KR100257787B1 - Method for antislip in baking wafer substrate - Google Patents

Method for antislip in baking wafer substrate Download PDF

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Publication number
KR100257787B1
KR100257787B1 KR1019970046237A KR19970046237A KR100257787B1 KR 100257787 B1 KR100257787 B1 KR 100257787B1 KR 1019970046237 A KR1019970046237 A KR 1019970046237A KR 19970046237 A KR19970046237 A KR 19970046237A KR 100257787 B1 KR100257787 B1 KR 100257787B1
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South Korea
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wafer
plate
cylinder
speed
pin
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KR1019970046237A
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Korean (ko)
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KR19990024865A (en
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강희영
김태수
이준승
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김광교
대한민국디엔에스주식회사
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Priority to KR1019970046237A priority Critical patent/KR100257787B1/en
Priority to US09/139,270 priority patent/US6089763A/en
Priority to JP10254321A priority patent/JP3056468B2/en
Publication of KR19990024865A publication Critical patent/KR19990024865A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A wafer slip preventing method of a semiconductor manufacture facility is provided to improve the manufacture efficiency and quality of wafer and increase the work speed by placing the wafer at a precise position in a short time. CONSTITUTION: An action supporter(30) elevated by a cylinder(20) is installed on one side of a plate(10). In the action supporter(30), several pins(40) are installed, which are elevated projecting upward from a passage(11) of the plate(10). At a sector(31) formed on one side of the action supporter(30) is a sensor(50) that recognizes the elevation level of the action supporter(30). This sensor(50) is linked to a controller(51) that controls the elevation speed of the cylinder(20).

Description

반도체 제조용 설비의 웨이퍼 슬립 방지방법Wafer slip prevention method of semiconductor manufacturing equipment

본 발명은 반도체 제조용 설비의 웨이퍼 슬립 방지방법, 더욱 상세하게는 반도체 제조설비중 스피너(Spiner)의 베이크에 구비된 핫 플레이트 또는 쿨 플레이트에 웨이퍼를 안착시킬 때 순간적인 공기압에 의해 설정된 안착위치로부터 이탈되는 미끌림현상을 방지하여 정위치에 안착시킬 수 있게한 반도체 제조용 설비의 웨이퍼 슬립 방지방법에 관한 것이다.The present invention provides a method of preventing wafer slip in a semiconductor manufacturing facility, and more particularly, a deviation from a mounting position set by instantaneous air pressure when the wafer is seated on a hot plate or a cool plate provided in a spiner's bake in a semiconductor manufacturing facility. The present invention relates to a method for preventing wafer slip of a semiconductor manufacturing facility which prevents slippage and can be seated in place.

일반적으로, 반도체 웨이퍼에 미세패턴을 형성하게 되는 스피너에는 감광액이 도포된 웨이퍼를 가열시키는 핫 플레이트(Hot Plate)와 웨이퍼를 냉각시키는 쿨 플레이트(Cool Plate)를 갖춘 다수의 베이크(Bake)가 설치되어 있다.In general, a spinner for forming a fine pattern on a semiconductor wafer is provided with a plurality of bakes including a hot plate for heating a wafer coated with a photosensitive liquid and a cool plate for cooling the wafer. have.

베이크에는 반송 로봇에 의해 입출되는 웨이퍼를 상기 각 플레이트면에 안착 및 이탈되게 실린더에 의해 수직으로 승강동작되는 다수의 핀을 구비한 작동부재가 설치되고, 상기 다수의 핀은 플레이트를 관통되게 부설되어 있다.The bake is provided with an operating member having a plurality of pins which are vertically lifted and moved by a cylinder to settle and detach the wafer entering and exiting by the transfer robot on the respective plate surfaces, and the plurality of pins are installed to penetrate the plate. have.

