KR100256851B1 - Manufacturing method for cu-ni-mn-sn-si alloy and same product - Google Patents

Abstract

PURPOSE: Provided is a process for preparing the titled wire material and alloy by adding manganese in place of a part of nickel, tin in proportion to a content of nickel and silicon to nickel as a main element. Whereby, the obtained alloy has excellent tensile force, drawing rate and electrical specific resistivity. CONSTITUTION: This Cu-Ni-Mn-Su-Si alloy for plate comprises 1.0 to 8.0% by weight of nickel, 0.5 to 5.0% by weight of manganese, 0.1 to 0.8% by weight of tin, 0.1 to 0.5% by weight of silicon and the balance of copper. The process for producing high strength wire material and the alloy contains an alloy material discharging process, a melting process, an alloying process, a bar and plate continuous casting process, a solution treatment process and an ageing process.

Description

Copper (Cu) -nickel (Ni) -manganese (Mn) -tin (Sn)-silicon (Si) alloys for high-strength wire and plate and its manufacturing method

The present invention relates to a copper (Cu) -nickel (Ni) -manganese (Mn) -tin (Sn) -silicon (Si) alloy for high-strength wire and plate and a method of manufacturing the same.

Conventional copper alloys include copper (Cu) -nickel (Ni) -tin (Sn) ternary alloys, which exhibit high strength as a spinodal decomposition effect, and the typical composition of this alloy is 9% by weight of nickel (Ni). And 6% tin (Sn), with the remainder consisting of 85% copper (Cu).

Copper (85%)-nickel (9%)-tin (6%)-based ternary alloys can obtain tensile strength of 1,000 MPa or more through processing heat treatment using spinodal decomposition strengthening effect. High strength and low manufacturing cost are possible to replace the copper alloy beryllium (Cu-Be), in particular has the advantage of not using toxic metals such as beryllium (Be).

However, copper (Cu) -nickel (Ni) -tin (Sn) -based spinodal decomposition-reinforced alloys have a disadvantage in that it is difficult to manufacture plates, bars, wires, etc., because hot working is not possible in the billet ingot state.

Therefore, a part of the plate, bar and wire by powder metallurgy has been produced, but there is a problem that the manufacturing process is very expensive due to difficulty and high cost.

An object of the present invention for solving the above problems relates to a method for producing a copper (Cu) -nickel (Ni) -manganese (Mn) -tin (Sn) -silicon (Si) alloy for high strength wire and plate, Nickel is used as a main additive, but a part of nickel (Ni) is added to another solid solution, inexpensive manganese (Mn), to obtain a solid solution effect, and to increase spinoidal decomposition, tin (Sn) is proportional to the content of nickel. In addition to obtaining some precipitation strengthening effect, in order to improve the fluidity of the melt as well as the refining effect by the strong deoxidation in the molten metal to provide an alloy and a method for producing the silicon (Si).

The alloy composition range of the present invention is less than 1.0 ~ 5.0wt% nickel (Ni), 2.1 ~ 5.0wt% manganese (Mn), 4.0 ~ 8.0wt% tin (Sn), 0.1 ~ 0.3wt% less than silicon (Si), The remainder is composed of copper (Cu).

Among the alloying components, a portion of nickel (Ni) is replaced with a portion of manganese (Mn) which provides a function as a solid element similar to nickel (Ni), and proportionally transfers tin (Sn) which leads the spinodal decomposition product. Controlled to show effective spinodal degradation enhancement.

In addition, the problem of lowering the strength due to insufficient content of nickel (Ni) and tin (Sn) was supplemented by adding silicon (Si), which is one of the elements showing the precipitation strengthening effect.

Here, silicon (Si) has good alloying property when it is put in a high temperature molten metal, and has a high oxidizing property, and also has a strong deoxidation effect in the molten metal, which is also good for the refining effect of clearing the molten metal.

When explaining the present invention step by step as follows.

Copper alloy for high-strength wire and plate, alloy composition range of less than 1.0 ~ 5.0wt% nickel (Ni), 2.1 ~ 5.0wt% manganese (Mn), 4.0 ~ 8.0wt% tin (Sn), less than 0.1 ~ 0.3wt% silicon ( Si), the remainder being weighed with copper (Cu),

After weighing, place copper (Cu) at the bottom of the furnace and load it in a stack in order of nickel (Ni), copper (Cu), nickel (Ni), and copper (Cu) in sequence, but thicken it with copper (Cu) at the end. Cover, start dissolving, if both copper and nickel dissolve, remove the slag, add manganese (Mn) to dissolve, and when the temperature of the molten metal increases gradually, the temperature of the molten metal reaches about 1,250 ℃. A dissolution alloy step of discontinuing or supplying a very low heat source and continuously adding tin (Sn) and silicon (Si) and stirring to dissolve it;

