JPH01125897A - Device for shielding high frequency circuit - Google Patents

Device for shielding high frequency circuit

Info

Publication number
JPH01125897A
JPH01125897A JP26465287A JP26465287A JPH01125897A JP H01125897 A JPH01125897 A JP H01125897A JP 26465287 A JP26465287 A JP 26465287A JP 26465287 A JP26465287 A JP 26465287A JP H01125897 A JPH01125897 A JP H01125897A
Authority
JP
Japan
Prior art keywords
shielding
sub
frequency circuit
main substrate
earth pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26465287A
Other languages
Japanese (ja)
Inventor
Sadahiko Kanno
管野 貞彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu General Ltd
Original Assignee
Fujitsu General Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu General Ltd filed Critical Fujitsu General Ltd
Priority to JP26465287A priority Critical patent/JPH01125897A/en
Publication of JPH01125897A publication Critical patent/JPH01125897A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To enable a shielding device to be miniaturized and facilitate the assembly of it by a method wherein an earth pattern of a conductor foil is formed on a main substrate and the earth pattern is made to serve also as a part of a shielding case. CONSTITUTION:An earth pattern 8 of a conductor foil is formed on a main substrate 1, and the pattern 8 is made to serve also as a part of a shielding case 2. That is, a circuit element constituting a high frequency circuit and a sub-substrate provided with a printed circuit are made to be shielded in all and upward directions by shielding plates 3, 6, and 7 and also shielded in a downward direction by an earth pattern 8 provided to the main substrate 1. Therefore, the earth pattern is made to serve also as a shielding plate. By these processes, a shielding plate for the main substrate 1 and the sub-strate 5 can be dispensed with, so that the space between the main substrate 1 and the sub-substrate 5 can be reduced to half, and not only a device of this design can be miniaturized in an outer shape dimension but also a structure used for mounting a shielding plate can be dispensed with and an assemling man-hour can be reduced.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明はテレビのチューナ回路やRFモジュレータ回路
など、シールドを要する高周波回路のシールド装置を関
するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a shielding device for high frequency circuits that require shielding, such as television tuner circuits and RF modulator circuits.

[従来の技術] 従来、高周波回路をシールドする場合には第3図に示す
ようにメイン基板(1)上にて、シールドを要する回路
毎に区分し、シールドケース(2)の左右のシールド板
(3)(3)を植立し、このシールド板(3) (3)
の高さ方向略中夫に高周波回路素子(4)を有するサブ
基板(5)を固定して、さらにこのサブ基板(5)の上
面と下面を覆うようにシールド板(6) (7)を設け
ていた。
[Prior Art] Conventionally, when shielding a high frequency circuit, as shown in Figure 3, each circuit that requires shielding is divided on the main board (1), and the left and right shield plates of the shield case (2) are separated. (3) Plant this shield plate (3) (3)
A sub-board (5) having a high-frequency circuit element (4) is fixed approximately in the height direction of the sub-board (5), and shield plates (6) (7) are further placed to cover the top and bottom surfaces of this sub-board (5). It was set up.

C発明が解決しようとする問題点1 以上のシールド構造では、シールドケース(2)の左右
のシールド板(3) (3)、上面のシールド板(6)
、サブ基板(5)とメイン基板(1)の間のシールド板
(7)と、多数のシールド板を組立てて完全に高周波回
路を包囲する独立したシールドケース(2)を構成する
ことが必要であった。このように、各ブロック毎に独立
したシールドケース(2)・・・を作らなければならな
いため、組立てが面倒であるばかりか、外形寸法が大き
くなるなどの問題があった。
Problem to be solved by invention C 1 In the above shield structure, the left and right shield plates (3) (3) of the shield case (2), the upper shield plate (6)
, it is necessary to assemble a shield plate (7) between the sub-board (5) and the main board (1) and a number of shield plates to form an independent shield case (2) that completely surrounds the high-frequency circuit. there were. In this way, since it is necessary to make an independent shield case (2) for each block, there are problems such as not only the assembly is troublesome but also the external dimensions become large.

[問題点を解決するための手段] 本発明は以上の問題点を解決するためになされたもので
、シールドを要する高周波回路を構成したサブ基板を、
シールドケースで遮蔽しつつメイン基板上に設置してな
る高周波回路のシールド装置において、前記メイン基板
に導体箔のアースパターンを形成し、このアースパター
ン部分を、前記シールドケースの一部として兼用したも
のである。
[Means for Solving the Problems] The present invention has been made to solve the above problems.
A shielding device for a high frequency circuit that is installed on a main board while being shielded by a shield case, in which a ground pattern of conductive foil is formed on the main board, and this ground pattern portion is also used as a part of the shield case. It is.

[作用コ 高周波回路を構成する回路素子やプリント配線を施こし
たサブ基板の前後左右と上面はシールド板によってシー
ルドされ、下面はメイン基板に形成されたアースパター
ンによってシールドされる。
[Operations] The front, rear, left, right, and top surfaces of the sub-board on which the circuit elements and printed wiring that make up the high-frequency circuit are installed are shielded by shield plates, and the bottom surface is shielded by the ground pattern formed on the main board.

このため、アースパターンがシールド板を兼用すること
となる。
Therefore, the ground pattern also serves as a shield plate.

[実施例コ 本発明の一実施例を第1図および第2図に基づいて説明
する。
[Embodiment] An embodiment of the present invention will be described based on FIGS. 1 and 2.