도 1a 및 1b는 상기 베이크의 내부구조를 개략적으로 나타낸 것으로, 실린더(2)에 의해 동작되는 작동부재(3)가 상승되어 이에 부설된 다수의 핀(4)이 플레이트(1)의 표면으로부터 돌출된 상태에서 로봇암(도시하지 않음)에 의해 웨이퍼(W)가 반입 또는 배출되며(1a 참조), 상기 핀(4)에 올려진 웨이퍼(W)는 핀의 하강동작에 의해 플레이트(1)의 상면에 안착되어 가열 및 냉각작용을 하게 된다(1b 참조).1A and 1B schematically show the internal structure of the bake, in which the operating member 3 operated by the cylinder 2 is raised so that a plurality of pins 4 attached thereto protrude from the surface of the plate 1. In the opened state, the wafer W is brought in or ejected by a robot arm (not shown) (see 1a), and the wafer W placed on the pin 4 is moved by the lowering operation of the plate 1. It is seated on the top surface for heating and cooling (see 1b).

즉, 베이크 하우징에 고정된 플레이트(1)에 다수의 핀(4)이 수직으로 관통되고 그 승강동작에 의해 상부에 지지된 웨이퍼(W)가 수평상태에서 플레이트(1)에 안착됨과 아울러 입출대기 작용을 하게 된다.That is, a plurality of pins 4 vertically penetrate the plate 1 fixed to the baking housing, and the wafer W supported thereon by the elevating operation is seated on the plate 1 in a horizontal state, It works.

상기와 같이 핀의 상부에 웨이퍼를 지지되게한 상태에서 웨이퍼를 플레이트에 안착 또는 분리되게 할 때, 공기의 저항력을 충분히 상쇄시킬 수 있는 웨이퍼의 상승동작시에는 특별한 문제점을 발견할 수 없었다.As described above, when the wafer is seated or separated from the plate while the wafer is supported on the upper portion of the pin, no particular problem was found in the ascending operation of the wafer, which can sufficiently offset the air resistance.

그러나 핀의 하강동작에 의해 그 위에 지지된 웨이퍼가 동시에 낙하될 때 웨이퍼와 플레이트의 사이(L)에 있던 공기가 미처 빠져나가지 못하게 되면서 웨이퍼보다 핀이 먼저 낙하되면서 압축공기의 저항을 받게된다.However, when the wafer supported thereon is simultaneously dropped by the falling operation of the pin, the air between the wafer and the plate L cannot be escaped and the pin falls before the wafer, thereby receiving the resistance of the compressed air.

이에 따라, 핀의 지지력을 상실하되 공기의 저항력을 받게되는 웨이퍼가 도 2에서와 같이, 마치 공중에 떠있던 상태에서 낙하되므로 최종 착지점에 도달될 때에는 플레이트 표면의 어느 일측으로 미끌리게 되면서 설정된 위치를 벗어나게 된다.Accordingly, the wafer, which loses the bearing capacity of the pin but is subjected to the air resistance, falls as if floating in the air, as shown in FIG. You get out.

그러므로 베이크 플레이트에서 작업이 완료된 웨이퍼를 핀에 의해 플레이트의 표면으로부터 상승시켜 로봇암에 의해 배출시킬 때, 이미 발생된 위치편차에 의해 주변의 설비에 웨이퍼가 부딪히면서 웨이퍼에 손상이나 파손이 유발됨은 물론 심한경우에는 설비고장을 야기하는 등의 문제점이 있었다.Therefore, when the wafer that has been completed in the baking plate is lifted from the surface of the plate by the pin and discharged by the robot arm, the wafer may hit the surrounding equipment due to the position deviation that has already occurred, causing damage or damage to the wafer. In this case, there were problems such as equipment failure.

또한 균형을 상실한채 착지되는 웨이퍼가 플레이트의 표면에서 미끌리는 과정에서 웨이퍼의 표면에 형성된 산화막이 손상되어 품질을 저하시키는 등의 문제점도 있었다.In addition, there is a problem in that the oxide film formed on the surface of the wafer is damaged while the wafer is landed while losing the balance and is slipped on the surface of the plate.

