KR100246657B1 - Breaking structure for electromagnetic bond - Google Patents

Abstract

The present invention improves the shielding property of electromagnetic coupling in high frequency equipment and simplifies assembly workability.

The mounting area of the printed circuit board 5 is divided into two, the circuit component 22 is mounted on the surface of the printed circuit board 5 on one side, and the circuit component 23 is mounted on the rear surface of the printed board 5 on the other side. It is. Ground electrodes 21a and 21b are formed on the whole surface on the opposite side to the surface on which the circuit components 22 and 23 are mounted.

Description

Shielding structure of electromagnetic coupling {BREAKING STRUCTURE FOR ELECTROMAGNETIC BOND}

The present invention relates to a shield structure of electromagnetic coupling in high frequency equipment.

6 shows a high frequency end and an intermediate frequency end of a double conversion tuner as an example of a high frequency device. The RF signal received via the antenna, not shown, is amplified by the RF amplifier 101 and then mixed with the first local frequency LOCAL1 from the first local oscillator 103 by the mixer 102, and the first Converted to IF frequency (IF1). This first IF frequency IF1 is amplified by the IF amplifier 104 and then mixed with the second local frequency LOCAL2 from the second local oscillator 106 by the mixer 105 and the second IF frequency (IF1). IF2). Thus, in the double conversion tuner, two frequency conversions are performed. In particular, when the stage of the first local oscillator 103 and the stage of the second local oscillator 106 are arranged in close proximity, mutual modulation by two kinds of signals and abnormality due to positive feedback are performed. Unnecessary signals are generated by electromagnetic coupling such as oscillation.

7 shows a conventional shielding structure. The metal case frame 1 constitutes a side wall, and the covers 2 and 3 are respectively configured to cover the top and bottom of the metal case frame 1. The metal case frame 1 is provided with a connector 4 for connecting to the antenna. The printed circuit board 5 is horizontally arranged in the metal case frame 1, and the circuit blocks 6, 7, 8 constituting the circuit shown in FIG. 6 are mounted on the printed circuit board 5.

FIG. 8 shows another shielding structure, and by forming the compartments 12, 13, 14 for mounting the circuit blocks 6, 7, 8 by the shield plates 10, 11 for the structure shown in FIG. It is configured to shield between the circuit blocks 6, 7, 8.

However, in the structure shown in FIG. 7, since the circuit blocks constituting the first local oscillator 103 stage and the second local oscillator 106 stage are simply separated and mounted on the printed circuit board 5, electromagnetic coupling is avoided. Also, there is a problem that there is no degree of freedom due to constraints on the arrangement. In addition, in the structure shown in FIG. 8, there is a certain shielding effect, but a gap is generated between the shield plates 10 and 11 and the metal case frame 1, or the shield plates 10 and 11 are moved to the printed board 5. There is a problem that the shielding is not perfect because it penetrates, and the work for assembling the shield plates 10 and 11 to the printed board 5 deteriorates the production efficiency.

It is an object of the present invention to provide a shielding device for electromagnetic coupling which improves the shielding property of electromagnetic coupling in a high frequency device, and which is easy to assemble in view of the above conventional problems.

1 is a side view showing an embodiment of a shield of electromagnetic coupling according to the present invention;

2 is a side view showing a second example;

3 is a side view showing a third example;

4 is a side view showing a fourth example;

5 is a side view showing a fifth example;

6 is a block diagram illustrating a high frequency end and an intermediate frequency end of a double conversion tuner as an example of a high frequency device;

7 is a side view showing a conventional example;

8 is a side view showing another conventional example;

(Explanation of symbols for the main parts of the drawing)

5, 5a, 5b, 5c: printed board

21a, 21b, 24a, 24b, 24c, 28a, 28b, 28c: ground electrode

22, 23, 25-27, 33-35: parts

29, 37, 38: Sealed Edition

In order to achieve the above object, the present invention is characterized by dividing a printed board into a plurality of regions, mounting components on opposite sides of adjacent regions, and forming a ground electrode on a rear side of each component mounting surface.

In addition, the ground electrode of each adjacent area is formed to overlap.

In addition, the overlap portion of the ground electrode is characterized in that it is electrically connected.

In addition, each adjacent area is partitioned by a shield plate.

Each adjacent area is partitioned by a shield plate, and an overlap portion of the ground electrode is electrically connected by the shield plate.

The parts are parts of the first and second local oscillators constituting the double conversion tuner, and each part is mounted in each of the divided regions.

The present invention also arranges a plurality of printed boards in a substantially horizontal direction, mounts components on opposite sides of adjacent adjacent printed boards, and forms a ground electrode on the rear side of each component mounting surface, and at the same time, a ground electrode of the printed board. It is electrically connected on this same surface, It is characterized by the above-mentioned.

In addition, it is characterized in that each adjacent printed board is partitioned by a shield plate.

