response to a control signal provided by the temperature controller 140.

In this embodiment, the heating units 101 to 10n correspond to the processing unit, the heater controller 110 corresponds to the power supply means, and the temperature regulation controller 140 corresponds to the power supply control means.

Next, operation | movement of the substrate processing apparatus 3 of FIG. 8 is demonstrated. Here, the power consumption of the heaters of the heating units 101 to 10n is 100W. Further, the set temperatures of the heating units 101, 102, 103, and 10n set in the temperature controller 140 in the initial state are, for example, 150 ° C, 200 ° C, 120 ° C and 100 ° C, respectively.

The temperature controller 140 detects the temperature of the substrate support plates of the heating units 101 to 10n based on the output signals SE1 to SEn of the temperature sensors of the heating units 101 to 10n.

When the power is turned on, the temperature controller 140 first turns on the switch 121 connected to the heating unit 101 by the on-off control unit 130. As a result, a current is supplied to the heater of the heating unit 101, and the substrate support plate is heated. At this time, the power consumed in the heating unit 101 is 100W.

When the temperature of the substrate supporting plate of the heating unit 101 reaches the set temperature, the temperature controller 140 turns on the switch 122 connected to the heating unit 102 by the on-off control unit 130. In addition, in order to maintain the temperature of the substrate support plate of the heating unit 101 at the set temperature, the on-off control of the switch 121 by the on-off control unit 130. In this case, the current supplied to the heater of the heating unit 101 is controlled on / off in accordance with the temperature variation of the substrate support plate of the heating unit 101.

Thereafter, similarly, the temperature controller 140 turns on the switches 123 to 12n connected to the heating units 103 to 10n in turn by the on-off control unit 130, and at the same time, the temperature of the heating units 103 to 10n. After the temperature of the substrate supporting plate reaches the set temperature, the on / off control unit 130 controls the switches 123 to 12n on and off for keeping warm.

When the recipe (processing order) is changed by changing the lot or the like of the substrate to be processed, the set temperature of the heating units 101 to 10n set in the temperature control controller 140 is also changed accordingly.

In this case, the temperature controller 140 performs the temperature adjustment of the heating units 101 to 10n in time shifts in accordance with the set temperature after the change. For example, the temperature controller 140 first adjusts the temperature of the substrate support plate of the heating unit 101 to the set temperature after the change by supplying current to the heater of the heating unit 101 by the on / off control unit 130. do.

The temperature controller 140 supplies a current to the heater of the heating unit 102 by the on-off control unit 130 after completion of the temperature adjustment of the heating unit 101, thereby providing a substrate support plate of the heating unit 102. Adjust the temperature to the set temperature after the change.

Similarly, the temperature controller 140 sequentially adjusts the temperature of the substrate support plates of the heating units 103 to 10n to the set temperature after the change while shifting the time after completion of the temperature adjustment of the heating unit 102.

As described above, in the substrate processing apparatus 3 of the present embodiment, since the power for temperature adjustment is sequentially supplied to the heating units 101 to 10n while shifting the power in time, the maximum power consumption is (100 + α). It becomes W. Here, α is the power required for warming after completion of temperature adjustment, and is sufficiently small compared to the power required for temperature adjustment.

On the other hand, in the conventional substrate processing apparatus, since electric power is simultaneously supplied to the entire heating unit at the time of power supply, the maximum power consumption is (100 x n) W. Where n is the number of heating units.

In addition, in the substrate processing apparatus 3 of this embodiment, since the temperature of the substrate support plates of the heating units 101 to 10n is adjusted to the set temperature after the change while shifting the set time in time, the set temperature is changed. The maximum power consumption immediately after is reduced.

Therefore, it becomes possible to reduce the power supply capability of the external power source E and at the same time, the capacity of the wire rod component of the power system can be reduced. As a result, energy reduction and cost reduction can be achieved.

In the present embodiment, the time required until the temperature adjustment of the heating units 101 to 10n is completed is increased, but since the temperature adjustment is limited at the time of turning on the power and changing the set temperature, an increase in the time required for temperature adjustment Is less than the overall operating time of the substrate processing apparatus 3.

On the other hand, as in the present embodiment, it is preferable to start the temperature adjustment of the next heating unit every time the temperature adjustment of each heating unit is completed, in order to reduce the maximum power consumption, but before the completion of the temperature adjustment of each heating unit, You may start temperature adjustment. In this case as well, by shifting the start time of the temperature adjustment of each heating unit, the number of heating units to be adjusted at the same time is reduced, so that the maximum power consumption can be reduced as compared with the conventional substrate processing apparatus.

In the substrate processing apparatus according to the first aspect of the invention, since the power supplied from the external power source is sequentially supplied to the plurality of processing units at different timings in time, the timing of initial power consumption in the plurality of processing units is dispersed. . This reduces the instantaneous maximum power consumed by the entire substrate processing apparatus immediately after the power is turned on. Therefore, there is an effect that it is possible to reduce the power supply capacity of the external power source.