When the alloying elements are sufficiently dissolved and the flowability of the molten metal is improved at the melting temperature of about 1250 ° C, in the case of an alloy method that can be hot worked, continuous casting is performed with a thick sheet of ingot having a thickness of 70 mm or more and a large diameter rod having a diameter of 100 mm or more. Ingot manufacturing by ingot casting, and in the case of alloying method where cold working is advantageous, ingot is produced by continuous casting with thin plate of ingot thickness of 30mm or less or small diameter rod of diameter of 20mm or less,

In the ingot thus prepared, the ingot in the form of plate or small diameter rod is homogenized and completely removed from the cast structure by 85% or more plastic processing by cold rolling or cold drawing, and then maintained at a temperature of 850 ± 50 ° C. for 0.5 to 1.0 hours. After cooling, the solution is subjected to the solution treatment, and in the case of a plate or wire produced by hot rolling or extrusion, the solution is subjected to solution cooling by maintaining the solution at a temperature of 850 ± 50 ° C. for 0.5 to 1.0 hours, and then performing solution treatment.

The bar or plate in the intermediate state that has been solvated is rolled or drawn as much as the cold working amount according to the target physical property, and then maintained at 300 to 550 ° C for 1 to 10 hrs. Reinforcement effect of (Cu _X Ni _y ) _z Sn-type spinoidal decomposition products in nickel (Ni) -manganese (Mn) -tin (Sn) -based alloys and copper (Cu) -nickel (Ni) -silicon (Si It has an aging treatment step to obtain the reinforcing effect by the Cu _x Si Cu _y Ni _z Si Ni _x Si type precipitation appearing in the) -based alloy.

In the limitation of temperature and time suggested in the step-by-step process, first, the melting temperature of molten metal is about 1250 ° C. The melting point of pure copper is 1,080 ° C. In the case of alloying nickel and manganese having higher melting point, In order to promote the dissolution of nickel and manganese by increasing the fluidity and activity of molten pure copper molten metal, it is limited to an optimal temperature for suppressing oxidation loss of manganese having high oxidative properties. In the case of the present invention, the solid state and recrystallization temperature range of 800 ~ 900 ℃, the holding time of 0.5 ~ 1.0 hours was most suitable, and in the case of less than that, if the state diagram considering the alloy composition composed of the material of the present invention, Sufficient employment is difficult, and at higher temperatures, the crystal growth rapidly and coarsens, which adversely affects the fragrance properties. On the other hand, in the aging treatment temperature and the holding time, as a result of testing the overaging and unaging treatment conditions, the aging treatment temperature range was 300 to 550 ° C for 1 to 10 hours. In view of the change in physical properties according to the treatment conditions, when the aging temperature is high and the holding time is long, the strength decreases slightly, but the ductility is increased. When the aging temperature is low and the holding time is short, the strength or ductility is low. However, in the low temperature range close to the unaging age, the precipitation strengthening effect is small and only residual stress is removed from the work hardening. For the above reasons, the treatment temperature and the holding time have been limited.

The present invention as described above relates to a method for producing a copper (Cu) -nickel (Ni) -manganese (Mn) -tin (Sn) -silicon (Si) alloy for high-strength wire and plate, nickel as the main additive element Some of nickel (Ni) was added to another solid solution element, inexpensive manganese (Mn), to obtain a solid solution effect, and for the spinodal decomposition enhancement effect, tin (Sn) in proportion to the content of nickel was added, and some precipitation In addition to obtaining reinforcing effect, it is an alloy containing silicon (Si) to improve the flowability of molten metal as well as the refining effect by strong deoxidation in the molten metal. After proper processing and heat treatment, tensile strength is over 1100Mpa and elongation is 5%. Thus, the electrical resistivity was provided with an alloy and a method for producing the 11 ~ 20 μΩcm range.

The following Table 1 is an example of the alloys presented in the present invention, Tables 2 and 3 are changes in tensile strength and elongation according to the processing heat treatment, Table 4 is a change in the electrical resistivity value according to the processing heat treatment.

In Table 2, the tensile strength of the existing 85% copper (Cu)-9% nickel (Ni)-6% tin (Sn) ternary alloy is aged from 1043 to 1,195 MPa after three hours of aging at 300 to 400 ° C. The elongation can be obtained from 7 to 9%, and the electrical resistivity value is 10 to 14 µΩcm.

And copper (Cu) -9% nickel (Ni) -6% tin (Sn) alloy in the copper (Cu) -9% of the part of 9% nickel (Ni), which is a solid solution, replaced with manganese (Mn) [nickel (Ni) + Manganese (Mn)]-6% Tin (Sn) tri-alloy alloys have tensile strengths ranging from 837 to 1,156 MPa and elongation 6 to 12% under the same aging conditions. ˜26 μΩcm is shown.

