KR100264842B1 - Chip-type aluminium electrolytic condenser - Google Patents
Chip-type aluminium electrolytic condenser Download PDFInfo
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- KR100264842B1 KR100264842B1 KR1019950019006A KR19950019006A KR100264842B1 KR 100264842 B1 KR100264842 B1 KR 100264842B1 KR 1019950019006 A KR1019950019006 A KR 1019950019006A KR 19950019006 A KR19950019006 A KR 19950019006A KR 100264842 B1 KR100264842 B1 KR 100264842B1
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- South Korea
- Prior art keywords
- electrolytic capacitor
- aluminum foil
- aluminum
- solid electrolyte
- chip
- Prior art date
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 53
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 239000004411 aluminium Substances 0.000 title 1
- 239000011888 foil Substances 0.000 claims abstract description 31
- 239000010410 layer Substances 0.000 claims abstract description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 239000004332 silver Substances 0.000 claims abstract description 7
- 239000011247 coating layer Substances 0.000 claims abstract description 6
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920000128 polypyrrole Polymers 0.000 claims abstract description 5
- KSXHZOTTWSNEHY-UHFFFAOYSA-N 3-[3-(2-cyanoethoxy)-2,2-bis(2-cyanoethoxymethyl)propoxy]propanenitrile Chemical group N#CCCOCC(COCCC#N)(COCCC#N)COCCC#N KSXHZOTTWSNEHY-UHFFFAOYSA-N 0.000 claims abstract description 4
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000005868 electrolysis reaction Methods 0.000 claims abstract 8
- 239000003990 capacitor Substances 0.000 claims description 40
- 239000007784 solid electrolyte Substances 0.000 claims description 23
- 150000003839 salts Chemical class 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052809 inorganic oxide Inorganic materials 0.000 claims description 4
- 239000011368 organic material Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000007787 solid Substances 0.000 abstract description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 229920001940 conductive polymer Polymers 0.000 description 4
- 238000004804 winding Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
- H01G9/045—Electrodes or formation of dielectric layers thereon characterised by the material based on aluminium
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
제1도는 본 발명에 따른 칩형 알루미늄 전해 콘덴서의 개략 사시도.1 is a schematic perspective view of a chip-shaped aluminum electrolytic capacitor according to the present invention.
제2도는 본 발명인 칩형 알루미늄 전해 콘덴서를 도시한 제1도의 A-A선 단면도.2 is a cross-sectional view taken along the line A-A of FIG. 1 showing a chip type aluminum electrolytic capacitor according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 알루미늄 포일 2 : 고체 전해질1: aluminum foil 2: solid electrolyte
3,3′: 절연수지 코팅층 4 : 전해 콘덴서3,3 ': insulating resin coating layer 4: electrolytic capacitor
5 : 음극층 6,6′: 전극층5: cathode layer 6,6 ': electrode layer
본 발명은 고전도성 고체 전해질을 음극으로한 칩형(Chip Type) 알루미늄 전해 콘덴서에 관한 것으로 이는 특히, 화성처리된 알루미늄 포일(Al2O3)이 무기산화물 및 고분자 유기물등의 고체 전해질 내에 함침되고, 상하측 표면에는 절연수지 코팅층이 적층되며, 일측으로 탄소 또는 은 페이스트(Ag Paste)를 적층한 음극을 형성하여 양측에 전극층을 마련함으로써, 전해 콘덴서를 권회형이 아닌 평판적층형으로 구성하여 코일성분을 극소화 하면서도 고주파 특성을 향상시킴은 물론, 콘덴서의 내부에 전도성이 우수한 고체 전해질을 함침하여 알루미늄 전해 콘덴서로서의 전기적 특성이 향상될 수 있도록 한 칩형 알루미늄 전해 콘덴서에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type aluminum electrolytic capacitor having a high conductivity solid electrolyte as a cathode. In particular, a chemically processed aluminum foil (Al 2 O 3 ) is impregnated into a solid electrolyte such as an inorganic oxide and a polymer organic material. The insulating resin coating layer is stacked on the upper and lower surfaces, and the cathode layer is formed by laminating carbon or silver paste (Ag Paste) on one side, and the electrode layers are provided on both sides. The present invention relates to a chip-type aluminum electrolytic capacitor which minimizes high frequency characteristics and also impregnates a solid electrolyte with excellent conductivity inside the capacitor to improve electrical characteristics as an aluminum electrolytic capacitor.
