KR100258442B1 - Method and apparatus for stocking and exchanging wafers - Google Patents

Method and apparatus for stocking and exchanging wafers Download PDF

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Publication number
KR100258442B1
KR100258442B1 KR1019970046241A KR19970046241A KR100258442B1 KR 100258442 B1 KR100258442 B1 KR 100258442B1 KR 1019970046241 A KR1019970046241 A KR 1019970046241A KR 19970046241 A KR19970046241 A KR 19970046241A KR 100258442 B1 KR100258442 B1 KR 100258442B1
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South Korea
Prior art keywords
wafer
stocker
coating
loading
robot arm
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KR1019970046241A
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Korean (ko)
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KR19990024869A (en
Inventor
최진영
김동호
강희영
박경대
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김광교
대한민국디엔에스주식회사
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Priority to KR1019970046241A priority Critical patent/KR100258442B1/en
Priority to US09/139,270 priority patent/US6089763A/en
Priority to JP10254321A priority patent/JP3056468B2/en
Publication of KR19990024869A publication Critical patent/KR19990024869A/en
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Publication of KR100258442B1 publication Critical patent/KR100258442B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Abstract

PURPOSE: A stocker for storing a wafer of semiconductor equipment is provided to reduce the size of the semiconductor equipment by allowing the wafer to be loaded/unloaded at both sides of the stocker. CONSTITUTION: A stocker(40) is installed between an exposing device(10) and a coating/developing device. Robot arms(10a,20a) are installed at the exposing device(10) and at the coating/developing device, respectively. The robot arms(10a,20a) are introduced into the stocker(40) so as to load or unload the wafer. Stacking slots(41) are formed in the stocker(40) so as to receive two wafers. When a wafer is transferred from the exposing device(10), the robot arm(10a) grips the wafer and moves into the stacking slots(41) of the stocker(40) so as to load the wafer in one of the stacking slots(41). When the wafer is transferred from the stocker(40) into the coating/developing device, the robot arm(20a) is operated.

Description

반도체 제조설비의 웨이퍼 보관용 스토커Stoker for wafer storage in semiconductor manufacturing facilities

본 발명은 반도체 제조설비의 웨이퍼 보관용 스토커에 관한 것으로서, 더욱 상세하게는 웨이퍼의 제조공정중 노광기와 도포/현상기의 사이에 설치되어 웨이퍼를 적재하는 스토커를 설치하여 상기 웨이퍼의 적재 및 이송작업을 간편하고 신속하게 할 수 있도록 한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stocker for storage of wafers in semiconductor manufacturing equipment, and more particularly, a stocker installed between an exposure machine and an application / developer during the wafer manufacturing process to install a stocker for loading the wafer. It is intended to be simple and quick.

일반적으로, 반도체 제조설비에서 웨이퍼를 제조할 때에는 상기 웨이퍼를 노광기에서 노광을 마친후 도포/현상기에서 현상을 하는 작업을 반복하고 있으며 상기 노광기와 도포/현상기의 사이에는 대기중인 웨이퍼를 적재하는 적재부가 설치되어 있다.In general, when manufacturing a wafer in a semiconductor manufacturing facility, the wafer is repeatedly exposed and developed in an exposure machine after the exposure is performed, and a loading unit for loading a wafer that is waiting between the exposure machine and the application / developer is repeated. It is installed.

종래의 적재부(1)는 도 1에 도시된 바와같이 제조설비의 일측에 웨이퍼(W)가 안착되는 3점핀(2)이 설치되어 있고 이의 일측에는 3점핀(2)에 안착된 웨이퍼(W)를 이동시키는 핸들암(3)이 형성되어 있으며 상기 핸들암(3)이 설치된 타측에는 웨이퍼(W)를 보관하는 버퍼 카세트(4)가 설치되어 있다.As shown in FIG. 1, the conventional loading part 1 has a three-point pin 2 on which a wafer W is seated on one side of a manufacturing facility, and a wafer W seated on a three-point pin 2 on one side thereof. The handle arm 3 for moving) is formed, and on the other side where the handle arm 3 is installed, a buffer cassette 4 for storing the wafer W is provided.