In the copper (Cu) -9% nickel (Ni) -6% tin (Sn) ternary alloy, a part of nickel (Ni), an element of employment, is replaced with manganese (Mn), and tin (Sn) leads the spinodal decomposition product. Tensile strength was about 733 ~ 857MPa when 0.1 ~ 0.3% of silicon (Si) was added instead of 2 ~ 4%.

The change in tensile strength or electrical resistivity of the copper (Cu) -9% nickel (Ni) -6% tin (Sn) ternary alloy with and without the addition of precipitated strengthening silicon (Si) Is not large and the decrease in elongation tends to be insignificant.

On the other hand, in the example of copper (Cu) -nickel (Ni) -tin (Sn) -silicon (Si) alloy which is a case of this invention, copper (Cu) -6% nickel (Ni) -3% manganese (Mn)- In the case of 6% tin (Sn) -0.1 to 0.3% silicon (Si) alloy, the tensile strength is 1000 to 1088 Mpa, the elongation is 4 to 7%, and the electrical resistivity is 13 to 27 μΩcm.

This result has led to the development of a new copper (Cu) -nickel (Ni) -manganese (Mn) -tin (Sn) -silicon (Si) -based alloy that can obtain a tensile strength of 1000 MPa or more.

Claims (2)

Copper alloy for high strength wire and sheet metal, less than 1.0 ~ 5.0wt% nickel (Ni), 2,1 ~ 5.0wt% manganese (Mn), 4.0 ~ 8.0wt% tin (Sn), less than 0.1 ~ 0.3wt% silicon (Si), the remainder is copper (Cu), characterized in that the copper (Cu) -nickel (Ni) -manganese (Mn) -tin (Sn) -silicon (Si) alloy for high strength wire and plate. In the manufacturing method of copper (Cu) -nickel (Ni) -manganese (Mn) -tin (Sn) -silicon (Si) alloy for high strength wire and plate, the alloy composition range from 1.0 to Less than 5.0 wt% nickel (Ni), 2.1 to 5.0 wt% manganese (Mn), 4.0 to 8.0 wt% tin (Sn), less than 0.1 to 0.3 wt% silicon (Si), the remainder being weighed with copper (Cu) After weighing, lay copper (Cu) at the bottom of the melting furnace, and load nickel (Ni), copper (Cu), nickel (Ni), and copper (Cu) in this order in the order of lamination, and finally, copper (Cu) Cover with thick, start melting and dissolve both slag and copper, and then remove slag, add manganese (Mn) to dissolve, and gradually increase the temperature of the molten metal and heat it up to about 1,250 ℃. Melted alloy stage that discontinues or supplies a very low heat source and adds tin (Sn) and silicon (Si) continuously and stirs well to dissolve When the alloying elements are sufficiently dissolved and the melt temperature is about 1250 ° C, the flowability of the molten metal is improved. In the case of the alloying method that can be hot worked, continuous casting is performed with a thick plate of ingot thickness of 70 mm or more or a large diameter rod of diameter 100 mm or more. B. Ingots are manufactured by die casting, and in the case of an alloy scheme in which cold working is advantageous, ingots are made by continuous casting with a thin plate having a thickness of 30 mm or less or a small diameter rod having a diameter of 20 mm or less. Among the ingots, the ingots in the form of plate or small diameter rods are homogenized and completely removed from the cast structure by plastic working over 85% by cold rolling or cold drawing, and then maintained at a temperature of 850 ° C ± 50 ° C for 05 to 1.0 hours. After cooling with water, solution treatment is carried out. In the case of a plate or wire produced by hot rolling or extrusion, 0.5 to 1.0 hours at a temperature of 850 ± 50 ° C After cooling, the solution is cooled and subjected to solution treatment, and the bar or plate in the intermediate state subjected to the solution treatment is then rolled or drawn as much as the cold working amount according to the target physical properties, and then aged at 300 to 550 ° C. as an aging treatment. When air-cooled after 1 ~ 10hr, the reinforcing effect and (Cu _x Ni _y ) _Z Sn type spinoidal decomposition products in copper (Cu) -nickel (Ni) -manganese (Mn) -tin (Sn) alloys High-strength wire and sheet material characterized by a method of undergoing an aging treatment step to obtain reinforcement effect of Cu _x Si Cu _y Ni _z Si Ni _x Si type precipitation in (Cu) -nickel (Ni) -silicon (Si) -based alloys Method for producing a copper (Cu) -nickel (Ni) -manganese (Mn) -tin (Sn) -silicon (Si) alloy.