일반적으로 알려져 있는 종래의 칩형 전해 콘덴서에 있어서는, 엣칭(Etching)처리된 양극 및 음극 알루미늄 포일을 권회하여 알루미늄 원통형 전해 콘덴서 케이스 내에 수납후, 상기 알루미늄 포일이 수납된 전해 콘덴서 케이스 내에 도전성 고분자인 플리피롤(Polypyrrole)염등을 융해등과 같은 방법에 의해 함침시키고, 고열에서 상기 고체 전해질을 열분해하여 고체화토록 한다.In a conventionally known chip type electrolytic capacitor, a flipper roll, which is a conductive polymer, is placed in an electrolytic capacitor case in which the aluminum foil is accommodated after winding up an etched anode and cathode aluminum foil in an aluminum cylindrical electrolytic capacitor case. A polypyrrole salt lamp is impregnated by a method such as melting lamp, and the solid electrolyte is pyrolyzed at high temperature to solidify.
또한, 상기와 같이 알루미늄 포일과 일체로 고체 전해질이 함침된 전해 콘덴서 케이스의 개구부는 에폭시 수지등과 같은 절연수지를 통해 밀봉처리토록 함으로써, 고체 전해질로된 알루미늄 전해 콘덴서가 제작되는 것이다.In addition, as described above, the opening of the electrolytic capacitor case in which the solid electrolyte is impregnated with the aluminum foil is sealed through an insulating resin such as an epoxy resin, thereby producing an aluminum electrolytic capacitor made of a solid electrolyte.
그러나 상기와 같은 종래의 고체 전해 콘덴서는, 고체 전해질인 도전성 고분자의 함침성에 따른 문제로 엣칭배율이 비교적 낮은 알루미늄 포일을 사용하게 되며, 상기 알루미늄 포일의 권회에 따른 전해 콘덴서 케이스 내부의 체적이 크게 되어 고체상의 전해 콘덴서 크기가 대형화되고, 고주파 특성이 저하되는 단점이 있는 것이다.However, the conventional solid electrolytic capacitor as described above uses aluminum foil having a relatively low etching rate due to the impregnation of the conductive polymer, which is a solid electrolyte, and increases the volume inside the electrolytic capacitor case due to the winding of the aluminum foil. There is a disadvantage that the size of the solid-state electrolytic capacitor is increased and the high frequency characteristics are deteriorated.
또한, 전극을 형성하는 알루미늄 포일의 권회에 따라 이를 삽입하기 위한 케이스와, 전극 인출을 위한 별도의 리드선 가공등과 같은 다수의 소재를 필요로 하여 제작이 어렵게 되고, 이에 따라 생산성이 저하되는 등 많은 문제점이 있었던 것이다.In addition, it requires a number of materials such as a case for inserting the electrode according to the winding of the aluminum foil to form the electrode, and a separate lead wire processing for electrode withdrawal, making the production difficult, thereby reducing productivity There was a problem.
본 발명은 상기한 바와 같은 종래의 여러 문제점들을 개선시키기 위한 것으로서 그 목적은, 알루미늄 전해 콘덴서의 내부에 전도성이 우수한 고체 전해질을 함침하여 내부에 평판상으로 적층된 알루미늄 포일 양측으로 전극을 형성함으로써, 전해 콘덴서를 권회형이 아닌 평판형으로 구성하여 코일성분을 극소화 하면서도 고주파 특성을 향상시킴은 물론, 알루미늄 포일이 고배율로 엣칭 산화된 유전체층 형성후 이를 평판상으로 밴딩 적층되어 회로내에서 표면실장이 용이하게 이루어지며, 전해 콘덴서로서의 전기적 특성이 향상될 수 있는 칩형 알루미늄 전해 콘덴서를 제공하는데 있다.The present invention is to improve the various problems as described above, the object of the present invention, by impregnating a solid electrolyte with excellent conductivity in the interior of the aluminum electrolytic capacitor to form electrodes on both sides of the aluminum foil laminated in a flat plate, Electrolytic capacitors are configured as flat rather than wound to improve the high frequency characteristics while minimizing coil components, and after forming a dielectric layer where aluminum foil is etched at high magnification, it is banded and stacked on a plate to facilitate surface mounting in a circuit. The present invention provides a chip-type aluminum electrolytic capacitor capable of improving electrical characteristics as an electrolytic capacitor.