상기 제조설비에서 웨이퍼(W)를 제조하는 공정(형광막도포, 노광, 현상등)을 마친 웨이퍼(W)는 로봇암(5)에 파지된 상태로 이동되어 3점핀(2)의 상부에 안착된다.After the process of manufacturing the wafer W (fluorescent film coating, exposure, development, etc.) in the manufacturing facility, the wafer W is moved to a state held by the robot arm 5 and seated on the three-point pin 2. do.

상기 3점핀(2)의 상부에 웨이퍼(W)가 안착되면 핸들암(3)이 작동하여 상기 웨이퍼(W)를 버퍼 카세트(4)에 형성된 다수의 적재홈(4a)중 빈 적재홈(4a)의 내부로 삽입시킨다.When the wafer W is seated on the three-point pin 2, the handle arm 3 is operated to empty the groove 4a among the plurality of loading grooves 4a formed in the buffer cassette 4. Inside).

그리고 상기 버퍼 카세트(4)에 적재된 웨이퍼(W)를 다음공정으로 이동시키고자 할 때에는 핸들암(3)을 작동시켜 버퍼 카세트(4)에 적재된 웨이퍼(W)를 인출하여 3점핀(2)의 상부로 안착시킨후 상기 웨이퍼(W)의 이동위치가 일정하도록 센터링 작업을 한후 로봇암(5)으로 상기 웨이퍼(W)를 파지하여 다음공정으로 이동시킨다.When the wafer W loaded on the buffer cassette 4 is to be moved to the next step, the handle arm 3 is operated to take out the wafer W loaded on the buffer cassette 4, and the three-point pin 2 After seating on the top of the center, the centering operation is performed so that the moving position of the wafer W is constant, and then the wafer W is gripped by the robot arm 5 to move to the next step.

이와같이 종래의 웨이퍼 적재부(1)는 웨이퍼(W)를 보관하는 버퍼 카세트(4)의 적재홈(4a)이 협소하여 이의 내부에 웨이퍼(W)를 파지하는 로봇암(5)이 삽입되지 못하게 되므로 상기 웨이퍼(W)가 안착되는 3점핀(2) 및 웨이퍼(W)를 파지한 상태로 버퍼 카세트(4)의 적재홈(4a)의 내부로 삽입될 수 있는 핸들암(3)이 반드시 설치되어 있어야 하므로 장비가 대형화 되는 문제점이 있었다.As described above, the conventional wafer loading section 1 has a narrow loading groove 4a of the buffer cassette 4 holding the wafer W so that the robot arm 5 holding the wafer W is not inserted therein. Therefore, the three-point pin 2 on which the wafer W is seated and a handle arm 3 that can be inserted into the loading groove 4a of the buffer cassette 4 while holding the wafer W are necessarily installed. There must be a problem that the equipment is large.

또한 웨이퍼(W)를 안착 파지하는 횟수가 많아지제 되므로 상기 웨이퍼(W)의 위치가 가변되고 이에 따라 불량품이 발생하였으며 이를 방지하기 위해서는 웨이퍼(W)의 위치를 보정할 수 있는 별도의 장치를 설치하여야 하며 웨이퍼의 보정작업으로 인하여 작업시간이 많이 소요되는 등의 문제점이 있어다.In addition, since the number of times of mounting and holding the wafer W is increased, the position of the wafer W is variable and defective products are generated accordingly. In order to prevent this, a separate device that can correct the position of the wafer W is installed. There is a problem such that a lot of working time is required due to the calibration operation of the wafer.