본 발명은 위와 같은 종래의 스피너 설비에 웨이퍼를 안착시킬 때 발생되는 문제점을 감안하여 안출한 것으로서, 그 목적은 설정된 작업위치에 웨이퍼를 정확히 안착시킬 수 있는 반도체 제조용 설비의 웨이퍼 슬립 방지방법 제공하는 것이다.The present invention has been made in view of the problems caused when the wafer is seated in the conventional spinner equipment as described above, the object is to provide a method for preventing wafer slip of the semiconductor manufacturing equipment that can accurately seat the wafer at the set working position. .

이러한 목적을 달성하기 위한 본 발명은, 실린더에 의해 동작되는 핀의 상승속도를 일정하게 하되 핀의 하강속도를 구간별로 차등 적용하여 웨이퍼의 승강속도를 제어함에 따라, 웨이퍼와 플레이트표면 사이의 공기가 충분한 시간을 가지고 빠져나가게 하는 한편 상기 공기가 배출되는 구간 외에는 재차 고속으로 하강되게 하여 웨이퍼의 안착에 따른 위치이동을 방지하고 안착시간을 최소화 하게 됨을 특징으로 한다.In order to achieve the above object, the present invention maintains a constant rising speed of a pin operated by a cylinder, but applies a lowering speed of the pin to each section to control the lifting speed of the wafer, thereby providing air between the wafer and the plate surface. While leaving a sufficient time while leaving the air is discharged again at a high speed to prevent the position shift due to the mounting of the wafer is characterized in that to minimize the settling time.

도 1a 및 1b는 일반적인 베이크의 내부구조를 개략적으로 나타낸 구성도,1a and 1b is a schematic view showing the internal structure of a typical bake,

도 2는 종래의 베이크 플레이트에 웨이퍼 안착시 공기저항에 의한 위치변위상태를 나타낸 구성도,2 is a configuration diagram showing a position displacement state due to air resistance when the wafer is seated on a conventional baking plate;

도 3은 본 발명의 실시예의 웨이퍼 슬립을 방지하기 위한 제어 구성도,3 is a control block diagram for preventing wafer slip in an embodiment of the present invention;

도 4는 본 발명에 의한 웨이퍼를 지지하는 핀의 승강속도변화를 나타낸 선도이다.4 is a diagram showing a change in lift speed of a pin for supporting a wafer according to the present invention.

< 도면의 주요부분에 대한 부호의 설명 ><Description of Symbols for Major Parts of Drawings>

10 : 플레이트 20 : 실린더10 plate 20 cylinder

30 : 작동부재 40 : 핀30: operating member 40: pin

50 : 감지센서 51 : 콘트롤러50: detection sensor 51: controller

W : 웨이퍼W: Wafer

이하, 본 발명의 반도체 제조용 설비의 웨이퍼 슬립 방지방법을 첨부도면을 참조하여 설명하면 다음과 같다.Hereinafter, the wafer slip prevention method of the semiconductor manufacturing equipment of the present invention will be described with reference to the accompanying drawings.

도 3은 본 발명의 실시예의 웨이퍼 슬립을 방지하기 위한 제어 구성도이고, 도 4는 본 발명에 의한 웨이퍼의 승강상태를 나타낸 선도로서, 반도체 웨이퍼(W)를 가열 또는 냉각시키는 베이크 하우징(도시하지 않음)의 내부에 플레이트(10)가 고정설치되어 있다.3 is a control block diagram for preventing wafer slip in an embodiment of the present invention, and FIG. 4 is a diagram showing a lifted state of the wafer according to the present invention, and a baking housing (not shown) for heating or cooling the semiconductor wafer W. FIG. The plate 10 is fixedly installed inside.

상기 플레이트(10)의 일측에는 실린더(20)에 의해 승강동작되는 작동부재(30)가 설치되고, 이 작동부재(30)에는 상기 플레이트(10)에 형성된 통공(11)의 저면으로부터 상부로 돌출된 상태에서 승강되는 다수의 핀(40)이 부설되어 있다.One side of the plate 10 is provided with an operating member 30 which is moved up and down by a cylinder 20, the operating member 30 protrudes upward from the bottom surface of the through hole 11 formed in the plate 10. A plurality of pins 40 which are raised and lowered in the closed state are laid.