상기 목적을 달성하기 위한 기술적인 구성으로 본 발명은, 화성처리된 알루미늄 포일이 무기 산화물 또는 도전체 고분자 유기물등의 고체 전해질 내에 밴딩 적층되며, 상기 고체 전해질 상하측에는 절연수지 코팅층이 형성되며, 상기 전해 콘덴서 일측으로 탄소 및 은 페이스트를 도금한 음극층이 마련되고, 전해 콘덴서 양측에는 구리등으로 된 전극층이 형성토록된 칩형 알루미늄 전해 콘덴서를 마련함에 의한다.As a technical configuration for achieving the above object, the present invention, the converted aluminum foil is band-laminated in a solid electrolyte such as an inorganic oxide or a conductive polymer organic material, an insulating resin coating layer is formed on the upper and lower sides of the solid electrolyte, One side of the capacitor is provided with a cathode layer plated with carbon and silver paste, and on both sides of the electrolytic capacitor, a chip-type aluminum electrolytic capacitor is provided in which electrode layers made of copper or the like are formed.
이하, 첨부된 도면을 기초하여 본 발명의 실시예를 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
제1도는 본 발명에 따른 칩형 알루미늄 전해 콘덴서의 개략 사시도이고, 제2도는 본 발명인 칩형 알루미늄 전해 콘덴서를 도시한 제1도의 A-A선 단면도로서, 유전체층이 형성된 알루미늄 포일(1)이 고체 전해질(2)내에 밴딩 적층되며, 상기 고체 전해질(2) 상하측에는 절연수지 코팅층(3)(3′)이 형성되며, 내부에 알루미늄 포일(1)이 밴딩 적층된 전해 콘덴서(4)의 일측으로 탄소 및 은 페이스트가 도금된 음극층(5)이 마련되고, 상기 전해 콘덴서(4)의 양측에는 전도성금속으로 된 전극층(6)(6′)이 각각 형성된다.1 is a schematic perspective view of a chip-shaped aluminum electrolytic capacitor according to the present invention, and FIG. 2 is a cross-sectional view taken along line AA of FIG. 1 showing a chip-shaped aluminum electrolytic capacitor according to the present invention, in which an aluminum foil 1 having a dielectric layer formed thereon is a solid electrolyte 2. Banded and stacked in the upper and lower sides of the solid electrolyte (2), the insulating resin coating layer (3) (3 ') is formed, the carbon and silver paste to one side of the electrolytic capacitor (4) where the aluminum foil (1) is banded and laminated therein The plated cathode layer 5 is provided, and electrode layers 6 and 6 'made of conductive metal are formed on both sides of the electrolytic capacitor 4, respectively.
또한, 상기 알루미늄 포일(1)이 밴딩 적층되는 고체 전해질(2)은, 무기 산화물인 이산화망간(MnO2) 또는, 전도성 고분자 유기물인 폴리피롤(Polypyrrole)염 및 TCNQ(테트라시아노 N-알킬퀴노이드)염등으로 구성된다.In addition, the solid electrolyte 2 in which the aluminum foil 1 is banded and stacked is manganese dioxide (MnO 2 ), which is an inorganic oxide, or a polypyrrole salt and TCNQ (tetracyano N-alkylquinoid), which are conductive polymer organic materials. It consists of salt.
이와 같은 구조로 구성된 본 발명의 작용 및 효과를 설명하면 다음과 같다.Referring to the operation and effect of the present invention configured as such a structure as follows.
제1도 및 제2도에 도시한 바와같이, 화성처리공정의 고배율 엣칭 후 산화되어 유전체층(Al2O3)이 형성된 알루미늄 포일(1)을 이용하여 칩형태의 전해 콘덴서(4)를 제작할 경우, 상기 알루미늄 포일(1) 고체 전해질(2) 내에서 순차로 밴딩되면서 적층토록되어 콘덴서 소자가 완성된다.As shown in FIGS. 1 and 2, in the case of fabricating a chip-shaped electrolytic capacitor 4 using an aluminum foil 1 which is oxidized after high magnification etching in a chemical conversion process and has a dielectric layer Al 2 O 3 formed thereon. The bending is sequentially performed in the aluminum foil (1) and the solid electrolyte (2), so that the capacitor is laminated.
상기 알루미늄 포일(1)이 적층되는 고체 전해질(2)은, 전도성이 우수한 무기 산화물인 이산화망간 또는 도전성 고분자 유기물인 폴리피롤염 및 TCNQ(테트라시아노 N-알킬퀴노이드)염등으로 구성되며, 이때 상기 고체 전해질(2)에 적층된 알루미늄 포일(1)의 일단을 돌출시켜 금속전극을 도포한 양극(Anode) 전극층(6′)을 형성시킨다.The solid electrolyte 2 on which the aluminum foil 1 is laminated is composed of a polypyrrole salt, a TCNQ (tetracyano N-alkylquinoid) salt, etc. One end of the aluminum foil 1 laminated on the electrolyte 2 is protruded to form an anode electrode layer 6 'coated with a metal electrode.
