KR100269706B1 - 와이어본딩, 와이어절단 및 본드와이어에 볼을 형성하는 방법 및 와이어본더 - Google Patents

와이어본딩, 와이어절단 및 본드와이어에 볼을 형성하는 방법 및 와이어본더 Download PDF

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KR100269706B1
KR100269706B1 KR1019970708456A KR19970708456A KR100269706B1 KR 100269706 B1 KR100269706 B1 KR 100269706B1 KR 1019970708456 A KR1019970708456 A KR 1019970708456A KR 19970708456 A KR19970708456 A KR 19970708456A KR 100269706 B1 KR100269706 B1 KR 100269706B1
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wire
electrode
light
bond
capillary
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Korean (ko)
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KR19990021981A (ko
Inventor
벤자민 엔. 엘드리지
개탄 엘. 매튜
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이고르 와이. 칸드로스
폼팩터, 인크.
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Priority claimed from US08/452,255 external-priority patent/US6336269B1/en
Priority claimed from US08/533,584 external-priority patent/US5772451A/en
Priority claimed from US08/554,902 external-priority patent/US5974662A/en
Priority claimed from US08/558,332 external-priority patent/US5829128A/en
Priority claimed from US08/573,945 external-priority patent/US5601740A/en
Application filed by 이고르 와이. 칸드로스, 폼팩터, 인크. filed Critical 이고르 와이. 칸드로스
Publication of KR19990021981A publication Critical patent/KR19990021981A/ko
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    • H—ELECTRICITY
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/06—Arrangements or circuits for starting the arc, e.g. by generating ignition voltage, or for stabilising the arc
    • B23K9/067—Starting the arc
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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    • G—PHYSICS
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Ceramic Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Wire Bonding (AREA)
KR1019970708456A 1995-05-26 1996-05-24 와이어본딩, 와이어절단 및 본드와이어에 볼을 형성하는 방법 및 와이어본더 Expired - Fee Related KR100269706B1 (ko)

Applications Claiming Priority (19)

Application Number Priority Date Filing Date Title
US08/452,255 1995-05-26
US08/452,255 US6336269B1 (en) 1993-11-16 1995-05-26 Method of fabricating an interconnection element
US8/452,255 1995-05-26
US52624695A 1995-09-21 1995-09-21
US8/526,246 1995-09-21
US08/526,246 1995-09-21
US8/533,584 1995-10-18
US08/533,584 US5772451A (en) 1993-11-16 1995-10-18 Sockets for electronic components and methods of connecting to electronic components
US08/533,584 1995-10-18
US08/554,902 1995-11-09
US8/554,902 1995-11-09
US08/554,902 US5974662A (en) 1993-11-16 1995-11-09 Method of planarizing tips of probe elements of a probe card assembly
USPCT/US95/14909 1995-11-13
US08/558,332 US5829128A (en) 1993-11-16 1995-11-15 Method of mounting resilient contact structures to semiconductor devices
US8/558,332 1995-11-15
US08/558,332 1995-11-15
US08/573,945 1995-12-18
US8/573,945 1995-12-18
US08/573,945 US5601740A (en) 1993-11-16 1995-12-18 Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires

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KR19990021981A KR19990021981A (ko) 1999-03-25
KR100269706B1 true KR100269706B1 (ko) 2000-10-16

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US6442831B1 (en) 1993-11-16 2002-09-03 Formfactor, Inc. Method for shaping spring elements
US6836962B2 (en) 1993-11-16 2005-01-04 Formfactor, Inc. Method and apparatus for shaping spring elements
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6799976B1 (en) 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US7247035B2 (en) 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7579848B2 (en) 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies
US9165904B1 (en) 2014-06-17 2015-10-20 Freescale Semiconductor, Inc. Insulated wire bonding with EFO before second bond
EP3927662B1 (de) 2019-02-21 2024-06-19 Trappe, Lars Transportable wasserreinigungsvorrichtung

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JPS53123663A (en) * 1977-04-04 1978-10-28 Mitsubishi Electric Corp Cutting device of metal thin wire
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US4955523A (en) 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
US4889274A (en) * 1988-03-22 1989-12-26 Texas Instruments Incorporated Gas mixture for use in control and formation of ball bonds
US5176310A (en) * 1988-11-28 1993-01-05 Hitachi, Ltd. Method and apparatus for wire bond
JPH0322446A (ja) * 1989-06-20 1991-01-30 Ricoh Co Ltd ワイヤボンディング用ボール形成方法

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US5095187A (en) * 1989-12-20 1992-03-10 Raychem Corporation Weakening wire supplied through a wire bonder

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EP1232828A1 (en) 2002-08-21
EP0837750A4 (enExample) 1998-06-10
EP0837750B1 (en) 2002-08-28
WO1996037331A1 (en) 1996-11-28
EP0837750A1 (en) 1998-04-29
AU5939796A (en) 1996-12-11
DE69623294D1 (de) 2002-10-02
DE69623294T2 (de) 2003-04-17
KR19990021981A (ko) 1999-03-25
JPH11508407A (ja) 1999-07-21

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