In addition, the ground electrode of the printed board is characterized in that it is electrically connected by a shield plate.

The parts are parts of the first and second local oscillators constituting the double conversion tuner, and each part is mounted on each of the plurality of printed boards.

According to the present invention, since the printed board is divided into a plurality of areas, parts are mounted on opposite sides of adjacent areas, and a ground electrode is formed on the back side of each parts mounting surface, electromagnetic coupling of each area is shielded. In addition, the assembly work can be simplified.

Also, a plurality of printed boards are arranged in a substantially horizontal direction, and components are mounted on opposite sides of adjacent printed boards, and a ground electrode is formed on the rear side of each component mounting surface, and the ground electrodes of each printed board are on the same plane. Since it is electrically connected, the electromagnetic coupling of each printed board is shielded, and assembly can be simplified.

In addition to the above configuration, the shielding of the electromagnetic coupling in the high frequency device can be improved by overlapping the ground electrodes in the adjacent areas or by electrically connecting the overlap portions by a shield plate or the like.

(Example)

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a side view showing an embodiment of an electromagnetic coupling shielding device according to the present invention, and the upper and lower sides of the metal case frame 1 constituting the side wall as shown in the same figure are covered by the covers 2 and 3, respectively. In addition, the metal case frame 1 is provided with a connector 4 for connecting to the antenna. In the metal case frame 1, one printed circuit board 5 is arranged horizontally, and in this example, the mounting area of the printed circuit board 5 is divided into two.

The circuit part 22 is mounted on the surface of the printed board 5 on one side of the mounting area divided into two, and the circuit part 23 is mounted on the back surface of the printed board 5 on the other side. In addition, ground electrodes 21a and 21b are formed on the entire opposite side of the surface on which the circuit components 22 and 23 are mounted, and the ground electrodes 21a and 21b constitute conductors of the printed circuit board 5, respectively. It is formed of foil. As the circuit components 22 and 23, for example, the stage of the first local oscillator 103 and the stage of the second local oscillator 106 shown in Fig. 6 are mounted.

Therefore, since the circuit parts 22 and 23 are mounted on opposite sides of the printed circuit board 5 and the ground electrodes 21a and 21b are formed on the entire opposite sides of the circuit parts 22 and 23, a shield plate is provided. It can improve the shielding effect and simplify the assembly work. In addition, as shown by the broken line in the drawing, the ground electrodes 21a and 21b are formed to extend to overlap with the counterpart region so that the shielding effect can be further improved, and a through hole is formed in this overlap part to be electrically connected. It further improves the sealing effect.

Next, a second example will be described with reference to FIG. 2. In this example, the mounting area of one printed circuit board 5 is divided into three, the circuit part 26 is mounted on the rear surface in the center area, and the circuit parts 25 and 27 are mounted on the surface in the left and right areas. In addition, ground electrodes 24a, 24b, and 24c are formed on the entire opposite side of the surface on which circuit components 25 to 27 are mounted. In this example, the circuit components 25 and 27 in the left and right regions are mounted on the same surface, but the shielding effect can be improved because they are spaced apart by the center region. As the circuit components 25 and 27 in the left and right regions, for example, the first local oscillator 103 stage and the second local oscillator 106 stage shown in FIG. 6 are mounted.

3 shows a modification of FIG. 1. That is, the mounting area of the printed board 5 is divided into two parts as in the case of Fig. 1, but the area on the left is relatively small, and the area on the right is relatively large. In a relatively small area on the left side, a relatively small number of circuit components 33 are mounted on the surface, and at the same time, a ground electrode 28a is formed on the back side, and in the relatively large area on the right side, a relatively large number of circuit components 34, 35 are placed on the back side. At the same time, the common ground electrodes 28b and 28c are formed on the surface. The circuit parts 34 and 35 in the relatively large area on the right side are partitioned by a shield plate 29 orthogonal to the printed board 5.

In such a configuration, the circuit component 33 is disposed in the upper compartment 30 partitioned by the surface of the printed board 5 and the shield plate 29, and the circuit component 34 is formed on the rear surface of the printed board 5. And the lower left partition chamber 31 partitioned by the shield plate 29, and the circuit component 35 is disposed on the rear surface of the printed board 5 and the lower partition partition 32 partitioned by the shield plate 29. Is placed. Therefore, even if the circuit components 34 and 35 are mounted on the same surface, the shielding effect can be improved by the shield plate 29.

4 shows a modification of FIGS. 2 and 3. That is, the mounting area of the printed circuit board 5 is divided into three parts as in the case of FIG. 2, and the three areas are partitioned by the shield plates 37 and 38 to form three compartments 39, 40 and 41. . Adjacent ground electrodes 24a and 24b overlap, and the shield plate 37 is provided perpendicular to the printed circuit board 5 so as to electrically connect the ground electrodes 24a and 24b. In such a configuration, when the circuit components 25 and 26 must be brought close to each other in the arrangement of the components, the shielding effect between the circuit components 25 and 26 can be improved.