또한, 상기 알루미늄 포일(1)이 고체 전해질(2) 내부에 밴딩 적층된 전해 콘덴서(4)의 일측에는 탄소 및 은 페이스트를 도금하여 음극층(5)의 마련후, 그 외측에는 구리(Cu)등의 전도성이 우수한 금속으로된 음극(Cathode) 전극층(6)을 형성토록 하며, 상기 각 전극층(6)(6′)의 외부에는 납땜(Soldering)성이 용이토록 Sn/Pb(주석)을 피복토록 함으로써, 칩형태의 알루미늄 전해 콘덴서가 제작되는 것이다.In addition, the aluminum foil 1 is plated with carbon and silver paste on one side of the electrolytic capacitor 4 in which the aluminum foil 1 is banded and laminated in the solid electrolyte 2, and then the cathode layer 5 is provided. Cathode electrode layers 6 made of metal having excellent conductivity, etc., are formed, and Sn / Pb (tin) is coated on the outside of each electrode layer 6 (6 ') for easy soldering. By doing so, a chip-shaped aluminum electrolytic capacitor is produced.
따라서, 평판상의 알루미늄 포일(1)이 수회 밴딩되어 고체 전해질(2)의 내부에 적층된 전해 콘덴서(4)는, 권회형이 아닌 평판형으로 구성되어 고주파 특성을 향상시키면서 회로내에서 표면실장이 용이하게 이루어질 수 있는 것이다.Therefore, the electrolytic capacitor 4, in which the plate-shaped aluminum foil 1 is bent several times and laminated inside the solid electrolyte 2, is not a wound type but a flat type, and the surface mount in the circuit is improved while improving the high frequency characteristics. It can be made easily.
이상과 같이 본 발명에 따른 칩형 알루미늄 전해 콘덴서에 의하면, 알루미늄 전해 콘덴서의 내부에 전도성이 우수한 고체 전해질을 함침하여 내부에 평판상으로 적층된 알루미늄 포일 양측으로 전극을 형성함으로써, 전해 콘덴서를 권회형이 아닌 평판형으로 구성하여 코일성분을 극소화 하면서도 고주파 특성을 향상시킴은 물론, 알루미늄 포일 고배율로 엣칭 산화된 유전체층 형성후 이를 평판상으로 밴딩 적층되어 회로내에서 표면 실장이 용이하게 이루어지며, 전해 콘덴서로서의 전기적 특성이 향상될 수 있는 우수한 효과가 있다.According to the chip-type aluminum electrolytic capacitor according to the present invention as described above, the electrolytic capacitor is wound around the aluminum electrolytic capacitor by impregnating a solid electrolyte having excellent conductivity to form electrodes on both sides of the aluminum foil laminated in a flat plate. In addition, it has a flat plate shape, which minimizes coil components, improves high frequency characteristics, and forms an oxidized dielectric layer etched with aluminum foil at high magnification, and then bands and stacks them on a plate to facilitate surface mounting in a circuit. There is an excellent effect that the electrical properties can be improved.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950019006A KR100264842B1 (en) | 1995-06-30 | 1995-06-30 | Chip-type aluminium electrolytic condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950019006A KR100264842B1 (en) | 1995-06-30 | 1995-06-30 | Chip-type aluminium electrolytic condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970003312A KR970003312A (en) | 1997-01-28 |
| KR100264842B1 true KR100264842B1 (en) | 2000-09-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950019006A KR100264842B1 (en) | 1995-06-30 | 1995-06-30 | Chip-type aluminium electrolytic condenser |
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| Country | Link |
|---|---|
| KR (1) | KR100264842B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100392667B1 (en) * | 2000-11-28 | 2003-07-23 | 주식회사 네스캡 | Metal Oxide Electrochemical Psedocapacitor Employing Organic Electrolyte |
| KR100939765B1 (en) | 2007-12-17 | 2010-01-29 | 삼성전기주식회사 | Solid electrolytic condenser and method for manufacturing the same |
-
1995
- 1995-06-30 KR KR1019950019006A patent/KR100264842B1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100392667B1 (en) * | 2000-11-28 | 2003-07-23 | 주식회사 네스캡 | Metal Oxide Electrochemical Psedocapacitor Employing Organic Electrolyte |
| KR100939765B1 (en) | 2007-12-17 | 2010-01-29 | 삼성전기주식회사 | Solid electrolytic condenser and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR970003312A (en) | 1997-01-28 |
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