In the case of the substrate processing apparatus according to the second aspect of the invention, since the plurality of switch means are sequentially turned on after each preset time passes when the power is turned on, the timing of initial power consumption in the plurality of processing units is dispersed, Immediately after power is applied, the instantaneous maximum power is consumed by the entire substrate processing apparatus.

In the case of the substrate processing apparatus according to the third aspect of the present invention, since the plurality of switch means are sequentially turned on based on the measured values of the power measuring means, the instantaneous maximum power consumed by the entire substrate processing apparatus immediately after the power supply is set to a certain level. There is an effect that it becomes possible to make it below the level.

In the case of the substrate processing apparatus according to the fourth aspect of the invention, when the measured value of the power measuring means is higher than the reference level, the switch means is not turned on, and when the measured value of the power measuring means is lower than the reference level, the next switch means is turned on. do. Thereby, there is an effect that the plurality of switch means is turned on while delaying in a predetermined order.

In the case of the substrate processing apparatus according to the fifth aspect of the present invention, since the processing unit having a power consumption lower than the difference between the maximum allowable level and the measured value of the power measuring means can be turned on, the substrate processing apparatus is consumed in the entire substrate processing apparatus immediately after the power is supplied. At the moment, the maximum power can be lowered below the maximum allowable level.

In the case of the substrate processing apparatus according to the sixth aspect of the present invention, the timing of turning on the plurality of switch means to the on-state is sequentially delayed so that the measured value of the power measuring means does not exceed the maximum allowable level when the power is turned on, so that the entire substrate processing apparatus is The effect is that the maximum power consumed at does not exceed the maximum allowable level.

In the substrate processing apparatus according to the seventh aspect of the invention, since the power supplied from the external power source is sequentially supplied to the plurality of processing units at different timings at the time of power supply, the timing of power consumption required for temperature adjustment in the plurality of processing units is increased. Is dispersed. This reduces the instantaneous maximum power consumed by the entire substrate processing apparatus immediately after the power is turned on.

Therefore, it is possible to reduce the power supply capability of the external power source and at the same time reduce the capacity of the wire rod component of the power system. As a result, there is an effect that energy reduction and cost reduction can be achieved.

In the substrate processing apparatus according to the eighth aspect of the invention, since the supply of power to each processing unit by the power supply means is controlled at different timings at the time of changing the set temperatures of the plurality of processing units, The timing of the consumption of the required power is dispersed. Thereby, the instantaneous maximum power consumed by the whole substrate processing apparatus immediately after the change of the set temperature is reduced.

Therefore, it is possible to reduce the power supply capability of the external power source and at the same time reduce the capacity of the wire rod component of the power system. As a result, there is an effect that energy reduction and cost reduction can be achieved.

Claims (9)

A plurality of processing units which perform predetermined processing on the substrate, power supply means connected to an external power supply, and power supply from the external power supply when the power supply by the power supply means is shifted in time, sequentially And a power supply control means for supplying power to the substrate. The power supply control means according to claim 1, wherein the power supply control means comprises: a plurality of switch means connected between the power supply means and the plurality of processing units, and the power supply means using the power supply means; And a time-keeping means for turning on after each preset time from the controller. 2. The power supply control unit according to claim 1, wherein the power supply control unit comprises: a plurality of switch means connected between the power supply unit and the plurality of processing units, and power measuring means for measuring the power being used in the plurality of processing units; And switch control means for sequentially turning on the plurality of switch means on the basis of the measured value of the power measuring means. 4. The substrate processing apparatus according to claim 3, wherein the switch control means turns on each switch means in a preset order when the measured value of the power measuring means is lower than a preset reference level. 4. The switch control means according to claim 3, wherein the switch control means selects one of the plurality of processing units on the basis of a difference between a preset maximum allowable level and a measurement paper of the power measuring means, and sets the selected processing unit to be in an on state. Substrate processing apparatus to be. 4. The substrate processing apparatus according to claim 3, wherein the switch control means sequentially delays the timing of turning on the plurality of switch means in an on state such that the measured value of the power measuring means exceeds a preset maximum allowable level. A plurality of processing units having a heat source and performing heat treatment on the substrate, a power supply unit connected to an external power source and supplying power from the external power source to the heat sources of the plurality of processing units, and a processing temperature of each processing unit, respectively; And a power supply control means for controlling the supply of power to each processing section by the power supply means to adjust the temperature of the power supply means, wherein the power supply control means shifts the power from the external power source at the time of power supply. And controlling the power supply means to sequentially supply the plurality of processing units. A plurality of processing units which have a heat source and heat-treat the substrate, a power supply unit which is connected to an external power source, and supplies power from the external power source to the heat sources of the plurality of processing units, and a processing temperature of each processing unit, respectively. And a power supply control means for controlling the supply of power to each processing unit by the power supply means to adjust the set temperature at each set, wherein the power supply control means is set at each processing unit after the change at the change of the set temperature. And controlling the supply of power to each of the processing units by the power supply means in a sequential order while shifting the power in time. 9. The substrate processing according to claim 8, wherein the power supply control means controls the power supply control means to sequentially supply the power from the external power source to the plurality of processing units at a time when power is turned on. Device.

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