In the example shown in Fig. 5, the configuration of the printed board is different. That is, in this example, three printed circuit boards 5a, 5b, and 5c are used, and the ground electrodes 24a to 24c of the printed circuit boards 5a to 5c are arranged to be flush with each other. In such a configuration, since the installation height of each of the printed circuit boards 5a to 5c is different with respect to the metal case frame 1, the insulating plates of the printed circuit boards 5a to 5c do not join, and therefore the shielding effect is very large. In addition, even in the configuration using the plurality of printed circuit boards 5a, 5b, and 5c, the shielding effect can be enhanced by combining the configurations shown in Figs.

In each of the above examples, two divisions and three divisions have been described, but the present invention is not limited to this, and the ground electrode need not be formed on the entire surface of the printed board, and at least the necessary conductive patterns are formed according to the position of the components on the opposite side. Even if the shielding effect can be maintained.

As described above, according to the present invention, since the printed circuit board is divided into a plurality of areas, parts are mounted on opposite sides of adjacent areas, and a ground electrode is formed on the back side of each part mounting surface, so that the electromagnetic fields of each area are not. The coupling is shielded and the assembly work can be simplified.

According to the present invention, a plurality of printed circuit boards are arranged in a substantially horizontal direction, and components are mounted on opposite sides of adjacent printed circuit boards, and a ground electrode is formed on the rear side of each component mounting surface, and at the same time, Since the ground electrodes are electrically connected on the same plane, the electromagnetic coupling of each printed board is shielded, and the assembly work can be simplified.

In addition to the above configuration, shielding of electromagnetic coupling in high frequency equipment can be improved by overlapping the ground electrodes of adjacent areas or by electrically connecting the overlapping portions by a shield plate or the like.

Claims (20)

A shielding structure for electromagnetic coupling, characterized by dividing a printed board into a plurality of regions, mounting components on opposite sides of adjacent regions, and forming a ground electrode on the rear side of each component mounting surface. The method of claim 1, Shielding structure of electromagnetic coupling, characterized in that the ground electrode of each adjacent area is formed to overlap. The method of claim 2, And the overlapping portion of the ground electrode is electrically connected. The method of claim 3, Shielding structure of electromagnetic coupling, characterized in that each adjacent area is partitioned by a shield plate. The method of claim 4, wherein And said components are respective components of the first and second local oscillators constituting the double conversion tuner, wherein each component is mounted in each of the divided regions. The method of claim 3, And said components are respective components of the first and second local oscillators constituting the double conversion tuner, and each component is mounted in each of the divided regions. The method of claim 2, Shielding structure of electromagnetic coupling, characterized in that each adjacent area is partitioned by a shield plate. The method of claim 7, wherein And said components are respective components of the first and second local oscillators constituting the double conversion tuner, wherein each component is mounted in each of the divided regions. The method of claim 2, Shielding structure of electromagnetic coupling, wherein adjacent areas are partitioned by a shield plate and an overlapping portion of the ground electrode is electrically connected by the shield plate. The method of claim 9, And said components are respective components of the first and second local oscillators constituting the double conversion tuner, wherein each component is mounted in each of the divided regions. The method of claim 2, And said components are respective components of the first and second local oscillators constituting the double conversion tuner, wherein each component is mounted in each of the divided regions. The method of claim 1, Shielding structure of electromagnetic coupling, characterized in that each adjacent area is partitioned by a shield plate. The method of claim 12, And said components are respective components of the first and second local oscillators constituting the double conversion tuner, wherein each component is mounted in each of the divided regions. The method of claim 1, And said components are respective components of the first and second local oscillators constituting the double conversion tuner, wherein each component is mounted in each of the divided regions. Arrange a plurality of printed boards in a substantially horizontal direction, mount components on opposite sides of adjacent printed boards, and form a ground electrode on the back side of each component mounting surface, and at the same time, the ground electrodes of the printed board may be electrically Shielding structure of electromagnetic coupling, characterized in that connected to. The method of claim 15, An electromagnetic coupling shielding structure, wherein adjacent printed circuit boards are partitioned by a shield plate. The method of claim 16, And said parts are respective parts of the first and second local oscillators constituting a double conversion tuner, and each said part is mounted on each of said plurality of printed boards. The method of claim 15, And the ground electrode of the printed board is electrically connected by a shield plate. The method of claim 18, And said components are respective components of the first and second local oscillators constituting the double conversion tuner, and each component is mounted on each of said plurality of printed circuit boards. The method of claim 15, And said components are respective components of the first and second local oscillators constituting the double conversion tuner, and each component is mounted on each of said plurality of printed circuit boards.