第1図において、(1)はメイン基板であり、このメイ
ン基板(1)のシールドを要する高周波回路に対応する
部分は全面が導体箔のアースパターン(8)になってい
る。前記メイン基板(1)にはさらに直立したシールド
板(3) (3)を半田付は固定するための取付穴(9
)が設けられ、シールド板(3)の脚部(10)がこの
取付穴(9)に挿入され、半田付けされる。またシール
ド板(3)の高さ方向略中夫にはサブ基板(5)が固定
されており、このサブ基板(5)に高周波回路素子(4
)が接続されている。前記シールド板(3)の上面には
第1図および第2図に示すようにシールドケース(2)
全体に覆せて上面をシールドするシールド板(6)が着
脱自在に嵌めこまれている。
In FIG. 1, (1) is a main board, and the entire surface of the main board (1) corresponding to a high frequency circuit that requires shielding is a ground pattern (8) made of conductive foil. The main board (1) further has mounting holes (9) for fixing the upright shield plate (3) by soldering.
), and the legs (10) of the shield plate (3) are inserted into these mounting holes (9) and soldered. Further, a sub-board (5) is fixed to the substantially middle part of the shield plate (3) in the height direction, and a high-frequency circuit element (4) is fixed to this sub-board (5).
) are connected. On the upper surface of the shield plate (3) is a shield case (2) as shown in Figures 1 and 2.
A shield plate (6) that can be completely covered and shields the upper surface is removably fitted.

[発明の効果コ 本発明は以上のように構成したので、メイン基板とサブ
基板のシールド板が不要となり、周基板の間隔が約半分
ですみ、外形寸法を小型化できる。
[Effects of the Invention] Since the present invention is configured as described above, the shield plates for the main board and the sub-board are not required, the distance between the peripheral boards can be reduced by about half, and the external dimensions can be reduced.

またシールド板を取り付けるための構造も不要であり組
立工数も削減できる。さらにアースパターンを有するメ
イン基板上には、段間複同調回路。
Furthermore, no structure is required for attaching the shield plate, and the number of assembly steps can be reduced. Furthermore, on the main board that has a ground pattern, there is an interstage double tuning circuit.

局部発振回路、高周波フィルタ回路などの共振インダク
タとしてのマイクロストリップラインをパターンにて形
成してもメイン基板がシールド板を兼用し、別個のシー
ルド板を必要としないなどの効果を有するものである。
Even if a microstrip line as a resonant inductor for a local oscillation circuit, a high frequency filter circuit, etc. is formed in a pattern, the main board also serves as a shield plate, and a separate shield plate is not required.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明によるシールド装置の一実施例を示す断
面図、第2図は同上分解斜視図、第3図は従来例を示す
断面図である。 (1)・・・メイン基板、(2)・・・シールドケース
、(3) (6)(7)・・・シールド板、(4)・・
・回路素子、(5)・・・サブ基板、(8)・・・アー
スパターン、(9)・・・取付穴、(10)・・脚部。 出願人  株式会社富士通ゼネラル 山−□ 1 代理人 弁理士古澤俊明 □;。 −−−じ 同   弁理士 加 納 −男□ 第4図 第  D  図 ’/ 7 第  2  図
FIG. 1 is a sectional view showing an embodiment of the shielding device according to the present invention, FIG. 2 is an exploded perspective view of the same, and FIG. 3 is a sectional view showing a conventional example. (1)... Main board, (2)... Shield case, (3) (6) (7)... Shield plate, (4)...
-Circuit element, (5)...Sub board, (8)...Earth pattern, (9)...Mounting hole, (10)...Legs. Applicant Fujitsu General Yamaha Ltd.-□ 1 Agent Patent attorney Toshiaki Furusawa □;. ---Same Patent Attorney Kano -M □ Figure 4 Figure D'/7 Figure 2

Claims (1)

【特許請求の範囲】[Claims] (1)シールドを要する高周波回路を構成したサブ基板
を、シールドケースで遮蔽しつつメイン基板上に設置し
てなる高周波回路のシールド装置において、前記メイン
基板に導体箔のアースパターンを形成し、このアースパ
ターン部分を、前記シールドケースの一部として兼用し
たことを特徴とする高周波回路のシールド装置。
(1) In a high-frequency circuit shielding device in which a sub-board that constitutes a high-frequency circuit that requires shielding is installed on a main board while being shielded by a shield case, a ground pattern of conductive foil is formed on the main board, and this A shielding device for a high frequency circuit, characterized in that a ground pattern portion also serves as a part of the shielding case.
JP26465287A 1987-10-20 1987-10-20 Device for shielding high frequency circuit Pending JPH01125897A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26465287A JPH01125897A (en) 1987-10-20 1987-10-20 Device for shielding high frequency circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26465287A JPH01125897A (en) 1987-10-20 1987-10-20 Device for shielding high frequency circuit

Publications (1)

Publication Number Publication Date
JPH01125897A true JPH01125897A (en) 1989-05-18

Family

ID=17406326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26465287A Pending JPH01125897A (en) 1987-10-20 1987-10-20 Device for shielding high frequency circuit

Country Status (1)

Country Link
JP (1) JPH01125897A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0568963A2 (en) * 1992-05-07 1993-11-10 Siemens Aktiengesellschaft Chassis for television receiver
US7145084B1 (en) * 2005-08-30 2006-12-05 Freescale Semiconductor, Inc. Radiation shielded module and method of shielding microelectronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0568963A2 (en) * 1992-05-07 1993-11-10 Siemens Aktiengesellschaft Chassis for television receiver
EP0568963A3 (en) * 1992-05-07 1994-03-23 Siemens Ag
US7145084B1 (en) * 2005-08-30 2006-12-05 Freescale Semiconductor, Inc. Radiation shielded module and method of shielding microelectronic device

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