본 발명은 상기한 문제점을 해결하기 위하여 안출한 것으로서, 노광기와 도포/현상기의 사이에 간편하고 신속하게 웨이퍼를 적재하며 장비를 소형화시킬 수 있는 반도체 제조설비의 웨이퍼 보관용 스토커를 제공하는데 그 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and the object of the present invention is to provide a wafer storage stocker of a semiconductor manufacturing facility which can easily and quickly load a wafer between an exposure machine and an application / developer and downsize the equipment. have.

상기 목적을 달성하기위한 본 발명은 웨이퍼를 제조하는 제조설비의 노광기와 도포/현상기의 사이에 설치되어 상기 웨이퍼를 적재하는 적재부에 있어서, 상기 노광기 및 도포/현상기에 설치되어 웨이퍼를 파지하여 이동시키는 로봇암이 인입 인출되며 두장의 웨이퍼를 동시에 삽입할 수 있는 적재홈이 다단으로 형성된 스토커로 이루어진 것이다.The present invention for achieving the above object is provided between the exposure machine and the coating / developing device of the manufacturing equipment for manufacturing a wafer, the loading portion for loading the wafer, is installed in the exposure and coating / developing device to hold and move the wafer The robot arm is pulled out and made of a stocker having a multi-stage stacking groove for inserting two wafers at the same time.

도 1은 종래 웨이퍼 적재부를 도시한 평면도,1 is a plan view showing a conventional wafer loading portion,

도 2는 본 발명에 따른 적재부를 도시한 사시도.Figure 2 is a perspective view of the mounting portion according to the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

W : 웨이퍼 10 : 노광기W: Wafer 10: Exposure Machine

10a, 20a : 로봇암 20 : 도포/현상기10a, 20a: robot arm 20: coating / developing

30 : 적재부 40 : 스토커30: loading part 40: stocker

40a : 적재홈40a: loading groove

이하 본 발명을 도시한 첨부도면 도 2를 참조하여 상세히 설명하면 다음과 같다.Hereinafter, with reference to the accompanying drawings showing the present invention in detail as follows.

도 2는 본 발명에 따른 적재부에 웨이퍼를 적재하는 상태를 도시한 사시도로서, 본 발명은 반도체 제조설비에 설치된 노광기(10)와 도포/현상기(12)의 사이에 적재부(30)를 설치되는 스토커(40)에는 상기 노광기(10)와 도포/현상기(20)에 각각 설치되어 웨이퍼(W)을 파지한 상태에서 이동시키는 로봇암(10a)(20a)이 인입 및 인출가능하며 두장의 웨이퍼(W)가 삽입되는 적재홈(40a)이 다단으로 형성되어 있다.FIG. 2 is a perspective view showing a state in which a wafer is loaded in a loading unit according to the present invention. The present invention provides a loading unit 30 between an exposure machine 10 installed in a semiconductor manufacturing facility and an application / developer 12. In the stocker 40, the robot arms 10a and 20a, which are installed in the exposure machine 10 and the coating / developing machine 20, and move in the state of holding the wafer W, are capable of drawing and extracting two wafers. The loading groove 40a into which (W) is inserted is formed in multiple stages.

따라서 본 발명은 노광기(10)에서 노광을 마친후 웨이퍼(W)를 이동시킬 때에는 로봇암(10a)으로 웨이퍼(W)를 파지하고 로봇암(10a)을 상기 스토커(40)가 설치된 적재부(40a)로 이동시킨후 스토커(40)에 형성된 다단의 적재홈(40a)중 빈 적재홈(40a)의 내부에 웨이퍼(W)를 안착시킨다.Therefore, in the present invention, when the wafer W is moved after the exposure in the exposure apparatus 10, the wafer W is gripped by the robot arm 10a and the robot arm 10a is provided with a stacker in which the stocker 40 is installed ( After moving to 40a, the wafer W is seated inside the empty loading groove 40a among the multi-stage loading grooves 40a formed in the stocker 40.