또한 플레이트(10)의 외측에는 주변의 설비로부터 웨이퍼(W)를 반입 및 반출시키는 로봇암(도시하지 않음)이 설치될 것이다.In addition, a robot arm (not shown) for loading and unloading the wafer W may be installed outside the plate 10.

상기 작동부재(30)의 일측에 섹터(31)를 형성하되 이 섹터(31)에 상응하는 소정위치에는 작동부재(30)의 승강위치를 인식하는 감지센서(50)가 설치되고, 이 감지센서는 실린더(20)의 승강속도를 제어하는 콘트롤러(51)에 연결되어 있다.Sector 31 is formed on one side of the actuating member 30, but a predetermined sensor corresponding to the sector 31 detects the lifting position of the actuating member 30, and a sensing sensor 50 is installed. Is connected to a controller 51 that controls the lifting speed of the cylinder 20.

상기 콘트롤러(51)는 실린더(20)의 상승동작시에는 고속을 유지되게 하는 반면, 하강시에는 초기속도를 고속으로 하되 웨이퍼가 플레이트에 닿기 직전에는 저속으로 변환시킨후 웨이퍼로부터 핀(40)이 분리된 시점에는 다시 고속으로 변환되게 실린더(20)의 동작을 제어한다.The controller 51 maintains the high speed during the ascending operation of the cylinder 20, while the initial speed is high when the cylinder 20 is lowered, but is converted to a low speed immediately before the wafer touches the plate, and then the pin 40 is removed from the wafer. At the time of separation, the operation of the cylinder 20 is controlled to be converted again at a high speed.

도 4는 웨이퍼를 지지하는 핀의 승강속도변화를 나타낸 선도로서, 플레이트(10)의 표면으로부터 몰입된 상태에서 대기중인 핀(40)이 실린더(20)의 구동에 의해 단시간에 상승되어 플레이트상에 놓인 웨이퍼(W)를 들어 올리게 되고, 소정의 경과시간이 종료된후 하강동작을 할 때에는 고속으로 하강되다가 플레이트면에 접근되는 시점에서 저속으로 변환된 다음 다시 고속으로 하강되어 초기의 대기상태로 된다.4 is a diagram showing a change in the lifting speed of the pin supporting the wafer, in which the pin 40 waiting in the state immersed from the surface of the plate 10 is lifted in a short time by the driving of the cylinder 20, When the wafer W is placed, the wafer W is lifted up, and when the lowering operation is completed after the predetermined elapsed time is completed, the wafer W is lowered at a high speed and then converted to a low speed at the time of approaching the plate surface, and then lowered again at a high speed to become an initial standby state. .

따라서, 상기와 같은 본 발명은 플레이트(10)에 놓인 웨이퍼를 들어올릴 때에는 공기의 저항력을 무시할 수 있으므로 실린더(20)에 의해 동작되는 핀(40)의 상승속도를 고속으로 일정하게 하는 것이 가능하다.Therefore, the present invention as described above can ignore the resistance of the air when lifting the wafer placed on the plate 10, it is possible to make the rising speed of the pin 40 operated by the cylinder 20 constant at high speed. .

반면에, 웨이퍼의 하강시에는 공기저항을 받게 되므로 핀(40)의 하강속도를 구간별로 차등 적용하여 웨이퍼와 플레이트의 표면사이에 잔류되었던 공기가 충분한 시간을 가지고 빠져나가게 한 후 웨이퍼(W)가 플레이트(10)의 정상위치에 도달한 상태에서 재차 고속으로 하강되게 제어한다.On the other hand, since the air resistance is received during the lowering of the wafer, the lowering speed of the pin 40 is differentially applied to each section to allow the air remaining between the wafer and the surface of the plate to escape with sufficient time before the wafer W is released. The control is made to descend at high speed again in the state where the normal position of the plate 10 is reached.

이와 같은 본 발명의 반도체 제조용 설비의 웨이퍼 슬립 방지방법은, 베이크의 플레이트 등에 웨이퍼를 안착시킬 때 공기저항으로 인한 위치이동을 방지하여 정확한 위치에 안착시킴에 따라, 웨이퍼의 제조효율을 향상시키고 다음 공정으로 이송시킬 때 오동작을 최소화 하여 품질을 향상시킬 수 있는 효과가 있다.Such a wafer slip prevention method of the semiconductor manufacturing equipment of the present invention improves the wafer manufacturing efficiency by preventing the position shift due to air resistance when the wafer is seated on the plate of the bake, etc. It has the effect of improving the quality by minimizing malfunctions when transferring to.

또한, 웨이퍼의 안착시간을 단축하여 전체라인의 작업속도를 높일 수 있으며, 웨이퍼의 미끌림을 근본적으로 방지하여 제품의 손상이나 미세분진의 발생으로 인한 품질저하를 방지할 수 있는 장점도 있다.In addition, it is possible to shorten the settling time of the wafer to increase the working speed of the entire line, and also to prevent the degradation of the product due to the damage of the product or the generation of fine dust by fundamentally preventing the wafer from slipping.

Claims (1)

반도체 웨이퍼(W)가 수평으로 안착되는 플레이트(10)의 일측에 실린더(20)에 의해 승강동작되는 작동부재(30)를 설치하되 이 작동부재(30)에 상기 플레이트(10)에 형성된 통공(11)의 저면으로부터 상부로 돌출된 상태에서 승강되는 다수의 핀(40)을 부설하여 웨이퍼를 지지하게 된 것에 있어서,On one side of the plate 10 on which the semiconductor wafer W is horizontally mounted, an operating member 30 which is moved up and down by the cylinder 20 is installed, but through holes formed in the plate 10 in the operating member 30 ( In the case of supporting the wafer by laying a plurality of pins 40 which are lifted and raised in the state protruding upward from the bottom of 11), 상기 작동부재(30)의 일측에 섹터(31)를 형성하되 이 섹터(31)에 상응하는 소정위치에는 작동부재(30)의 승강위치를 인식하는 감지센서(50)를 설치하고, 이 감지센서는 실린더(20)의 승강속도를 제어하는 콘트롤러(51)에 연결하며, 상기 콘트롤러(51)의 신호에 의해 실린더(20)의 하강초기속도를 고속으로 하되 웨이퍼(W)가 플레이트(10)에 닿기 직전에는 저속으로 변환시킨 후 웨이퍼로부터 핀(40)이 분리된 시점에는 다시 고속으로 변환되게 제어함을 특징으로 하는 반도체 제조용 설비의 웨이퍼 슬립 방지방법.A sector 31 is formed on one side of the actuating member 30, and a predetermined sensor 50 is provided at a predetermined position corresponding to the sector 31 to recognize a lifting position of the actuating member 30. Is connected to the controller 51 for controlling the lifting speed of the cylinder 20, and by the signal of the controller 51 to lower the initial initial speed of the cylinder 20, the wafer (W) to the plate 10 A method of preventing wafer slip in a semiconductor manufacturing facility, characterized in that the control is performed such that the speed is converted to a low speed just before the touch and then converted to a high speed again when the pin 40 is separated from the wafer.
KR1019970046237A 1997-09-09 1997-09-09 Method for antislip in baking wafer substrate KR100257787B1 (en)

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KR1019970046237A KR100257787B1 (en) 1997-09-09 1997-09-09 Method for antislip in baking wafer substrate
US09/139,270 US6089763A (en) 1997-09-09 1998-08-25 Semiconductor wafer processing system
JP10254321A JP3056468B2 (en) 1997-09-09 1998-09-08 Semiconductor wafer processing system

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KR1019970046237A KR100257787B1 (en) 1997-09-09 1997-09-09 Method for antislip in baking wafer substrate

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7556246B2 (en) 2005-11-21 2009-07-07 Tokyo Electron Limited Unloading method of object, program storage medium, and mounting mechanism

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7556246B2 (en) 2005-11-21 2009-07-07 Tokyo Electron Limited Unloading method of object, program storage medium, and mounting mechanism

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