또한 상기 스토커(40)에 적재된 웨이퍼(W)를 도포/현상기(20)측으로 이동시킬때에는 상기 도포/현상기(20)에 설치된 또다른 로봇암(20a)을 웨이퍼(W)가 적재된 적재홈(40a)의 내부로 인입시켜 상기 웨이퍼(W)를 파지한후 로봇암(20a)을 작동하여 도포/현상기(20)의 내부로 웨이퍼(W)를 이동시킨다.In addition, when moving the wafer W loaded on the stocker 40 toward the coating / developing machine 20, another robot arm 20a installed on the coating / developing machine 20 is loaded with the wafer W loaded thereon. After the wafer 40 is drawn into the interior of the 40a and the wafer W is held, the robot arm 20a is operated to move the wafer W into the coating / developer 20.

이상에서와 같이 본 발명은 반도체 제조설비의 노광기(10)와 도포/현상기(20)에 각각 설치된 로봇암(10a)(20a)으로 웨이퍼(W)를 파지한 상태에서 상기 노광기(10)와 도포/현상기(20)의 사이에 설치된 적재부(30)에 웨이퍼(W)를 적재할 수 있게 되므로 웨이퍼(W)의 위치가 가변되지 않게되며 작업시간이 단축되어 생산성의 향상으로 수율을 증가시킬 수 있는 효과가 있다.As described above, the present invention is coated with the exposure apparatus 10 in a state in which the wafer W is held by the robot arms 10a and 20a respectively installed in the exposure apparatus 10 and the coating / developing machine 20 of the semiconductor manufacturing equipment. It is possible to load the wafer (W) in the stacking portion 30 installed between the / developer 20, the position of the wafer (W) is not variable and the working time is shortened to increase the yield by improving productivity It has an effect.

또한 웨이퍼(W)를 적재하는 스토커()의 양측에서 상기 웨이퍼(W)의 적재 및 인출이 가능하게 되므로 구조의 단순화로 장비를 소형화 할 수 있는 효과가 있다.In addition, since the wafer W can be loaded and unloaded from both sides of the stocker W for loading the wafer W, there is an effect that the equipment can be miniaturized due to the simplification of the structure.

Claims (1)

웨이퍼(W)를 제조하는 제조설비의 노광기(10)와 도포/현상기(20)의 사이에 설치되어 상기 웨이퍼(W)를 적재하는 적재부(30)에 있어서, 상기 노광기(10) 및 도포/현상기(20)에 설치되어 웨이퍼(W)를 파지하여 이동시키는 로봇암(10a)(20a)이 양측으로 인입 인출되며 두장의 웨이퍼(W)를 삽입할 수 있는 적재홈(40a)이 다단으로 형성된 스토커(40)로 이루어짐을 특징으로하는 반도체 제조설비의 웨이퍼 보관용 스토커.In the loading part 30 which is installed between the exposure apparatus 10 of the manufacturing equipment which manufactures the wafer W, and the application | coating / developer 20, and loads the said wafer W, the said exposure apparatus 10 and application | coating / The robot arms 10a and 20a installed in the developing device 20 to grasp and move the wafer W are drawn in and drawn out from both sides, and a stacking groove 40a into which two wafers W can be inserted is formed in multiple stages. A stocker for a wafer storage of a semiconductor manufacturing equipment, characterized in that the stocker (40).
KR1019970046241A 1997-09-09 1997-09-09 Method and apparatus for stocking and exchanging wafers KR100258442B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019970046241A KR100258442B1 (en) 1997-09-09 1997-09-09 Method and apparatus for stocking and exchanging wafers
US09/139,270 US6089763A (en) 1997-09-09 1998-08-25 Semiconductor wafer processing system
JP10254321A JP3056468B2 (en) 1997-09-09 1998-09-08 Semiconductor wafer processing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970046241A KR100258442B1 (en) 1997-09-09 1997-09-09 Method and apparatus for stocking and exchanging wafers

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KR19990024869A KR19990024869A (en) 1999-04-06
KR100258442B1 true KR100258442B1 (en) 2000-06-01

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